Quartz resonator clamp preset salient point connecting device

Abstract

The utility model discloses a preset salient point connecting device for a quartz resonator clamp. The preset salient point connecting device comprises two parts, namely a clamp and a preset salient point, specifically, the clamps are installed on the connecting base in pairs, gaps are designed in the middles of the clamps and used for clamping the quartz wafer, a plurality of pre-arranged protruding points are arranged in the clamps and further fixedly make contact with the quartz wafer, and the surfaces of the protruding points are coated with a layer of low-melting-point metal. After a quartz wafer is placed in the clamp, the gap is coated with a small amount of conductive silver adhesive, and heating curing treatment is carried out to promote fusion of the low-melting-point metal and the conductive silver adhesive, so that firm connection and electrical interconnection with the quartz wafer are realized. According to the technical scheme, the connection stability is enhanced, the contact resistance is reduced, and the usage amount of the conductive silver adhesive is saved.

Description

Technical Field

[0001] The utility model relates to the field of quartz resonator manufacturing, and specifically relates to a quartz resonator fixture pre - set bump connection device. Background Art

[0002] A quartz resonator is a key component widely used in electronic devices, especially playing a crucial role in ensuring accurate timing, such as in applications like clocks, radio communication devices, and computers. This accuracy depends on the inherent property of the quartz crystal to oscillate at a specific frequency. During the processing, after the quartz wafer (SiO 2 ) is plated with metal electrodes, it needs to be placed on a fixture device. Conductive silver glue is coated at the connection between the fixture and the quartz wafer. After heating and curing, signals can be transmitted externally through the electrodes. The performance and reliability of the quartz resonator directly depend on the connection method between its internal crystal and the external circuit. Conventionally, the connection area between the quartz wafer and the fixture is small and prone to detachment. A large amount of conductive silver glue needs to be coated to achieve a stable connection, resulting in waste and at the same time reducing the electromechanical coupling performance.

[0003] In view of the above problems, the utility model proposes a quartz resonator pre - set bump connection device. By pre - designing and processing bumps with precise dimensions and positions on the fixture, and then using these bumps to clamp and fix the quartz wafer, and then coating a small amount of conductive silver glue, the consumption of conductive silver glue can be saved. Summary of the Utility Model

[0004] In view of the problems existing in the prior art, the utility model provides a quartz resonator pre - set bump connection device, which is achieved through the following technical means:

[0005] 1. Two support feet 3 are arranged vertically and parallelly, vertically passing through the connecting seat 2, and the support feet 3 and the connecting seat are insulated from each other.

[0006] 2. The upper end of the support foot 3 is connected with a fixture 1. The fixture 1 is in the shape of a frustum of a pyramid and is a shell - like structure. There is a gap for clamping the quartz wafer 4 in the middle. The width of the gap is determined according to the actual thickness of the quartz wafer 4, slightly larger than the thickness of the quartz wafer 4, generally 0.4 - 0.8 mm, to facilitate the insertion of the quartz wafer.

[0007] 3. The pre - set bumps 5 can be formed by spot welding, stamping, etching, physical vapor deposition, etc., and are distributed on the inner side of the fixture 1. Different pre - set bumps 5 are arranged in a staggered manner. The pre - set bumps 5 are perpendicular to the quartz wafer 4, with a height of about 200 μm and a cross - sectional diameter of about 400 μm. The shape can be a cylinder or a combination of a cylinder and a hemisphere to ensure that the force exerted by the bumps on clamping the quartz wafer is evenly distributed.

[0008] 4. The surface of the bump 5 is coated with a layer of low-melting-point metal, which can be indium, lead-tin alloy, antimony-lead alloy, indium-bismuth-tin alloy or other metals or alloys with a melting point close to that of the conductive silver paste. The coating thickness of the low-melting-point metal layer is in the range of 50-100 μm. When the conductive silver paste is coated at the connection 6 between the fixture 1 and the quartz wafer 4 and then cured by heating, the low-melting-point metal fuses with the conductive silver paste. Due to the presence of the pre-set bump 5, the amount of conductive silver paste can be saved on the premise of forming a stable connection path. Brief Description of the Drawings

[0009] Figure 1 is the front view of the device provided by the embodiment of the present invention, where: 1 is the fixture, 2 is the connection base, 3 is the support leg, 4 is the quartz wafer, 5 is the pre-set bump, the dotted line indicates the inside, 6 is the coating point of the conductive silver paste, and 7, 8 are Figure 2 , Figure 3 cutting surfaces.

[0010] Figure 2 is the top view of the cut surface seen after cutting along the plane 7 provided by the embodiment of the present invention, where: 1 is the fixture, 4 is the quartz wafer, and 5 is the pre-set bump.

[0011] Figure 3 is the side view of the cut surface seen after cutting along the plane 8 provided by the embodiment of the present invention, where: 1 is the fixture, 4 is the quartz wafer, and 5 is the pre-set bump.

