Temperature measuring sensor device

Abstract

The utility model provides a temperature measurement sensor device, which comprises an MEMS chip and a CMOS circuit chip, and is characterized in that the MEMS chip is provided with a plurality of harmonic oscillators; the CMOS circuit chip is connected with the MEMS chip, the CMOS circuit chip comprises an oscillating circuit, a temperature measuring circuit, an integer or decimal frequency dividing circuit, a buffer circuit and a digital logic circuit, the oscillating circuit, the integer or decimal frequency dividing circuit and the buffer circuit are sequentially connected, the digital logic circuit is connected with the integer or decimal frequency dividing circuit, and the oscillating circuit is connected with the temperature measuring circuit; the oscillating circuit controls the harmonic oscillator to vibrate so as to generate a clock signal, the digital logic circuit is used for controlling the integer or decimal frequency dividing circuit to carry out frequency dividing processing on the clock signal and outputting a clock signal of a target frequency through the buffer circuit, and the temperature measuring circuit is used for extracting surface temperature information of an object to be measured at the MEMS chip. Therefore, the temperature measurement sensor device can realize multifunctionalization.

Description

Technical Field

[0001] The present application relates to the technical field of micro-electromechanical systems, and in particular to a temperature sensor device. Background Art

[0002] Micro-Electro-Mechanical System (MEMS) is a high-tech field based on microelectronics and micromachining technology. MEMS technology can integrate mechanical components, drive components, electronic control systems, digital processing systems, etc. into an integrated micro unit. MEMS devices have many advantages such as small size, intelligence, executable, integrable, good process compatibility, and low cost.

[0003] The temperature sensor device system usually includes multiple electrodes to drive the MEMS resonator. As is well known, when a bias voltage is applied to the resonator, charges accumulate on the resonator, which generates an electrostatic force between the electrode and the opposite charges accumulated on the resonator. By applying a time-varying drive voltage signal to the drive electrode, usually combined with a DC (Direct Current) voltage, a time-varying electrostatic force can be generated, which results in a temperature sensor device.

[0004] However, the existing single temperature sensor device cannot achieve multi-functions, such as temperature measurement and output clock signal and other functions. The inability of a single temperature sensor device to achieve multi-functions means that when the system requires multiple functions, more discrete temperature sensor devices need to be installed to complete the overall function. In some space-constrained application scenarios, such as portable devices or embedded systems, multiple discrete temperature sensor devices may not be accommodated or installed. Utility Model Content

[0005] In view of this, the present application provides a temperature measuring sensor device so that the temperature measuring sensor device can be multifunctional.

[0006] The present application provides a temperature measuring sensor device, comprising:

[0007] A MEMS chip with multiple resonators;

[0008] A CMOS circuit chip connected to the MEMS chip, wherein the CMOS circuit chip includes an oscillation circuit, a temperature measurement circuit, an integer or fractional frequency division circuit, a buffer circuit, and a digital logic circuit, wherein the oscillation circuit, the integer or fractional frequency division circuit, and the buffer circuit are connected in sequence, the digital logic circuit is connected to the integer or fractional frequency division circuit, and the oscillation circuit is connected to the temperature measurement circuit;

[0009] Among them, the oscillation circuit controls the vibration of the resonator to generate a clock signal, the digital logic circuit is used to control the integer or fractional frequency division circuit to perform frequency division processing on the clock signal, and output the clock signal of the target frequency through the buffer circuit, and the temperature measurement circuit is used to extract the surface temperature information of the object to be measured at the MEMS chip.

[0010] In some embodiments, the MEMS chip has at least one first resonator and at least one second resonator, the first resonator and the second resonator constitute a temperature measurement structure, the oscillation circuit is connected to the first resonator and the second resonator in a one-to-one correspondence, and the temperature measurement circuit is connected to the digital logic circuit;

[0011] One of the oscillation circuits is used to control the vibration of the first resonator to obtain a first clock signal with a first frequency, and the other oscillation circuit is used to control the vibration of the second resonator to obtain a second clock signal with a second frequency. The frequency synthesis circuit in the temperature measurement circuit is used to combine the first clock signal with the second clock signal to obtain frequency difference information between the first resonator and the second resonator, and the frequency synthesis circuit extracts the surface temperature information of the object to be measured at the MEMS chip through the frequency difference information.

[0012] In some embodiments, the CMOS circuit chip also includes a register or a memory, the digital logic circuit is connected to the register or the memory, the polynomial fitting circuit and the filtering circuit in the digital logic circuit fit the temperature information to generate a temperature signal, and the temperature signal is transmitted to the register or the memory after being trimmed by the filtering circuit.

