Turnover mechanism and marking machine

Abstract

The utility model discloses a turnover mechanism and a marking machine. And the overturning mechanism is used for overturning the chip. The overturning mechanism comprises an overturning frame, an adsorption part and a rotating air cylinder, the adsorption part is used for adsorbing the chip, the adsorption part is arranged on the side, facing the chip, of the overturning frame, the output end of the rotating mechanism is connected with the overturning frame so as to drive the overturning frame to rotate around the axis of the overturning frame in the first direction, and the rotating air cylinder is arranged on the overturning frame. The first direction is perpendicular to the thickness direction of the chip. After one surface of the chip is marked by the marking machine, the chip can be overturned through the overturning mechanism, so that the other surface of the chip can be marked by the marking machine, the chip marking speed and the chip overturning automation are improved, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of chip marking technology, and in particular to a flipping mechanism and a marking machine. Background Art

[0002] The marking machine can mark different types of chips, thereby improving the appearance and recognition of the chips.

[0003] CN115781034A discloses an array chip marking machine, including a conveyor belt and a laser marking machine, wherein two laser marking machines are symmetrically arranged on the conveyor belt bracket, and the two laser marking machines are respectively located on the brackets on both sides of the conveyor belt, and also includes a plurality of cleaning mechanisms, wherein a first mounting frame is mounted on the conveyor belt bracket, and the cleaning mechanism is mounted on the first mounting frame, and the cleaning mechanism is connected to the conveyor belt bracket, and the cleaning mechanism is used to temporarily fix and clean the chip conveyed on the conveyor belt. Through the above technical scheme, the problem in the prior art that when there are impurities such as dust on the chip surface, it is easy to cause the laser to be covered by dust when irradiating the chip, resulting in defects in chip marking, making the imprint on the chip surface obtained by marking unclear, and unable to be packaged and sold normally is solved.

[0004] However, the marking machine in the above solution can only mark one surface of the chip. If both surfaces of the chip need to be marked, the surface of the chip needs to be turned over and the marking process needs to be performed again, which results in low marking efficiency. Therefore, how to achieve fast chip marking is one of the problems that need to be solved urgently. Utility Model Content

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the first embodiment of the present application proposes a flip mechanism and a marking machine, which can quickly mark chips and improve production efficiency.

[0006] According to a first aspect of the present application, a flipping mechanism is provided for flipping a chip. The flipping mechanism comprises a flipping frame, an adsorbent and a rotating cylinder, wherein the adsorbent is used to adsorb the chip, the adsorbent is arranged on a side of the flipping frame facing the chip, and the output end of the rotating cylinder is connected to the flipping frame to drive the flipping frame to rotate around the axis of the flipping frame in a first direction, wherein the first direction is perpendicular to the thickness direction of the chip.

[0007] A flipping mechanism in an embodiment of the present application can flip the chip through the flipping mechanism after the marking machine marks one surface of the chip, so that the marking machine can mark the other surface of the chip, thereby improving the chip marking speed and the automation of chip flipping, thereby improving production efficiency.

[0008] In some embodiments, the flip frame includes a first flip frame and a second flip frame, and the second flip frame and the second flip frame are spaced apart along the second direction. The rotating cylinder includes a first rotating cylinder and a second rotating cylinder, the first rotating cylinder is connected to the first flip frame, and the second rotating cylinder is connected to the second flip frame. The adsorbent includes a first adsorbent and a second adsorbent, the first adsorbent is arranged on the side of the first flip frame facing the chip, and the second adsorbent is arranged on the side of the second flip frame facing the chip. Wherein, the first flip frame is configured so that the first adsorbent adsorbs the chip and then rotates 90° along the first rotation direction, and the second flip frame is configured so that the first flip frame rotates 90° along the second rotation direction after rotating 90°, so that the chip moves from the first adsorbent to the second adsorbent and rotates 90° along the first rotation direction. Wherein, the rotation directions of the first rotation direction and the second rotation direction are opposite.

