Thermal imaging data acquisition and transmission device and system

Abstract

The utility model discloses a thermal imaging data acquisition and transmission device, which comprises a thermal imaging acquisition module, a control module and a wireless communication module, each of the thermal imaging acquisition module, the control module and the wireless communication module comprises a data receiving end and a data transmitting end; the data transmitting end of the wireless communication module is connected with the data receiving end of the control module; a data receiving end of the wireless communication module is connected with a data sending end of the thermal imaging acquisition module, and the thermal imaging acquisition module is used for sending acquired thermal imaging data to the wireless communication module after receiving a data acquisition instruction; the wireless communication module is used for sending thermal imaging data to the outside; the data receiving end of the thermal imaging acquisition module is connected with the data sending end of the control module, and the control module is used for sending a data acquisition instruction to the thermal imaging acquisition module. According to the measuring device provided by the utility model, the miniaturization of a thermal imaging data acquisition device is realized, and the reliability of the device is improved; and the security and timeliness of data transmission of the device are ensured.

Description

Technical Field

[0001] The utility model relates to the field of thermal imaging acquisition, in particular to a thermal imaging data acquisition and sending device and system. Background Art

[0002] In the existing field of thermal imaging acquisition, handheld thermal imagers are mostly used, which cannot be used for thermal imaging in narrow environments. Band-type temperature sensors are also used, which have a small detection temperature range and must be in contact with the monitored part. They are not suitable for large-scale installation and use in factories and are easily damaged. Or in existing thermal imaging acquisition equipment, the specifications of the acquisition equipment are all set at the factory, and it is impossible to design on site according to the actual situation of the project.

[0003] In summary, the thermal imaging acquisition equipment in the prior art has poor reliability. Utility Model Content

[0004] The utility model provides a thermal imaging data acquisition and transmission device and system, so as to realize the miniaturization of the thermal imaging data acquisition device, improve the reliability of the device, and ensure the security and timeliness of the device data transmission.

[0005] According to a first aspect of the utility model, a thermal imaging data acquisition device is provided, comprising: a thermal imaging acquisition module, a control module and a wireless communication module;

[0006] The thermal imaging acquisition module, the control module and the wireless communication module all include a data receiving end and a data sending end;

[0007] The data transmitting end of the wireless communication module is connected to the data receiving end of the control module;

[0008] The data receiving end of the wireless communication module is connected to the data sending end of the thermal imaging acquisition module. The thermal imaging acquisition module is used to send the collected thermal imaging data to the wireless communication module after receiving the data acquisition instruction; the wireless communication module is used to send the thermal imaging data outwardly;

[0009] The data receiving end of the thermal imaging acquisition module is connected to the data sending end of the control module, and the control module is used to send a data acquisition instruction to the thermal imaging acquisition module.

[0010] Optionally, it further comprises: a housing;

[0011] The power module, the thermal imaging acquisition module, the control module and the wireless communication module are arranged in a housing;

[0012] The wireless communication module is used to send an identification code to the control module; after receiving the identification code, the control module is used to send a data acquisition instruction to the thermal imaging acquisition module when the identification code matches the local identification code.

[0013] Optionally, it further comprises: a power supply module, configured to provide a first voltage and a second voltage, wherein the second voltage is lower than the first voltage;

[0014] The power module is connected to the control module, the thermal imaging acquisition module and the wireless communication module.

[0015] Optionally, the power module includes a power input port, a power input switch, a first voltage output terminal, a second voltage output terminal, a first voltage stabilizing chip, a second voltage stabilizing chip, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor and an eighth capacitor;

[0016] The first end of the power input port is connected to the first end of the power input switch, and the second end of the power input port is grounded; the second end of the power input switch is connected to the input end of the first voltage stabilizing chip, the first end of the first capacitor is connected to the input end of the first voltage stabilizing chip, and the second end of the first capacitor is grounded; the first end of the second capacitor is connected to the input end of the first voltage stabilizing chip, and the second end of the second capacitor is grounded;