[0013] In some embodiments, the CMOS circuit chip further includes an I connected to the register or memory. 2 C or One-wire communication interface, the I 2 C or One-wire communication interface is provided with a data interface and a communication clock interface to the outside. 2 C or One-wire communication interface is used to output the temperature signal to the outside.

[0014] In some embodiments, the CMOS circuit chip also includes a register or memory, a first MOS tube and a timing circuit. The digital logic circuit, the temperature measurement circuit, the digital logic circuit, the register or memory connection, the timing circuit and the first MOS tube are connected in sequence. The register or memory and the timing circuit are used to generate an interrupt signal and output the interrupt signal through the first MOS tube.

[0015] In some embodiments, the CMOS circuit chip further includes a second MOS tube, the temperature measurement circuit, the digital logic circuit and the second MOS tube are connected in sequence, and the second MOS tube is used to output a square wave signal.

[0016] In some embodiments, the digital logic circuit includes a frequency division circuit, which is used to divide the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and output a square wave signal through the second MOS tube.

[0017] In some embodiments, the digital logic circuit includes a frequency division circuit, which is used to divide the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and transmit it to the register or memory. The register or memory and the timing circuit generate an interrupt signal through timing or counting operation.

[0018] In some embodiments, the CMOS circuit chip further includes a power management circuit, which has external power supply, battery power supply and ground interface, and is used to allocate various voltage signals to supply different modules.

[0019] In some embodiments, the MEMS chip is connected to the CMOS circuit chip via an interconnection line with a shielding layer or a shielding line.

[0020] The present application provides a temperature measuring sensor device, comprising a MEMS chip and a CMOS circuit chip, wherein the MEMS chip has a plurality of resonators; the CMOS circuit chip is connected to the MEMS chip, the CMOS circuit chip comprises an oscillation circuit, a temperature measuring circuit, an integer or fractional frequency dividing circuit, a buffer circuit and a digital logic circuit, the oscillation circuit, the integer or fractional frequency dividing circuit and the buffer circuit are connected in sequence, the digital logic circuit is connected to the integer or fractional frequency dividing circuit, and the oscillation circuit is connected to the temperature measuring circuit; the oscillation circuit controls the vibration of the resonator to generate a clock signal, the digital logic circuit is used to control the integer or fractional frequency dividing circuit to perform frequency division processing on the clock signal, and outputs a clock signal of a target frequency through the buffer circuit, and the temperature measuring circuit is used to extract surface temperature information of an object to be measured at the MEMS chip, so that the temperature measuring sensor device can be multifunctional. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is a plan view of a temperature sensor device provided by the present application;

[0023] Figure 2 is a plan view of a MEMS chip provided by the present application;

[0024] Figure 3 is a schematic diagram of the resonance frequency and temperature of the first resonator provided by the present application;

[0025] Figure 4 is a schematic diagram of the resonant frequency and temperature of the second resonator provided by the present application;

[0026] Figure 5 It is a block diagram of the CMOS circuit chip provided by the present application.

[0027] Reference numerals:

[0028] 10. Temperature sensor device; 100. Protective shell; 200. MEMS chip; 210. First resonator; 220. Second resonator; 230. Chip substrate; 240. Connecting rod; 300. CMOS circuit chip; 400. Interconnection line. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of the present application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by a person skilled in the art to which this application belongs. The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more related listed items. The terms "connection", "electrical connection", and "electrical connection" used herein include any direct and indirect electrical or structural connection means. Therefore, if the text describes a first device coupled / connected / electrically connected to a second device, it means that the first device can be directly electrically / structurally connected to the second device, or indirectly electrically / structurally connected to the second device through other devices or connection means.

[0032] The present application provides a temperature measurement sensor device, comprising a MEMS chip and a CMOS circuit chip, wherein the MEMS chip has a plurality of resonators; the CMOS circuit chip is connected to the MEMS chip, the CMOS circuit chip comprises an oscillation circuit, a temperature measurement circuit, an integer or decimal frequency division circuit, a buffer circuit and a digital logic circuit, the oscillation circuit, the integer or decimal frequency division circuit and the buffer circuit are connected in sequence, the digital logic circuit is connected to the integer or decimal frequency division circuit, and the oscillation circuit is connected to the temperature measurement circuit; the oscillation circuit controls the vibration of the resonator to generate a clock signal, the digital logic circuit is used to control the integer or decimal frequency division circuit to perform frequency division processing on the clock signal, and outputs a clock signal of a target frequency through the buffer circuit, and the temperature measurement circuit is used to extract surface temperature information of an object to be measured at the MEMS chip.

