Mounting device for CMOS (Complementary Metal Oxide Semiconductor) on laser sensor

Abstract

The utility model discloses a mounting device for a CMOS (Complementary Metal Oxide Semiconductor) on a laser sensor, which belongs to the technical field of mounting of the CMOS on the laser sensor, the mounting device is used for mounting the CMOS on a sensor shell and comprises a positioning part, and the positioning part is used for positioning and mounting the sensor shell; the mounting part comprises an adjusting carrying table and a clamping piece, the clamping piece is used for clamping the CMOS, and the adjusting carrying table is used for adjusting the clamping piece so as to change the position of the CMOS on the sensor shell; and the distance between the optical test board and the CMOS is adjustable, so that the installation position of the CMOS can be detected. According to the installation device of the CMOS on the laser sensor, the CMOS can be rapidly installed on the sensor shell, real-time detection can be carried out on the CMOS in the installation process, the installation precision of the CMOS is improved, and compared with traditional manual operation, the installation efficiency of the CMOS is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of CMOS installation on laser sensors, and in particular relates to a CMOS installation device on laser sensors. Background Art

[0002] CMOS is one of the important components of laser sensors. During the production and processing of laser sensors, CMOS needs to be accurately installed on the sensor housing to ensure the quality of the finished sensor. At present, the installation of CMOS is often carried out manually, that is, the operator manually installs CMOS on the sensor housing, and then checks the installation position of CMOS after the installation is completed. If the accuracy is insufficient, it needs to be disassembled and then installed. This installation method cannot detect the installation position of CMOS in real time during the installation process, which is time-consuming, labor-intensive, and inefficient. When installation problems occur, it needs to be disassembled and then installed. Utility Model Content

[0003] The utility model overcomes the shortcomings of the prior art and provides a CMOS mounting device on a laser sensor to solve the problems existing in the prior art.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a CMOS installation device on a laser sensor, which installs the CMOS on the sensor housing, including:

[0005] A positioning portion, wherein the positioning portion positions and installs the sensor housing;

[0006] A mounting part, wherein the mounting part includes an adjustment stage and a clamping member, wherein the clamping member clamps the CMOS, and the adjustment stage adjusts the clamping member to change the position of the CMOS on the sensor housing;

[0007] An optical test board, wherein the distance between the optical test board and the CMOS is adjustable so as to detect the installation position of the CMOS.

[0008] In a preferred embodiment of the utility model, a base is further included, and the positioning portion and the mounting portion are both arranged on the base.

[0009] In a preferred embodiment of the utility model, a scale block is arranged on one side of the base, and the optical test board is mounted on the scale block and moves along the length direction of the scale block.

[0010] In a preferred embodiment of the utility model, a guide rail is arranged on the scale block, and the optical test board is installed on the guide rail via a sliding bracket.

[0011] In a preferred embodiment of the utility model, the positioning part includes a positioning platform, a positioning block and a positioning pin. The positioning platform is provided with a receiving cavity to receive the sensor housing. The positioning block and the positioning pin position and install the sensor housing in the receiving cavity.

[0012] In a preferred embodiment of the present invention, a negative pressure connector is provided at the bottom of the positioning platform, and the negative pressure connector is communicated with the accommodating cavity to negatively position the sensor housing located in the accommodating cavity.

[0013] In a preferred embodiment of the utility model, a filter is arranged on one side of the positioning platform, and the filter is arranged in parallel with the optical testing board to filter the CMOS.

[0014] In a preferred embodiment of the present invention, the clamping member is a movable clamping claw to clamp the CMOS.

[0015] The utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0016] The CMOS installation device on the laser sensor of the utility model can quickly install the CMOS on the sensor housing, and can perform real-time detection of the CMOS during the installation process to improve the installation accuracy of the CMOS. Compared with traditional manual operation, this method effectively improves the installation accuracy of the CMOS, reduces manpower consumption, and improves the installation efficiency of the CMOS. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0018] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the utility model;

[0019] Figure 2 It is a partial structural schematic diagram of a preferred embodiment of the utility model;

[0020] Figure 3 This is a structural schematic diagram of a positioning part of a preferred embodiment of the utility model;

