High-density chip plastic packaging equipment

Abstract

The utility model discloses high-density chip plastic packaging equipment, which relates to the technical field of chip plastic packaging and comprises a bottom plate, two ends of the bottom plate are fixedly connected with a side plate and an air cylinder respectively, the side end of the bottom plate is fixedly connected with a plastic packaging machine, two groups of guide rods are arranged between the side plate and the air cylinder, and the bottom end of the air cylinder is connected with a suction cup in a matched manner. The bottom end of the suction cup is fixedly connected with a bearing plate, the two sets of drivers are connected with the guide rods in a matched mode, the two ends of the supporting plate are connected with the drivers in a matched mode, the inner wall of the supporting plate is connected with a chip in an abutting mode, the bottom end of the supporting plate is connected with a bearing plate in a matched mode, and the bearing plate is connected with the bottom end of the chip in an abutting mode. The bearing plate adsorbed by the suction cup is aligned with the supporting plate, when the supporting plate moves all the time, the bearing plate is installed on the top of the supporting plate, the driving machine controls the supporting plate to rotate, so that the back face of the chip is achieved, and when the back face of the chip is completely achieved, the plastic packaging machine can conduct plastic packaging on the bottom of the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip plastic packaging, in particular to high-density chip plastic packaging equipment. Background Art

[0002] High-density chips generally refer to integrated circuits that integrate a large number of electronic components per unit area. These chips are widely used in many fields, including smartphones, high-performance computing, data centers, artificial intelligence, and the Internet of Things.

[0003] In the prior art, high-density chips are often plasticized using a plasticizer during the production process. The chip is placed on a plasticizer table, and the plasticizer heats and melts the plastic compound, and then spreads the plastic compound flat on the chip to protect the leads and electronic components on the chip.

[0004] Since chips are hard products, plastic sealing machines usually perform plastic sealing by pressing. However, the pressing plastic sealing process can only operate on the surface of the chip alone, and the chip needs to be turned over. The conventional turning method is to disassemble the chip, turn it over, and then install it on the plastic sealing table. This plastic sealing process is cumbersome and inefficient. Utility Model Content

[0005] The utility model aims to provide a high-density chip plastic sealing device to solve the problem in the prior art that since the chip is a hard product, the plastic sealing machine often performs plastic sealing processing by pressing; however, the pressing type plastic sealing processing can only operate on the surface of the chip alone, and the chip needs to be turned over. The conventional turning method is to disassemble the chip, turn it over and then install it on the plastic sealing table. This plastic sealing processing method is cumbersome to operate and has low efficiency.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A high-density chip plastic packaging device, comprising:

[0008] A bottom plate, the two ends of the bottom plate are respectively fixedly connected with side plates and a cylinder, the side ends of the bottom plate are fixedly connected with a plastic sealing machine, two groups of guide rods are arranged between the side plates and the cylinder, the bottom end of the cylinder is matched with a suction cup, and the bottom end of the suction cup is fixedly connected with a bearing plate;

[0009] A driving machine, wherein the driving machine is provided with two groups and is cooperatively connected with respective guide rods;

[0010] A support plate, wherein both ends of the support plate are respectively connected with the driving machine, the inner wall of the support plate is connected with a chip, and the bottom end of the support plate is connected with a carrier plate, and the carrier plate is connected with the bottom end of the chip.

[0011] As a further solution of the utility model: the two groups of guide rods are respectively located on both sides of the side plate, and the two ends of the guide rods are respectively fixedly connected to the side plate and the cylinder.

[0012] As a further solution of the utility model: the driving machine is transversely provided with a guide hole, a rotating shaft is provided between the driving machine and the support plate, the guide hole is slidably connected to the guide rod, and both ends of the rotating shaft are fixedly connected to the driving machine and the support plate respectively.

[0013] As a further solution of the utility model: two sets of locking components are fixedly connected to the end of the support plate away from the cylinder, control holes are opened on the upper and lower sides of the end of the support plate away from the cylinder, and sliding grooves are respectively opened on the upper and lower sides of both ends of the support plate, a slide plate is clamped in the control hole, and the two ends of the support plate are respectively fixedly connected to the slide plate.