[0009] In some embodiments, the flip mechanism further comprises a first cylinder and a second cylinder, wherein the output end of the first cylinder is connected to the first flip frame to drive the first flip frame to move along a second direction, and the output end of the second cylinder is connected to the second flip frame to drive the second flip frame to move along the second direction. The first direction, the second direction and the thickness direction of the chip are perpendicular to each other.

[0010] In some embodiments, the flip mechanism further includes a third cylinder and a fourth cylinder, the output end of the third cylinder is connected to the first flip frame to drive the first flip frame to move along a third direction, and the output end of the fourth cylinder is connected to the second flip frame to drive the second flip frame to move along the third direction. The third direction is parallel to the thickness direction of the chip.

[0011] In some embodiments, the flipping mechanism further includes a negative pressure mechanism, and the negative pressure mechanism is connected to the adsorption member to provide negative pressure for the adsorption member.

[0012] In some embodiments, the flipping mechanism further includes a negative pressure gauge, which is connected to the adsorption member to detect the negative pressure of the adsorption member.

[0013] In some embodiments, the flipping mechanism further includes a detection member, and the detection member is used to detect the position of the chip.

[0014] In some embodiments, the flipping mechanism also includes a controller, and the first cylinder, the second cylinder and the detection member are respectively connected to the controller signal, and the controller can receive the detection signal of the detection member, and the controller can control the operation of the first cylinder and the second cylinder through the detection signal.

[0015] A marking machine according to an embodiment of the second aspect of the present application is used for marking chips. The marking machine includes a loader, a unloader, a carrier, a marking machine, a conveying mechanism and a flipping mechanism. The loader is used for loading the chips. The unloader is used for unloading the chips. The carrier is used to place the chips. A marking member is arranged on the carrier, and is used to mark the surface of the chip away from the carrier. The conveying mechanism includes a first conveying member and a second conveying member, the first conveying member connecting the loader and the carrier, and the second conveying member connecting the carrier and the unloader. The flipping mechanism is connected to the carrier, and the flipping mechanism is used to flip the chip 180°.

[0016] In some embodiments, the marking machine further includes a flipping platform, the flipping platform is connected to the carrier, and the flipping mechanism is disposed on the flipping platform.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 A schematic diagram of the structure of the flipping mechanism of an embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of the structure of a marking machine according to an embodiment of the present application.

[0021] Reference numerals: marking machine 1, chip 2;

[0022] Conveying mechanism 10, first conveying member 11, second conveying member 12;

[0023] Turning mechanism 20, turning frame 21, first turning frame 211, second turning frame 212, adsorption member 22, first adsorption member 221, second adsorption member 222, rotating cylinder 23, first rotating cylinder 231, second rotating cylinder 232, first cylinder 24, second cylinder 25, third cylinder 26, fourth cylinder 27, negative pressure mechanism 28, negative pressure gauge 281, detection member 29, controller 291;

[0024] Loading machine 30;

[0025] Carrier 40;

[0026] Marking parts 50;

[0027] Feeder 60;

[0028] Flipping platform 70;

[0029] First direction X, second direction Y, third direction Z, first rotation direction D, second rotation direction E. DETAILED DESCRIPTION

[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0031] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0034] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0035] Please refer to Figure 1 , Figure 1 Schematic diagram of the structure of the flipping mechanism of the embodiment of the present application.

[0036] The first embodiment of the present application provides a flipping mechanism 20 for flipping a chip 2. The flipping mechanism 20 includes a flipping frame 21, an adsorbent 22, and a rotating cylinder 23. The adsorbent 22 is used to adsorb the chip 2. The adsorbent 22 is arranged on a side of the flipping frame 21 facing the chip 2. The output end of the rotating cylinder 23 is connected to the flipping frame 21 to drive the flipping frame 21 to rotate around the axis of the flipping frame 21 in a first direction X, wherein the first direction X is perpendicular to the thickness direction of the chip 2.

[0037] In some embodiments, the chip 2 can be set on a plane for marking, with one surface of the chip 2 in contact with the plane and the other surface away from the plane. After the marking machine 1 finishes marking the surface of the chip 2 away from the plane, the flipping mechanism 20 flips the chip 2 180°, so that the surface of the chip 2 originally in contact with the plane is away from the plane, so that the surface of the chip 2 originally away from the plane is in contact with the plane, so that the marking machine 1 marks the surface of the chip 2 originally in contact with the plane, so that the marking machine 1 completes marking on both surfaces of the chip 2.

