Silicon wafer suction device and carrying equipment

Abstract

The utility model relates to the technical field of suction cups, in particular to a silicon wafer suction device and carrying equipment. The silicon wafer suction device comprises a support sleeve. The telescopic inner pipe is arranged in the support sleeve in a sliding mode, and the telescopic inner pipe is provided with an air source channel; the sucking disc is arranged at the bottom of the telescopic inner pipe and is communicated with the air source channel in the telescopic inner pipe; one end of the elastic piece is connected with the telescopic inner pipe, the other end of the elastic piece is connected with the support sleeve, and the elastic piece is in a stretching state. According to the device, the elastic piece lifts the telescopic inner pipe, the pressure of the gravity of the telescopic inner pipe to the suction cup is reduced to the maximum extent, it can be ensured that under the same downward pressing distance, the risk that suction cup marks are generated due to the fact that downward pressing force is too large is greatly reduced, and the yield is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of suction cups, in particular to a silicon wafer suction device and a handling device. Background Art

[0002] In order to reduce the production cost of high-efficiency heterojunction batteries, PECVD equipment suppliers usually expand the cavity and the carrier plate as much as possible to improve the single-line production capacity. However, the larger the area of the carrier plate, the more difficult it is to control its deformation, and generally the maximum allowable deformation of the carrier plate is less than 6 mm.

[0003] After the silicon wafers are coated, they are transferred out together with the carrier plate, and the gantry mechanism sucks a row of silicon wafers from the carrier plate at one time. Since the carrier plate is bound to have deformation and the deformation of each carrier plate is inconsistent, when the suction cups suck the silicon wafers from the carrier plate, there must be some suction cups with too large a pressing distance and some suction cups with too large a pressing force. Moreover, as the silicon wafers become thinner, the thin silicon wafers can withstand less pressing force and are more likely to produce suction cup marks.

[0004] Such as the conventional suction cup mounting bracket in the prior art, as Figure 1 shown, it includes an outer bracket 7, a telescopic inner tube 2, a spring 8, a suction cup 3, an air pipe joint 6 and other structures. Among them, the air pipe joint is installed at the top of the telescopic inner tube and is integrally connected with it. A suction cup is installed at the bottom of the telescopic inner tube. When the suction cup presses down on the silicon wafer, the telescopic inner tube will be pushed up, and the air pipe has a certain elasticity. At this time, the silicon wafer will be subjected to three forces, namely, the gravity of the telescopic inner tube, the tension of the spring, and the additional pressure of the air pipe. The pressing force is too large, and it is easy to produce suction cup marks.

[0005] Based on this, a new type of silicon wafer suction device and a handling device are developed in the present utility model to solve the above problems. Summary of the Utility Model

[0006] An object of the present utility model is to provide a silicon wafer suction device. In this device, an elastic member lifts the telescopic inner tube, minimizing the pressure brought by the gravity of the telescopic inner tube itself to the suction cup, that is, the pressure borne by the silicon wafer is less than the gravity of the telescopic inner tube, which can ensure that at the same pressing distance, the risk of producing suction cup marks due to too large a pressing force is greatly reduced, and the yield is improved.

[0007] The present utility model adopts the following technical solutions: A silicon wafer suction device, comprising:

[0008] A support sleeve;

[0009] A telescopic inner tube, slidably arranged in the support sleeve, and the telescopic inner tube has a gas source channel;

[0010] The suction cup is arranged at the bottom of the telescopic inner tube and is communicated with the air source channel in the telescopic inner tube;

[0011] The elastic member, one end of the elastic member is connected to the telescopic inner tube, and the other end is connected to the support sleeve and is in a stretched state.

[0012] Further, an air pipe joint is installed on the support sleeve, and an air inlet hole is opened at the air source channel of the telescopic inner tube. The air source channel is communicated with the air pipe joint through the air inlet hole.

[0013] Further, the air inlet hole is a long strip hole.

[0014] Further, an external thread is formed on the outer wall surface of the support sleeve, and two spaced mounting nuts are sleeved on the external thread. Both mounting nuts are threadedly connected to the external thread of the support sleeve, and the gap formed between the two mounting nuts is used for the installation and fixation of the silicon wafer suction device.

[0015] Further, an annular flange is formed on the outside of the telescopic inner tube, and a limiting step is formed on the inner wall of the support sleeve. The limiting step is used for limiting the annular flange so that at least part of the telescopic inner tube is kept inside the support sleeve.