[0014] As a further solution of the utility model: the locking assembly cooperates with the control hole, and the locking assembly includes: a locking controller, a control rod and a locking plate. The locking controller is fixedly connected to the support plate, and the locking controller is cooperatively connected to the control rod. The end of the control rod away from the locking controller is fixedly connected to the locking plate, and the locking plate is slidably connected to the control hole. A locking groove is provided at one end of the bearing plate close to the locking controller, and the locking groove is abutted against the locking plate.

[0015] As a further solution of the utility model: the side end of the carrier plate is fixedly connected to a limiting plate, and the limiting plate is butted against and connected to the side end of the chip.

[0016] Beneficial effects of the utility model:

[0017] 1. The bottom plate is used to provide support for the cylinder and the side plate. Multiple chips are evenly distributed on the bearing plate installed at the bottom of the support plate. The driving machine is operated to slide on the guide rod. The equipment driving the driving machine belongs to the electrical equipment of the prior art. The driving machine slides along the guide rod, thereby driving the support plate to slide. When the support plate moves to the bottom of the laminating machine with the chip, the laminating machine plasticizes the chip.

[0018] 2. The carrier plate adsorbed by the suction cup is aligned with the support plate. When the support plate is moving all the time, the carrier plate is installed on the top of the support plate. The driving machine controls the rotation of the support plate to realize the reverse side of the chip. When the chip is completely reversed, the suction cup adsorbs the carrier plate on the top of the support plate. When the driving machine moves toward the direction of the plastic sealing machine, the carrier plate begins to detach from the top of the support plate, and the plastic sealing machine can plastic seal the bottom of the chip. The support plate cooperates with the cylinder to achieve the effect of automatically reversing the chip, avoiding the time-consuming and laborious chip removal. Among them, the driving machine moves back and forth along the guide rod to realize the support plate carrying the chip for double-sided plastic sealing. After that, the support plate carries the chip back to the starting position, and the entire work process is automated, further improving the efficiency of the plastic sealing machine for double-sided plastic sealing of chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a front view of the overall structure of the utility model;

[0022] Figure 3 It is the AA cross-sectional view of the overall structure of the utility model;

[0023] Figure 4 It is the BB cross-sectional view of the overall structure of the utility model;

[0024] Figure 5 For the utility model Figure 3 A schematic diagram of the structure at A;

[0025] Figure 6 For the utility model Figure 4 A schematic diagram of the structure at B;

[0026] Figure 7 This is a schematic diagram of the structure of the driving machine of the utility model;

[0027] Figure 8 This is a schematic diagram of the structure of the load-bearing plate of the utility model;

[0028] Fig. 9 It is a schematic diagram of the structure of the locking assembly of the utility model.

[0029] In the figure: 1. bottom plate; 2. guide rod; 3. driving machine; 4. support plate; 5. bearing plate; 6. suction cup; 7. cylinder; 8. laminator; 9. side plate; 10. rotating shaft; 11. slide groove; 12. slide plate; 13. guide hole; 14. locking controller; 15. control rod; 16. control hole; 17. locking groove; 18. chip; 19. limit plate; 20. locking plate. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figure 1-Figure 9 As shown, a high-density chip plastic packaging device includes: a base plate 1, a driving machine 3 and a support plate 4,

[0032] The two ends of the bottom plate 1 are respectively fixedly connected to the side plate 9 and the cylinder 7, the side end of the bottom plate 1 is fixedly connected to the plastic sealing machine 8, two groups of guide rods 2 are arranged between the side plate 9 and the cylinder 7, the bottom end of the cylinder 7 is matched with the suction cup 6, the bottom end of the suction cup 6 is fixedly connected to the bearing plate 5, the driving machine 3 is provided with two groups and is matched with the guide rod 2, the two ends of the support plate 4 are respectively matched with the driving machine 3, the inner wall of the support plate 4 is abutted and connected with the chip 18, the bottom end of the support plate 4 is matched with the bearing plate 5, the bearing plate 5 is abutted and connected with the bottom end of the chip 18, and the bottom The plate 1 is used to provide support for the cylinder 7 and the side plate 9, and multiple chips 18 are evenly distributed on the bearing plate 5 installed at the bottom end of the support plate 4. The driving machine 3 is operated to slide on the guide rod 2. The device driving the driving machine 3 belongs to the electrical equipment of the prior art. The driving machine 3 slides along the guide rod 2, thereby driving the support plate 4 to slide. When the support plate 4 moves to the bottom end of the plastic sealing machine 8 with the chip 18, the plastic sealing machine 8 plastic seals the chip 18. The specific working principle belongs to the prior art and will not be repeated here.

