Electronic device

Abstract

The utility model provides electronic equipment, relates to the technical field of electronic equipment, and is used for solving the problem that a rear cavity of an audio module is relatively small. The electronic equipment comprises a bracket, a middle frame, an audio module, a cover body and a sealing element, the bracket comprises a first mounting part, a second mounting part and a third mounting part; the first installation part, the middle frame and the third installation part jointly define a first sound cavity, and the audio module is located in the first sound cavity. And the second mounting part, the middle frame and the third mounting part jointly enclose a second sound cavity. The sealing element is in sealing connection with the third mounting part and the cover body, the third mounting part, the cover body and the sealing element jointly define a communication channel, and the communication channel is communicated with the first sound cavity and the second sound cavity. The first sound cavity, the second sound cavity and the communication channel jointly serve as a rear cavity of the audio module. According to the invention, the sealing element is in sealed connection with the cover body and the third installation part, so that the size of the third installation part can be smaller, and the rear cavity of the audio module can be enlarged.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to an electronic device. Background Art

[0002] With the rapid development of technology, the development of electronic devices (such as mobile phones, tablets, smart watches, etc.) is also becoming increasingly rapid, and electronic devices are becoming thinner and lighter. In an electronic device, in order to enable the electronic device to have an audio playback function, an audio module is provided, and the audio module usually requires a sealed space as the rear cavity of the audio module. However, in existing electronic devices, the rear cavity of the audio module is small, resulting in poor sound quality of the audio module. Summary of the Utility Model

[0003] Embodiments of this application provide an electronic device for solving the problem of the small rear cavity of the audio module.

[0004] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0005] An electronic device is provided.

[0006] In a possible implementation manner, the electronic device includes a bracket, a middle frame, an audio module, a cover body, and a sealing member. The bracket includes a first mounting portion, a second mounting portion, and a third mounting portion located between the first mounting portion and the second mounting portion and connected to the first mounting portion and the second mounting portion respectively. The first mounting portion, the middle frame, and the third mounting portion jointly enclose a first sound cavity, and the audio module is located in the first sound cavity. The second mounting portion, the middle frame, and the third mounting portion jointly enclose a second sound cavity. The cover body is located on the side of the third mounting portion away from the middle frame. The sealing member is hermetically connected to the third mounting portion and the cover body respectively. The third mounting portion, the cover body, and the sealing member jointly enclose a communication channel, or the third mounting portion and the cover body jointly enclose a communication channel. The communication channel is respectively communicated with the first sound cavity and the second sound cavity. The first sound cavity, the second sound cavity, and the communication channel jointly serve as the rear cavity of the audio module.

[0007] By hermetically connecting the sealing member to the cover body and the third mounting portion respectively, the size of the third mounting portion can be made smaller, thereby increasing the space between the third mounting portion and the middle frame, so that the volumes of the first sound cavity and the second sound cavity are increased; the size of the communication channel is increased. The volumes of the first sound cavity, the second sound cavity, and the communication channel can be increased, thereby increasing the rear cavity of the audio module.

[0008] In a possible implementation, a communication groove is formed in the third mounting portion by being recessed inward from the surface of the third mounting portion away from the middle frame. The groove wall of the communication groove includes a connected first bottom wall and a first side wall. A first through hole and a second through hole penetrating the third mounting portion are formed in the first bottom wall. The first through hole communicates with the first sound cavity, and the second through hole communicates with the second sound cavity. The groove wall of the communication groove, the cover body, and the sealing member together enclose a communication channel. Alternatively, the groove wall of the communication groove and the cover body together enclose a communication channel.

[0009] By forming a penetrating first through hole in the first bottom wall, the communication channel is communicated with the first sound cavity. By forming a penetrating second through hole in the first bottom wall, the communication channel is communicated with the second sound cavity.

[0010] In a possible implementation, the cover body includes a main body portion and a skirt surrounding the main body portion, and the main body portion is connected to the skirt. A receiving opening is formed in the first side wall, and the receiving opening is used for receiving at least part of the skirt. At least part of the sealing member is located in the receiving opening, and the sealing member is respectively and sealingly connected to the first side wall and the skirt. By forming a receiving opening in the first side wall to receive the skirt, the structure of the electronic device is made more compact.

[0011] In a possible implementation, the receiving opening includes a connected second bottom wall and a second side wall. The second side wall extends in a first direction, and the first direction is perpendicular to the extending direction of the cover body. In a second direction, the size of the second bottom wall is greater than or equal to 0.3 mm. The second direction intersects the first direction. The larger size of the second bottom wall enables a larger contact area between the second bottom wall and the skirt, improving the connection strength between the second bottom wall and the skirt; or enables a larger contact area between the second bottom wall and the sealing member, improving the connection strength between the second bottom wall and the sealing member.

[0012] In a possible implementation, the skirt is connected to the second side wall, and the sealing member is respectively and sealingly connected to the skirt and the second bottom wall. Moisture and dust will enter the rear cavity of the audio module along the direction from the receiving opening to the communication channel. The sealing member is located between the skirt and the second bottom wall. The skirt can block moisture and dust from entering the receiving opening, and the sealing member can block moisture and dust from entering the communication channel from the receiving opening, so as to improve the sealing reliability between the skirt and the second bottom wall.

[0013] In a possible implementation, the skirt is connected to the second bottom wall. The sealing member is respectively and sealingly connected to the skirt and the second side wall, or the sealing member is respectively and sealingly connected to the skirt and the second bottom wall. Moisture and dust will enter the rear cavity of the audio module along the direction from the receiving opening to the communication channel. The sealing member is located between the skirt and the second side wall. The sealing member can block moisture and dust from entering the receiving opening, and the skirt can block moisture and dust from entering the communication channel from the receiving opening, so as to improve the sealing reliability between the skirt and the second bottom wall.

