Grinding device with automatic cleaning structure
By introducing an automatic cleaning structure into the grinding device, and the coordinated work of cleaning brushes and cleaning oil stones is solved, the problems of low efficiency and poor results of manual cleaning are achieved, efficient automatic cleaning of the chuck is avoided, wafer debris is ensured, and the yield of semiconductor products is ensured.
Patent Information
- Application Number
- CN202421869277.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-02
AI Technical Summary
When cleaning the chuck, the manual cleaning efficiency and poor effect of existing grinding devices lead to residual particulate matter, affecting the wafer grinding process and easily leading to wafer debris.
A grinding device with an automatic cleaning structure is designed, including a cleaning assembly and a control assembly. The cleaning components include independent cleaning brushes and cleaning oil stones. The control components can automatically control the cleaning brushes to contact and brush the bearing surface, and the cleaning oil stones to contact and polish the bearing surface.
Through automated cleaning, the chuck cleaning efficiency and effect are significantly improved, particulate residues are reduced, wafer fragmentation is avoided during the grinding process, and the yield of semiconductor products is ensured.
Smart Images
Figure CN222945232U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a grinding device with an automatic cleaning structure. Background Art
[0002] In the manufacturing process of semiconductor devices such as IGBT, after the device structure is formed on the front side of the wafer, the back side of the wafer needs to be thinned. Before thinning the back side of the wafer, a film needs to be applied to the front side of the wafer to prevent scratches on the front side of the wafer when the back side of the wafer is thinned. Currently, the back side of the wafer is mainly ground by a grinding device to thin the wafer to the desired target thickness. The steps of using a grinding device to thin the back side of the wafer include: opening the cover of the grinding chamber in the grinding device, and manually cleaning the chuck in the grinding chamber; then, placing a wafer positioning fixture into the grinding chamber; then, placing the wafer on the chuck in the grinding chamber; finally, taking out the wafer positioning fixture, and closing the cover of the grinding chamber to start grinding and thinning the back side of the wafer. However, the manual cleaning method of the chuck in the grinding chamber, on the one hand, requires more manpower and takes a long time to clean, which occupies more time of the grinding machine and is not conducive to improving the productivity of the grinding machine; on the other hand, the manual cleaning method has a poor cleaning effect and easily leads to the residue of particles on the surface of the chuck. The residue of particles will cause the wafer to break during grinding, resulting in the scrapping of the wafer.
[0003] Therefore, how to improve the cleaning efficiency of the chuck in the grinding device while improving the cleaning effect of the chuck in the grinding device, reduce or even avoid the residue of particles on the chuck surface, thereby avoiding wafer fragmentation during the grinding process, is a technical problem that needs to be solved urgently. Summary of the invention
[0004] The utility model provides a grinding device with an automatic cleaning structure, which is used to improve the cleaning efficiency of the chuck in the grinding device and improve the cleaning effect of the chuck in the grinding device, reduce or even avoid the residue of particles on the chuck surface, thereby avoiding wafer fragmentation during the grinding process.
[0005] According to some embodiments, the utility model provides a grinding device with an automatic cleaning structure, comprising:
[0006] A chuck including a bearing surface for bearing a wafer;
[0007] A cleaning assembly, comprising a cleaning brush and a cleaning oil stone which are independent of each other, and the cleaning brush and the cleaning oil stone are both located above the chuck;
[0008] A control component is connected to the cleaning component, and the control component can control the cleaning brush to contact with the bearing surface and scrub the bearing surface, and the control component can control the cleaning oilstone to contact with the bearing surface and polish the bearing surface.
[0009] In some embodiments, the control component includes:
[0010] A track, located above the chuck and extending in a direction parallel to the bearing surface, the cleaning brush and the cleaning oilstone are both connected to the track;
[0011] A controller is connected to the cleaning brush and the cleaning oil stone, and the controller can control the cleaning brush and the cleaning oil stone to move along the track respectively.
[0012] In some embodiments, it also includes:
[0013] The rotating platform is located below the chuck, and the rotating platform can drive the chuck to rotate.