[0017] The output end of the first voltage stabilizing chip is connected to the first voltage output end, the first end of the third capacitor is connected to the output end of the first voltage stabilizing chip, and the second end of the third capacitor is grounded; the first end of the fourth capacitor is connected to the output end of the first voltage stabilizing chip, and the second end of the fourth capacitor is grounded;

[0018] The first voltage output terminal is connected to the input terminal of the second voltage stabilizing chip, the first terminal of the sixth capacitor is connected to the input terminal of the second voltage stabilizing chip, and the second terminal of the sixth capacitor is grounded;

[0019] The second voltage output terminal is connected to the output terminal of the second voltage stabilizing chip, the first terminal of the seventh capacitor is connected to the output terminal of the second voltage stabilizing chip, and the second terminal of the seventh capacitor is grounded;

[0020] A first end of the fifth capacitor is connected to the first voltage output end, and a second end of the fifth capacitor is grounded;

[0021] The first end of the eighth capacitor is connected to the second voltage output end, and the second end of the eighth capacitor is grounded; the grounding ends of the first voltage stabilizing chip and the second voltage stabilizing chip are grounded.

[0022] Optionally, it also includes: a power module and a housing;

[0023] The power module, the thermal imaging acquisition module, the control module and the wireless communication module are arranged in a housing;

[0024] The housing is provided with a first opening corresponding to the power input port portion of the power module, and the housing is provided with a second opening corresponding to the power input switch portion of the power module;

[0025] The shell is provided with a third opening corresponding to the data acquisition port portion of the thermal imaging acquisition module;

[0026] The shell is provided with a fourth opening corresponding to the antenna connection port portion of the wireless communication module.

[0027] Optionally, it further comprises: a substrate;

[0028] The power module, the thermal imaging acquisition module, the control module and the wireless communication module are arranged on the substrate.

[0029] Optionally, the thermal imaging acquisition module, the control module and the wireless communication module are arranged on the first surface of the substrate; the power input switch, the power input port, the fifth capacitor and the seventh capacitor of the power module are arranged on the first surface of the substrate;

[0030] The first voltage stabilizing chip, the second voltage stabilizing chip, the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, the sixth capacitor and the eighth capacitor of the power module are arranged on the second surface of the substrate.

[0031] Optionally, a row mother is also included;

[0032] The pin portion of the female connector is disposed on the first surface of the substrate; the groove portion of the female connector is connected to the pin portions of the wireless communication module, the control module and the thermal imaging acquisition module;

[0033] The wireless communication module, the control module and the thermal imaging acquisition module are partially disconnected from the groove of the female connector so as to replace the wireless communication module, the control module and the thermal imaging acquisition module.

[0034] According to a second aspect of the utility model, a thermal imaging data acquisition and transmission system is provided, the system comprising: a host computer;

[0035] The host computer is connected to the wireless communication module and is used to send an identification code to the wireless communication module and receive thermal imaging data sent out by the wireless communication module.

[0036] Optionally, there are at least two thermal imaging data acquisition and transmission devices;

[0037] The host computer is used to send at least one identification code to all thermal imaging data acquisition and sending devices.

[0038] The utility model discloses a thermal imaging data acquisition device, a thermal imaging acquisition module, a control module and a wireless communication module; the thermal imaging acquisition module, the control module and the wireless communication module all include a data receiving end and a data sending end; the data sending end of the wireless communication module is connected to the data receiving end of the control module; the data receiving end of the wireless communication module is connected to the data sending end of the thermal imaging acquisition module, the thermal imaging acquisition module is used to send the collected thermal imaging data to the wireless communication module after receiving the data acquisition instruction; the wireless communication module is used to send the thermal imaging data outward; the data receiving end of the thermal imaging acquisition module is connected to the data sending end of the control module, and the control module is used to send the data acquisition instruction to the thermal imaging acquisition module. The measuring device provided by the utility model realizes the miniaturization of the thermal imaging data acquisition device, improves the reliability of the device, and ensures the security and timeliness of the device data transmission.