[0033] In the present application, an oscillation circuit, an integer or fractional frequency division circuit and a buffer circuit are sequentially connected in a temperature sensor device, and a digital logic circuit is connected to the integer or fractional frequency division circuit. At the same time, the temperature measurement circuit is connected to the oscillation circuit, so that the temperature measurement sensor device can not only measure the temperature of the temperature measurement sensor device, but also output a clock signal, so that the temperature measurement sensor device can achieve multifunctionality.

[0034] See also Figure 1-Figure 5 , Figure 1 is a plan view of a temperature sensor device provided by the present application; Figure 2 is a plan view of a MEMS chip provided by the present application; Figure 3 is a schematic diagram of the resonance frequency and temperature of the first resonator provided by the present application; Figure 4 is a schematic diagram of the resonant frequency and temperature of the second resonator provided by the present application; Figure 5: is a block diagram of a CMOS circuit chip provided by the present application. The present application provides a temperature sensor device 10, including a MEMS chip 200 and a CMOS circuit chip 300, wherein the MEMS chip 200 has a plurality of resonators; the CMOS circuit chip 300 is connected to the MEMS chip 200, and the CMOS circuit chip 300 includes an oscillation circuit, a temperature measurement circuit, an integer or decimal frequency division circuit, a buffer circuit, and a digital logic circuit, wherein the oscillation circuit, the integer or decimal frequency division circuit, and the buffer circuit are connected in sequence, the digital logic circuit is connected to the integer or decimal frequency division circuit, and the oscillation circuit is connected to the temperature measurement circuit; the oscillation circuit controls the vibration of the resonator to generate a clock signal, the digital logic circuit is used to control the integer or decimal frequency division circuit to perform frequency division processing on the clock signal, and outputs a clock signal of a target frequency through the buffer circuit, and optionally, the buffer circuit can output a clock signal of 32.768kHz or 1Hz-128Hz, and the temperature measurement circuit is used to extract the surface temperature information of the object to be measured at the MEMS chip 200. Further, the MEMS chip 200 and the CMOS circuit chip 300 are arranged side by side, or the MEMS chip 200 is located below or above the CMOS circuit chip 300. In this embodiment, the MEMS chip 200 and the CMOS circuit chip 300 can be arranged side by side as an example for explanation. In its working state, the frequency of vibration or oscillation of each resonator falls within the range of kilohertz (KHz), and the power consumption of the CMOS circuit chip 300 is at the μA level.

[0035] In one embodiment, the MEMS chip 200 and the CMOS circuit chip 300 are connected via an interconnection line 400 with a shielding layer or a shielding line. Furthermore, the lengths of the interconnection lines 400 are equal. In the present application, the MEMS chip 200 and the CMOS circuit chip 300 are connected via an interconnection line 400 with a shielding layer or a shielding line, which can prevent the MEMS chip 200 and the CMOS circuit chip 300 from being easily disturbed by external noise due to the increased distance and weak transmission signal, that is, to ensure that the MEMS chip 200 and the CMOS circuit chip 300 will not be disturbed by external signals, thereby ensuring the performance of the temperature sensor device 10.

[0036] In one embodiment, the interconnection lines 400 include on-chip interconnection lines 400 and off-chip interconnection lines 400 . The on-chip interconnection lines 400 are used to electrically connect electrical connection points of the MEMS chip 200 and the CMOS circuit chip 300 .

[0037] In one embodiment, the temperature sensor device 10 further includes a protective shell 100 , which encapsulates the MEMS chip 200 , the interconnection line 400 and the CMOS circuit chip 300 . The protective shell 100 has good thermal conductivity.