[0014] In a possible implementation, the skirt includes a connecting portion and a contacting portion. The connecting portion is connected to the main body portion and the contacting portion respectively, and the contacting portion is connected to the second bottom wall. The contacting portion, the connecting portion, the second bottom wall, and the second side wall jointly enclose a receiving groove, or the contacting portion, the connecting portion, and the second side wall jointly enclose a receiving groove, and the seal is located in the receiving groove. The contacting portion can separate the seal from the communication channel, so that the seal will not flow into the communication channel, avoiding the seal from hanging and shaking in the communication channel, and improving the sound output effect.

[0015] In a possible implementation, in the extending direction of the second bottom wall, the size of the contacting portion is larger than that of the connecting portion. By setting the contacting portion, the contact area with the second bottom wall is increased, and the connection strength between the skirt and the second bottom wall is improved.

[0016] In a possible implementation, the receiving groove includes a groove bottom and an opening; the groove bottom includes the contacting portion, or the groove bottom includes the contacting portion and the second bottom wall; in the direction from the groove bottom to the opening, the size of the receiving groove gradually increases. The opening of the receiving groove can be used for guiding, which is convenient for placing the seal into the receiving groove.

[0017] In a possible implementation, the electronic device further includes a fingerprint module, which is located between the first bottom wall and the middle frame, and the fingerprint module is located between the first sound cavity and the second sound cavity. By extending the third mounting portion to the position of the fingerprint module, the space between the fingerprint module and the rear shell is reasonably utilized, and the space between the fingerprint module and the rear shell is converted into a communication channel to realize the communication between the first sound cavity and the second sound cavity, thereby realizing the expansion of the rear cavity of the audio module and improving the sound output effect of the audio module.

[0018] In a possible implementation, the arrangement direction of the first mounting portion, the third mounting portion, and the second mounting portion is the third direction; in the third direction, the first through hole and the second through hole are arranged in a staggered manner. Compared with the scheme in which the first through hole and the second through hole are arranged in parallel in the third direction, the distance between the first through hole and the second through hole is larger, which can increase the volume of the communication channel, thereby expanding the rear cavity of the audio module and improving the sound output effect of the audio module.

[0019] In a possible implementation, in the fourth direction, the first through hole and the second through hole are arranged in a staggered manner, and the fourth direction intersects with the first direction and the third direction. Compared with the scheme in which the first through hole and the second through hole are arranged in parallel in the fourth direction, the distance between the first through hole and the second through hole is larger, which can increase the volume of the communication channel, thereby expanding the rear cavity of the audio module.

[0020] In a possible implementation, the second mounting portion includes a base and a circuit board connected to each other. The base is connected to the third mounting portion. The circuit board, the third mounting portion, and the middle frame jointly enclose a second sound cavity. A third through hole penetrating the circuit board is formed in the circuit board, and the third through hole is communicated with the second through hole. Reasonably using the circuit board to form the second sound cavity and reducing the number of internal structures of the electronic device can reduce costs and reduce the weight of the electronic device.

[0021] In a possible implementation, the opening area of the third through hole is smaller than the opening area of the second through hole. During the installation process, first install the circuit board on the middle frame, and then install the base, the first mounting portion, and the third mounting portion on the circuit board. The opening area of the third through hole is smaller than the opening area of the second through hole, which is convenient for ensuring that the connection area between the circuit board and the third mounting portion is large enough and improving the connection reliability between the circuit board and the third mounting portion.

[0022] In a possible implementation, an expansion groove is formed in the first bottom wall. By forming the expansion groove in the first bottom wall, the volume of the communication channel is further expanded to expand the rear cavity of the audio module and improve the sound output effect of the audio module.

[0023] In a possible implementation, in the extending direction of the cover body, the shape of the sealing member is a closed shape. It can ensure complete sealing between the cover body and the third mounting portion, thereby improving the sealing reliability between the sealing member and the third mounting portion and the sealing reliability between the sealing member and the cover body.

[0024] In a possible implementation, the cover body is a metal sheet. On the basis of meeting the strength requirements, a structure with a smaller size in the Z-axis direction can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A three-dimensional schematic diagram of an electronic device provided by an embodiment of the present application;

[0026] Figure 2 An exploded schematic diagram of an electronic device provided by an embodiment of the present application;

[0027] Figure 3 A schematic diagram of the structure of the rear cavity of the audio module;

[0028] Figure 4 A partial structure schematic diagram of an electronic device;

[0029] Figure 5 A partial structure schematic diagram of another electronic device;

[0030] Figure 6 A partial structure schematic diagram of an electronic device provided by an embodiment of the present application;

[0031] Figure 7 For Figure 6 The enlarged schematic diagram at position G in

[0032] Figure 8 The partial structural schematic diagram of another electronic device provided by an embodiment of the present application;

[0033] Figure 9 The partial structural exploded schematic diagram of an electronic device provided by an embodiment of the present application;

[0034] Figure 10 The partial structural schematic diagram of yet another electronic device provided by an embodiment of the present application;

[0035] Figure 11 For Figure 10 The sectional schematic diagrams of the B - B section and the C - C section in figure (a) in

[0036] Figure 12 The structural schematic diagram of a bracket in an electronic device provided by an embodiment of the present application;

[0037] Figure 13 The exploded schematic diagram of a bracket in an electronic device provided by an embodiment of the present application;

[0038] Figure 14 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application

[0039] Figure 15 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0040] Figure 16 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0041] Figure 17 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0042] Figure 18 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0043] Figure 19 The partial structural schematic diagram of still another electronic device provided by an embodiment of the present application. Detailed implementation manners

[0044] In the embodiments of the present application, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include one or more of such features.

[0045] In the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0046] The embodiments of the present application provide an electronic device, which is a type of electronic device with audio functions. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet personal computer, a monitor, a camera, a laptop computer, a wearable device, etc. with audio functions. For the convenience of description below, the mobile phone is taken as an example for illustration.

[0047] Please refer to Figure 1 , Figure 1 which is a three-dimensional schematic diagram of an electronic device provided by the embodiments of the present application. As can be seen from the above, in this embodiment, the electronic device 100 is a mobile phone, and the electronic device 100 may have an approximate rectangular plate-like structure.