[0014] In some embodiments, the track is a linear track extending along a first direction, and the first direction is parallel to the bearing surface;
[0015] The orthographic projection of the track on the carrying surface extends from the edge of the carrying surface to the center of the carrying surface at least along the first direction.
[0016] In some embodiments, an orthographic projection of the track on the bearing surface crosses the bearing surface along the first direction.
[0017] In some embodiments, the control component further comprises:
[0018] a first telescopic rod, one end of which is connected to the cleaning brush and the other end of which is connected to the track, and the first telescopic rod can telescopically move along a second direction, and the controller can control the first telescopic rod to reciprocate along the first direction, and the second direction is perpendicular to the bearing surface;
[0019] A second telescopic rod has one end connected to the cleaning oilstone and the other end connected to the track, and the second telescopic rod can telescopically move along the second direction, and the controller can control the second telescopic rod to reciprocate along the first direction.
[0020] In some embodiments, the control component further comprises:
[0021] a first adjuster, connected to the controller and the first telescopic rod, for adjusting a speed at which the first telescopic rod reciprocates along the first direction;
[0022] The second adjuster is connected to the controller and the second telescopic rod, and is used to adjust the speed of the reciprocating motion of the second telescopic rod along the first direction.
[0023] In some embodiments, the control assembly further includes a first buckle and a second buckle fixedly connected to opposite ends of the track along the first direction, the first buckle being used to fix the first telescopic rod, and the second buckle being used to fix the second telescopic rod.
[0024] In some embodiments, the cleaning component further comprises:
[0025] A water washing structure is located above the chuck, and the water washing structure includes a first pipe and a first nozzle. One end of the first pipe is connected to a water source, and the other end is connected to the first nozzle. The first nozzle can spray water toward the bearing surface of the chuck.
[0026] In some embodiments, the cleaning component further comprises:
[0027] The purge structure is located above the chuck, and the purge structure includes a second pipe and a second nozzle. One end of the second pipe is connected to the gas source, and the other end is connected to the second nozzle. The second nozzle can spray dry gas toward the bearing surface.
[0028] The utility model provides a grinding device with an automatic cleaning structure, by arranging a cleaning component and a control component in the grinding device, the cleaning component includes a cleaning brush and a cleaning oil stone which are independent of each other, the control component can control the cleaning brush to contact and scrub the bearing surface, and the control component can control the cleaning oil stone to contact and polish the bearing surface, so that the cleaning brush can be controlled by the control component to scrub the bearing surface of the chuck and the cleaning oil stone can be controlled to polish the bearing surface of the chuck, thereby realizing automatic cleaning of the bearing surface of the chuck, reducing the labor cost of chuck cleaning, and improving the efficiency of chuck cleaning. At the same time, the automated chuck cleaning method can improve the cleaning effect of the chuck, reduce or even completely avoid the residue of particles on the bearing surface of the chuck, avoid the wafer from being broken during the grinding process, and ensure the yield of semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a cross-sectional schematic diagram of a grinding device with an automatic cleaning structure in a specific embodiment of the utility model;
[0030] Figure 2 It is a top view schematic diagram of a grinding device with an automatic cleaning structure in a specific embodiment of the utility model;
[0031] Figure 3 It is a structural schematic diagram of a specific embodiment of the utility model when a cleaning brush is used to brush a chuck;
[0032] Figure 4 It is a structural schematic diagram of a specific implementation manner of the utility model when a cleaning oilstone is used to grind a chuck. DETAILED DESCRIPTION
[0033] The specific implementation of the grinding device with automatic cleaning structure provided by the utility model is described in detail below with reference to the accompanying drawings.