[0033] When the top of chip 18 is sealed, driving machine 3 moves chip 18 toward cylinder 7 through supporting plate 4. When supporting plate 4 moves toward cylinder 7, cylinder 7 controls suction cup 6 to move downward, and carrier plate 5 adsorbed by suction cup 6 is aligned with supporting plate 4. When supporting plate 4 keeps moving, carrier plate 5 is installed on the top of supporting plate 4. At this time, carrier plate 5 limits the top of chip 18, driving machine 3 stops sliding on guide rod 2, and cylinder 7 controls suction cup 6 to move upward. At the same time, driving machine 3 controls support plate 4 to rotate, thereby realizing reverse side of chip 18. When chip 18 is completely reversed, carrier plate 5 installed at the bottom of supporting plate 4 is turned to the top, and cylinder 7 controls suction cup 6 to move upward. 7 controls the suction cup 6 to move downward, and the suction cup 6 absorbs the carrying plate 5 on the top of the support plate 4. When the driving machine 3 moves toward the direction of the plastic sealing machine 8, the carrying plate 5 begins to detach from the top of the support plate 4, and the plastic sealing machine 8 can perform plastic sealing on the bottom of the chip 18. The support plate 4 cooperates with the cylinder 7 to achieve the effect of automatically turning the chip 18 over, avoiding the time-consuming and laborious removal of the chip 18. Among them, the driving machine 3 moves back and forth along the guide rod 2, so that the support plate 4 carries the chip 18 for double-sided plastic sealing. After that, the support plate 4 carries the chip 18 back to the starting position, and the entire work process is automated, further improving the efficiency of the plastic sealing machine 8 in performing double-sided plastic sealing on the chip 18.

[0034] In some specific implementation schemes, two groups of guide rods 2 are respectively located on both sides of the side plate 9, and the two ends of the guide rods 2 are respectively fixedly connected to the side plate 9 and the cylinder 7, a guide hole 13 is horizontally opened in the driving machine 3, and a rotating shaft 10 is provided between the driving machine 3 and the support plate 4, the guide hole 13 is slidably connected to the guide rod 2, and the two ends of the rotating shaft 10 are respectively fixedly connected to the driving machine 3 and the support plate 4, and the guide hole 13 opened in the driving machine 3 slides along the guide rod 2. On the one hand, the guide rod 2 provides a supporting and guiding function for the driving machine 3, and on the other hand, the guide rod 2 connects the cylinder 7 and the side plate 9 together, further improving the structural stability of the cylinder 7 and the side plate 9. When the driving machine 3 drives the support plate 4 to rotate, the driving machine 3 drives the rotating shaft 10 to rotate, and the rotating shaft 10 drives the support plate 4 to rotate, and the rotating shaft 10 realizes the effect of transmitting the action of the driving machine 3 to the support plate 4.