[0016] Further, an adjusting assembly is further included. The adjusting assembly is installed at the top of the support sleeve, and the other end of the elastic member is connected to the adjusting assembly. The adjusting assembly is used for adjusting the position of the elastic member inside the support sleeve.

[0017] Further, the adjusting assembly includes an adjusting screw. The adjusting screw is arranged along the axial direction of the support sleeve and is threadedly connected to the top of the support sleeve. The other end of the elastic member is fixedly connected to the adjusting screw.

[0018] Further, the adjusting assembly further includes a locking nut; the locking nut is sleeved on the adjusting screw.

[0019] Further, the elastic member is a tension spring.

[0020] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0021] In the silicon wafer suction device of the present utility model, when in the working state, the support sleeve is kept fixed, and the telescopic inner tube and the suction cup are installed in the inner cavity of the support sleeve by means of the locking assembly and the elastic member. When it is necessary to suck materials such as silicon wafers, the air source channel is subjected to vacuum treatment and acts on the suction cup, and the suction cup thus adsorbs the silicon wafer. And under the pulling force of the elastic member, the telescopic inner tube moves upward along the axial direction of the support sleeve, driving the suction cup and the silicon wafer to move upward together.

[0022] Compared with the prior art, the present application adds an elastic member that is always in a stretched state. When sucking the silicon wafer, the telescopic inner tube moves synchronously. At this time, the elastic member lifts the telescopic inner tube, minimizing the pressure exerted on the suction cup by the self-gravity of the telescopic inner tube. That is, the pressure borne by the silicon wafer is less than the gravity of the telescopic inner tube, which can ensure that under the same downward pressing distance, the pressure exerted by the suction cup on the silicon wafer is significantly reduced compared to the conventional solution. Furthermore, it greatly reduces the risk of suction cup marks caused by excessive downward pressure, improving the yield rate.

[0023] 2) Since the tracheal joint is installed on the support sleeve, the telescopic inner tube will not be affected by the additional force caused by the deformation of the trachea during operation, eliminating the force exerted by the trachea on the suction cup.

[0024] 3) The locking component is an adjustment component used to adjust the extended length of the suction cup, increasing the flexibility and versatility of the device, enabling it to adapt to the requirements of different working scenarios and silicon wafer sizes; at the same time, it can also more precisely control the contact position and pressure between the suction cup and the silicon wafer, improving the stability and reliability of suction, and facilitating fine adjustment during actual operation to achieve the best suction effect.

[0025] Another object of the present utility model is to provide a handling device, which includes the above-mentioned silicon wafer suction device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of a conventional suction cup mounting bracket in the prior art;

[0028] Figure 2 It is a three-dimensional structural diagram of the silicon wafer suction device in a specific embodiment of the present utility model;

[0029] Figure 3 It is a cross-sectional view of the silicon wafer suction device in a specific embodiment of the present utility model;

[0030] Figure 4 For Figure 2 the structural schematic diagram of the support sleeve in

[0031] Figure 5 For Figure 2 the cross-sectional view of the structure of the support sleeve in

[0032] Figure 6 For Figure 2Schematic diagram of the middle adjusting screw, elastic member, telescopic inner tube and suction cup structure;

[0033] In the figure: bracket sleeve 1, external thread 10, mounting nut 11; telescopic inner tube 2, air source channel 20, air inlet hole 21, annular flange 22; suction cup 3; locking assembly 4, adjusting screw 40, locking nut 41; elastic member 5; air pipe joint 6; outer bracket 7; spring 8. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present invention.

[0035] Next, in conjunction with the attached Figure 2 To the attached Figure 6 And specific embodiments, the present invention will be elaborated in detail:

[0036] As Figures 2 to 6 shown, the present invention provides a silicon wafer suction device, which includes:

[0037] Bracket sleeve 1, in the shape of a long strip tube;

[0038] Telescopic inner tube 2, in the shape of a long strip, slidably arranged in the bracket sleeve 1, and the telescopic inner tube 2 has an air source channel 20;

[0039] Suction cup 3, arranged at the bottom of the telescopic inner tube 2 and communicating with the air source channel 20 in the telescopic inner tube 2, for sucking materials such as silicon wafers; in the present invention, the specific structure, shape, etc. of the suction cup 3 are not limited, and can be designed by those skilled in the art according to the actual situation. For example, in this embodiment, the suction cup 3 is in the shape of a trumpet opening, which can increase the suction area;