[0048] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that Figure 1 only some components included in the electronic device 100 are schematically shown, and the actual shapes, actual sizes, actual positions and actual structures of these components are not limited by Figure 1 .

[0049] Please refer to Figure 2 , Figure 2 which is an exploded schematic diagram of an electronic device provided by the embodiments of the present application. The electronic device 100 may include a screen 10, a rear cover 20, and a middle frame 30. The screen 10 may be used to display images, videos, etc. The screen 10 may include a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the light-transmitting cover plate 11 includes but is not limited to glass. The display screen 12 may be a flexible display screen or a rigid display screen.

[0050] The rear cover 20 can be used to protect the internal electronic components of the electronic device 100, and the rear cover 20 can be located on the side of the display screen 12 away from the light-transmitting cover plate 11.

[0051] The middle frame 30 can include a connected frame 31 and a middle plate 32. The frame 31 can be located between the rear cover 20 and the light-transmitting cover plate 11, and the frame 31 can be fixedly connected to the rear cover 20. Exemplarily, the frame 31 can be fixedly connected to the rear cover 20 by adhesive. The light-transmitting cover plate 11 can be fixedly connected to the frame 31 by adhesive. The middle plate 32 is connected to the inner surface of the frame 31 to achieve the installation and fixation of the middle plate 32. Exemplarily, the middle plate 32 and the frame 31 can be made of metal materials, and the middle plate 32 can be fixedly connected to the frame 31 by welding. The middle plate 32 can also be an integrally formed structure with the frame 31. The middle plate 32 serves as the structural "skeleton" of the electronic device 100.

[0052] The electronic device 100 can also include an audio module. The audio module has a rear cavity. The larger the volume of the rear cavity of the audio module, the better the sound effect emitted by the audio module. Currently, the rear cavity of the audio module includes three types: closed type, semi-open type, and connected cavity type.

[0053] Please refer to Figure 3 Figure (a) in. The closed rear cavity means that the audio module is located in a closed housing 61, and the cavity jointly formed by the housing 61 and the audio module serves as the rear cavity of the audio module. During installation, the housing can be directly installed inside the electronic device.

[0054] Please refer to Figure 3 Figure (b) in. When the size of the electronic device in the Z-axis direction is large, the rear cavity of the audio module can be a semi-open rear cavity. The semi-open rear cavity means that a groove 35 is formed on the middle frame 30, the audio module 60 is placed in the groove 35, and then a cover plate (not shown in the figure) is provided to cover the middle frame 30 and be hermetically connected to the middle frame 30. The cavity jointly formed by the cover plate, the groove wall of the groove 35, and the audio module 60 serves as the rear cavity of the audio module 60.

[0055] Please refer to Figure 3 Figure (c) in. When the size of the electronic device in the Z-axis direction is small, for example, when the electronic device is a foldable mobile phone, the rear cavity of the audio module 60 can be a connected cavity type rear cavity. The connected cavity type rear cavity means that a plurality of grooves 35 are formed on the middle frame 30. Figure 3In Figure (c), the number of grooves 35 is two. The audio module 60 is placed in one of the grooves 35, and then a cover plate (not shown in the figure) is set on the middle frame 30 and sealedly connected to the middle frame 30. The cover plate and the groove walls of each groove 35 enclose accommodation cavities 36, and the multiple accommodation cavities 36 communicate with each other. The cavity formed by the multiple accommodation cavities 36 together serves as the rear cavity of the audio module 60. That is to say, the connected cavity rear cavity expands the dimensions of the rear cavity in the X-axis and Y-axis directions by forming multiple accommodation cavities 36, so that the volume of the rear cavity meets the sound output requirements. The rear cavity in the embodiment of the present application is a connected cavity rear cavity.

[0056] Please refer to Figure 4 , in some electronic devices, the electronic device may further include a bracket 50, an audio module 60, and a connection cover 70. The bracket 50 includes a first mounting portion 51, a second mounting portion 52, and a third mounting portion 53 located between the first mounting portion 51 and the second mounting portion 52. The third mounting portion 53 is respectively connected to the first mounting portion 51 and the second mounting portion 52. The first mounting portion 51, the third mounting portion 53, and the second mounting portion 52 are sequentially connected along the X-axis direction. The first mounting portion 51, the middle frame 30, and the third mounting portion 53 together enclose a first sound cavity 54, and the audio module 60 is located in the first sound cavity 54. The audio module 60 is used to emit sound. The second mounting portion 52, the middle frame 30, and the third mounting portion 53 together enclose a second sound cavity 55.

[0057] The connection cover 70 is connected to the third mounting portion 53, and the connection cover 70 and the third mounting portion 53 together enclose a communication channel 56. One end of the communication channel 56 is communicated with the first sound cavity 54, and the other end of the communication channel 56 is communicated with the second sound cavity 55. The first sound cavity 54, the second sound cavity 55, and the communication channel 56 together serve as the rear cavity of the audio module 60.

[0058] As Figure 4 shown, the connection cover 70 and the third mounting portion 53 can be integrally formed by injection molding, and the connection cover 70 and the third mounting portion 53 can both be made of plastic. However, on the basis that the thickness of the electronic device in the Z-axis direction is small, the minimum thickness of the injection-molded connection cover 70 in the Z-axis direction is 0.5 mm, so that the distance between the connection cover 70 and the third mounting portion 53 in the Z-axis direction is small, and even there is no gap between the connection cover 70 and the third mounting portion 53 in the Z-axis direction, resulting in a small volume of the communication channel 56 or the inability to form the communication channel 56.