[0038] The thickness direction of the chip 2 is the thickness direction of the chip 2 when the chip 2 is arranged on the plane mentioned above. The two surfaces of the chip 2 are the two surfaces of the chip 2 in the thickness direction.

[0039] In some embodiments, the first direction X may be represented by a direction indicated by a letter X in the figure.

[0040] In some embodiments, the adsorbent 22 may be a suction cup with negative pressure to adsorb the chip 2 , so that when the flip frame 21 is flipped, the adsorbent 22 can adsorb the chip 2 , thereby driving the chip 2 to flip.

[0041] In some embodiments, the adsorption member 22 may be a magnetic member to adsorb the chip 2 , so that when the flip frame 21 is flipped, the adsorption member 22 can adsorb the chip 2 , thereby driving the chip 2 to flip.

[0042] In some embodiments, the flip frame 21 can drive the chip 2 to flip 180°.

[0043] In some embodiments, the flip rack 21 can directly drive the chip 2 to flip 180°, or multiple flip racks 21 can be used. After one flip rack 21 adsorbs the chip 2 and flips it to a certain angle, the chip 2 is transferred to the second flip rack 21 to adsorb the chip 2 and flip it to a certain angle, thereby achieving a 180° flip of the chip 2.

[0044] A flipping mechanism 20 of an embodiment of the present application can flip the chip 2 through the flipping mechanism 20 after the marking machine 1 marks one surface of the chip 2, so that the marking machine 1 can mark the other surface of the chip 2, thereby improving the marking speed of the chip 2 and automating the flipping of the chip 2, thereby improving production efficiency.

[0045] In some embodiments, the flip frame 21 includes a first flip frame 211 and a second flip frame 212, and the second flip frame 212 and the second flip frame 212 are arranged at intervals along the second direction Y. The rotating cylinder 23 includes a first rotating cylinder 231 and a second rotating cylinder 232, the first rotating cylinder 231 is connected to the first flip frame 211, and the second rotating cylinder 232 is connected to the second flip frame 212. The adsorbent 22 includes a first adsorbent 221 and a second adsorbent 222, the first adsorbent 221 is arranged on the side of the first flip frame 211 facing the chip 2, and the second adsorbent 222 is arranged on the side of the second flip frame 212 facing the chip 2. Among them, the first flip frame 211 is configured so that the first adsorbent 221 adsorbs the chip 2 and then rotates 90° along the first rotation direction D, and the second flip frame 212 is configured so that after the first flip frame 211 rotates 90°, it rotates 90° along the second rotation direction E, so that the chip 2 moves from the first adsorbent 221 to the second adsorbent 222 and rotates 90° along the first rotation direction D. The first rotation direction D and the second rotation direction E are opposite in rotation direction.

[0046] In some embodiments, the first rotation direction D may be represented by the direction indicated by the letter D in the figure, and the second rotation direction E may be represented by the direction indicated by the letter E in the figure.

[0047] In some embodiments, the first rotation direction D may be clockwise, and the second rotation direction E may be counterclockwise.

[0048] In some embodiments, the first rotation direction D may be counterclockwise, and the second rotation direction E may be clockwise.

[0049] In some embodiments, the flip frame 21 may include a first flip frame 211 and a second flip frame 212 , and the structures of the first flip frame 211 and the second flip frame 212 and the connected devices may be the same.

[0050] In some embodiments, the chip 2 may be disposed below the first flip frame 211 and the second flip frame 212 . The first adsorption member 221 may be disposed below the first flip frame 211 , and the second adsorption member 222 may be disposed below the second flip frame 212 .

[0051] The chip 2 may have a first surface and a second surface. The chip 2 is disposed on a plane, the first surface is in contact with the plane, and the second surface is away from the plane. The marking machine 1 marks the second surface.