[0034] This specific embodiment provides a grinding device with an automatic cleaning structure. Figure 1 This is a schematic diagram of the structure of a grinding device with an automatic cleaning structure in a specific embodiment of the utility model. Figure 2 Schematic diagram of a top view of a grinding device with an automatic cleaning structure in a specific embodiment of the utility model. Figure 1 and Figure 2 As shown, the grinding device with automatic cleaning structure comprises:
[0035] The chuck 10 includes a carrying surface 101 for carrying a wafer;
[0036] A cleaning assembly, comprising a cleaning brush 12 and a cleaning oil stone 13 which are independent of each other, and the cleaning brush 12 and the cleaning oil stone 13 are both located above the chuck 10;
[0037] A control component is connected to the cleaning component, and the control component can control the cleaning brush 12 to contact with the bearing surface 101 and scrub the bearing surface 101 , and the control component can control the cleaning oilstone 13 to contact with the bearing surface 101 and polish the bearing surface 101 .
[0038] Specifically, the grinding device with automatic cleaning structure includes a grinding chamber, the chuck 10 and the automatic cleaning structure located in the grinding chamber, and the automatic cleaning structure includes the cleaning component and the control component. The cleaning component includes the cleaning brush 12 and the cleaning oil stone 13, wherein the cleaning brush 12 can automatically brush the bearing surface 101 of the chuck 10 under the control of the control component, and the cleaning oil stone 13 can automatically grind the bearing surface 101 of the chuck under the control of the control component to clean the bearing surface 101 in the chuck 10.
[0039] For example, before placing the wafer into the grinding chamber, the user can trigger a cleaning instruction through a button located outside the grinding chamber. After receiving the cleaning instruction, the control component controls the cleaning brush 12 in the initial brush position to move to the bearing surface 101 of the chuck 10, and brushes the bearing surface 101 to remove relatively large particles on the bearing surface 101 of the chuck 10. After the cleaning brush 12 finishes brushing the bearing surface 101, the control component controls the cleaning brush 12 to return to the initial brush position, and controls the cleaning oilstone to move from the initial oilstone position to the bearing surface 101 of the chuck 10, and grinds the bearing surface 101 to remove relatively small particles on the bearing surface 101 of the chuck 10. The control component controls the cleaning brush 12 and the cleaning oilstone 13 to automatically clean the bearing surface 101 of the chuck 10, which not only reduces the labor cost of chuck cleaning and improves the efficiency of chuck cleaning, but also the coordinated cleaning of the cleaning brush 12 and the cleaning oilstone 13 improves the cleaning effect of the chuck 10, reduces or even completely avoids the residue of particles on the bearing surface of the chuck, avoids the wafer from being broken during the grinding process, and ensures the yield of semiconductor products.
[0040] In some embodiments, the control component includes:
[0041] A track 14 is located above the chuck 10 and extends in a direction parallel to the bearing surface 101. The cleaning brush 12 and the cleaning oil stone 13 are both connected to the track 14.
[0042] A controller is connected to the cleaning brush 12 and the cleaning oil stone 13, and the controller can control the cleaning brush 12 and the cleaning oil stone 13 to move along the track respectively.
[0043] For example, by arranging the track 14 above the chuck 10 along the second direction D2, and the cleaning brush 12 and the cleaning oil stone 13 are independently connected to the track 14, so that the controller can control the cleaning brush 12 and the cleaning oil stone 13 to move along the track 14, on the one hand, the control operation of the cleaning brush 12 and the cleaning oil stone 13 is simplified, and the cleaning efficiency of the chuck 10 is further improved; on the other hand, the movement path of the cleaning brush 12 and the cleaning oil stone 13 can be limited, so as to flexibly adjust the cleaning area of the cleaning brush 12 and the cleaning oil stone 13 on the bearing surface 101, so as to improve the flexibility of cleaning the chuck 10. Wherein, the second direction D2 intersects the bearing surface 101 perpendicularly.
[0044] In some embodiments, the grinding device with automatic cleaning structure further comprises:
[0045] The rotating platform 11 is located below the chuck 10 , and the rotating platform 11 can drive the chuck 10 to rotate.
[0046] In some embodiments, the track 14 is a linear track extending along a first direction D1, and the first direction D1 is parallel to the carrying surface 101;
[0047] The orthographic projection of the track 14 on the carrying surface 101 extends from the edge of the carrying surface 101 to the center of the carrying surface 101 at least along the first direction D1.
