PCB jointed board structure

Abstract

The utility model discloses a PCB (printed circuit board) jointed board structure, which relates to the technical field of PCB production, and comprises unit boards which are symmetrically distributed and are fixedly connected with each other; comprising a face A and a face B, and the face A and the face B of the unit plate on one side and the face B of the unit plate on the other side are opposite in direction. And the process edges are fixedly connected between the unit plates in a three-section manner. The utility model has the beneficial effects that the working efficiency is improved, and the user experience is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board production, and more specifically, to a PCB panel structure. Background Art

[0002] Solid State Drives (SSDs), due to different application scenarios, commonly have models such as 2.5 inches, mSATA (M0-300), and M.2 2280. Some of these models have a double-sided component layout. During production, components are first surface-mounted and soldered on one side, and then the board is turned over to surface-mount and solder the other side. Secondly, some models (such as mSATA) do not have a housing and are in the form of a bare machine module, with strict precision and appearance requirements for the board edge, and a router is used for panel cutting. Traditional panel structures have the following disadvantages:

[0003] 1. Traditional panel structures add process edges between boards, resulting in a large amount of work and low efficiency for router panel cutting;

[0004] 2. Traditional panel structures use the same-side panel layout method. When surface-mounting and soldering components, components are first surface-mounted and soldered on one side, and then the board is turned over to surface-mount and solder the other side. There is only one component surface-mounting production line. It is necessary to first complete the surface-mounting and soldering of side A, then transfer the line to change the program and component feeder, and surface-mount and solder side B. During this process, if an error occurs, it is impossible to judge in advance whether the program and components are correct through a whole-machine test, resulting in a great quality risk;

[0005] 3. Another production method is to have two component surface-mounting production lines, one for mounting side A and the other for mounting side B, for coordinated production. This solution requires more production equipment, and the workload of transferring the line to change the program and component feeder is too concentrated. There is a problem of production equipment waiting for materials and stopping, seriously affecting efficiency. Content of the Utility Model

[0006] In order to overcome the deficiencies of the prior art, the utility model provides a PCB panel structure, which solves the problems of large router workload and cumbersome component surface-mounting and soldering workload in the current PCB panel structure, thereby improving work efficiency and optimizing the user experience.

[0007] The technical solution adopted by the utility model to solve its technical problems is: a PCB panel structure, which is improved in that the PCB panel structure includes:

[0008] Unit boards, which are symmetrically distributed and fixedly connected to each other; including side A and side B, and the side A and side B of the unit boards on one side and the unit boards on the other side face in opposite directions;

[0009] Process edges, which are fixedly connected between the unit boards in a three-section form.

[0010] In the above structure, the area between the process edges is hollow.

[0011] In the above structure, the PCB panel structure further includes edge boards located on both sides of the PCB panel structure, and the end positions and middle positions of the edge boards are fixedly connected to the unit boards through process edges.

[0012] In the above structure, the length of the edge board is adapted to the sum of the lengths of two unit boards.

[0013] In the above structure, gold fingers are provided at the mutually remote ends of the unit boards with opposite A and B faces, and a U-shaped groove is provided between the gold fingers, dividing the gold fingers into section A and section B.

[0014] In the above structure, the unit board is further provided with tool paths located at both ends of the gold fingers.

[0015] In the above structure, the distance between laterally adjacent process edges is adapted to the width of the unit board.

[0016] In the above structure, the distance between longitudinally adjacent process edges is adapted to the length of the unit board.

[0017] The beneficial effects of the present utility model are as follows: In this solution, the unit boards are connected by a three-section process edge, significantly reducing the area of the connection structure between the unit boards, thereby greatly reducing the tool path workload; by designing the unit board to include an A face and a B face, and the A faces and B faces of the unit boards on one side and the unit boards on the other side are opposite, so as to form a yin-yang board with symmetric A and B faces. During the process of mounting and soldering components, when half of them are used to mount and solder A-face components and the other half are used to mount and solder B-face components, after high-temperature soldering by reflow soldering, turn it over, and continue to use half to mount and solder A-face components and the other half to mount and solder B-face components. After two times of mounting and soldering, the complete product mounting and soldering is completed. It can be divided into boards for functional testing to determine whether there are incorrect mountings of the program and components. Moreover, both sides of the PCB panel structure of this solution are exactly the same, and the same set of stencil fixtures, mounting programs, and component feeders can be shared, so as to simplify the work of mounting and soldering components, thereby improving work efficiency and optimizing the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is an overall structural schematic diagram of a PCB panel structure of the present utility model;

[0019] Figure 2 is a cross-sectional view of a unit board of a PCB panel structure of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope of protection of the present utility model. In addition, all connection / connection relationships involved in the patent do not refer only to the direct connection of components, but refer to the formation of a more optimal connection structure by adding or reducing connection accessories according to specific implementation situations. The various technical features in the creation of the present utility model can be combined with each other without conflict.