[0052] First, the first flip frame 211 adsorbs the chip 2 through the first adsorbent 221, and the first rotating cylinder 231 drives the first flip frame 211 to rotate 90° along the first rotating direction D, so that the chip 2 rotates 90° along the first rotating direction D, so that the chip 2 moves toward the direction close to the second flip frame 212. At this time, the first adsorbent 221 adsorbs the second surface.

[0053] Secondly, the second rotating cylinder 232 drives the second flip frame 212 to rotate 90° along the second rotation direction E, so that the second adsorbent 222 moves in the direction close to the first flip frame 211. At this time, the second adsorbent 222 is opposite to the first adsorbent 221 in the second direction Y, and the first adsorbent 221 stops working or the suction force is reduced, so that the chip 2 is separated from the first adsorbent 221, so that the second adsorbent 222 adsorbs the chip 2. At this time, the second adsorbent 222 adsorbs the first surface. It should be noted that after the chip 2 is separated from the first adsorbent 221, the first rotating cylinder 231 can drive the first flip frame 211 to rotate 90° along the second rotation direction E, so that the first adsorbent 221 is reset, so as to facilitate the flipping of the second chip 2.

[0054] Finally, the second rotating cylinder 232 drives the second flip frame 212 to rotate 90° along the first rotating direction D, so that the second adsorbent 222 is located below the second flip frame 212. At this time, the second adsorbent 222 stops working, and the chip 2 is separated from the second adsorbent 222, so that the chip 2 is set on the plane, the second surface is in contact with the plane, and the first surface is away from the plane. The marking machine 1 can mark the first surface. Thereby, the marking machine 1 can mark the first surface and the second surface of the chip 2.

[0055] In some embodiments, the first rotation direction D may be clockwise, and the second rotation direction E may be counterclockwise.

[0056] In some embodiments, the first rotation direction D may be counterclockwise, and the second rotation direction E may be clockwise.

[0057] After the marking machine 1 marks one surface of the chip 2, the chip 2 can be flipped by the first flip frame 211 and the second flip frame 212, so that the marking machine 1 can mark the other surface of the chip 2, thereby increasing the speed of marking the chip 2 and automating the flipping of the chip 2, thereby improving production efficiency.

[0058] In some embodiments, the flip mechanism 20 further includes a first cylinder 24 and a second cylinder 25, wherein the output end of the first cylinder 24 is connected to the first flip frame 211 to drive the first flip frame 211 to move along the second direction Y, and the output end of the second cylinder 25 is connected to the second flip frame 212 to drive the second flip frame 212 to move along the second direction Y. The first direction X, the second direction Y and the thickness direction of the chip 2 are perpendicular to each other.

[0059] In some embodiments, the second direction Y may be represented by the direction indicated by the letter Y in the figure.

[0060] In some embodiments, the first turning frame 211 and the second turning frame 212 are spaced apart along the second direction Y. When the first turning frame 211 rotates 90° along the first rotation direction D, the first cylinder 24 can drive the first turning frame 211 to move along the second direction Y close to the second turning frame 212. At the same time, the second cylinder 25 can drive the second turning frame 212 to move along the second direction Y close to the first turning frame 211.

[0061] In some embodiments, when the chip 2 is separated from the first adsorption member 221 and is adsorbed by the second adsorption member 222, the first cylinder 24 can drive the first flip frame 211 to move along the second direction Y away from the second flip frame 212, and the second cylinder 25 can drive the second flip frame 212 to move along the second direction Y away from the first flip frame 211, so that the first flip frame 211 and the second flip frame 212 are reset.

[0062] By setting the first cylinder 24 to move the first flip frame 211 and setting the second cylinder 25 to move the second flip frame 212, it is convenient to adjust the distance between the first flip frame 211 and the second flip frame 212 in the second direction Y, thereby reducing the risk of interference between the first flip frame 211 and the second flip frame 212, and also reducing the risk of chip 2 falling and being damaged due to the long distance between the first adsorption component 221 and the second adsorption component 222 during the process of chip 2 being transported from the first adsorption component 221 to the second adsorption component 222.

