Router radiator

By adopting a single-point glue injection injection molding method and the design of dispersed bonding surfaces in the router radiator, the problems of uneven bonding surfaces, burrs and insufficient strength in the router radiator in the prior art are solved, and high strength, flatness and efficient heat dissipation of the parts are achieved.

CN222940830UActive Publication Date: 2025-06-03BENSONG ENG PLASTICS HANGZHOU +1
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Patent Information

Application Number
CN202323555822.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-26
Publication Date
2025-06-03
Estimated Expiration
2033-12-26

AI Technical Summary

Technical Problem

Existing router radiators have problems of unevenness, burrs and insufficient strength at the bonding surface, especially when using thermal conductive plastics, welding marks and stress concentrations caused by molding shrinkage and multi-point glue injection methods.

Method used

The router radiator is formed by a thermally conductive plastic. Through the injection molding method of single-point glue injection, the connection between the fins and the substrate is located at the same horizontal plane, and the substrate is equipped with multiple dispersed bonding surfaces, which reduces the "stolen material" area and improves the flatness and strength of the parts.

Benefits of technology

The top edges of the parts are neat and burr-free, which improves the strength of the parts and the simplicity of the forming process, while improving the heat dissipation efficiency and reducing production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a router radiator, belongs to the technical field of radiator devices, and particularly relates to a router radiator which comprises a substrate and fins arranged along the substrate in an extending mode, the radiator is integrally formed by heat-conducting plastic, the glue feeding mode is single-point glue feeding, and the joints of the fins and the substrate are located on the same plane. The substrate is dispersedly provided with a plurality of binding surfaces. The injection molding mode of single-point glue feeding is free of weld marks, the strength of a workpiece is high, a reinforcing rib structure does not need to be additionally arranged, the forming process is simpler, and meanwhile the edge of the top end of the workpiece is neat and free of burrs.
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Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation devices, and particularly relates to a router radiator. Background Art

[0002] A router is a hardware device that connects two or more networks, acting as a gateway between networks. It is a dedicated intelligent network device that reads the address in each data packet and then decides how to transmit it. A router has a unique precise structure. When it works, a large amount of heat is generated by its components. The most common radiator is made of aluminum, and there are also existing heat-conducting plastic radiators. The heat-conductivity coefficient of the heat-conducting plastic is lower than that of the aluminum parts, which puts higher requirements on the structure and molding of the heat-conducting plastic parts.

[0003] In the prior art, a radiator for a router is disclosed. Due to the installation requirements of the radiator and the router components, the fitting surface of the radiator needs to protrude a certain height from the substrate. However, directly increasing the thickness at the fitting surface will result in a relatively large material thickness. During processing, due to plastic molding shrinkage, the fitting surface becomes severely uneven, and the heat dissipation effect is poor. To improve the flatness of the fitting surface of this radiator, a debossing treatment is adopted on the back of the substrate at the fitting surface to form a recessed area, reducing the thickness of the substrate at the fitting surface, thereby improving the flatness of the fitting surface. However, since the fin height in the recessed area is still the same as that in other positions, as the size of the recess in the recessed area increases, the fin height at this position becomes higher. When injecting glue from the non-fitting surface position of the substrate, due to factors such as the recessed structure, relatively high fin height, and relatively thin fins in the fins entering this recess, the pressure for entering the fins is large, resulting in difficulty in filling the top of the fins, and there are uneven edges and burrs at the top. The fitting surface of the radiator part is provided with a reinforcing rib structure because it adopts a multi-point injection method. In this injection method, weld lines are easily generated when the melt converges, resulting in stress concentration and affecting the strength of the part. Summary of the Invention

[0004] In order to overcome the above technical problems, the purpose of the present application is to provide a router radiator with neat edges and no burrs at the top of the part and high strength of the part, which is specifically achieved through the following technical solutions:

[0005] A radiator for a router provided by the present application includes a substrate and fins extending along the substrate. It is characterized in that the connection between the fins and the substrate is at the same horizontal plane. The radiator is integrally formed by heat-conducting plastic, the injection method is single-point injection, and the other side of the substrate with fins is provided with a plurality of dispersedly arranged fitting surfaces.

[0006] Optionally, the injection port of the single-point injection is located at the middle position of the side surface of the substrate.

[0007] Optionally, the injection port is located in the injection groove at the edge of the substrate.

[0008] Optionally, the substrate is provided with a positioning groove.

[0009] Optionally, the substrate is provided with a connection hole.

[0010] Optionally, the position where the ejector pin ejects is provided on the substrate.

[0011] Optionally, the fins are arranged along the length direction of the substrate.

[0012] Optionally, the thickness of the substrate at the bonding surface is 1.5 - 6 mm, and the thermal conductivity is 3 - 15 W / (m·K).

[0013] This application also provides a router, including any one of the routers in the above technical solutions, which is fixedly connected to the router through the connection hole.