[0040] The elastic member 5 is arranged at the top of the telescopic inner tube 2, and the elastic member 5 is always in a stretched state. One end of the elastic member 5 is connected to the telescopic inner tube 2, and the other end is connected to the support sleeve 1. It should be noted that in the present utility model, the specific connection positions between the elastic member 5 and the telescopic inner tube 2 and the support sleeve 1 are not limited. For example, one end of the elastic member 5 can be connected to the top of the telescopic inner tube 2, and the other end can be fixedly connected to the side wall or the top wall of the top of the support sleeve 1, etc. Preferably, however, the elastic member 5 is vertically arranged at the top of the telescopic inner tube 2. One end of the elastic member 5 is fixedly connected to the top wall of the top of the telescopic inner tube 2, and the other end is fixedly connected to the inner top wall of the top of the support sleeve 1. The vertical arrangement can ensure that the force borne by the elastic member 5 during the telescopic process is along its axis direction, avoiding the decomposition and uneven distribution of the force caused by inclination, thereby providing a more stable and consistent tensile force. At the same time, the lateral component force that may be generated by the inclined arrangement is avoided, reducing the additional pressure and wear on the side walls of the telescopic inner tube 2 and the support sleeve 1, and extending the service life of the components.

[0041] In the working state, the support sleeve 1 is fixed, and the telescopic inner tube 2 can move up and down relative to the support sleeve 1 along the axis direction of the support sleeve 1.

[0042] In the present utility model, when the silicon wafer suction device is in the working state, the support sleeve 1 remains fixed, and the telescopic inner tube 2 and the suction cup 3 are installed in the inner cavity of the support sleeve 1 by means of the elastic member 5. When it is necessary to suck materials such as silicon wafers, the air source channel 20 is subjected to vacuum treatment and acts on the suction cup 3, and the suction cup 3 thus adsorbs the silicon wafer. Under the tensile force of the elastic member 5, the telescopic inner tube 2 moves upward along the axis direction of the support sleeve 1, driving the suction cup 3 and the silicon wafer to move upward together.

[0043] Compared with the prior art, the present application adds the elastic member 5 that is always in a stretched state. When sucking the silicon wafer, the telescopic inner tube 2 moves synchronously. At this time, the elastic member 5 lifts the telescopic inner tube 2, minimizing the pressure brought by the gravity of the telescopic inner tube 2 itself to the suction cup 3 to the greatest extent. At this time, the force received by the silicon wafer is: the gravity of the telescopic inner tube 2 minus the tensile force of the elastic member 5, that is, the pressure borne by the silicon wafer is less than the gravity of the telescopic inner tube 2, which can ensure that under the same downward pressing distance, the pressure applied by the suction cup 3 to the silicon wafer is significantly reduced compared with the conventional scheme, thereby greatly reducing the risk of suction cup marks caused by excessive downward pressure and improving the yield.

[0044] Further, as Figure 2 、 3As shown, an air pipe joint 6 is installed on the support sleeve 1, and an air inlet hole 21 is opened at the air source channel 20 of the telescopic inner tube 2. The air source channel 20 is communicated with the air pipe joint 6 through the air inlet hole 21, so as to realize the airtight connection between the air source channel 20 and the air pipe joint 6. The airtight connection is realized in a completely closed state. The air inlet hole 21 is a long strip hole to ensure that the air source channel 20 and the air pipe joint 6 can be connected through the air inlet hole 21 within the stroke range of the telescopic inner tube 2. During use, the air pipe joint 6 is used to connect with the air pipe, and the air source channel 20 is vacuum-treated from the air pipe joint 6. Since the air pipe joint 6 is installed on the support sleeve 1, the telescopic inner tube 2 will not be affected by the extra force caused by the deformation of the air pipe during operation, eliminating the force exerted by the air pipe on the suction cup 3. It should be noted that in the present utility model, the specific structure of the air pipe joint 6, the installation position, and the opening position of the air source channel 20 are not specifically limited, as long as the above functions can be realized. In this embodiment, the air pipe joint 6 is installed in the middle of the support sleeve 1, as Figure 6 shown, the air source channel 20 is arranged along the axial direction of the telescopic inner tube 2, extending from the top to the bottom of the telescopic inner tube 2. The top of the air source channel 20 is closed, and the bottom is non-closed and communicated with the suction cup 3 for sucking materials such as silicon wafers.