[0063] In some embodiments, the flip mechanism 20 further includes a third cylinder 26 and a fourth cylinder 27, wherein the output end of the third cylinder 26 is connected to the first flip frame 211 to drive the first flip frame 211 to move along the third direction Z, and the output end of the fourth cylinder 27 is connected to the second flip frame 212 to drive the second flip frame 212 to move along the third direction Z. The third direction Z is parallel to the thickness direction of the chip 2.

[0064] In some embodiments, the third direction Z may be represented by the direction indicated by the letter Z in the figure.

[0065] In some embodiments, the third direction Z may be the direction of gravity.

[0066] In some embodiments, when the chip 2 is disposed on a plane, the marking machine 1 completes marking on one surface of the chip 2. The third cylinder 26 can drive the first flip frame 211 to move close to the plane along the third direction Z, so that after the first adsorbing member 221 adsorbs the chip 2, the third cylinder 26 can drive the first flip frame 211 to move away from the plane along the third direction Z and complete flipping.

[0067] After the chip 2 is transported from the first adsorbing member 221 to the second adsorbing member 222, the fourth cylinder 27 can drive the second flip frame 212 to move closer to the plane along the third direction Z, and the second adsorbing member 222 stops working, so that the chip 2 is placed on the plane. Afterwards, the fourth cylinder 27 can drive the second flip frame 212 to move away from the plane along the third direction Z, so that the second flip frame 212 is reset.

[0068] By setting the third cylinder 26 to move the first flip frame 211 and setting the fourth cylinder 27 to move the second flip frame 212, it is convenient to adjust the distance between the first flip frame 211 and the second flip frame 212 in the third direction Z, thereby reducing the risk of the first flip frame 211 and the second flip frame 212 interfering with the plane when flipping, and also reducing the risk of the chip 2 falling and being damaged due to the long distance between the second suction piece 222 and the plane during the process of the chip 2 being transported from the second suction piece 222 to the plane.

[0069] In some embodiments, the flipping mechanism 20 further includes a negative pressure mechanism 28 , which is connected to the adsorption member 22 to provide negative pressure for the adsorption member 22 .

[0070] In some embodiments, the negative pressure mechanism 28 may be a suction device, an air pump, etc.

[0071] In some embodiments, the adsorption member 22 may be a suction cup, wherein the adsorption member 22 has an air hole connected to the negative pressure mechanism 28 .

[0072] The negative pressure mechanism 28 provides negative pressure to the adsorption member 22 , thereby improving the reliability of the adsorption member 22 in adsorbing the chip 2 and reducing the risk of the chip 2 falling and being damaged.

[0073] In some embodiments, the flipping mechanism 20 further includes a negative pressure gauge 281 , which is connected to the adsorption member 22 to detect the negative pressure of the adsorption member 22 .

[0074] The adsorption capacity of the adsorption member 22 is detected by the negative pressure gauge 281, so as to improve the reliability of the adsorption of the chip 2 by the adsorption member 22 and reduce the risk of the chip 2 falling and thus being damaged.

[0075] In some embodiments, the flipping mechanism 20 further includes a detection member 29 , and the detection member 29 is used to detect the position of the chip 2 .

[0076] In some embodiments, the detection element 29 may be a camera or other visual sensors.

[0077] In some embodiments, the detection member 29 can detect the position of the chip 2, such as whether the chip 2 is on a plane, whether the chip 2 is adsorbed by the first adsorption member 221, whether the chip 2 is flipped on the first flip frame 211, whether the chip 2 is adsorbed by the second adsorption member 222, whether the chip 2 is flipped on the second flip frame 212, etc.

[0078] By detecting the position of the chip 2 through the detection part 29, the risk of flipping errors is reduced, and errors can be corrected in time after flipping errors, thereby reducing the efficiency of chip 2 marking affected by flipping failures and reducing the risk of chip 2 falling and causing damage to the chip 2.

[0079] In some embodiments, the flipping mechanism 20 also includes a controller 291, and the first cylinder 24, the second cylinder 25 and the detection member 29 are respectively connected to the controller 291 by signal. The controller 291 can receive the detection signal of the detection member 29, and the controller 291 can control the operation of the first cylinder 24 and the second cylinder 25 through the detection signal.