[0059] Please refer to Figure 5 Figures (a) and (b) in Figure 5 Figure (b) in Figure 5An enlarged schematic view of the position F in Figure (a). The connecting cover 70 can also be used as an insert, and the connecting cover 70 is embedded in the third mounting portion 53. Among them, the connecting cover 70 can be a metal sheet, and the third mounting portion 53 can be formed by injection molding of plastic. The size of the metal sheet in the Z-axis direction can be less than 0.5 mm, so the distance between the connecting cover 70 and the third mounting portion 53 in the Z-axis direction can be increased, the volume of the communication channel 56 can be increased, and then the volume of the rear cavity can be increased.

[0060] However, in order to make the third mounting portion 53 have a good molding and the third mounting portion 53 is hermetically connected to the connecting cover 70, the connecting cover 70 includes a connecting plate 71 and a bent portion 72 surrounding the connecting plate 71, and the connecting plate 71 is connected to the bent portion 72. The bent portion 72 includes a first extension portion 721 and a second extension portion 722 connected to each other. The first extension portion 721 is connected to the connecting plate 71, the first extension portion 721 extends along the plane where the X-axis and the Y-axis are located, and the second extension portion 722 extends along the Z-axis direction. By arranging the first extension portion 721 and the second extension portion 722, the bent portion 72 is buried in the third mounting portion 53, so as to improve the sealing performance between the bent portion 72 and the third mounting portion 53.

[0061] On the basis of meeting the requirements of connection strength and sealing performance, the size of the first extension portion 721 in the X-axis direction needs to be greater than or equal to 0.7 mm, and the first extension portion 721 needs to be buried in the third mounting portion 53, so that the size of the third mounting portion 53 in the X-axis direction is larger, and the third mounting portion 53 will limit the arrangement size of the communication channel 56 in the X-axis direction, resulting in a smaller volume of the communication channel 56.

[0062] In addition, the size of the second extension portion 722 in the Z-axis direction needs to be greater than or equal to 0.5 mm, and the second extension portion 722 needs to be buried in the third mounting portion 53, so that the size of the third mounting portion 53 in the Z-axis direction is larger, and the third mounting portion 53 limits the arrangement size of the first sound cavity 54 and the second sound cavity 55 in the Z-axis direction, resulting in a smaller volume of the first sound cavity 54 and the second sound cavity 55. That is to say, because the first extension portion 721 and the second extension portion 722 need to be buried in the third mounting portion 53, the size of the third mounting portion 53 in the X-axis and Z-axis directions is larger, and the volumes of the first sound cavity 54, the second sound cavity 55, and the communication channel 56 are smaller, resulting in a smaller rear cavity of the audio module 60.

[0063] Please refer to Figure 6 and Figure 7 , Figure 7 for Figure 6An enlarged schematic diagram at position G in China. To solve the problem of the relatively small rear cavity of the audio module in the above-mentioned electronic device. The present application provides an electronic device, which may include a cover body 80 and a seal 40. One end of the seal 40 is sealingly connected to the cover body 80, and the other end of the seal 40 is sealingly connected to the third mounting portion 53. The cover body 80 is located on the side of the third mounting portion 53 away from the middle frame 30.

[0064] The cover body 80, the third mounting portion 53, and the seal 40 together enclose a communication channel 56, or the third mounting portion 53 and the cover body 80 together enclose a communication channel 56. One end of the communication channel 56 is communicated with the first sound cavity 54, and the other end of the communication channel 56 is communicated with the second sound cavity 55. The first sound cavity 54, the second sound cavity 55, and the communication channel 56 together serve as the rear cavity of the audio module 60.

[0065] By sealingly connecting the seal 40 to the cover body 80 and the third mounting portion 53 respectively, compared with the solution of embedding the connecting cover 70 as an insert into the third mounting portion 53 (see Figure 5 Figures (a) and (b) in Figure 5 Figures (a) and (b) in Figure 5 Figures (a) and (b) in Figure 5 Figures (a) and (b) in

[0066] Exemplarily, the seal 40 may be a glue with good sealing performance. For example, the seal 40 may be liquid silicone, liquid silicone rubber, or other glue.

[0067] In some embodiments, the cover body 80 may be a metal sheet, which can obtain a structure with a relatively small size in the Z-axis direction on the basis of meeting the strength requirements. Exemplarily, the cover body 80 may be a sheet-like structure made of steel sheet, copper sheet, iron sheet or other metals, and the present application embodiment does not limit the type of metal material of the cover body 80.

[0068] Exemplarily, the size of the cover body 80 in the Z-axis direction is greater than or equal to 0.1 mm and less than or equal to 0.5 mm. The size of the cover body 80 in the Z-axis direction is greater than or equal to 0.1 mm, so that the cover body 80 can have better structural strength and extend the service life of the cover body 80. The size of the cover body 80 in the Z-axis direction is less than or equal to 0.5 mm, avoiding the situation that the volume of the communication channel 56 is small due to the over-large size of the cover body 80 in the Z-axis direction. The size of the cover body 80 in the Z-axis direction can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc.

[0069] In some embodiments, please refer to Figure 8 Figures (a) and (b) in Figure 8 Figure (b) in Figure 8 is an enlarged schematic view of the position H in Figure (a) in

[0070] In some embodiments, please refer to Figure 9 , Figure 9 which is a partial structural decomposition schematic diagram of an electronic device provided by an embodiment of the present application. The middle frame 30 further includes a first sealing body 33. The first sealing body 33 is hermetically connected to the middle plate 32 and the first mounting portion 51 respectively. By providing the first sealing body 33, the middle plate 32 and the first mounting portion 51 are hermetically connected. The middle plate 32, the first mounting portion 51, the first sealing body 33, and the third mounting portion 53 together enclose a first sound cavity 54.

[0071] Exemplarily, the first sealing body 33 may include a double-sided foam tape, which has the characteristics of good sealing performance, strong adhesion, good holding force, good waterproof performance, and strong heat resistance. One side of the double-sided foam tape can be bonded to the middle plate 32, and the other side of the double-sided foam tape can be bonded to the first mounting portion 51.