[0039] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 It is a structural schematic diagram of a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model;

[0042] Figure 2 It is a structural schematic diagram of a power supply module of another thermal imaging data acquisition and transmission device provided by an embodiment of the utility model;

[0043] Figure 3 A circuit diagram of a power module provided by an embodiment of the utility model;

[0044] Figure 4 A three-view diagram of a shell provided by an embodiment of the utility model;

[0045] Figure 5 A layout diagram of the first side of a circuit board of a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model;

[0046] Figure 6 A layout diagram of the second side of a circuit board of a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model;

[0047] Figure 7 A circuit diagram of another thermal imaging data acquisition and transmission device provided by an embodiment of the utility model;

[0048] Figure 8 A schematic diagram of the structure of a thermal imaging data acquisition and transmission system provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0051] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0052] Figure 1 Schematic diagram of a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model. Figure 1As shown, it includes a thermal imaging acquisition module 101, a control module 102 and a wireless communication module 103; the thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103 all include a data receiving end and a data sending end; the data sending end TX3 of the wireless communication module 103 is connected to the data receiving end RX2 of the control module 102; the data receiving end RX3 of the wireless communication module 103 is connected to the data sending end TX1 of the thermal imaging acquisition module 101, and the thermal imaging acquisition module 101 is used to send the collected thermal imaging data to the wireless communication module 103 after receiving the data acquisition instruction; the wireless communication module 103 is used to send the thermal imaging data outward; the data receiving end RX1 of the thermal imaging acquisition module 101 is connected to the data sending end TX2 of the control module 102, and the control module 102 is used to send the data acquisition instruction to the thermal imaging acquisition module 101.

[0053] Specifically, the data transmitting end of the wireless communication module 103 is connected to the data receiving end of the control module 102. After the control module 102 receives the information sent by the wireless communication module 103, it determines whether to perform data collection work inside the control module 102. When the control module 102 determines that data collection work needs to be performed, since the data transmitting end TX2 of the control module 102 is connected to the RX1 end of the thermal imaging acquisition module 101, the control module 102 can send a data collection instruction to the thermal imaging acquisition module 101. After receiving the data collection instruction sent by the control module 102, the thermal imaging acquisition module 101 performs thermal imaging data collection. After the collection is completed, the thermal imaging acquisition module 101 sends the collected thermal imaging data to the wireless communication module through the bridge connection between the data transmitting end TX1 and the data receiving end RX3 of the wireless communication module 103. After receiving the thermal imaging data, the wireless communication module 103 sends the thermal imaging data to the outside.

[0054] In a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model, the control module determines whether to perform data acquisition work. When it is determined that thermal imaging data acquisition is required, the thermal imaging acquisition module performs thermal imaging data acquisition. After the thermal imaging data acquisition is completed, the thermal imaging acquisition module does not send the collected data to the control module for processing, but directly sends the collected data to the wireless communication module for external transmission. In the thermal imaging data acquisition and transmission device provided by the embodiment of the utility model, when collecting and transmitting data, the data does not pass through the internal controller, and there is no need to worry about the interruption or error of the data processing inside the controller. At the same time, sending data directly through the serial port can avoid the risk of data loss or damage that may occur when processing data inside the controller. During the operation of the device, the risk of data loss will increase due to sudden power failure of the module or communication interruption. By directly sending data, this risk can be reduced and the integrity of the data can be improved. The thermal imaging data acquisition and transmission device provided by the utility model realizes the miniaturization of the thermal imaging data acquisition device and improves the reliability of the device; it ensures the security and timeliness of the data transmission of the device.

[0055] In another thermal imaging data acquisition and transmission device provided by the present utility model, continue to refer to Figure 1 , based on the above embodiment, the thermal imaging data acquisition and transmission device further includes a housing, in which the thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103 are arranged;

[0056] Optionally, the housing can be made of alloy material, plastic material, etc., and the housing has a size and shape that can accommodate the thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103. The specific material and shape of the housing are set according to actual needs and are not limited here.