[0080] In some embodiments, the controller 291 can be connected to the first cylinder 24, the second cylinder 25 and the detection element 29 by signal, and the connection method can be circuit connection, WIFI connection, Bluetooth connection, etc.

[0081] In some embodiments, the controller 291 may also be connected to the third cylinder 26 and the fourth cylinder 27 by signal, and the connection method may be circuit connection, WIFI connection, Bluetooth connection, etc.

[0082] The controller 291 can control various mechanisms based on the detection signal of the detection element 29. For example, after the chip 2 is marked on the plane, the controller 291 can control the first cylinder 24 and the third cylinder 26 to move the first flip frame 211 to adsorb the chip 2.

[0083] The flipping of the chip 2 is controlled by the controller 291, thereby improving automation, increasing production efficiency, and reducing the risk of the chip 2 falling or failing to flip.

[0084] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a marking machine according to an embodiment of the present application.

[0085] The second aspect of the present application provides a marking machine 1 for marking a chip 2. The marking machine 1 includes a loader 30, a feeder 60, a carrier 40, a marking machine 1, a conveying mechanism and a flipping mechanism 20. The loader 30 is used for loading the chip 2. The feeder 60 is used for unloading the chip 2. The carrier 40 is used to place the chip 2. The marking member 50 is arranged on the carrier 40, and is used to mark the surface of the chip 2 away from the carrier 40. The conveying mechanism includes a first conveying member and a second conveying member, the first conveying member connecting the loader 30 and the carrier 40, and the second conveying member connecting the carrier 40 and the feeder 60. The flipping mechanism 20 is connected to the carrier 40, and the flipping mechanism 20 is used to flip the chip 2 180°.

[0086] In some embodiments, the first conveying member and the second conveying member of the conveying mechanism may be conveyor belts, guide rails, etc.

[0087] In some embodiments, the marking part 50 may be a laser marking machine 1. The working principle of laser marking is to use a laser beam to mark the surface of different types of products. After the laser beam emits a pulse beam, the material on the surface of the product is irradiated by the laser and evaporates rapidly, and the deeper material is retained, thereby leaving exquisite patterns, texts, trademarks, etc. on the product.

[0088] In some embodiments, the working process of the marking machine 11 is as follows: the chip 2 is placed on the loader 30. The loader 30 conveys the chip 2 to the first conveyor. The first conveyor conveys the chip 2 to the stage 40. The marking member 50 can be placed on the stage 40 and mark the chip 2 conveyed to the stage 40. After the marking is completed, the chip 2 enters the second conveyor, and the second conveyor conveys the chip 2 to the unloader 60.

[0089] In some embodiments, the first conveyor conveys the chip 2 to the carrier 4040 , and the chip 2 on the carrier 40 is placed on the second conveyor by a gripper or a robot.

[0090] In some embodiments, after the chip 2 is placed on the stage 40, when one surface of the chip 2 is marked, the flip mechanism 20 flips the chip 2 180°, and the marking member 50 marks the other surface of the chip 2. When both surfaces of the chip 2 are marked, the chip 2 enters the second conveyor, and the second conveyor conveys the chip 2 to the unloader 60.

[0091] After the marking machine 1 marks one surface of the chip 2, the chip 2 can be flipped through the flipping mechanism 20, so that the marking machine 1 can mark the other surface of the chip 2, thereby increasing the speed of chip 2 marking and automating the flipping of the chip 2, thereby improving production efficiency.

[0092] In some embodiments, the marking machine 1 further includes a flipping platform 70 , which is connected to the carrier 40 , and the flipping mechanism 20 is disposed on the flipping platform 70 .

[0093] In some embodiments, the structure of the flip platform 70 may be the same as that of the carrier 40 , and is used to carry the chip 2 .

[0094] In some embodiments, when the chip 2 is placed on the carrier 40, the marking member 50 marks one surface of the chip 2. After the marking is completed, the chip 2 is transported to the flipping platform 70, and the chip 2 is flipped on the flipping platform 70 by the flipping mechanism 20. After flipping, the chip 2 is transported to the carrier 40 for marking on the other surface.