[0048] Specifically, the chuck 10 is installed on the top of the rotating table 11. The rotating table 11 can rotate, and the rotating table 11 automatically drives the chuck 10 located on the top to rotate. The track 14 is a linear track extending along the first direction D1, and the orthographic projection of the track 14 on the bearing surface 101 at least extends from the edge of the bearing surface 101 to the center of the bearing surface 101 along the first direction D1, that is, when the bearing surface 101 of the chuck 10 is circular, the length of the track 14 along the first direction D1 is at least greater than or equal to the radius of the bearing surface 101 of the chuck 10. While the cleaning brush 12 or the cleaning oil stone 13 reciprocates along the track 14, the chuck 10 rotates, so that the cleaning brush 12 or the cleaning oil stone 13 can clean the entire bearing surface 101 of the chuck 10, further improving the cleaning effect of the chuck 10.
[0049] In some embodiments, the orthographic projection of the track 14 on the bearing surface 101 crosses the bearing surface 101 along the first direction D1, thereby increasing the cleaning area of the cleaning brush 12 or the cleaning oilstone 13 in a single reciprocating motion, thereby further improving the cleaning effect and cleaning efficiency of the chuck 10.
[0050] In some embodiments, the control component further comprises:
[0051] A first telescopic rod 15, one end of which is connected to the cleaning brush 12 and the other end of which is connected to the track 14, and the first telescopic rod 15 can telescopically move along a second direction D2, and the controller can control the first telescopic rod 15 to reciprocate along the first direction D1, and the second direction D2 is perpendicular to the bearing surface 101;
[0052] The second telescopic rod 16 has one end connected to the cleaning oilstone 13 and the other end connected to the track 14, and the second telescopic rod 16 can telescopically move along the second direction D2, and the controller can control the second telescopic rod 16 to reciprocate along the first direction D1.
[0053] Figure 3 It is a structural schematic diagram of a specific embodiment of the utility model when a cleaning brush is used to brush the chuck. For example, the top end of the first telescopic rod 15 is movably connected to the track 14, and the bottom end of the first telescopic rod 15 is fixedly connected to the cleaning brush 12. When the chuck 10 is not cleaned, the first telescopic rod 15 is at one end of the track 14 along the first direction D1, and the end of the track 14 along the first direction D1 is used as the initial position of the brush. When the cleaning brush 12 is needed to brush the bearing surface 101 of the chuck 10, the controller controls the first telescopic rod 15 to move from the initial position of the brush along the first direction to directly above the chuck 10. The movement of the first telescopic rod 15 drives the cleaning brush 12 to move to directly above the chuck 10. After that, the controller controls the first telescopic rod 15 to extend along the second direction D2, so that the cleaning brush 12 contacts the bearing surface 101. Then, the first telescopic rod 15 reciprocates along the track 14 along the first direction D1 (for example, along the track 14). Figure 3 The cleaning brush 12 reciprocates in the direction of the double-headed arrow in the figure, so that the cleaning brush 12 brushes the bearing surface 101, as shown in FIG. Figure 3 After brushing is finished, the first telescopic rod 15 is shortened along the second direction D2 so that the cleaning brush 12 is separated from the carrying surface 101, and the controller controls the first telescopic rod 15 to move along the track 14 to the initial position of the brush.