[0035] In some specific embodiments, one end of the support plate 4 away from the cylinder 7 is fixedly connected with two sets of locking components, and control holes 16 are opened on the upper and lower sides of the end of the support plate 4 away from the cylinder 7, and slide grooves 11 are opened on the upper and lower sides of both ends of the support plate 4, and slide plates 12 are connected in the control holes 16. Both ends of the carrying plate 5 are fixedly connected to the slide plates 12, and the locking components cooperate with the control holes 16. The locking components include: a locking controller 14, a control rod 15 and a locking plate 20. The locking controller 14 is fixedly connected to the support plate 4, and the locking controller 14 is cooperatively connected with the control rod 15. The end of the control rod 15 away from the locking controller 14 is fixedly connected to the locking plate 20, and the locking plate 20 is slidably connected to the control hole 16. A locking groove 17 is opened on the end of the carrying plate 5 close to the locking controller 14, and the locking groove 17 is abutted against the locking plate 20. When the carrying plate 5 is automatically installed on the support plate 4, the slide plates 12 fixed on both sides of the carrying plate 5 move along the slide grooves 1 When the support plate 5 is detached from the support plate 4, the locking assembly operates the locking plate 20 in the reverse direction. After the locking assembly releases the fixation of the support plate 5, the driving machine 3 slides on the guide rod 2.

[0036] In some specific implementation schemes, the side end of the carrier plate 5 is fixedly connected to a limiting plate 19, and the limiting plate 19 is abutted against the side end of the chip 18. In order to ensure that the carrier plate 5 limits the chip 18 in the horizontal direction, the limiting plate 19 abuts against the side end of the chip 18, thereby limiting the side end of the chip 18.

[0037] Several embodiments of the utility model are described in detail above, but the embodiments of the utility model are not limited thereto and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A high-density chip plastic packaging equipment, characterized in that: include: A bottom plate (1), the two ends of the bottom plate (1) are respectively fixedly connected to a side plate (9) and a cylinder (7), the side end of the bottom plate (1) is fixedly connected to a plastic sealing machine (8), two groups of guide rods (2) are arranged between the side plate (9) and the cylinder (7), the bottom end of the cylinder (7) is cooperatively connected to a suction cup (6), and the bottom end of the suction cup (6) is fixedly connected to a bearing plate (5); A driving machine (3), wherein the driving machine (3) is provided with two groups and is cooperatively connected with the guide rods (2) respectively; A support plate (4), wherein both ends of the support plate (4) are respectively connected to the driving machine (3), the inner wall of the support plate (4) is butted against a chip (18), the bottom end of the support plate (4) is connected to a carrier plate (5), and the carrier plate (5) is butted against the bottom end of the chip (18).

2. The high-density chip encapsulation equipment according to claim 1, characterized in that: The two groups of guide rods (2) are respectively located on both sides of the side plate (9), and the two ends of the guide rods (2) are respectively fixedly connected to the side plate (9) and the cylinder (7).

3. The high-density chip packaging equipment according to claim 1, characterized in that: The driving machine (3) is provided with a guide hole (13) in a transverse direction, a rotating shaft (10) is provided between the driving machine (3) and the supporting plate (4), the guide hole (13) is slidably connected to the guide rod (2), and the two ends of the rotating shaft (10) are respectively fixedly connected to the driving machine (3) and the supporting plate (4).

4. The high-density chip packaging equipment according to claim 1, characterized in that: The end of the support plate (4) away from the cylinder (7) is fixedly connected with two sets of locking components, the end of the support plate (4) away from the cylinder (7) is provided with control holes (16) on the upper and lower sides, and the two ends of the support plate (4) are respectively provided with sliding grooves (11) on the upper and lower sides, and the control holes (16) are connected with sliding plates (12) in a clamped manner, and the two ends of the carrier plate (5) are respectively fixedly connected with the sliding plates (12).

5. The high-density chip encapsulation equipment according to claim 4, characterized in that: The locking assembly cooperates with the control hole (16), and comprises: a locking controller (14), a control rod (15) and a locking plate (20); the locking controller (14) is fixedly connected to the support plate (4); the locking controller (14) is cooperatively connected to the control rod (15); one end of the control rod (15) away from the locking controller (14) is fixedly connected to the locking plate (20); the locking plate (20) is slidably connected to the control hole (16); a locking groove (17) is provided at one end of the bearing plate (5) close to the locking controller (14); the locking groove (17) is butt-connected to the locking plate (20).

6. The high-density chip packaging equipment according to claim 1, characterized in that: The side end of the carrier plate (5) is fixedly connected to a limiting plate (19), and the limiting plate (19) is butt-connected to the side end of the chip (18).

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