[0014] Compared with the prior art, this application has the following beneficial effects: The injection molding method with single-point feeding has no weld marks, the strength of the molded part is high, there is no need to separately provide a reinforcing rib structure, the molding process is simpler, and at the same time, the top edge of the molded part is neat and has no burrs. Description of the Drawings

[0015] Figure 1 Is the perspective view of Embodiment 1;

[0016] Figure 2 Is the top view of Embodiment 1;

[0017] Figure 3 Is the front view of Embodiment 1;

[0018] Figure 4 Is the bottom view of Embodiment 1;

[0019] Figure 5 Is the left view of Embodiment 1;

[0020] Figure 6 Is the right view of Embodiment 1;

[0021] Figure 7 Is Figure 3 The cross-sectional view along the A - A direction.

[0022] In the figure, the reference numerals are: 1 - substrate, 2 - fin, 3 - bonding surface, 4 - glue inlet, 5 - positioning groove, 6 - connection hole, 7 - injection groove. Detailed Embodiments

[0023] The specific implementation methods of the present application are described in detail below through examples, but the specific implementation of the present application does not serve as a limitation on the technical solution of the present application. Any non-substantial changes such as replacing common technical solutions in the field with the technical solutions described in the examples of the present application are within the scope of protection of the present application.

[0024] In addition, the length direction of the substrate in the present application is not limited to a strict rectangle, but can also be a square. Any side can be the length direction, or it can be an irregular edge, including but not limited to special-shaped edges, arc edges and other structures, which should be understood by those skilled in the art. Example 1

[0025] like Figures 3 - 7 The router radiator shown includes a base plate 1 and fins 2 extending along the base plate. The connection between the fins 2 and the base plate 1 is located in the same horizontal plane. The radiator is integrally formed of a thermally conductive plastic and is integrally formed by a single-point gluing method. The single-point gluing part has no welding marks, which improves the strength of the part. The other side of the base plate 1 where the fins 2 are provided is provided with four bonding surfaces 3. In the prior art, the area of ​​the bonding surface is large, and the "stealing material" area is large. The "stealing material" area is reduced by dividing the bonding surface, and the edge of the part is neat and has no burrs.

[0026] The glue inlet 4 is located in the glue injection groove 7, which is located in the middle of the side of the substrate 1, and the edge of the workpiece is neat and has no burrs. At the same time, due to the existence of the glue injection groove 7, the connection between the glue inlet and the workpiece can be manually broken without the need for machine grinding, which is simple and convenient to improve production efficiency. In other embodiments, the glue injection groove may not be set.

[0027] Among them, four positioning grooves 5 are provided on the edge of the substrate 1 to facilitate the positioning and installation of the heat sink. In other embodiments, the number and positions of the positioning grooves 5 can be changed according to actual conditions.

[0028] The substrate 1 is provided with an ejection position of an ejector pin, and the ejection position avoids the position of the fin 2. During ejection, the entire part is subjected to uniform force, and warping and damage of the part are prevented.

[0029] The fins 2 are arranged along the length direction of the substrate 1 to effectively prevent the occurrence of warping.

[0030] Among them, the thickness of the substrate 1 at the bonding surface 3 is 4 mm, the bonding surface 3 has high flatness, and no thermal shrinkage occurs. The four bonding surfaces 3 are bonded to the heat dissipation components of the router while avoiding other parts of the router at different heights. Compared with the radiator being bonded to the router as a whole, the presence of the bonding surface 3 can quickly store heat, concentrate heat, improve heat dissipation efficiency, and effectively reduce production costs.

[0031] Among them, the thermal conductivity of the thermally conductive plastic is 15 W / (m·K).

[0032] It should be noted that "material stealing" refers to stealing glue or uniform material level. During the design and manufacture of injection or die-casting molds, in order to make the material thickness of parts as consistent as possible or meet other thickness requirements, it is necessary to solve the problem by stealing material (glue), reducing the thickness, or reducing the glue in the places where the material is thicker. Those skilled in the art should understand this. Embodiment 2

[0033] A router includes the router radiator described in Embodiment 1 and is connected to the router through the connection hole 6. In other embodiments, other methods such as thermal adhesive bonding or snap connection can also be used.

[0034] It should be noted that for the components used in the above embodiments, those skilled in the art can select or replace them according to their needs, which does not exceed the protection scope of this application.

Claims

1. A router heat sink, comprising a substrate and fins extending along the substrate. Characterized in that the heat sink is integrally formed of thermally conductive plastic, and the gating method is single-point gating. The connection between the fins and the substrate is in the same plane, and the substrate is dispersedly provided with a plurality of fitting surfaces.

2. The heat sink according to claim 1, Characterized in that the gating port of the single-point gating is located at the middle position of the side surface of the substrate.

3. The heat sink according to claim 2, Characterized in that the gating port is located in the injection groove at the edge of the substrate.

4. The heat sink according to claim 1, Characterized in that the substrate is provided with a positioning groove.

5. The heat sink according to claim 1, Characterized in that the substrate is provided with connection holes.

6. The heat sink according to claim 1, Characterized in that the substrate is provided with ejector pin ejection positions.

7. The heat sink according to claim 1, Characterized in that the fins are arranged along the length direction of the substrate.

8. The heat sink according to claim 1, Characterized in that the thickness of the substrate at the fitting surface is 1.5 - 6 mm, and the thermal conductivity of the thermally conductive plastic is 3 - 15 W / (m·K).

9. A router, Characterized in that it includes the heat sink according to any one of claims 1 - 8, and the heat sink is connected to the router through the connection holes.