[0057] The wireless communication module 103 is used to send an identification code to the control module 102 ; after receiving the identification code, the control module 102 is used to send a data acquisition instruction to the thermal imaging acquisition module 101 when the identification code matches the local identification code.

[0058] Specifically, the local identification code is "01EN", the wireless communication module 103 sends the identification code "02EN" to the control module 102, and the control module 102 compares the identification code "02EN" with the local identification code "01EN", and determines that the identification code and the local identification code do not match, so the control module 102 does not send a data acquisition instruction to the thermal imaging acquisition module 101. Optionally, the control module 102 performs a loop wait. When the wireless communication module 103 sends the identification code "01EN" to the control module, the control module 102 compares the identification code "01EN" with the local identification code "01EN", and determines that the identification code and the local identification code match, so the control module 102 sends a data acquisition instruction to the thermal imaging acquisition module 101.

[0059] In another thermal imaging data acquisition and transmission device provided by the utility model, a thermal imaging acquisition module, a control module and a wireless communication module are arranged in a shell to improve the portability of the thermal imaging data acquisition device. At the same time, the control module will only send a data acquisition instruction when the received identification code matches the local identification code, which can ensure that only instructions that meet the requirements will be executed, thereby avoiding the possibility of misoperation. It helps to reduce the abnormalities or failures of the system caused by receiving invalid or erroneous instructions, and improve the stability and reliability of the system. In addition, when new devices or systems need to be added, they only need to be assigned new identification codes and ensure that the control module can recognize these new identification codes, which makes the system have good scalability and flexibility.

[0060] Figure 2 is a schematic diagram of the structure of a power supply module of another thermal imaging data acquisition and transmission device provided by an embodiment of the utility model, such as Figure 2 As shown, based on the above embodiment, it also includes a power supply module 104 for providing a first voltage and a second voltage, the second voltage is less than the first voltage; the power supply module is connected to the control module 102, the thermal imaging acquisition module 101 and the wireless communication module 103.

[0061] Figure 3 A circuit diagram of a power module provided by an embodiment of the utility model, such as Figure 3As shown, the power module includes a power input port DC, a power input switch SW1, a first voltage output terminal VCC1, a second voltage output terminal VCC2, a first voltage stabilizing chip U1, a second voltage stabilizing chip U2, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7 and an eighth capacitor C8; wherein the first end of the power input port DC is connected to the first end of the power input switch SW1, and the second end of the power input port DC is grounded; the second end of the power input switch SW1 is connected to the input terminal VIN1 of the first voltage stabilizing chip U1, the first end of the first capacitor C1 is connected to the input terminal VIN1 of the first voltage stabilizing chip U1, and the second end of the first capacitor C1 is grounded; the first end of the second capacitor C2 is connected to the input terminal VIN1 of the first voltage stabilizing chip U1, and the second end of the second capacitor C2 is grounded; the output terminal VOUT1 of the first voltage stabilizing chip U1 is connected to the first voltage output The first end of the third capacitor C3 is connected to the output end VOUT1 of the first voltage stabilizing chip U1, and the second end of the third capacitor C3 is grounded; the first end of the fourth capacitor C4 is connected to the output end VOUT1 of the first voltage stabilizing chip U1, and the second end of the fourth capacitor C4 is grounded; the first voltage output end VCC1 is connected to the input end VIN2 of the second voltage stabilizing chip U2, the first end of the sixth capacitor C6 is connected to the input end VIN2 of the second voltage stabilizing chip U2, and the second end of the sixth capacitor C6 is grounded; the second voltage output end VCC2 is connected to the output end VOUT2 of the second voltage stabilizing chip U2, the first end of the seventh capacitor C7 is connected to the output end VOUT2 of the second voltage stabilizing chip U2, and the second end of the seventh capacitor C7 is grounded; the first end of the fifth capacitor C5 is connected to the first voltage output end VCC1, and the second end of the fifth capacitor C5 is grounded; the first end of the eighth capacitor C8 is connected to the second voltage output end VCC2, and the second end of the eighth capacitor C8 is grounded. The grounding end GND1 of the first voltage stabilizing chip U1 and the grounding end GND2 of the second voltage stabilizing chip U2 are grounded.