[0054] Figure 4It is a schematic diagram of the structure when the cleaning oilstone is used to grind the chuck in a specific embodiment of the utility model. For example, the top end of the second telescopic rod 16 is movably connected to the track 14, and the bottom end of the second telescopic rod 16 is fixedly connected to the cleaning oilstone 13. When the chuck 10 is not being polished, the second telescopic rod 16 is at the other end of the track 14 along the first direction D1, and the other end of the track 14 along the first direction D1 is used as the initial position of the oilstone, that is, the initial position of the brush and the initial position of the oilstone are located at opposite ends of the track 14 along the first direction D1. When the cleaning oilstone 13 is needed to grind the bearing surface 101 of the chuck 10, the controller controls the second telescopic rod 16 to move from the initial position of the oilstone along the first direction to directly above the chuck 10. The movement of the second telescopic rod 16 drives the cleaning oilstone 13 to move directly above the chuck 10. After that, the controller controls the second telescopic rod 16 to extend along the second direction D2 so that the cleaning oilstone 13 contacts the bearing surface 101. Then, the second telescopic rod 16 reciprocates along the track 14 along the first direction D1 (for example, along the track 14). Figure 4 The cleaning oilstone 13 grinds the bearing surface 101, such as Figure 4 After the grinding is finished, the second telescopic rod 16 is shortened along the second direction D2 so that the cleaning oilstone 13 is separated from the bearing surface 101, and the controller controls the second telescopic rod 16 to move along the track 14 to the initial position of the oilstone.
[0055] In one example, the first telescopic rod 15 and the second telescopic rod 16 can also rotate around the track 14 within a preset angle range, so that the first telescopic rod 15 and the second telescopic rod 16 are inclined to intersect the bearing surface 101, so as to increase the angle at which the cleaning brush 12 brushes the bearing surface 101 and the angle at which the cleaning oilstone 13 polishes the bearing surface 101, thereby further improving the cleaning effect of the chuck 10.
[0056] In order to further improve the flexibility of cleaning the bearing surface 101 of the chuck 10, in some embodiments, the control component further includes:
[0057] a first adjuster, connected to the controller and the first telescopic rod 15, and used to adjust the speed of the first telescopic rod 15 reciprocating along the first direction D1;
[0058] The second adjuster is connected to the controller and the second telescopic rod 16 and is used to adjust the speed of the reciprocating motion of the second telescopic rod 16 along the first direction D1.
[0059] In some embodiments, the control assembly further includes a first buckle 17 and a second buckle 18 fixedly connected to opposite ends of the track 14 along the first direction D1, the first buckle 17 being used to fix the first telescopic rod 15, and the second buckle 18 being used to fix the second telescopic rod 16.
[0060] Specifically, in order to avoid collision between the cleaning brush 12 and the cleaning oilstone 13, when the cleaning brush 12 is brushing the bearing surface 101, the second telescopic rod 16 is fixed to the initial position of the oilstone through the second buckle 18 to prevent the second telescopic rod 16 from sliding along the track 14; when the cleaning oilstone 13 is polishing the bearing surface 101, the first telescopic rod 15 is fixed to the initial position of the brush through the first buckle 17 to prevent the first telescopic rod 15 from sliding along the track 14.
[0061] In some embodiments, the cleaning component further comprises:
[0062] The water washing structure is located above the chuck 10 , and the water washing structure includes a first pipe and a first nozzle. One end of the first pipe is connected to a water source, and the other end is connected to the first nozzle. The first nozzle can spray water toward the supporting surface 101 of the chuck 10 .
[0063] In some embodiments, the cleaning component further comprises:
[0064] The purge structure is located above the chuck 10 , and includes a second pipe and a second nozzle. One end of the second pipe is connected to the gas source, and the other end is connected to the second nozzle. The second nozzle can spray dry gas toward the carrying surface 101 .
[0065] Specifically, during the process of the cleaning brush 12 brushing the carrying surface 101 and the process of the cleaning oilstone 13 polishing the carrying surface 101, the controller can also control the first nozzle to spray water to the carrying surface 101 at the same time to wash away the particles on the carrying surface 101. After the cleaning oilstone 13 finishes polishing the carrying surface 101, the second nozzle can spray dry gas to the carrying surface 101 to remove the residual water on the carrying surface 101, so as to dry the carrying surface 101 and facilitate the subsequent stable carrying of wafers.