[0072] The middle frame 30 further includes a second seal 34. The second seal 34 is hermetically connected to the middle plate 32 and the second mounting portion 52 respectively. By providing the second seal 34, the hermetic connection between the middle plate 32 and the second mounting portion 52 is realized. The middle plate 32, the second mounting portion 52, the second seal 34, and the third mounting portion 53 together enclose a second sound cavity 55.

[0073] Exemplarily, similarly, the second seal 34 may include double-sided foam tape.

[0074] In some embodiments, please refer to Figure 9 , in the extending direction of the cover 80, that is, in the plane where the X-axis and the Y-axis are located, the shape of the seal 40 is a closed shape, which can ensure a complete seal between the cover 80 and the third mounting portion 53, thereby improving the sealing reliability between the seal 40 and the third mounting portion 53, and improving the sealing reliability between the seal 40 and the cover 80.

[0075] Please refer to Figure 10 Figures (a), (b), and (c) in Figure 10 Figure (b) in Figure 10 is a cross-sectional view of the A-A section in Figure (a) in Figure 10 Figure (c) in Figure 10 is an enlarged view of the D position in Figure (b) in

[0076] Please refer to Figure 10 Figures (b) and (c) in

[0077] The groove wall of the communication groove 531 includes a connected first bottom wall 5311 and a first side wall 5312. The first bottom wall 5311 extends along the X-axis direction, the first side wall 5312 extends along the Z-axis direction, the first side wall 5312 is connected to the cover 80, and the first side wall 5312 is connected to the seal 40. A first through hole 5313 is formed in the first bottom wall 5311. The first through hole 5313 penetrates the first bottom wall 5311 along the Z-axis direction, and the first through hole 5313 communicates with the first sound cavity 54.

[0078] Please refer to Figure 11 Figures (a), (b), and (c) in Figure 11 Figure (a) in Figure 10 is a cross-sectional view of the B-B section in Figure (a) in Figure 11 Figure (b) in Figure 11 is an enlarged view of the E position in Figure (a) in Figure 11 Figure (c) in Figure 10Schematic cross-sectional view of the C-C section in Figure (a).

[0079] Please refer to Figure 11 Figures (a) and (b), a second through-hole 5314 is formed in the first bottom wall 5311, the second through-hole 5314 penetrates the first bottom wall 5311 along the Z-axis direction, and the second through-hole 5314 communicates with the second sound cavity 55.

[0080] The groove wall of the communication groove 531 and the cover body 80 together enclose a communication channel 56. By forming a through first through-hole 5313 in the first bottom wall 5311, the communication channel 56 is communicated with the first sound cavity 54. By forming a through second through-hole 5314 in the first bottom wall 5311, the communication channel 56 is communicated with the second sound cavity 55.

[0081] Please refer to Figure 11 Figure (c). In some embodiments, an expansion groove 561 is formed in the first bottom wall 5311, the expansion groove 561 extends along the Z-axis direction, and the expansion groove 561 extends in a direction close to the middle plate 32. By forming the expansion groove 561 in the first bottom wall 5311, the volume of the communication channel 56 is further enlarged to expand the rear cavity of the audio module and improve the sound output effect of the audio module.

[0082] The number of the expansion grooves 561 can be multiple, so as to further expand the volume of the communication channel 56 to expand the rear cavity of the audio module and improve the sound output effect of the audio module. The embodiments of the present application do not limit the number of the expansion grooves 561.

[0083] The opening shape of the expansion groove 561 can be rectangular, circular, polygonal or irregular, and the embodiments of the present application do not limit the opening shape of the expansion groove 561.

[0084] Please refer to Figure 11In figure (c), in some embodiments, the electronic device 100 may further include a fingerprint module 90 for fingerprint verification. The fingerprint module 90 may include a short-focus lens facing the screen. When the user places a finger on the screen, the fingerprint module 90 captures a fingerprint image through the short-focus lens. The fingerprint module 90 is located between the first bottom wall 5311 and the middle frame 30. The first bottom wall 5311 and the middle frame 30 may jointly enclose an installation groove 91. The fingerprint module 90 is located within the installation groove 91, and the groove wall of the installation groove 91 is used to fix the fingerprint module 90 and limit its shaking. The fingerprint module 90 may be located between the first sound cavity and the second sound cavity. By extending the third installation portion 53 to the position of the fingerprint module 90, the space between the fingerprint module 90 and the rear shell is reasonably utilized, and the space between the fingerprint module 90 and the rear shell is converted into a communication channel 56 to achieve the communication between the first sound cavity and the second sound cavity, thereby expanding the rear cavity of the audio module and improving the sound output effect of the audio module.

[0085] Exemplarily, the expansion slot 561 may be arranged along the Z-axis direction with the fingerprint module 90, reasonably utilizing the space between the fingerprint module 90 and the rear shell.

[0086] In some embodiments, Figure 12 Figures (a) and (b) in show the schematic structural diagrams of a bracket in an electronic device provided by an embodiment of the present application. Please refer to Figure 12 In figure (a), the arrangement directions of the first installation portion 51, the third installation portion 53, and the second installation portion 52 are the third direction, and the third direction is the X-axis direction. In the X-axis direction, the first through hole 5313 and the second through hole 5314 are arranged in a staggered manner. Compared with the scheme where the first through hole 5313 and the second through hole 5314 are arranged in parallel along the X-axis direction, the distance between the first through hole 5313 and the second through hole 5314 is larger, which can increase the volume of the communication channel 56, thereby expanding the rear cavity of the audio module and improving the sound output effect of the audio module.

[0087] In some embodiments, please refer to Figure 12 In figure (b), the fourth direction intersects with the first direction and the third direction, and the fourth direction is the Y-axis direction. In the Y-axis direction, the first through hole 5313 and the second through hole 5314 are arranged in a staggered manner. Compared with the scheme where the first through hole 5313 and the second through hole 5314 are arranged in parallel along the Y-axis direction, the distance between the first through hole 5313 and the second through hole 5314 is larger, which can increase the volume of the communication channel 56, thereby expanding the rear cavity of the audio module.