[0045] Specifically, as Figure 4 , 5 , 6 shown, a ring-shaped flange 22 is formed on the outer side of the telescopic inner tube 2, and a limiting step 12 is formed on the inner wall of the support sleeve 1. The limiting step 12 is used to limit the ring-shaped flange 22 in the middle of the telescopic inner tube 2, so that at least part of the telescopic inner tube 2 is kept inside the support sleeve 1. The setting of the limiting step 12 can accurately control the sliding range of the telescopic inner tube 2, prevent it from moving excessively, and ensure the reliability and stability of the operation of the whole device.

[0046] It should be noted that the present utility model does not specifically limit how to realize the airtight connection between the air source channel 20 and the air pipe joint 6, which can be designed by those skilled in the art according to the actual situation. However, preferably, as in this embodiment, as Figure 6 shown, ring-shaped flanges 22 protruding in the radial direction of the telescopic inner tube 2 are formed at both the top and the middle of the telescopic inner tube 2. The telescopic inner tube 2 is placed in the inner cavity of the support sleeve 1, and the ring-shaped flange 22 of the telescopic inner tube 2 is in close contact with the inner wall of the support sleeve 1 to form an airtight cavity. Correspondingly, the air inlet hole 21 is opened at the position between the top and the middle of the telescopic inner tube 2. Then, the vacuum will enter the airtight cavity from the air pipe joint 6, and then enter the air source channel 20 through the air inlet hole 21, and then be transported to the suction cup 3 to realize the airtight transportation of the vacuum.

[0047] Furthermore, as Figure 2As shown in the figure, external threads 10 are formed on the outer wall surface of the support sleeve 1. Two spaced-apart mounting nuts 11 are sleeved on the external threads 10. Both of the two mounting nuts 11 are threadedly connected to the external threads 10 of the support sleeve 1. The gap formed between the two mounting nuts 11 is used for the installation and fixation of the wafer suction device. During use, by relatively rotating the two mounting nuts 11, the two mounting nuts 11 are urged to move towards each other, thereby clamping the components on the manipulator, fixing the support sleeve 1 on the manipulator, realizing rapid clamping and loosening operations, and further realizing the installation and fixation of the wafer suction device. At the same time, through the cooperation of the two mounting nuts 11 and the external threads 10, the clamping position and force can be flexibly adjusted to adapt to the clamping requirements of components of different sizes and shapes, improving the versatility and practicality of the device. In addition, the mounting nut is a standard part with a simple structure, easy to manufacture and obtain, reducing the production cost and procurement difficulty.

[0048] Further, as Figure 2 , 3 , and Figure 6 show, the wafer suction device further includes an adjustment assembly 4. The adjustment assembly 4 is installed at the top of the support sleeve 1. The other end of the elastic member 5 is connected to the bottom of the adjustment assembly 4. The adjustment assembly 4 is used to adjust the position of the elastic member 5 within the support sleeve 1, and further adjust the protruding length of the suction cup 3, increasing the flexibility and versatility of the device, enabling it to adapt to the requirements of different working scenarios and wafer sizes; at the same time, the contact position and pressure between the suction cup 3 and the wafer can be more accurately controlled, improving the stability and reliability of suction, and facilitating fine adjustment during actual operation to achieve the best suction effect.

[0049] Specifically, the adjustment assembly 4 includes an adjustment screw 40. The adjustment screw 40 is arranged along the axial direction of the support sleeve 1. The bottom of the adjustment screw 40 extends into the support sleeve 1 and is threadedly connected to the top of the support sleeve 1. The other end of the elastic member 5 is fixedly connected to the bottom of the adjustment screw 4, realizing the adjustment of the installation height of the adjustment screw 40, and further adjusting the protruding length of the suction cup 3. With this design of the adjustment screw 40, the thread adjustment has high precision and can achieve fine and accurate length adjustment. At the same time, its structure is simple and the operation is convenient. Only by rotating the adjustment screw can the adjustment action be completed. In addition, the threaded connection has good self-locking property, which can maintain a stable state after adjustment and is not prone to self-change.

[0050] Specifically, the adjustment assembly 4 may further include a lock nut 41; the lock nut 41 is sleeved on the adjustment screw 40. After the adjustment screw 40 completes the adjustment of the protruding length of the suction cup 3 and reaches the ideal state, due to possible vibrations or other external force interferences during the operation of the equipment, relying only on the threaded connection between the adjustment screw 40 and the top of the support sleeve 1 may gradually loosen, resulting in a decrease in adjustment accuracy or even failure. The added lock nut 41 can further enhance the stability and reliability of the connection of the adjustment screw 40, effectively preventing it from loosening during work, ensuring that the adjustment effect of the protruding length of the suction cup 3 is maintained stably for a long time, thereby guaranteeing the normal and precise operation of the entire silicon wafer suction device.