[0022] Referring to Figure 1 and Figure 2 as shown, the present utility model discloses a PCB panel structure, and the PCB panel structure includes:

[0023] Unit boards 1, which are symmetrically distributed and fixedly connected to each other; including an A side 3 and a B side 4, and the A sides 3 and B sides 4 of the unit boards 1 on one side and the unit boards 1 on the other side face in opposite directions;

[0024] Process edges 2, which are fixedly connected between the unit boards 1 in a three-section manner.

[0025] It should be noted that in this embodiment, the PCB panel structure is designed with a total of 10 unit boards 1. The unit boards 1 are symmetrically distributed, but the A sides 3 and B sides 4 of the unit boards 1 on the opposite sides face in opposite directions to form a yin-yang board with the A side 3 and B side 4 symmetrically joined. During the process of mounting and soldering components, when half of them are used to mount and solder the components on the A side 3 and the other half are used to mount and solder the components on the B side 4, after high-temperature soldering by reflow soldering, turn it over and continue to have half mount and solder the components on the A side 3 and the other half mount and solder the components on the B side 4. After two rounds of mounting and soldering, the complete product mounting and soldering is completed. It can be separated into boards for functional testing to determine whether there are incorrect mountings of the program and components. Moreover, the two sides of the PCB panel structure of this solution are exactly the same, and the same set of stencil fixtures, mounting programs, and component feeders can be shared; while for the traditional PCB panel structure, the A side 3 / B side 4 of the unit board 1 are both located on the same side of the PCB panel structure. The traditional PCB panel structure usually uses two methods to mount and solder components: one is to first mount and solder one side, and then turn it over to mount and solder the other side. There is only one component mounting production line, and it is necessary to first complete the mounting on the A side 3 and then transfer the line to change the program and component feeder. During the process of mounting and soldering the B side 4, if there is an error, it is impossible to judge in advance whether the program and components are correct through a whole-machine test, which has a great quality risk; the other is to design two component mounting production lines, one for mounting the A side 3 and the other for mounting the B side 4, and they are produced in cooperation. This solution requires more production equipment, and the workload of transferring the line to change the program and component feeder is too concentrated, and there is a problem of production equipment waiting for materials and stopping, seriously affecting the efficiency; compared with the traditional method of mounting and soldering components in the PCB panel structure, this solution can obviously simplify the work of mounting and soldering components; thus improving both the work efficiency and the user experience.

[0026] It should also be noted that, in this embodiment, the process edge 2 is designed in a three-section form. That is, taking every two opposite unit boards 1 as a unit, three process edges 2 are designed. These three process edges 2 are arranged at both ends and the middle position of the unit. The process edges 2 at both ends are used to connect the laterally adjacent unit boards 1, and the process edge 2 in the middle position is used to connect the laterally adjacent and longitudinally adjacent process edges 2. While the traditional PCB panel structure adds a whole piece of process edge 2 between the unit boards 1, which makes the workload of the routing tool for panel separation large. Compared with the traditional PCB panel structure, the three-section process edge 2 in this solution makes the workload of the routing tool about 9% of that of the traditional PCB panel structure. Moreover, the three-section process edge 2 is distributed at both ends and the middle, and the overall stability of the panel structure remains good and will not be reduced due to the reduction of the process edge 2. In addition, because the process edge 2 is greatly shortened, the wear of the routing tool is less, and a routing tool with a smaller diameter can be used. The smaller routing tool can reduce the width of the process edge 2. For the whole panel, due to the reduction of the width of the process edge 2, the area is reduced by about 1%, and there can be a better layout space in PCB circuit manufacturing. Thus, both the work efficiency is improved and the user experience is optimized.