[0012] Figure 4 is the distribution diagram of the pre-set bumps provided by the embodiment of the present invention, where: 1 is the fixture and 5 is the pre-set bump. Detailed Embodiment

[0013] In the present invention, the fixtures 1 are mounted on the connection base 2 in pairs, with a gap designed in the middle of the fixtures for clamping the quartz wafer 4. There are several pre-set bumps 5 inside the fixtures to further fix and contact the quartz wafer, and the surface of the pre-set bumps 5 is coated with a layer of low-melting-point metal. After placing the quartz wafer 4 in the fixture 1, a small amount of conductive silver paste is coated at the gap 6 and then cured by heating to promote the fusion of the low-melting-point metal and the conductive silver paste, thereby achieving a firm connection and electrical interconnection with the quartz wafer. To make the content, features and effects of the present invention clearer and more feasible, the following is further described with reference to the drawings. It should be understood that the specific embodiments provided herein are only for better explaining the present invention and do not limit the present invention.

[0014] Please refer to Figure 1, Two support feet 3 are arranged vertically and parallelly, passing through the connecting seat 2 perpendicularly, and being insulated between the support feet and the connecting seat. The upper end of the support foot 3 is connected with a clamp 1. The clamp 1 is in the shape of a frustum of a pyramid and is a shell-like structure, with a gap for clamping the quartz wafer 4 left in the middle. The width of the gap is 0.4 - 0.8 μm larger than the thickness of the quartz wafer 4, which is convenient for putting in the quartz wafer.

[0015] Please refer to Figure 2 , Figure 3 , Figure 4 , The pre-set bumps 5 are formed on the inner side of the clamp 1 by methods such as spot welding, stamping, etching, and physical vapor deposition, mainly distributed at the places where the inner side of the clamp 1 is connected with the electrode pattern of the quartz wafer. 1 - 3 columns of pre-set bumps 5 are set as required, and the bumps are arranged in a staggered manner. The pre-set bumps 5 are perpendicular to the quartz wafer 4, with a height of 200 μm and a cross-sectional diameter of 400 μm, and the shape is a cylinder or a combination of a cylinder and a hemisphere, so as to ensure that the force exerted by the bumps on clamping the quartz wafer is evenly distributed. The surface of the bumps is coated with a layer of low-melting-point metal such as indium, lead-tin alloy, antimony-lead alloy, indium-bismuth-tin alloy, or other metals or alloys with a melting point close to that of the conductive silver paste, and the coating thickness is 50 - 100 μm. When the conductive silver paste is coated at the connection 6 between the clamp 1 and the quartz wafer 4 and heated and cured, a stable connection is formed.

[0016] The working principle of the present utility model:

[0017] In this device, the support feet 3 play a supporting role, the connecting seat 2 ensures the stability of the structure, and the clamp 1 clamps the quartz wafer 4. After putting the quartz wafer plated with metal electrodes into the clamp, multiple pre-set bumps 5 distributed on the inner side of the clamp 1 are connected and fixed with the quartz wafer 4 at the electrode positions. Conductive silver paste is applied at the connection and heated and cured. Since the melting point of the low-melting-point metal coated on the pre-set bumps is close to the curing temperature of the conductive silver paste, heating and curing will cause the metal coating to melt and fuse with the conductive silver paste. After solidification, a stable path is formed, enabling the resonant signal of the quartz wafer to be conducted outward through the electrode circuit. The introduction of the pre-set bumps 5 can not only better fix the quartz wafer 4, but also the conductive silver paste only needs to be coated at the connection 6, saving the usage amount of the conductive silver paste.

[0018] It should be noted that the above are only representative embodiments of the present utility model, and do not impose any form of limitation on the present utility model. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model all fall within the scope of the technical solution of the present utility model. At the same time, the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present application. Unless otherwise clearly specified and defined, terms such as "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

Claims

1. A quartz resonator fixture pre-bump connection device, characterized in that: The clamp (1) is installed on the connecting seat (2), the clamp (1) has a gap in the middle for clamping the quartz wafer (4), and has a plurality of preset bumps (5) inside, and the surface of the bumps is coated with a layer of low melting point metal.

2. A quartz resonator fixture pre-bump connection device according to claim 1, characterized in that: The clamp (1) is in the shape of a prism and a shell-like structure, with a gap in the middle for clamping the quartz wafer (4). The width of the gap is determined according to the actual thickness of the quartz wafer (4) and is 0.4-0.8 mm greater than the thickness of the quartz wafer (4).

3. A quartz resonator fixture pre-bump connection device according to claim 1, characterized in that: The preset bumps (5) are distributed inside the fixture (1), the preset bumps (5) are perpendicular to the quartz wafer (4), the overall height of the preset bumps is 200 μm, the cross-sectional diameter is about 400 μm, the shape can be a cylinder or a combination of a cylinder and a hemisphere, and the preset bumps (5) are arranged and distributed in a staggered manner.

4. A quartz resonator fixture pre-bump connection device according to claim 1, characterized in that: The pre-set convex point (5) can be formed by spot welding, stamping, corrosion, or physical vapor deposition.

5. A quartz resonator fixture pre-bump connection device according to claim 1, characterized in that: The melting point of the metal coated on the surface of the preset bump (5) is close to that of the conductive silver paste, and indium, lead-tin alloy, antimony-lead alloy, indium-bismuth-tin alloy can be selected. The coating thickness of the low-melting-point metal layer is in the range of 50-100 μm.

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