Silicon wafer cleaning basket and bottom rod of silicon wafer cleaning basket

Abstract

The utility model relates to a silicon wafer cleaning basket and a bottom rod thereof, the silicon wafer cleaning basket comprises U-shaped side plates, a plurality of side rods and a plurality of bottom rods are arranged between the two U-shaped side plates, the side rods are provided with a plurality of silicon wafer insertion clamping grooves, and every two silicon wafer insertion clamping grooves form a group for limiting silicon wafers; the bottom rod is used for supporting the bottom of the silicon wafer. The hardness of the bottom rod and the silicon wafer insertion clamping groove is smaller than that of the silicon wafer. By improving the design of the bottom rod of the silicon wafer cleaning basket, hard contact between the silicon wafer and the bottom rod of the silicon wafer cleaning basket is avoided, so that the possibility of edge breakage when the silicon wafer is inserted into the silicon wafer cleaning basket is reduced, the silicon wafer is effectively protected, and the quality of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer production, and particularly relates to a silicon wafer cleaning basket and a bottom rod of the silicon wafer cleaning basket. Background Art

[0002] In the production of photovoltaic silicon wafers, silicon wafer cleaning is a key process. After cutting, the surface of the silicon wafer has residues such as silicon powder, metal ions, and organic substances. These impurities will affect the performance of the silicon wafer, so they need to be removed through cleaning. The traditional method of cleaning silicon wafers is to insert the silicon wafers into a cleaning basket and then transfer the cleaning basket to a silicon wafer cleaning machine for cleaning. In this process, the design and material selection of the silicon wafer cleaning basket have an important impact on the cleaning effect of the silicon wafers.

[0003] Solutions of the prior art: Existing silicon wafer cleaning baskets usually use round rods made of hard PVDF material. This design can ensure the stability of the silicon wafers during the cleaning process and prevent the silicon wafers from moving or colliding during cleaning. However, this design also has some problems. For example, since the contact between the silicon wafer and the bottom rod of the cleaning basket is hard, when the silicon wafer is inserted into the cleaning basket, it is easy to cause chipping of the silicon wafer. In addition, during the chemical cleaning of the silicon wafer, this hard contact will also form contact cleaning marks - basket imprints, which affect the cleaning effect.

[0004] Problems of the prior art: Although the existing design of the silicon wafer cleaning basket can ensure the stability of the silicon wafers during the cleaning process, due to the hard contact between it and the silicon wafers, it is easy to cause chipping of the silicon wafers when the silicon wafers are inserted into the cleaning basket. In addition, this hard contact will also form contact cleaning marks - basket imprints during the chemical cleaning of the silicon wafers, which affect the cleaning effect. These problems will not only affect the quality of the silicon wafers but also may affect the efficiency and lifespan of the subsequent photovoltaic cells. Therefore, how to design a new type of silicon wafer cleaning basket to solve these problems and improve the cleaning effect of the silicon wafers is an urgent problem to be solved in the current production of photovoltaic silicon wafers. Summary of the Invention

[0005] The technical problem to be solved by the utility model is to provide a silicon wafer cleaning basket and a bottom rod of the silicon wafer cleaning basket. By improving the design of the bottom rod of the silicon wafer cleaning basket, the hard contact between the silicon wafer and the bottom rod of the cleaning basket is avoided, thereby reducing the possibility of chipping of the silicon wafer when it is inserted into the cleaning basket, effectively protecting the silicon wafer, and improving the quality of the silicon wafer.

[0006] To solve the above technical problem, the technical solution adopted by the utility model is:

[0007] A silicon wafer cleaning carrier includes U-shaped side plates. Between the two U-shaped side plates, there are multiple side rods and multiple bottom rods. Several silicon wafer insertion slots are provided on the side rods, and two silicon wafer insertion slots form a group for limiting the silicon wafers; the bottom rods are used to support the bottoms of the silicon wafers. The hardness of the bottom rods and the silicon wafer insertion slots is less than that of the silicon wafers.

[0008] Preferably, the bottom rod includes a stainless steel rod core, and an acid and alkali resistant and high temperature resistant layer is provided outside the stainless steel rod core.

