Silicon material cutting device

Abstract

The utility model discloses a silicon material cutting device which comprises a carrier plate, at least two bearing areas which are arranged at intervals and used for bearing silicon materials are arranged on the carrier plate, a gap area is formed between every two adjacent bearing areas, gaps are formed by extending outwards from the gap areas, and the gaps are used for separating the silicon materials on the adjacent bearing areas; the cutting mechanism is arranged on one side of the bearing area of the carrier plate, and the cutting mechanism is used for cutting the silicon material on the carrier plate; the first spraying mechanism is provided with a first liquid spraying opening facing the gap, and the first liquid spraying opening faces the cutting position of the cutting mechanism and the silicon material. According to the silicon material cutting device, liquid is sprayed to gaps between the silicon materials arranged at intervals through the first liquid spraying openings in the first spraying mechanism, and therefore the problems of line marks on the adjacent faces of the two silicon materials and silicon powder accumulation between the two silicon materials are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon material production equipment, in particular to a silicon material cutting device. Background Art

[0002] With the rapid development of the photovoltaic industry, the methods of silicon wafer cutting are also emerging. At present, the main slicing methods are single-row horizontal slicing, single-row vertical slicing and double-row vertical slicing. For double-row vertical slicing, it has a larger single-blade load and a higher comprehensive single-machine efficiency, which greatly saves time and improves production efficiency.

[0003] However, during the double-row vertical cutting process, there will be gaps between the spaced silicon rods. In the current cutting process, the cutting liquid is mainly infiltrated from both sides of the silicon rod, and the movement of the steel wire is used to bring it into the cutting to reduce the accumulation of silicon powder inside the cutting and the generation of line marks during the cutting process. However, as the size of the silicon wafer cutting increases, the wetting effect of this cutting liquid infiltration method on the middle of the silicon wafer becomes worse and worse. For double-row vertical cutting, the overall cutting width of the silicon rod will increase, and there will be a gap between the two silicon rods, which will cause the cutting liquid to be unable to effectively clean and infiltrate the middle of the cutting from both sides, resulting in abnormalities such as silicon powder accumulation and increased line marks.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0005] The utility model aims to provide a silicon material cutting device, which can solve the problems of silicon powder accumulation in the middle and increased line marks during the double-row vertical cutting of silicon rods.

[0006] In order to achieve the above-mentioned purpose, a specific embodiment of the utility model provides a technical solution as follows: a silicon material cutting device, comprising:

[0007] A carrier having at least two spaced-apart bearing areas for bearing silicon materials, wherein a gap area is formed between adjacent bearing areas, and a gap is formed extending outward from the gap area, and the gap is used to separate the silicon materials on adjacent bearing areas;

[0008] A cutting mechanism, disposed on one side of the carrying area of ​​the carrier, and used for cutting the silicon material on the carrier;

[0009] The first spray mechanism has a first liquid spray port facing the gap, and the first liquid spray port faces the cutting position between the cutting mechanism and the silicon material.

[0010] In one or more embodiments of the present invention, the silicon material cutting device further comprises a propulsion mechanism, and the carrier plate or the cutting mechanism is connected to the propulsion mechanism so that one of the carrier plate and the cutting mechanism is close to the other.

[0011] In one or more embodiments of the present invention, the propulsion mechanism is connected to the carrier plate.

[0012] In one or more embodiments of the present invention, the distance between the first liquid spray port and the cutting mechanism is fixed.

[0013] In one or more embodiments of the present invention, the silicon material cutting device further comprises a machine platform, and the cutting mechanism and the first spraying mechanism are both fixedly mounted on the machine platform.

[0014] In one or more embodiments of the present invention, the propulsion mechanism includes a pneumatic cylinder or an electric cylinder.

[0015] In one or more embodiments of the present invention, the silicon material cutting device further comprises a second spray mechanism, wherein the second spray mechanism comprises second liquid spraying ports arranged at two ends of the carrier plate along the direction in which the carrier area is arranged.

[0016] In one or more embodiments of the present invention, the second spray mechanism is a spray pipe, and the spray pipe is connected to the cutting fluid pipeline.

[0017] In one or more embodiments of the present invention, the first spray mechanism is a spray pipe, and the spray pipe is connected to the cutting fluid pipeline.

[0018] In one or more embodiments of the present invention, the carrier board is a PVC carrier board.

[0019] Compared with the prior art, the silicon material cutting device of the utility model sprays liquid into the gaps between the spaced silicon materials through the first liquid spraying port on the first spraying mechanism, thereby reducing the problems of line marks on the adjacent surfaces of the two silicon materials and silicon powder accumulation between the two silicon materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a partial three-dimensional schematic diagram of a silicon material cutting device in one embodiment of the utility model;

[0022] Figure 2 A top view of a carrier plate in one embodiment of the utility model;

[0023] Figure 3 It is a partial front view of a silicon material cutting device in one embodiment of the utility model.