[0088] In some embodiments, please refer to Figure 12In Figure (a), in the Y-axis direction, the first through hole 5313 and the second through hole 5314 can also partially overlap, so that the opening area of the expansion slot 561 is larger, thereby increasing the volume of the communication channel 56 to expand the rear cavity of the audio module.

[0089] In some embodiments, please refer to Figure 13 , Figure 13 which is an exploded schematic view of a bracket in an electronic device provided by an embodiment of the present application. The second mounting portion 52 includes a base 521 and a circuit board 522 connected to each other, and the base 521 and the circuit board 522 are distributed along the Z-axis direction. By connecting the base 521 to the third mounting portion 53, the connection between the second mounting portion 52 and the third mounting portion 53 is realized. A third through hole 523 penetrating the circuit board 522 along the Z-axis direction is formed on the circuit board 522, and the third through hole 523 communicates with the second through hole 5314.

[0090] Please refer to Figure 14 Figures (a) and (b) in Figure 14 Figure (b) in Figure 14 is an enlarged schematic view of the K position in Figure (a). The circuit board 522, the third mounting portion 53, and the middle frame 30 together enclose a second sound cavity 55, and electronic components can be arranged on the circuit board 522. Making reasonable use of the circuit board 522 to form the second sound cavity 55 and reducing the number of internal structures of the electronic device 100 can reduce costs and reduce the weight of the electronic device 100. It can be understood that the side of the circuit board 522 where the electronic components are arranged is close to the base 521 to prevent the electronic components from shaking in the second sound cavity 55 and reducing the sound output effect of the audio module.

[0091] In some embodiments, please refer to Figure 14 Figures (a) and (b) in

[0092] In some embodiments, please refer to Figure 14 Figures (a) and (b) in

[0093] In some embodiments, please refer to Figure 13 and Figure 14In Figures (a) and (b) thereof, the opening area of the third through-hole 523 is smaller than that of the second through-hole 5314. During the installation process, the circuit board 522 is first installed on the middle frame, and then the base 521, the first mounting portion 51, and the third mounting portion 53 are installed on the circuit board. The opening area of the third through-hole 523 being smaller than that of the second through-hole 5314 facilitates ensuring that the connection area between the circuit board 522 and the third mounting portion 53 is large enough, thereby improving the connection reliability between the circuit board 522 and the third mounting portion 53. Moreover, when the third mounting portion 53 and the circuit board 522 are hermetically connected through the third sealing body 524, the opening area of the third through-hole 523 being smaller than that of the second through-hole 5314 can also increase the connection area between the circuit board 522 and the third sealing body 524, improving the sealing reliability between the circuit board 522 and the third sealing body 524.

[0094] In some embodiments, please refer to Figure 15 Figures (a) and (b) thereof, Figure 15 which is a schematic partial structure diagram of another electronic device provided by an embodiment of the present application. Please refer to Figure 15 Figure (a) thereof. The cover body 80 includes a main body portion 82 and a skirt portion 83 surrounding the outside of the main body portion 82, and the main body portion 82 is connected to the skirt portion 83.

[0095] A receiving opening 5315 is formed in the first side wall 5312. The receiving opening 5315 is used to receive the skirt portion 83. By forming the receiving opening 5315 on the first side wall 5312 to receive the skirt portion 83, the structure of the electronic device 100 becomes more compact. The sealing member 40 is at least partially located in the receiving opening 5315, and the sealing member 40 is hermetically connected to the first side wall 5312 and the skirt portion 83 respectively.

[0096] In some embodiments, please refer to Figure 15 Figure (a) thereof. The receiving opening 5315 includes a connected second bottom wall 5316 and a second side wall 5317. The second bottom wall 5316 extends in the X-axis direction, and the second side wall 5317 extends in a first direction. The first direction is perpendicular to the extending direction of the cover body 80, and the first direction is the Z-axis direction.

[0097] In a second direction, the size of the second bottom wall 5316 is greater than or equal to 0.3 mm. The second direction intersects with the first direction, and the second direction can be the X-axis direction. Making the size of the second bottom wall 5316 larger enables the contact area between the second bottom wall 5316 and the skirt portion 83 to be larger, thereby improving the connection strength between the second bottom wall 5316 and the skirt portion 83; or enables the contact area between the second bottom wall 5316 and the sealing member 40 to be larger, improving the connection strength between the second bottom wall 5316 and the sealing member 40.

[0098] Exemplarily, in the X-axis direction, the size of the second bottom wall 5316 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 2 mm, 3 mm, etc.

[0099] In some embodiments, referring to Figure 15 Figure (a) in, the skirt 83 is connected to the second side wall 5317, the seal 40 is located between the skirt 83 and the second bottom wall 5316, and the skirt 83, the third mounting portion 53, and the seal 40 together enclose a communication channel 56. One end of the seal 40 is sealingly connected to the skirt 83, and the other end of the seal 40 is sealingly connected to the second bottom wall 5316. Moisture and dust will enter the rear cavity of the audio module along the direction from the receiving port 5315 to the communication channel 56. The seal 40 is located between the skirt 83 and the second bottom wall 5316. The skirt 83 can block moisture and dust from entering the receiving port 5315, and the seal 40 can block moisture and dust from entering the communication channel 56 from the receiving port 5315, so as to improve the sealing reliability between the skirt 83 and the second bottom wall 5316.

[0100] In some embodiments, referring to Figure 15 Figure (b) in, the seal 40 is located between the skirt 83 and the second bottom wall 5316, and the seal 40 can be sealingly connected to the skirt 83, the second bottom wall 5316, and the second side wall 5317. That is to say, the seal 40 is sealingly connected to both the second bottom wall 5316 and the second side wall 5317, increasing the connection area between the seal 40 and the receiving port 5315, and having a better effect of blocking moisture and dust from entering the communication channel 56 from the receiving port 5315, and can further improve the sealing reliability between the skirt 83 and the second bottom wall 5316.