[0021] In the figure: 10, positioning part; 11, positioning platform; 111, accommodating cavity; 12, positioning block; 13, positioning pin; 20, mounting part; 21, adjusting platform; 22, clamping member; 30, optical test board; 40, base; 50, scale block; 51, guide rail; 60, sliding bracket; 70, negative pressure joint; 80, filter. DETAILED DESCRIPTION

[0022] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many physical details will be described together in the following description. However, it should be understood that these physical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these physical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0023] In addition, in the present utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present utility model. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0024] This embodiment provides a CMOS installation device on a laser sensor, which installs the CMOS on the sensor housing. The installation device can quickly install the CMOS on the sensor housing and can perform real-time detection of the CMOS during the installation process to improve the installation accuracy of the CMOS. Compared with traditional manual operations, this method effectively improves the installation accuracy of the CMOS, reduces manpower consumption, and improves the installation efficiency of the CMOS.

[0025] Combination Figures 1 to 3 As shown, the installation device of CMOS on the laser sensor of this embodiment includes a positioning part 10, a mounting part 20 and an optical test board 30. The positioning part 10 positions and installs the sensor housing, while the mounting part 20 installs the CMOS at a corresponding position of the sensor housing. The optical test board 30 performs real-time optical detection on the CMOS so that the mounting part 20 can adjust the position of the CMOS.

[0026] In this embodiment, the installation device also includes a base 40, the positioning part 10 and the installation part 20 are both arranged on the base 40, a scale block 50 is arranged on one side of the base 40, the optical test board 30 is installed on the scale block 50, and moves along the length direction of the scale block 50. The scale block 50 can quickly determine the position of the optical test board 30, and by changing the position of the optical test board 30, multi-position detection of the CMOS can be achieved, which is beneficial to the rapid and accurate installation of the CMOS.

[0027] Specifically, a guide rail 51 is provided on the scale block 50, and the optical test board 30 is installed on the guide rail 51 through a sliding bracket 60. With the cooperation of the sliding bracket 60 and the guide rail 51, the optical test board 30 approaches or moves away from the CMOS, and the detection of the CMOS is achieved by changing the distance between the optical test board 30 and the CMOS.

[0028] Combination Figure 1 and Figure 3 As shown, the positioning portion 10 of the present embodiment includes a positioning platform 11, a positioning block 12 and a positioning pin 13. The positioning platform 11 is provided with a receiving cavity 111 to receive the sensor housing. The positioning block 12 and the positioning pin 13 position and install the sensor housing in the receiving cavity 111. In the present embodiment, the sensor housing is placed in the receiving cavity 111 of the positioning platform 11, and the sensor housing is positioned by the positioning block 12 and the positioning pin 13. A negative pressure connector 70 is provided at the bottom of the positioning platform 11, and the negative pressure connector 70 is connected to the receiving cavity 111 to negatively position the sensor housing in the receiving cavity 111. Under the negative pressure adsorption of the negative pressure connector 70 and the positioning action of the positioning block 12 and the positioning pin 13, the sensor housing is stably installed in the receiving cavity 111 so that the CMOS can be installed. A buffer spring is provided in the positioning pin 13 of the present embodiment to achieve buffer positioning of the CMOS by the positioning pin 13.

[0029] In this embodiment, the mounting portion 20 includes an adjustment platform 21 and a clamping member 22. The clamping member 22 clamps the CMOS. The adjustment platform 21 adjusts the clamping member 22 to change the position of the CMOS on the sensor housing. The adjustment platform 21 of this embodiment is composed of a plurality of adjustment blocks. Each adjustment block is provided with an adjustment head. The adjustment head adjusts the adjustment block to change the position of the CMOS and completes the installation process of the CMOS on the sensor housing. The clamping member 22 used in this embodiment is a movable clamp to clamp the CMOS.

[0030] Furthermore, a filter 80 is provided on one side of the positioning platform 11 of this embodiment. The filter 80 is arranged parallel to the optical test board 30 to filter the CMOS. During the CMOS detection process, the filter 80 can perform filtering processing so that the CMOS can perform stable detection and improve the detection accuracy.