[0062] Specifically, the first DC voltage input by the power input port DC is filtered by the first capacitor C1, the second capacitor C2, the third capacitor C3, the fourth capacitor C4 and the fifth capacitor C5, and is stepped down by the first voltage stabilizing chip U1, and then the first voltage is output from the first voltage output terminal; the first voltage is filtered by the sixth capacitor C6, the seventh capacitor C7 and the eighth capacitor C8, and is stepped down by the second voltage stabilizing chip U2, and then the second voltage is output from the second voltage output terminal VCC2.

[0063] Optionally, the first DC voltage may be 12V.

[0064] Optionally, the first voltage output terminal supplies power to the control module 102 and the thermal imaging module 101, providing a 5V power supply; the second voltage output terminal VCC2 supplies power to the wireless communication module 103, providing a 3.3V power supply.

[0065] Optionally, the first voltage stabilizing chip U1 uses an AMS1117-5V voltage stabilizing chip, and the second voltage stabilizing chip U2 uses an AMS1117-3.3V voltage stabilizing chip for voltage reduction. The model of the specific voltage stabilizing chip is set according to actual conditions and is not limited here.

[0066] Optionally, the first capacitor C1 and the third capacitor C3 can be 10μF chip capacitors, the second capacitor C2 and the fourth capacitor C4 can be 100nF chip capacitors, and the fifth capacitor C5 can be a 10μF electrolytic capacitor, which is used to filter the first voltage output by the first voltage output terminal; the sixth capacitor C6 can be a 0.01μF chip capacitor, the seventh capacitor C7 can be a 22μF electrolytic capacitor, and the eighth capacitor C8 can be a 0.1μF chip capacitor. The mixed setting of chip capacitors and electrolytic capacitors can ensure the filtering effect on the voltage, reduce the volume of the PCB and improve the heat dissipation efficiency.

[0067] Figure 4 A three-view drawing of a shell provided by an embodiment of the utility model is based on the above embodiment. Figure 2 , Figure 4 As shown, the power module 104, the thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103 are arranged in the shell; the shell is provided with a first opening 201 corresponding to the power input port portion of the power module 104, and the shell is provided with a second opening 202 corresponding to the power input switch portion of the power module 104; the shell is provided with a third opening 203 corresponding to the data acquisition port portion of the thermal imaging acquisition module 101; and the shell is provided with a fourth opening 204 corresponding to the antenna connection port portion of the wireless communication module 103.

[0068] Optionally, the opening position of the shell is set according to the port position corresponding to the device module, and the specific position of the opening on the shell is not limited here.

[0069] By arranging each module in a shell and designing openings for the ports of the shell corresponding to each module connected to the outside, the influence of the external environment on the modules can be effectively prevented, thereby improving the reliability of the device.

[0070] Figure 5 A layout diagram of the first side of a circuit board of a thermal imaging data acquisition and transmission device provided by an embodiment of the utility model, Figure 6 The second side layout diagram of the circuit board of a thermal imaging data acquisition and transmission device provided by the embodiment of the utility model is based on the above embodiment. Figure 1-6As shown, it also includes a substrate 100. Among them, the power module 104, the thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103 are arranged on the substrate 100. The thermal imaging acquisition module 101, the control module 102 and the wireless communication module 103 are arranged on the first surface 1001 of the substrate 100; the power input switch 1042, the power input port 1041, the fifth capacitor 10435 and the seventh capacitor 10437 of the power module 104 are arranged on the first surface 1001 of the substrate 100; the first voltage stabilizing chip 10441, the second voltage stabilizing chip 10442, the first capacitor 10431, the second capacitor 10432, the third capacitor 10433, the fourth capacitor 10434, the sixth capacitor 10436 and the eighth capacitor 10438 of the power module 104 are arranged on the second surface 1002 of the substrate 100.