[0024] Description of main reference numerals:

[0025] 1. Carrier; 11. Carrying area; 12. Gap; 13. Gap area; 2. Cutting mechanism; 21. Cutting line; 3. First spray mechanism; 31. First liquid spray port; 4. Second spray mechanism; 41. Second liquid spray port; 5. Propelling mechanism; 6. Silicon material. Specific embodiments

[0026] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0027] As described in the background technology, in the existing double-row vertical cutting process, there will be a gap between the spaced silicon materials. The cutting liquid is mainly infiltrated from both sides of the silicon material, and the movement of the steel wire is used to bring it into the cutting interior to reduce the accumulation of silicon powder inside the cutting and the generation of line marks during the cutting process. In the double-row vertical cutting process, since a gap must be left between the two rows of silicon materials, and the gap needs to have a certain width, it cannot be too small (to prevent the silicon materials on both sides from colliding and being damaged during the cutting process) or too large (limited by the machine axis spacing), the width of the gap between the two rows of silicon materials is preferably in the range of 2 to 3 mm.

[0028] The existing improved process is: a liquid outlet is opened on the carrier board carrying the silicon material, and the liquid outlet is located in the gap area between the two silicon materials on the carrier board or at both ends of the gap area, so that the cutting liquid flows from the liquid outlet into the gap between the two silicon materials to achieve infiltration of the gap. However, due to such a setting, the distance between the cutting position on the silicon material and the liquid outlet is from large to small, that is, in the early and middle stages of cutting, the cutting position on the silicon material is far away from the liquid outlet. Although the cutting liquid flows through the gap, the liquid volume and flow rate are difficult to control. That is, since the gap space is limited (generally 2 to 3 mm wide), the method of spraying downward from the liquid outlet is affected by the capillary effect and the flow rate cannot be controlled. If the flow rate is large, it will overflow from both sides of the gap space, and the liquid compensation effect on the cutting position close to the gap space is poor.

[0029] like Figure 1 ,2 As shown, a silicon material cutting device in an embodiment of the utility model comprises a carrier plate 1, a cutting mechanism 2 and a first spray mechanism 3; the carrier plate 1 has at least two spaced-apart carrying areas 11 for carrying silicon material 6, and a gap area 13 is formed between adjacent carrying areas 11, and a gap 12 is formed extending outward from the gap area 13, and the gap is used to separate the silicon material 6 on adjacent carrying areas 11; the cutting mechanism 2 is arranged on one side of the carrying area 11 of the carrier plate 1, and the cutting mechanism 2 is used to cut the silicon material 6 on the carrier plate 1; the first spray mechanism 3 has a first liquid spray port 31 facing the gap 12, and the first liquid spray port 31 faces the cutting position of the cutting mechanism 2 and the silicon material 6.

[0030] It should be noted that the cutting point between the cutting mechanism 2 and the silicon material 6 can be considered as the contact point between the cutting mechanism 2 and the silicon material 6 when the cutting mechanism 2 cuts the silicon material 6 on the carrier 1. Since the contact between the cutting mechanism 2 and the silicon material 6 can be considered as line contact or surface contact, in the present invention, the contact point between the first liquid spraying port 31 and the silicon material 6 is mainly considered as the contact position between the first liquid spraying port 31 and the cutting mechanism 2 near the gap 12 on the silicon material 6; in addition, during the cutting process, the contact point between the cutting mechanism 2 and the silicon material 6 can be considered to be continuously changing. The liquid sprayed from the first liquid spraying port 31 can be a cutting liquid, that is, a cutting liquid that can be directly purchased on the market, which is generally a mixture of water and organic matter.

[0031] It can be understood that when the cutting mechanism 2 cuts the silicon material 6 on the carrier 1, the first liquid spray port 31 sprays liquid toward the cutting point between the cutting mechanism 2 and the silicon material 6 in the gap 12, that is, the liquid sprayed from the first liquid spray port 31 can first pass through the gap 12, and then flow to the cutting point between the cutting mechanism 2 and the silicon material 6. The liquid will infiltrate the cutting point between the cutting mechanism 2 and the silicon material 6, and play a role of infiltrating the adjacent surfaces of the cutting mechanism 2 and the adjacent silicon material 6, thereby reducing the line marks of the adjacent surfaces of the two silicon materials 6 (that is, the surfaces located in the gap 2). At the same time, the silicon powder generated by cutting the silicon material 6 will be mixed into the liquid and flow out with the liquid, which can prevent the silicon powder from accumulating in the gap 12 between adjacent silicon materials 6.