[0009] Preferably, a buckle is provided on the top of the acid and alkali resistant and high temperature resistant layer, and a buffer rod is installed on the buckle.

[0010] Preferably, the silicon wafer insertion slots are made of an elastic material.

[0011] Preferably, mounting holes are provided on the U-shaped side plates.

[0012] Preferably, the acid and alkali resistant and high temperature resistant layer is made of PVDF.

[0013] A bottom rod of a silicon wafer cleaning carrier includes a rod core, an acid and alkali resistant and high temperature resistant layer is provided outside the rod core, a buckle is provided on the top of the acid and alkali resistant and high temperature resistant layer, and a buffer rod is installed on the buckle; the hardness of the buffer rod is less than that of the silicon wafers.

[0014] The utility model can achieve the following beneficial effects:

[0015] 1. Reduce silicon wafer damage: By improving the design of the bottom rod of the silicon wafer cleaning carrier, hard contact between the silicon wafer and the bottom rod of the cleaning carrier is avoided, thereby reducing the possibility of chipping of the silicon wafer when it is inserted into the cleaning carrier, effectively protecting the silicon wafer, and improving the quality of the silicon wafer.

[0016] 2. Improve the cleaning effect: Due to avoiding hard contact, the bottom rod of the silicon wafer cleaning carrier of the utility model will not form contact cleaning marks - carrier marks during chemical cleaning of the silicon wafer, thereby improving the cleaning effect of the silicon wafer, facilitating the removal of residues such as silicon powder, metal ions, and organic substances on the surface of the silicon wafer, and improving the performance of the silicon wafer.

[0017] 3. Improve the efficiency and lifespan of photovoltaic cells: Since the quality and cleaning effect of the silicon wafers are improved, the utility model helps to improve the efficiency and lifespan of subsequent photovoltaic cells, which is of great significance for the development of the photovoltaic industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following further illustrates the utility model in conjunction with the drawings and embodiments:

[0019] Figure 1 is a three-dimensional structure diagram of the silicon wafer cleaning carrier;

[0020] Figure 2 is Figure 1 the enlarged view at A in

[0021] Figure 3 It is a top view of a wafer cleaning basket;

[0022] Figure 4 It is a structural diagram of the bottom rod of the wafer cleaning basket.

[0023] In the figure: U-shaped side plate 1, side rod 2, bottom rod 3, wafer insertion slot 4, buffer rod 5, mounting hole 6, buckle 7. Specific implementation manners

[0024] The preferred solution is as Figures 1 to 3 shown. A wafer cleaning basket includes: U-shaped side plates 1. There are multiple side rods 2 and multiple bottom rods 3 between two U-shaped side plates 1. There are several wafer insertion slots 4 on the side rods 2. Two wafer insertion slots 4 form a group for limiting the wafers; the bottom rod 3 is used to support the bottom of the wafers. The hardness of the bottom rod 3 and the wafer insertion slots 4 is less than the hardness of the wafers.

[0025] The number of side rods 2 is 8. There are 4 side rods 2 on each side of the U-shaped side plate 1. Every 2 side rods 2 form a group. There is a row of wafer insertion slots 4 on each group of side rods 2. There are a total of four rows of wafer insertion slots 4. Wafers can be inserted between two opposite insertion slots 4. Several wafers can be inserted into the wafer cleaning basket at one time.

[0026] Further, the bottom rod 3 includes a stainless steel rod core, and an acid and alkali resistant and high temperature resistant layer is provided outside the stainless steel rod core. The stainless steel rod core is used to ensure the hardness of the bottom rod 3. The hardness of the acid and alkali resistant and high temperature resistant layer is less than the hardness of the wafers to avoid damage to the wafers.

[0027] Further, a buckle is provided at the top of the acid and alkali resistant and high temperature resistant layer, and a buffer rod 5 is installed on the buckle. The buffer rod 5 and the acid and alkali resistant and high temperature resistant layer can be made of PVDF. PVDF has acid and alkali resistance and high temperature resistance, and its hardness is less than that of the wafers, avoiding hard contact between the wafers and rigid materials. The buffer rod 5 can effectively reduce the probability of wafer chipping. And the buffer rod 5 can be replaced after being damaged.