[0071] Optionally, the thermal imaging acquisition module 101 may be an MLX90640B infrared thermal imaging module, the wireless communication module 103 may be a zigbee DL-20 wireless serial port transceiver module, and the control module 102 may be a N76E003AT single chip microcomputer. The specific models of the thermal imaging acquisition module, the wireless communication module, and the control module are set according to actual conditions and are not limited here.

[0072] like Figure 5 As shown, it also includes a female connector group; there is at least one female connector in the female connector group, and the pin portion of the female connector group is arranged on the substrate 100; the groove 202 portion of the female connector group is connected to the pin portion of the wireless communication module 103, the control module 102 and the thermal imaging acquisition module 101; the wireless communication module 103, the control module 102 and the thermal imaging acquisition module 101 are disconnected from the groove 202 portion of the female connector to replace the wireless communication module 103, the control module 102 and the thermal imaging acquisition module 101.

[0073] Specifically, Figure 5 As shown, the thermal imaging acquisition module 101 is connected to the substrate through the first row of mother groups 2011, the control module 102 is connected to the substrate through the second row of mother groups 2012, and the wireless communication module 103 is connected to the substrate through the third row of mother groups 2013. The third row of mother groups 2013 is a bent plug mother group with a model of PM254-1-04-W-8.5, the second row of mother groups 2012 is a straight plug mother group with a model of PM2.54-1*12, the control module 102 is raised by the second row of mother groups 2012, and the wireless communication module 103 is horizontally arranged below the control module 102 through the third row of mother groups 2013, so as to save the size of the substrate, improve the density of the circuit board, and thus reduce the manufacturing cost.

[0074] In another thermal imaging data acquisition and transmission device provided by the utility model, the wireless communication module, the control module and the thermal imaging acquisition module are connected to the base plate through the female connector, so that the wireless communication module, the control module and the thermal imaging acquisition module can be disassembled on the base plate, which is convenient for the replacement, upgrading and maintenance of the modules, and improves the flexibility and scalability of the system. At the same time, the complexity and space occupation required by traditional wiring are reduced, making the circuit board layout more concise and clear, and reducing the production cost.

[0075] Figure 7 A circuit diagram of another thermal imaging data acquisition and transmission device provided by an embodiment of the utility model is provided. Based on the above embodiment, Figure 7 , Figure 3 As shown, the third row of motherboards H3 of the first row of motherboards 2011 and the fourth row of motherboards H4 of the first row of motherboards 2011 are the thermal imaging acquisition module 101; the first row of motherboards H1 of the second row of motherboards 2012 and the second row of motherboards H2 of the second row of motherboards 2012 are the motherboards connecting the control module 102 and the substrate 100; the fifth row of motherboards H5 of the third row of motherboards 2013 are the motherboards connecting the line communication module 103 and the substrate 100. The power supply module 104 provides the first voltage VCC1 and the second voltage VCC2 to power the thermal imaging acquisition module 101, the control module 102, and the wireless communication module 103.

[0076] Specifically, the thermal imaging acquisition module 101 can use the MLX90640B infrared thermal imaging module, the wireless communication module 103 can be a zigbee DL-20 wireless serial port transceiver module, and the control module 102 can be a N76E003AT single-chip computer. Among them, the P0.7 pin of the N76E003AT single-chip computer is connected to the TX0 pin of the zigbee DL-20 wireless serial port transceiver module, the P0.6 pin of the N76E003AT single-chip computer is connected to the RX1 pin of the MLX90640B infrared thermal imaging module; the TX1 pin of the MLX90640B infrared thermal imaging module is connected to the RX0 pin of the zigbee DL-20 wireless serial port transceiver module. Figure 7 , Figure 3 As shown, a power interface module 105 may also be included, which includes a power interface 2014. The power interface 2014 includes a pin H6 and a pin H7 for providing a first voltage VCC1 and a second voltage VCC2.