[0038] In one embodiment, the MEMS chip 200 has at least one first resonator 210 and at least one second resonator 220, the first resonator 210 and the second resonator 220 constitute a temperature measurement structure, the oscillation circuit is connected to the first resonator 210 and the second resonator 220 in a one-to-one correspondence, and the temperature measurement circuit is connected to the digital logic circuit; one oscillation circuit is used to control the vibration of the first resonator 210 to obtain a first clock signal with a first frequency, and the other oscillation circuit is used to control the vibration of the second resonator 220 to obtain a second clock signal with a second frequency, and the frequency synthesis circuit in the temperature measurement circuit is used to combine the first clock signal with the second clock signal to obtain the frequency difference information between the first resonator 210 and the second resonator 220, and the frequency synthesis circuit extracts the surface temperature information of the object to be measured at the MEMS chip 200 through the frequency difference information. Specifically, the MEMS chip 200 includes a chip substrate 230, at least one first resonator 210 and at least one second resonator 220. Each first resonator 210 and each second resonator 220 are connected to the chip substrate 230 through a connecting rod 240, so that the resonator is suspended in the air and can vibrate. The plane shape of the first resonator 210 is a parallelogram, and the connecting rod 240 is connected to the opposite side of the first resonator 210. The plane shape of the second resonator 220 is a square, and the connecting rod 240 is connected to the opposite corner of the second resonator 220. The vibration mode of the first resonator 210 is different from the vibration mode of the second resonator 220. Among them, the first resonator 210 has a negative linear frequency-temperature curve, and the second resonator 220 has a positive linear frequency-temperature curve. Two of the resonators with positive and negative linear frequency-temperature curve characteristics can be combined into a temperature measurement structure, which is a frequency difference temperature measurement sensing structure. The shape structure, connection method and vibration mode of the first resonator 210 and the second resonator 220 are set to be different, so that the first resonator 210 and the second resonator 220 have different frequency temperature coefficients (TCFs), and different frequency temperature coefficients (TCFs) present different frequency-temperature curves; the frequency synthesis circuit in the temperature measurement circuit combines the first clock signal with the first frequency with the second clock signal with the second frequency to obtain a third clock signal with a third frequency. The third frequency is defined as a linear combination of the first frequency and the second frequency, that is, f3=α·f1-β·f2, and the third frequency is the frequency difference information between the first resonator 210 and the second resonator 220. Since f3=α·f1-β·f2, f3 has a linear frequency-temperature curve, and the frequency synthesis circuit in the temperature measurement circuit extracts the surface temperature information of the object to be measured at the MEMS chip 200 through the frequency difference information.

[0039] In one embodiment, the CMOS circuit chip 300 also includes a register or a memory, the digital logic circuit is connected to the register or the memory, the polynomial fitting circuit and the filter circuit in the digital logic circuit fit the temperature information to generate a temperature signal, and the temperature signal is transmitted to the register or the memory after being trimmed by the filter circuit.

[0040] In one embodiment, the CMOS circuit chip 300 further includes an I2C connected to a register or a memory. 2 C or One-wire communication interface, I 2 C or One-wire communication interface is provided with data interface and communication clock interface to the outside, so as to achieve I 2 C communication or One-wire communication requirements to make I 2 C or One-wire communication interface can output temperature signal to the outside.

[0041] In one embodiment, the CMOS circuit chip 300 further includes a register or memory, a first MOS transistor and a timing circuit, a digital logic circuit, a temperature measurement circuit, a digital logic circuit, a register or memory connection, a timing circuit and a first MOS transistor connected in sequence, the register or memory and the timing circuit are used to generate an interrupt signal, and output the interrupt signal through the first MOS transistor. Further, the digital logic circuit includes a frequency division circuit, the frequency division circuit is used to divide the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and transmit it to the register or memory, the register or memory and the timing circuit generate an interrupt signal through timing or counting operation.

[0042] In one embodiment, the CMOS circuit chip 300 further includes a second MOS tube, the temperature measurement circuit, the digital logic circuit and the second MOS tube are connected in sequence, and the second MOS tube is used to output a square wave signal. Further, the digital logic circuit includes a frequency division circuit, and the frequency division circuit is used to divide the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and output a square wave signal through the second MOS tube. Further, the second MOS tube output can output a square wave signal of 1Hz-32Hz.

[0043] In one embodiment, the CMOS circuit chip 300 further includes a power management circuit, which has external power supply, battery power supply and ground interface, and is used to allocate various voltage signals to different modules. Further, the CMOS circuit chip 300 further includes a POR reset circuit and a power switching circuit, the POR reset circuit is used to reset or reset the system, and the power switching circuit is used to switch the external power supply.

[0044] In the present application, an oscillator circuit, an integer or fractional frequency division circuit, and a buffer circuit are sequentially connected in the temperature sensor device 10, and a digital logic circuit is connected to the integer or fractional frequency division circuit. At the same time, the temperature measurement circuit is connected to the oscillator circuit, so that the temperature sensor device 10 can not only measure the temperature of the temperature sensor device 10, but also output a clock signal, so that the temperature sensor device 10 can be multifunctional; in addition, the oscillator circuit, the temperature measurement circuit, the digital logic circuit, the register or memory, and the I 2 C or One-wire communication interface is set to be connected in sequence, so that the temperature sensor device 10 can not only measure temperature and output clock signal, but also output temperature signal; in addition, the oscillation circuit, temperature measurement circuit, digital logic circuit, register or memory, timing circuit and first MOS tube are set to be connected in sequence, so that the temperature sensor device 10 can not only measure temperature and output clock signal, but also output interrupt signal; in addition, the oscillation circuit, temperature measurement circuit and second MOS tube are set to be connected in sequence, so that the temperature sensor device 10 can not only measure temperature, but also output 1Hz~32.768KHz clock signal, so that a single temperature sensor device 10 can realize multiple functions; in addition, the present application uses multiple KHz frequency resonators with a CMOS circuit chip 300 with a power consumption of μA level for temperature measurement, which not only ensures the high precision of temperature measurement, but also eliminates the influence of the heat of the signal processing circuit chip itself on the accuracy of temperature measurement, thereby ensuring the performance of the temperature sensor.