[0051] Further, as Figure 2 , 6 shown, in this embodiment, the elastic member 5 is a tension spring; the tension spring has good tensile properties and elastic recovery ability. When the telescopic inner tube 2 moves up and down relative to the support sleeve 1, the tension spring can provide a stable pulling force, making the movement of the telescopic inner tube 2 smoother and more controllable; moreover, the structure of the tension spring is relatively simple, the cost is low, and it is easy to install and maintain; in addition, the elastic coefficient of the tension spring is relatively stable, and it can provide a relatively constant pulling force, which helps to ensure the consistency and stability of the silicon wafer suction device during work.

[0052] More preferably, the tension spring is a low-elasticity coefficient tension spring. The low-elasticity coefficient tension spring can provide a relatively gentle pulling force. When the telescopic inner tube 2 moves relative to the support sleeve 1, this gentle pulling force can make the movement smoother and reduce the impact and vibration caused by excessive pulling force, thereby reducing the wear and damage to the overall structure of the silicon wafer suction device and extending the service life of the device. At the same time, the relatively gentle pulling force can enable the suction cup 3 to more accurately control the contact force when sucking materials such as silicon wafers, avoiding excessive squeezing and damage to the silicon wafers due to excessive pulling force, and ensuring the integrity and quality of the silicon wafers.

[0053] Based on the above silicon wafer suction device, the present utility model further provides a handling device, including the above silicon wafer suction device. The handling device provided by the present utility model adopts all the technical solutions of all embodiments of the above silicon wafer suction device, so it has at least all the beneficial effects brought by the technical solutions of the above silicon wafer suction device embodiments, which will not be elaborated here one by one.

[0054] The above further describes the present utility model with the aid of specific embodiments. However, it should be understood that this specific description should not be construed as a limitation on the essence and scope of the present utility model. Various modifications made by those of ordinary skill in the art to the above embodiments after reading this specification all fall within the scope protected by the present utility model.

Claims

1. A silicon wafer suction device, characterized in that: include: Stent sleeve; A telescopic inner tube, slidably disposed in the support sleeve, the telescopic inner tube having an air source channel; A suction cup, arranged at the bottom of the telescopic inner tube and connected to the air source channel in the telescopic inner tube; An elastic member, one end of which is connected to the telescopic inner tube, and the other end of which is connected to the support sleeve and is in a stretched state.

2. The silicon wafer suction device according to claim 1, characterized in that: An air pipe joint is installed on the support sleeve, and an air inlet hole is opened at the air source channel of the telescopic inner tube. The air source channel is connected to the air pipe joint through the air inlet hole.

3. The silicon wafer suction device according to claim 2, characterized in that: The air inlet hole is a long hole.

4. The silicon wafer suction device according to claim 1, characterized in that: An external thread is formed on the outer wall surface of the bracket sleeve, and two installation nuts arranged at intervals are sleeved on the external thread. The two installation nuts are threadedly connected to the external thread of the bracket sleeve, and the gap formed between the two installation nuts is used for installation and fixation of the silicon wafer suction device.

5. The silicon wafer suction device according to claim 1, characterized in that: An annular flange is formed on the outer side of the telescopic inner tube, and a limiting step is formed on the inner wall of the bracket sleeve. The limiting step is used to limit the annular flange so that the telescopic inner tube is at least partially retained in the bracket sleeve.

6. The silicon wafer suction device according to claim 1, characterized in that: It also includes an adjustment component, which is installed on the top of the bracket sleeve. The other end of the elastic member is connected to the adjustment component, and the adjustment component is used to adjust the position of the elastic member in the bracket sleeve.

7. The silicon wafer suction device according to claim 6, characterized in that: The adjusting assembly comprises an adjusting screw, which is arranged along the axial direction of the bracket sleeve and is threadedly connected to the top of the bracket sleeve, and the other end of the elastic member is fixedly connected to the adjusting screw.

8. The silicon wafer suction device according to claim 7, characterized in that: The adjusting assembly also includes a locking nut; the locking nut is sleeved on the adjusting screw.

9. The silicon wafer suction device according to claim 1, characterized in that: The elastic member is a tension spring.

10. A handling device, characterized in that: A silicon wafer suction device comprising the silicon wafer suction device according to any one of claims 1 to 9.

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