[0077] In another thermal imaging data acquisition and transmission device provided by an embodiment of the utility model, when collecting and transmitting data, the data does not pass through the internal controller, and there is no need to worry about interruptions or errors in the data processing inside the controller. By sending data directly, this risk can be reduced, the integrity and reliability of the data can be improved, and the stability and reliability of the entire system can be improved. At the same time, a mother bus bar is provided to connect the module to the substrate, which facilitates the replacement, upgrade and maintenance of the module, and improves the flexibility and scalability of the system. Through the mother bus bar connection, the complexity and space occupation required for traditional wiring are reduced, making the circuit board layout more concise and clear, and reducing production costs.

[0078] Figure 8 A schematic diagram of the structure of a thermal imaging data acquisition and transmission system provided by an embodiment of the utility model is shown as follows: Figure 8 As shown, it includes the thermal imaging data acquisition and transmission device 301 and the host computer 302 in the above embodiment. The host computer 302 is connected to the wireless communication module in the acquisition and transmission device 301.

[0079] The thermal imaging data acquisition and transmission system includes at least two thermal imaging data acquisition and transmission devices 301. Figure 8 As shown, the host computer 302 is connected to the wireless communication module 303113 in the thermal imaging data acquisition and transmission device 3011, and the host computer 302 is connected to the wireless communication module 301n3 in the thermal imaging data acquisition and transmission device 301n. The host computer 302 sends at least one identification code to all connected wireless communication modules.

[0080] Specifically, the local identification code of the wireless communication module 30113 is 01EN, and the local identification code of the wireless communication module 301n3 is 0nEN. When the host computer 302 sends the identification code 0nEN to all connected wireless communication modules, the wireless communication module 301n3 in the thermal imaging data acquisition and transmission device 301n receives the identification code and compares the identification code with the local identification code 0nEN. The comparison result is consistent, so the thermal imaging data acquisition and transmission device 301n starts thermal imaging acquisition, and the wireless communication module sends the collected thermal imaging data to the host computer. The wireless communication module 30113 in the thermal imaging data acquisition and transmission device 3011 receives the identification code and compares the identification code with the local identification code 01EN. The comparison result is inconsistent, so the thermal imaging data acquisition and transmission device 3011 does not start thermal imaging acquisition.

[0081] Optionally, when the host computer 302 sends the identification codes 01EN and 0nEN to all connected wireless communication modules, the thermal imaging data acquisition and sending device 3011 and the thermal imaging data acquisition and sending device 301n both start to perform thermal imaging acquisition.

[0082] Optionally, when the host computer 302 sends identification codes 01EN and 03EN to all connected wireless communication modules, the thermal imaging data acquisition and sending device 3011 starts to perform thermal imaging acquisition, while the thermal imaging data acquisition and sending device 301n does not start to perform thermal imaging acquisition.

[0083] In a thermal imaging data acquisition and transmission system provided by an embodiment of the utility model, a host computer and at least two data acquisition and transmission devices are set. The host computer is used to send an identification code to the wireless communication module. Only when the identification code matches the local code of the data acquisition and transmission device, the device starts to collect and transmit data. The system achieves precise control by matching the identification code with the local code. Only when the identification code is correct, the corresponding data acquisition and transmission device will collect and transmit data. This precise control can avoid unnecessary data collection and transmission and improve system efficiency. The system can easily add or delete data acquisition and transmission devices by simply assigning a unique identification code to the new device. This flexibility and scalability enables the system to adapt to different application scenarios and requirements. Since only devices that meet specific identification codes will collect and transmit data, this helps to reduce the possibility of data loss or erroneous transmission due to errors or misoperations, thereby improving the reliability of the system.

[0084] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A thermal imaging data acquisition and transmission device, characterized in that: include: Thermal imaging acquisition module, control module and wireless communication module; The thermal imaging acquisition module, the control module and the wireless communication module all include a data receiving end and a data sending end; The data transmitting end of the wireless communication module is connected to the data receiving end of the control module; The data receiving end of the wireless communication module is connected to the data sending end of the thermal imaging acquisition module. The thermal imaging acquisition module is used to send the collected thermal imaging data to the wireless communication module after receiving the data acquisition instruction; the wireless communication module is used to send the thermal imaging data outwardly; The data receiving end of the thermal imaging acquisition module is connected to the data sending end of the control module, and the control module is used to send a data acquisition instruction to the thermal imaging acquisition module.