[0101] Please refer to Figure 15 Figures (a) and (b) in, when the seal 40 is located between the skirt 83 and the second bottom wall 5316, in the X-axis direction, the size of the second bottom wall 5316 can be greater than or equal to 1 mm, so that the size of the second bottom wall 5316 is relatively large, preventing the volume of the seal 40 from being too large, resulting in part of the seal 40 hanging and shaking in the communication channel 56 and reducing the sound output effect of the audio module.

[0102] Exemplarily, the size of the second bottom wall 5316 can be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc.

[0103] In some embodiments, referring to Figure 16In figure (a), the skirt 83 is connected to the second bottom wall 5316. The skirt 83 and the third mounting portion 53 together enclose a communication channel 56. The skirt 83 can extend in the Z-axis direction, and the end of the skirt 83 away from the main body portion 82 is connected to the second bottom wall 5316. The seal 40 is located between the skirt 83 and the second side wall 5317. Along the X-axis direction, one end of the seal 40 is sealingly connected to the skirt 83, and the other end of the seal 40 is sealingly connected to the second side wall 5317. Water vapor and dust will enter the rear cavity of the audio module along the direction from the receiving port 5315 to the communication channel 56. The seal 40 is located between the skirt 83 and the second side wall 5317. The seal 40 can prevent water vapor and dust from entering the receiving port 5315, and the skirt 83 can prevent water vapor and dust from entering the communication channel 56 from the receiving port 5315, so as to improve the sealing reliability between the skirt 83 and the second bottom wall 5316.

[0104] In some embodiments, please refer to Figure 16 In figure (b), the seal 40 is located between the skirt 83 and the second side wall 5317. The seal 40 can also be sealingly connected to the skirt 83 and the second bottom wall 5316 respectively. The seal 40 can prevent water vapor and dust from entering the communication channel 56 through the gap between the skirt 83 and the second bottom wall 5316, so as to improve the sealing reliability between the skirt 83 and the second bottom wall 5316.

[0105] In some embodiments, please refer to Figure 16 In figure (c), the seal 40 is located between the skirt 83 and the second side wall 5317. The seal can be sealingly connected to the skirt 83, the second bottom wall 5316, and the second side wall 5317. Increasing the connection area between the seal 40 and the receiving port 5315 has a better effect of preventing water vapor and dust from entering the communication channel 56 from the receiving port 5315, and can further improve the sealing reliability between the skirt 83 and the second bottom wall 5316.

[0106] As Figure 16 Shown in figures (a), (b), and (c), the skirt 83 can separate the seal 40 from the communication channel 56, preventing the seal 40 from being too large in volume and hanging in the communication channel 56, thus improving the sound output effect of the audio module. The skirt 83 can separate the seal 40 from the communication channel 56, and the seal 40 will not flow into the communication channel 56. Then, along the X-axis direction, the size of the second bottom wall 5316 should be greater than or equal to 0.4 mm.

[0107] In some embodiments, please refer to Figure 17In Figure (a), the skirt 83 includes a connecting portion 831 and a contact portion 832. One end of the connecting portion 831 is connected to the main body portion 82, and the other end of the connecting portion 831 is connected to the contact portion 832. The contact portion 832 can extend along the plane where the X-axis and Y-axis are located, and the contact portion 832 can be connected to the second bottom wall 5316.

[0108] As shown in Figure 17 Figure (a), the contact portion 832, the connecting portion 831, the second bottom wall 5316, and the second side wall 5317 together define a receiving groove 5318 for receiving the seal 40. The contact portion 832 is connected to the second bottom wall 5316, and the contact portion 832 can separate the seal 40 from the communication channel 56, so that the seal 40 will not flow into the communication channel 56, avoiding the seal 40 from hanging and shaking in the communication channel 56 and improving the sound output effect.

[0109] The receiving groove 5318 includes a groove bottom 5319 and an opening 5310. The groove bottom 5319 includes the contact portion 832 and the second bottom wall 5316. The connecting portion 831 can extend along the Z-axis direction, so that the sizes of the groove bottom 5319 and the opening 5310 are kept consistent.

[0110] As shown in Figure 17 Figure (a), the seal 40 is located in the receiving groove 5318, and the seal 40 can be sealingly connected to the second bottom wall 5316, the second side wall 5317, and the contact portion 832.

[0111] As shown in Figure 17 Figure (b), the seal 40 is located in the receiving groove 5318, and the seal 40 can be sealingly connected to the second bottom wall 5316, the second side wall 5317, the connecting portion 831, and the contact portion 832. That is to say, the seal 40 is sealingly connected to the connecting portion 831 and the contact portion 832 respectively. Compared with the solution where the seal 40 is only sealingly connected to the contact portion 832 (see Figure 17 Figure (a)), the connection area between the seal 40 and the skirt 83 can be increased, and the sealing reliability between the seal 40 and the skirt 83 can be improved.

[0112] In some embodiments, please refer to Figure 17 Figure (c), the contact portion 832, the connecting portion 831, and the second side wall 5317 together define the receiving groove 5318. The groove bottom 5319 of the receiving groove 5318 includes the contact portion 832. That is to say, the contact portion 832 separates the seal 40 from the second bottom wall 5316.

[0113] In some embodiments, please refer to Figure 17In Figure (c), in the extending direction of the second bottom wall 5316, that is, in the X-axis and Y-axis directions, the size of the contact portion 832 is larger than that of the connecting portion 831. By setting the contact portion 832, the contact area with the second bottom wall 5316 is increased, and the connection strength between the skirt 83 and the second bottom wall 5316 is improved.

[0114] As shown in Figure 17 Figure (a) therein, the connecting portion 831, the contact portion 832, and the third mounting portion 53 may jointly enclose a communication channel 56. Alternatively, as shown in Figure 18 , the connecting portion 831 and the third mounting portion 53 may jointly enclose a communication channel 56.