[0066] The grinding device with an automatic cleaning structure provided in this specific embodiment is provided with a cleaning component and a control component in the grinding device, wherein the cleaning component includes a cleaning brush and a cleaning oil stone which are independent of each other, and the control component can control the cleaning brush to contact and scrub the bearing surface, and the control component can control the cleaning oil stone to contact and polish the bearing surface, so that the cleaning brush can be controlled by the control component to scrub the bearing surface of the chuck and the cleaning oil stone can be controlled to polish the bearing surface of the chuck, thereby realizing automatic cleaning of the bearing surface of the chuck, reducing the labor cost of chuck cleaning, and improving the efficiency of chuck cleaning. At the same time, the automated chuck cleaning method can improve the cleaning effect of the chuck, reduce or even completely avoid the residue of particles on the bearing surface of the chuck, avoid the wafer from being broken during the grinding process, and ensure the yield of semiconductor products.
[0067] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A grinding device with an automatic cleaning structure, characterized in that: include: A chuck including a bearing surface for bearing a wafer; A cleaning assembly, comprising a cleaning brush and a cleaning oil stone which are independent of each other, and the cleaning brush and the cleaning oil stone are both located above the chuck; A control component is connected to the cleaning component, and the control component can control the cleaning brush to contact with the bearing surface and scrub the bearing surface, and the control component can control the cleaning oilstone to contact with the bearing surface and polish the bearing surface.
2. The grinding device with automatic cleaning structure according to claim 1, characterized in that: The control component comprises: A track, located above the chuck and extending in a direction parallel to the bearing surface, the cleaning brush and the cleaning oil stone are both connected to the track; A controller is connected to the cleaning brush and the cleaning oil stone, and the controller can control the cleaning brush and the cleaning oil stone to move along the track respectively.
3. The grinding device with automatic cleaning structure according to claim 2, characterized in that: Also includes: The rotating platform is located below the chuck, and the rotating platform can drive the chuck to rotate.
4. The grinding device with automatic cleaning structure according to claim 2, characterized in that: The track is a linear track extending along a first direction, wherein the first direction is parallel to the carrying surface; an orthographic projection of the track on the carrying surface extends from an edge of the carrying surface to a center of the carrying surface at least along the first direction.
5. The grinding device with automatic cleaning structure according to claim 4, characterized in that: The orthographic projection of the track on the bearing surface crosses the bearing surface along the first direction.
6. The grinding device with automatic cleaning structure according to claim 4, characterized in that: The control component also includes: A first telescopic rod, one end of which is connected to the cleaning brush and the other end of which is connected to the track, and the The first telescopic rod can telescopically move along a second direction, and the controller can control the first telescopic rod to reciprocate along the first direction, and the second direction is perpendicular to the bearing surface; A second telescopic rod has one end connected to the cleaning oilstone and the other end connected to the track, and the second telescopic rod can telescopically move along the second direction, and the controller can control the second telescopic rod to reciprocate along the first direction.
7. The grinding device with automatic cleaning structure according to claim 6, characterized in that: The control component also includes: a first adjuster, connected to the controller and the first telescopic rod, for adjusting a speed at which the first telescopic rod reciprocates along the first direction; The second adjuster is connected to the controller and the second telescopic rod, and is used to adjust the speed of the reciprocating motion of the second telescopic rod along the first direction.
8. The grinding device with automatic cleaning structure according to claim 6, characterized in that: The control assembly further includes a first buckle and a second buckle fixedly connected to two opposite ends of the track along the first direction, the first buckle being used to fix the first telescopic rod, and the second buckle being used to fix the second telescopic rod.
9. The grinding device with automatic cleaning structure according to claim 1, characterized in that: The cleaning component also includes: A water washing structure is located above the chuck, and the water washing structure includes a first pipe and a first nozzle. One end of the first pipe is connected to a water source, and the other end is connected to the first nozzle. The first nozzle can spray water toward the bearing surface of the chuck.
10. The grinding device with automatic cleaning structure according to claim 1, characterized in that: The cleaning component also includes: The purge structure is located above the chuck, and the purge structure includes a second pipe and a second nozzle. One end of the second pipe is connected to the gas source, and the other end is connected to the second nozzle. The second nozzle can spray dry gas toward the bearing surface.