[0027] Referring to Figure 1 As shown, the space between the process edges 2 is in a hollow shape.

[0028] It should be noted that, in this embodiment, the space between the process edges 2 is designed to be in a hollow shape, making the whole PCB panel structure approximate a mesh structure, and the mesh structure can reduce the deformation and warping caused by high temperature during high-temperature reflow soldering.

[0029] Referring to Figure 1 As shown, the PCB panel structure further includes edge boards 5. The edge boards 5 are located on both sides of the PCB panel structure, and the end positions and the middle position of the edge boards 5 are fixedly connected to the unit boards 1 through the process edges 2.

[0030] It should be noted that, in this embodiment, the edge boards 5 provide additional mechanical strength to prevent the PCB panel structure from bending or breaking during the processing, and the edge boards 5 help to protect the edges of the PCB panel structure from scratching or other physical damage.

[0031] Referring to Figure 1 As shown, the length of the edge board 5 is adapted to the sum of the lengths of two unit boards 1.

[0032] It should be noted that, in this embodiment, the length of the edge board 5 is designed to be adapted to the side length of the PCB panel structure, that is, the sum of the lengths of two unit boards 1, to protect the edges of the whole PCB panel structure.

[0033] Referring to Figure 1 and Figure 2As shown, gold fingers are provided at the mutually remote ends of the unit boards 1 with the A side 3 and the B side 4 facing in opposite directions, and a U-shaped groove 6 is provided between the gold fingers, dividing the gold fingers into a section A and a section B.

[0034] It should be noted that, in this embodiment, the provision of the U-shaped groove 6 helps to guide the insertion of the gold fingers, ensuring that the gold fingers can be accurately aligned and inserted into the corresponding connectors during connection. This design can improve the reliability of the connection and reduce the possibility of misinsertion; in addition, by dividing the gold fingers into a section A and a section B, different signals can be transmitted, optimizing the signal integrity and transmission performance.

[0035] Refer to Figure 1 As shown, the unit board 1 is further provided with a tool path groove 7, and the tool path groove 7 is located at both ends of the gold fingers.

[0036] It should be noted that, in this embodiment, the design of the tool path groove 7 helps with subsequent board separation.

[0037] Refer to Figure 1 As shown, the distance between the laterally adjacent process edges 2 is adapted to the width of the unit board 1.

[0038] It should be noted that, in this embodiment, the design of the distance between the laterally adjacent process edges 2 is for adapting to the connection between the laterally adjacent unit boards 1.

[0039] Refer to Figure 1 As shown, the distance between the longitudinally adjacent process edges 2 is adapted to the length of the unit board 1.

[0040] It should be noted that, in this embodiment, the design of the distance between the longitudinally adjacent process edges 2 is for adapting to the connection between the longitudinally adjacent unit boards 1.

[0041] The above has specifically described the preferred embodiments of the present utility model, but the present utility model is not limited to the described embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A PCB panel structure, characterized in that: The PCB panel structure includes: The unit plates are symmetrically distributed and fixedly connected to each other; they include an A surface and a B surface, and the A surface and the B surface of the unit plate on one side are opposite to those of the unit plate on the other side; The process edge is fixedly connected between the unit plates in three sections.

2. A PCB panel structure according to claim 1, characterized in that: The process edges are hollowed out.

3. A PCB panel structure according to claim 1, characterized in that: The PCB panel structure also includes edge plates, which are located on both sides of the PCB panel structure, and the end positions and middle positions of the edge plates are fixedly connected to the unit boards through process edges.

4. A PCB panel structure according to claim 3, characterized in that: The length of the edge plate matches the sum of the lengths of the two unit plates.

5. A PCB panel structure according to claim 1, characterized in that: The ends of the unit board facing opposite sides A and B that are far away from each other are both provided with gold fingers, and a U-shaped groove is provided between the gold fingers to divide the gold fingers into A section and B section.

6. A PCB panel structure according to claim 5, characterized in that: The unit board is also provided with a tool groove, and the tool groove is located at two ends of the gold finger.

7. A PCB panel structure according to claim 1, characterized in that: The distance between laterally adjacent process edges is adapted to the width of the unit board.

8. The PCB panel structure according to claim 1, characterized in that: The distance between the longitudinally adjacent process edges is adapted to the length of the unit board.

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