[0115] In some embodiments, referring to Figure 18 , in the direction from the bottom of the groove 5319 to the opening 5310, the size of the receiving groove 5318 may gradually increase, that is, the size of the opening 5310 is larger than that of the bottom of the groove 5319, so that the opening 5310 of the receiving groove 5318 can be used for guiding, facilitating the placement of the seal 40 into the receiving groove 5318. Exemplarily, along the direction from the bottom of the groove 5319 to the opening 5310, the connecting portion 831 is inclined in a direction away from the contact portion 832, so that the size of the opening 5310 is larger than that of the bottom of the groove 5319.

[0116] In some embodiments, referring to Figure 19 , the cover 80 may be a plate-like structure, making the structure of the cover 80 simple and facilitating the processing of the cover 80.

[0117] Exemplarily, as shown in Figure 19 , the electronic device 100 may further include a battery (not shown in the figure), and the battery is located on the side of the third mounting portion 53 away from the middle plate 32. The surface of the cover 80 away from the middle plate 32 may be flush with the surface of the third mounting portion 53 away from the middle plate 32, improving the flatness of the surface of the third mounting portion 53 away from the middle plate and facilitating the installation of the battery on the surface of the third mounting portion 53 away from the middle plate 32.

[0118] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0119] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claimed rights.

Claims

1. An electronic device, characterized in that: The audio module comprises a bracket, a middle frame, an audio module, a cover body and a sealing member, wherein the bracket comprises a first mounting portion, a second mounting portion, and a third mounting portion located between the first mounting portion and the second mounting portion and respectively connected to the first mounting portion and the second mounting portion; the first mounting portion, the middle frame and the third mounting portion together form a first sound cavity, and the audio module is located in the first sound cavity; the second mounting portion, the middle frame and the third mounting portion together form a second sound cavity; the cover body is located on a side of the third mounting portion away from the middle frame; the sealing member is respectively sealed to the third mounting portion and the cover body; the third mounting portion, the cover body and the sealing member together form a connecting channel, or the third mounting portion and the cover body together form the connecting channel; the connecting channel is respectively connected to the first sound cavity and the second sound cavity; the first sound cavity, the second sound cavity and the connecting channel together serve as the back cavity of the audio module.

2. The electronic device according to claim 1, characterized in that: The third mounting portion is provided with a connecting groove which is formed by being recessed inwardly from a surface of the third mounting portion away from the middle frame, wherein a groove wall of the connecting groove comprises a first bottom wall and a first side wall connected to each other, and a first through hole and a second through hole which penetrate the third mounting portion are provided on the first bottom wall, wherein the first through hole is connected to the first sound cavity, and the second through hole is connected to the second sound cavity; The groove wall of the communicating groove, the cover body and the sealing member together form the communicating channel, or the groove wall of the communicating groove and the cover body together form the communicating channel.

3. The electronic device according to claim 2, characterized in that: The cover body includes a main body and a skirt surrounding the main body, wherein the main body is connected to the skirt; a receiving opening is provided on the first side wall, and the receiving opening is used to receive at least part of the skirt; the sealing member is at least partly located in the receiving opening, and the sealing member is respectively sealed and connected to the first side wall and the skirt.

4. The electronic device according to claim 3, characterized in that: The storage port includes a second bottom wall and a second side wall connected to each other, the second side wall extends along a first direction, and the first direction is perpendicular to the extension direction of the cover body; in the second direction, the size of the second bottom wall is greater than or equal to 0.3 mm; the second direction intersects with the first direction.

5. The electronic device according to claim 3 or 4, characterized in that: The skirt is connected to the second side wall, and the sealing member is sealingly connected to the skirt and the second bottom wall respectively.

6. The electronic device according to claim 3 or 4, characterized in that: The skirt is connected to the second bottom wall; the sealing member is respectively sealed to the skirt and the second side wall, or the sealing member is respectively sealed to the skirt and the second bottom wall.

7. The electronic device according to claim 6, characterized in that: The skirt includes a connecting portion and a contact portion, the connecting portion is respectively connected to the main body portion and the contact portion, and the contact portion is connected to the second bottom wall; the contact portion, the connecting portion, the second bottom wall, and the second side wall together form a receiving groove, or the contact portion, the connecting portion, and the second side wall together form the receiving groove, and the sealing member is located in the receiving groove.

8. The electronic device according to claim 7, characterized in that: In an extending direction of the second bottom wall, a size of the contact portion is larger than a size of the connecting portion.

9. The electronic device according to claim 7, characterized in that: The receiving groove includes a groove bottom and an opening; the groove bottom includes the contact portion, or the groove bottom includes the contact portion and the second bottom wall; the size of the receiving groove gradually increases from the groove bottom to the opening.

10. The electronic device according to any one of claims 2 to 9, characterized in that: The electronic device further includes a fingerprint module, wherein the fingerprint module is located between the first bottom wall and the middle frame, and the fingerprint module is located between the first sound cavity and the second sound cavity.

11. The electronic device according to any one of claims 2 to 10, characterized in that: The first mounting portion, the third mounting portion, and the second mounting portion are arranged in a third direction; in the third direction, the first through hole and the second through hole are staggered; and / or, In a fourth direction, the first through hole and the second through hole are staggered, and the fourth direction intersects with the first direction and the third direction.

12. The electronic device according to any one of claims 2 to 11, characterized in that: The second mounting portion includes a base and a circuit board connected to each other, the base is connected to the third mounting portion, the circuit board, the third mounting portion, and the middle frame together form the second sound cavity, a third through hole is opened on the circuit board and passes through the circuit board, and the third through hole is connected to the second through hole.

13. The electronic device according to claim 12, characterized in that: An opening area of ​​the third through hole is smaller than an opening area of ​​the second through hole.

14. The electronic device according to any one of claims 2 to 13, characterized in that: The first bottom wall is provided with a capacity expansion groove.

15. The electronic device according to any one of claims 1 to 14, characterized in that: In the extension direction of the cover body, the shape of the sealing member is a closed shape.

16. The electronic device according to any one of claims 1 to 15, characterized in that: The cover body is a metal sheet.

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