[0032] Compared with the existing improved process, the first liquid spraying port 31 of the present invention is always directed toward the cutting point between the cutting mechanism 2 and the silicon material 6, so the liquid spraying amount and flow rate can be fixed values ​​(can be set according to actual needs), and no adjustment is required, which is convenient for liquid spraying control. In addition, since the carrier is a disposable item during the cutting process, the present invention only needs a conventional carrier 1, and there is no need to customize a special carrier 1 (for example, a liquid outlet is provided thereon) as in the existing improved process. The present invention can reduce production costs. Specifically, in the case of Figure 2 In the embodiment shown, the carrier plate 1 has at least two spaced-apart carrying areas 11 for carrying the silicon material 6.

[0033] Among them, the carrier 1 is a PVC carrier, that is, the carrier 1 is a carrier made of PVC material. In other embodiments of the utility model, the carrier 1 can also be a carrier 1 of other plastic materials. The silicon material 6 can be a silicon rod. The silicon material 6 can be fixed on the carrier 1 by bonding. The bonding process is generally to apply a common adhesive to the carrier 1 by a glue coating machine, and at least cover the bearing area 11 to form a film, and then bond the silicon material 6 to the film. As for the above-mentioned improved process, since the width of the gap 12 between the silicon materials 6 is narrow (for example, 2 to 3 mm), if the liquid outlet is located in the gap 12 area between the two silicon materials 6 on the carrier 1 or at both ends of the gap 12 area, the adhesive may block the liquid outlet when applying glue, so the requirements for the glue coating process and equipment are high, which increases the difficulty and cost of work. The first spray mechanism 3 in this embodiment is not arranged on the surface of the carrier 1, so there is no need to have too high requirements for the glue coating process and equipment, which can reduce the difficulty of work and equipment cost.

[0034] like Figure 1 , 3 As shown, in this embodiment, the cutting mechanism 2 can be a common wire cutting machine, and the cutting part of the wire cutting machine is the cutting wire 21; for example, a diamond wire cutting machine, etc. The diamond wire cutting machine adopts a unidirectional circulation or reciprocating circulation mode of the diamond wire to form a relative grinding motion between the diamond wire and the object to be cut, thereby achieving the purpose of cutting. When the processed material is not conductive and a wire cutting processing method is required, the electric spark wire cutting machine will lose its effect. For this reason, the diamond wire cutting machine begins to show its processing advantages. It can cut conductive and non-conductive materials (as long as the hardness is smaller than that of the diamond wire). Therefore, diamond wire cutting machines are widely used in cutting various metal and non-metal composite materials, such as ceramics, glass, rocks, gems, jade, meteorites, single crystal silicon, silicon carbide, polycrystalline silicon, refractory bricks, epoxy boards, ferrites, PCBs, as well as building materials, dental materials, biological and bionic composite materials, etc., and are particularly suitable for cutting various brittle crystals with high hardness, high value and easy to break. As Figure 1 , 3 As shown, the silicon material 6 cutting device further includes a propulsion mechanism 5, and the carrier plate 1 or the cutting mechanism 2 is connected to the propulsion mechanism 5 so that the carrier plate 1 and the cutting mechanism 2 are close to each other. The propulsion mechanism 5 can drive the carrier plate 1 or the cutting mechanism 2 to move so that the carrier plate 1 and the cutting mechanism 2 are close to each other, so that the silicon material 6 on the carrier plate 1 is cut by the cutting mechanism 2.

[0035] Typically, the cutting mechanism 2 itself has many components and a large mass. For example, the propulsion mechanism 5 is connected to the cutting mechanism 2, that is, during the cutting process, the propulsion mechanism 5 drives the cutting mechanism 2 close to the carrier 1, which requires a large kinetic energy, and the power requirements of the propulsion mechanism are high, which increases the cost. Moreover, since the cutting mechanism 2 itself has many components and a large mass, the frequent movement of the cutting mechanism 2 may cause unstable connections between the components therein, thereby causing cutting errors.

[0036] Therefore, preferably, the propulsion mechanism 5 is connected to the carrier plate 1. During the cutting process, the cutting mechanism 2 is connected to the carrier plate 1, that is, the propulsion mechanism 5 drives the carrier plate 1 to approach the cutting mechanism 2, and the cutting mechanism 2 remains stationary.

[0037] Furthermore, the distance between the first liquid spraying port 31 and the cutting mechanism 2 is fixed, which can be understood as that during the cutting process, the first liquid spraying port 31 is always directed toward the contact point between the cutting mechanism 2 and the silicon material 6 (ie, the cutting point).