[0028] Further, the wafer insertion slot 4 is made of an elastic material. The wafer insertion slot 4 can be made of PVDF material.

[0029] Further, mounting holes 6 are provided on the U-shaped side plate 1. The mounting holes 6 are used to connect to the machine frame.

[0030] Preferably, the buffer rod 5 can be a round rubber band made of a material with certain elasticity such as polyurethane to reduce the impact force when the wafers are inserted into the cleaning basket, avoid wafer chipping, and at the same time reduce the contact area between the wafers and the bottom rod of the cleaning basket, thereby reducing the contact cleaning marks - basket marks and improving the cleaning effect.

[0031] In addition, during the process of silicon wafer cleaning, optimized cleaning process parameters are adopted, such as the temperature, concentration, and cleaning time of the cleaning solution, to further improve the cleaning effect and remove residues such as silicon powder, metal ions, and organic substances on the surface of the silicon wafer. After the silicon wafer cleaning is completed, strict quality control and detection methods are used to comprehensively inspect and evaluate the surface quality, cleanliness, etc. of the silicon wafer to ensure that the quality of the silicon wafer meets the requirements of subsequent photovoltaic cell manufacturing.

[0032] As Figure 4 shown, a bottom rod of a silicon wafer cleaning basket includes a rod core. An acid and alkali resistant and high temperature resistant layer is provided outside the rod core. A buckle is provided at the top of the acid and alkali resistant and high temperature resistant layer, and a buffer rod 5 is installed on the buckle; the hardness of the buffer rod 5 is less than the hardness of the silicon wafer. The buffer rod 5 and the acid and alkali resistant and high temperature resistant layer can be made of PVDF. PVDF has acid and alkali resistance and high temperature resistance, and its hardness is less than that of the silicon wafer, avoiding hard contact between the silicon wafer and rigid materials. The buffer rod 5 can effectively reduce the probability of silicon wafer edge chipping. And the buffer rod 5 can be replaced after being damaged.

[0033] The above embodiments are only the preferred technical solutions of the present invention and should not be regarded as limitations on the present invention. The protection scope of the present invention should be the technical solutions recorded in the claims, including the equivalent replacement solutions of the technical features in the technical solutions recorded in the claims. That is, equivalent replacement improvements within this scope are also within the protection scope of the present invention.

Claims

1. A silicon wafer cleaning basket, characterized in that: It comprises a U-shaped side plate (1), a plurality of side bars (2) and a plurality of bottom bars (3) are arranged between two U-shaped side plates (1), a plurality of silicon wafer insertion slots (4) are arranged on the side bars (2), two silicon wafer insertion slots (4) form a group and are used to limit the position of the silicon wafer; the bottom bars (3) are used to support the bottom of the silicon wafer; and the hardness of the bottom bars (3) and the silicon wafer insertion slots (4) is less than the hardness of the silicon wafer.

2. The silicon wafer cleaning basket according to claim 1, characterized in that: The bottom rod (3) comprises a stainless steel rod core, and an acid, alkali and high temperature resistant layer is provided on the outside of the stainless steel rod core.

3. The silicon wafer cleaning basket according to claim 2, characterized in that: A buckle is provided on the top of the acid, alkali and high temperature resistant layer, and a buffer rod (5) is installed on the buckle.

4. The silicon wafer cleaning basket according to claim 1, characterized in that: The silicon chip insertion slot (4) is made of elastic material.

5. The silicon wafer cleaning basket according to claim 1, characterized in that: The U-shaped side plate (1) is provided with a mounting hole (6).

6. The silicon wafer cleaning basket according to claim 1, characterized in that: The acid, alkali and high temperature resistant layer is made of PVDF.

7. A bottom rod of a silicon wafer cleaning basket, characterized in that: It comprises a rod core, an acid, alkali and high temperature resistant layer is arranged on the outside of the rod core, a buckle is arranged on the top of the acid, alkali and high temperature resistant layer, and a buffer rod (5) is mounted on the buckle; the hardness of the buffer rod (5) is less than the hardness of the silicon wafer.

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