[0045] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structural or equivalent process transformations made using the contents of the specification and drawings of the present application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature sensor device, characterized in that: include: A MEMS chip with multiple resonators; A CMOS circuit chip connected to the MEMS chip, wherein the CMOS circuit chip includes an oscillation circuit, a temperature measurement circuit, an integer or fractional frequency division circuit, a buffer circuit, and a digital logic circuit, wherein the oscillation circuit, the integer or fractional frequency division circuit, and the buffer circuit are connected in sequence, the digital logic circuit is connected to the integer or fractional frequency division circuit, and the oscillation circuit is connected to the temperature measurement circuit; Among them, the oscillation circuit controls the vibration of the resonator to generate a clock signal, the digital logic circuit is used to control the integer or fractional frequency division circuit to perform frequency division processing on the clock signal, and output the clock signal of the target frequency through the buffer circuit, and the temperature measurement circuit is used to extract the surface temperature information of the object to be measured at the MEMS chip.

2. The temperature sensor device according to claim 1, characterized in that: The MEMS chip has at least one first resonator and at least one second resonator, the first resonator and the second resonator form a temperature measurement structure, the oscillation circuit is connected to the first resonator and the second resonator in a one-to-one correspondence, and the temperature measurement circuit is connected to the digital logic circuit; One of the oscillation circuits is used to control the vibration of the first resonator to obtain a first clock signal with a first frequency, and the other oscillation circuit is used to control the vibration of the second resonator to obtain a second clock signal with a second frequency. The frequency synthesis circuit in the temperature measurement circuit is used to combine the first clock signal with the second clock signal to obtain frequency difference information between the first resonator and the second resonator, and the frequency synthesis circuit extracts the surface temperature information of the object to be measured at the MEMS chip through the frequency difference information.

3. The temperature sensor device according to claim 2, characterized in that: The CMOS circuit chip also includes a register or a memory, the digital logic circuit is connected to the register or the memory, the polynomial fitting circuit and the filtering circuit in the digital logic circuit fit the temperature information to generate a temperature signal, and the temperature signal is transmitted to the register or the memory after being trimmed by the filtering circuit.

4. The temperature sensor device according to claim 3, characterized in that: The CMOS circuit chip also includes an I connected to the register or memory 2 C or One-wire communication interface, the I 2 C or One-wire communication interface is provided with a data interface and a communication clock interface to the outside. 2 C or One-wire communication interface is used to output the temperature signal to the outside.

5. The temperature sensor device according to claim 1, characterized in that: The CMOS circuit chip also includes a register or memory, a first MOS tube and a timing circuit. The digital logic circuit, the temperature measurement circuit, the digital logic circuit, the register or memory connection, the timing circuit and the first MOS tube are connected in sequence. The register or memory and the timing circuit are used to generate an interrupt signal, and output the interrupt signal through the first MOS tube.

6. The temperature sensor device according to claim 1, characterized in that: The CMOS circuit chip also includes a second MOS tube, the temperature measurement circuit, the digital logic circuit and the second MOS tube are connected in sequence, and the second MOS tube is used to output a square wave signal.

7. The temperature measuring sensor device according to claim 6, characterized in that: The digital logic circuit includes a frequency division circuit, which is used to perform frequency division processing on the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and output a square wave signal through the second MOS tube.

8. The temperature sensor device according to claim 5, characterized in that: The digital logic circuit includes a frequency division circuit, which is used to divide the first clock signal or the second clock signal generated by the resonator to obtain a clock signal of a target frequency, and transmit it to the register or memory. The register or memory and the timing circuit generate an interrupt signal through timing or counting operation.

9. The temperature sensor device according to claim 1, characterized in that: The CMOS circuit chip also includes a power management circuit. The power management circuit has external power supply, battery power supply and grounding interface. The power management circuit is used to allocate various voltage signals to supply different modules.

10. The temperature sensor device according to claim 1, characterized in that: The MEMS chip is connected to the CMOS circuit chip via an interconnection line with a shielding layer or a shielding line.

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