[0038] Specifically, the silicon material cutting device further comprises a machine platform (not shown in the figure), and the cutting mechanism 2 and the first spray mechanism 3 are both fixedly mounted on the machine platform. Such an arrangement can ensure that the distance between the first spray port 31 and the cutting mechanism 2 is fixed.

[0039] Specifically, the propulsion mechanism 5 includes a gas cylinder or an electric cylinder. For example, the carrier plate 1 or the cutting mechanism 2 is fixedly connected to the piston rod of the gas cylinder, or the carrier plate 1 or the cutting mechanism 2 is fixedly connected to the electric slider on the electric cylinder.

[0040] like Figure 3 As shown, in a specific embodiment, the silicon material cutting device further includes a second spray mechanism 4, and the second spray mechanism 4 has second liquid spraying ports 41 disposed at both ends of the carrier plate 1 along the arrangement direction of the carrier area 11. The second spray mechanism 4 serves to spray cutting liquid onto the outer peripheral surface of the silicon material 6 during the cutting process, thereby assisting the cutting.

[0041] Specifically, the second spray mechanism 4 is a spray pipe, and the spray pipe is connected to a cutting liquid pipeline (not shown in the figure). The cutting liquid pipeline may include components such as a pipeline and an infusion pump, and the cutting liquid pipeline plays the role of providing the second spray mechanism 4 with cutting liquid.

[0042] Specifically, the first spray mechanism 3 is a spray pipe, and the spray pipe is connected to a cutting liquid pipeline. The cutting liquid pipeline plays a role in providing the first spray mechanism 3 with cutting liquid.

[0043] In this embodiment, the cutting fluid pipeline can be a component outside the utility model. In other embodiments, the cutting fluid pipeline is a part of the utility model.

[0044] The working process of the silicon material cutting device of the utility model will be described in detail below:

[0045] Lay an adhesive film on the carrier board 1, and bond the silicon material 6 to the corresponding supporting areas 11 at intervals;

[0046] The carrier plate 1 is mounted on the propulsion mechanism 5, and the cutting liquid pipeline is opened to inject the cutting liquid into the first spray mechanism 3 and the second spray mechanism 4, and the cutting liquid is sprayed out from the first spray port 31 and the second spray port 41, and the cutting device 2 is started to rotate the cutting line 21 thereon;

[0047] The propulsion device 5 is started to make the silicon material 6 on the carrier 1 close to the cutting line 21 and be cut by the cutting line 21 until the silicon material 6 is cut. During the cutting process, the first spray mechanism 3 and the second spray mechanism 4 can be kept spraying liquid all the time to ensure that the cutting liquid can fully infiltrate the cutting line 21.

[0048] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0049] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A silicon material cutting device, characterized in that: include: A carrier having at least two spaced-apart bearing areas for bearing silicon materials, a gap area being formed between adjacent bearing areas, and a gap extending outward from the gap area to form a gap, wherein the gap is used to separate the silicon materials on adjacent bearing areas; A cutting mechanism, disposed on one side of the carrying area of ​​the carrier, and used for cutting the silicon material on the carrier; The first spray mechanism has a first liquid spray port facing the gap, and the first liquid spray port faces the cutting position between the cutting mechanism and the silicon material.

2. The silicon material cutting device according to claim 1, characterized in that: The silicon material cutting device further comprises a propulsion mechanism, and the propulsion mechanism is connected to the carrier plate or the cutting mechanism so as to move the carrier plate and the cutting mechanism closer to or farther away from each other.

3. The silicon material cutting device according to claim 2, characterized in that: The propulsion mechanism is connected to the carrier plate.

4. The silicon material cutting device according to claim 3, characterized in that: The distance between the first liquid spraying port and the cutting mechanism is fixed.

5. The silicon material cutting device according to claim 4, characterized in that: The silicon material cutting device also includes a machine platform, and the cutting mechanism and the first spraying mechanism are both fixedly mounted on the machine platform.

6. The silicon material cutting device according to claim 2, characterized in that: The propulsion mechanism includes a pneumatic cylinder or an electric cylinder.

7. The silicon material cutting device according to claim 1, characterized in that: The silicon material cutting device further comprises a second spray mechanism, wherein the second spray mechanism comprises second liquid spraying ports arranged at two ends of the carrier plate along the direction in which the carrier area is arranged.

8. The silicon material cutting device according to claim 7, characterized in that: The second spray mechanism is a spray pipe, and the spray pipe is connected to the cutting fluid pipeline.

9. The silicon material cutting device according to claim 1, characterized in that: The first spray mechanism is a spray pipe, and the spray pipe is connected to the cutting liquid pipeline.

10. The silicon material cutting device according to claim 1, characterized in that: The carrier board is a PVC carrier board.

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