[0095] By setting up the flipping platform 70 for the flipping process of the chip 2, the marking process of the chip 2 is performed on the carrier 40, avoiding the risk of interference caused by setting the marking and flipping processes in the same place, thereby improving the safety of marking.

[0096] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A flipping mechanism for flipping a chip, characterized in that: The flipping mechanism includes a flipping frame, an adsorbent and a rotating cylinder. The adsorbent is used to adsorb the chip. The adsorbent is arranged on a side of the flipping frame facing the chip. The output end of the rotating cylinder is connected to the flipping frame to drive the flipping frame to rotate around the axis of the flipping frame in a first direction, wherein the first direction is perpendicular to the thickness direction of the chip.

2. The turning mechanism according to claim 1, characterized in that: The turning frame comprises a first turning frame and a second turning frame, wherein the first turning frame and the second turning frame are spaced apart from each other along the second direction; The rotary cylinder comprises a first rotary cylinder and a second rotary cylinder, the first rotary cylinder is connected to the first turning frame, and the second rotary cylinder is connected to the second turning frame; The adsorbent includes a first adsorbent and a second adsorbent, wherein the first adsorbent is disposed on a side of the first flip frame facing the chip, and the second adsorbent is disposed on a side of the second flip frame facing the chip; The first flip frame is configured such that the first adsorbent absorbs the chip and then rotates 90° along the first rotation direction, and the second flip frame is configured such that the first flip frame rotates 90° and then rotates 90° along the second rotation direction, so that the chip moves from the first adsorbent to the second adsorbent and rotates 90° along the first rotation direction; Wherein, the first rotation direction and the second rotation direction are opposite to each other.

3. The turning mechanism according to claim 2, characterized in that: The flip mechanism further includes a first cylinder and a second cylinder, wherein the output end of the first cylinder is connected to the first flip frame to drive the first flip frame to move along the second direction, and the output end of the second cylinder is connected to the second flip frame to drive the second flip frame to move along the second direction; The first direction, the second direction and the thickness direction of the chip are perpendicular to each other.

4. The turning mechanism according to claim 3, characterized in that: The flip mechanism further includes a third cylinder and a fourth cylinder, wherein the output end of the third cylinder is connected to the first flip frame to drive the first flip frame to move along the third direction, and the output end of the fourth cylinder is connected to the second flip frame to drive the second flip frame to move along the third direction; Wherein, the third direction is parallel to the thickness direction of the chip.

5. The turning mechanism according to claim 1, characterized in that: The flipping mechanism further comprises a negative pressure mechanism, and the negative pressure mechanism is connected to the adsorption member to provide negative pressure for the adsorption member.

6. The turning mechanism according to claim 5, characterized in that: The turnover mechanism further includes a negative pressure gauge, which is connected to the adsorption member to detect the negative pressure of the adsorption member.

7. The turning mechanism according to claim 3, characterized in that: The flipping mechanism further comprises a detection member, and the detection member is used to detect the position of the chip.

8. The turning mechanism according to claim 7, characterized in that: The flipping mechanism also includes a controller, and the first cylinder, the second cylinder and the detection member are respectively connected to the controller signal. The controller can receive the detection signal of the detection member, and the controller can control the operation of the first cylinder and the second cylinder through the detection signal.

9. A marking machine for marking chips, characterized in that: include: A loader, used for loading the chips; A blanking machine, used for blanking the chips; A carrier, used for placing the chip; A marking member, disposed on the carrier, for marking a surface of the chip facing away from the carrier; The conveying mechanism comprises a first conveying member and a second conveying member, wherein the first conveying member connects the loading machine and the carrier, and the second conveying member connects the carrier and the unloading machine; The flipping mechanism according to any one of claims 1 to 8, wherein the flipping mechanism is connected to the carrier, and the flipping mechanism is used to flip the chip 180°.

10. The marking machine according to claim 9, characterized in that: The marking machine further comprises a flipping platform, the flipping platform is connected to the carrier, and the flipping mechanism is arranged on the flipping platform.

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