[0031] In actual use, the installation device of this embodiment is used to quickly and accurately install the CMOS on the sensor housing. The positioning part 10 can accurately position the sensor housing, and the installation part 20 can drive the CMOS to move, so that the CMOS can be quickly installed on the sensor housing. The detection part can detect the installed CMOS so as to adjust the installation position of the CMOS. The detection part monitors the CMOS in real time, which can effectively improve the installation efficiency and installation accuracy of the CMOS and reduce manpower consumption.

[0032] Although the utility model has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the utility model. That is to say, the methods, systems or devices discussed above are all examples. Various configurations may appropriately omit, replace or add various processes or components. For example, in an alternative configuration, the method may be performed in an order different from the order described, and / or various stages may be added, omitted and / or combined. Moreover, the features described with respect to certain configurations may be combined in various other configurations. Different aspects and elements of the configuration may be combined in a similar manner. In addition, with the development of technology, many elements are merely examples and do not limit the scope of the present disclosure or claims.

[0033] Specific details are given in the specification to provide a thorough understanding of the exemplary configurations including implementations. However, the configurations can be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary details to avoid obscuring the configurations. This description provides only example configurations and does not limit the scope, applicability, or configurations of the claims. On the contrary, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made to the functions and arrangements of the elements without departing from the spirit or scope of the present disclosure.

[0034] In addition, although each operation may describe the operation as a sequential process, many operations may be performed in parallel or simultaneously. In addition, the order of the operations may be rearranged. A process may have additional steps. In addition, examples of methods may be implemented by hardware, software, firmware, middleware, code, hardware description language, or any combination thereof. When implemented in software, firmware, middleware, or code, program code or code segments for performing the necessary tasks may be stored in a non-transitory computer-readable medium such as a storage medium, and the described tasks are performed by a processor.

[0035] In summary, it is intended that the above detailed description is considered to be illustrative rather than restrictive, and it should be understood that the claims (including all equivalents) are intended to define the spirit and scope of the utility model. The above embodiments should be understood to be only used to illustrate the utility model and not to limit the scope of protection of the utility model. After reading the contents of the records of the utility model, the technicians can make various changes or modifications to the utility model, and these equivalent changes and modifications also fall within the scope defined by the claims of the utility model.

Claims

1. A CMOS mounting device on a laser sensor, which mounts the CMOS on a sensor housing, characterized in that: include A positioning portion (10), wherein the positioning portion (10) positions and installs the sensor housing; A mounting part (20), the mounting part (20) comprising an adjustment platform (21) and a clamping member (22), the clamping member (22) clamps the CMOS, and the adjustment platform (21) adjusts the clamping member (22) to change the position of the CMOS on the sensor housing; An optical test board (30) having an adjustable distance between the optical test board (30) and the CMOS so as to detect the installation position of the CMOS.

2. The CMOS mounting device on a laser sensor according to claim 1, characterized in that: It also comprises a base (40), and the positioning portion (10) and the mounting portion (20) are both arranged on the base (40).

3. The CMOS mounting device on a laser sensor according to claim 2, characterized in that: A scale block (50) is provided on one side of the base (40), and the optical test board (30) is mounted on the scale block (50) and moves along the length direction of the scale block (50).

4. The CMOS mounting device on a laser sensor according to claim 3, characterized in that: The scale block (50) is provided with a guide rail (51), and the optical test board (30) is mounted on the guide rail (51) via a sliding bracket (60).

5. The CMOS mounting device on a laser sensor according to claim 1, characterized in that: The positioning portion (10) comprises a positioning platform (11), a positioning block (12) and a positioning pressing pin (13); the positioning platform (11) is provided with a receiving cavity (111) for receiving the sensor housing; the positioning block (12) and the positioning pressing pin (13) position and install the sensor housing located in the receiving cavity (111).

6. The CMOS mounting device on a laser sensor according to claim 5, characterized in that: A negative pressure connector (70) is provided at the bottom of the positioning platform (11), and the negative pressure connector (70) is in communication with the accommodating cavity (111) so as to negatively position the sensor housing located in the accommodating cavity (111).

7. The CMOS mounting device on a laser sensor according to claim 5, characterized in that: A filter (80) is arranged on one side of the positioning platform (11), and the filter (80) is arranged in parallel with the optical test board (30) to filter the CMOS.

8. The CMOS mounting device on a laser sensor according to claim 1, characterized in that: The clamping member (22) is a movable clamping claw for clamping the CMOS.

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