2. The thermal imaging data acquisition and transmission device according to claim 1, characterized in that: Also includes: case; The thermal imaging acquisition module, the control module and the wireless communication module are arranged in the housing; The wireless communication module is used to send an identification code to the control module; after receiving the identification code, the control module is used to send a data acquisition instruction to the thermal imaging acquisition module when the identification code matches the local identification code.

3. The thermal imaging data acquisition and transmission device according to claim 1, characterized in that: Also includes: A power supply module, configured to provide a first voltage and a second voltage, wherein the second voltage is lower than the first voltage; The power module is connected to the control module, the thermal imaging acquisition module and the wireless communication module.

4. The thermal imaging data acquisition and transmission device according to claim 3, characterized in that: The power module includes a power input port, a power input switch, a first voltage output terminal, a second voltage output terminal, a first voltage stabilizing chip, a second voltage stabilizing chip, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor and an eighth capacitor; The first end of the power input port is connected to the first end of the power input switch, and the second end of the power input port is grounded; the second end of the power input switch is connected to the input end of the first voltage stabilizing chip, the first end of the first capacitor is connected to the input end of the first voltage stabilizing chip, and the second end of the first capacitor is grounded; the first end of the second capacitor is connected to the input end of the first voltage stabilizing chip, and the second end of the second capacitor is grounded; The output end of the first voltage stabilizing chip is connected to the first voltage output end, the first end of the third capacitor is connected to the output end of the first voltage stabilizing chip, and the second end of the third capacitor is grounded; the first end of the fourth capacitor is connected to the output end of the first voltage stabilizing chip, and the second end of the fourth capacitor is grounded; The first voltage output terminal is connected to the input terminal of the second voltage stabilizing chip, the first terminal of the sixth capacitor is connected to the input terminal of the second voltage stabilizing chip, and the second terminal of the sixth capacitor is grounded; The second voltage output terminal is connected to the output terminal of the second voltage stabilizing chip, the first terminal of the seventh capacitor is connected to the output terminal of the second voltage stabilizing chip, and the second terminal of the seventh capacitor is grounded; A first end of the fifth capacitor is connected to the first voltage output end, and a second end of the fifth capacitor is grounded; The first end of the eighth capacitor is connected to the second voltage output end, and the second end of the eighth capacitor is grounded; the grounding ends of the first voltage stabilizing chip and the second voltage stabilizing chip are grounded.

5. The thermal imaging data acquisition and transmission device according to claim 1, characterized in that: Also includes: Power module and housing; The power module, the thermal imaging acquisition module, the control module and the wireless communication module are arranged in a housing; The housing is provided with a first opening corresponding to the power input port portion of the power module, and the housing is provided with a second opening corresponding to the power input switch portion of the power module; The shell is provided with a third opening corresponding to the data acquisition port portion of the thermal imaging acquisition module; The shell is provided with a fourth opening corresponding to the antenna connection port portion of the wireless communication module.

6. The thermal imaging data acquisition and transmission device according to claim 4, characterized in that: Also includes: substrate; The power module, the thermal imaging acquisition module, the control module and the wireless communication module are arranged on the substrate.

7. The thermal imaging data acquisition and transmission device according to claim 6, characterized in that: The thermal imaging acquisition module, the control module and the wireless communication module are arranged on the first surface of the substrate; the power input switch, the power input port, the fifth capacitor and the seventh capacitor of the power module are arranged on the first surface of the substrate; The first voltage stabilizing chip, the second voltage stabilizing chip, the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, the sixth capacitor and the eighth capacitor of the power module are arranged on the second surface of the substrate.

8. The thermal imaging data acquisition and transmission device according to claim 6, characterized in that: Also includes row mother; The pin portion of the female connector is disposed on the first surface of the substrate; the groove portion of the female connector is connected to the pin portions of the wireless communication module, the control module and the thermal imaging acquisition module; The wireless communication module, the control module and the thermal imaging acquisition module are partially disconnected from the groove of the female connector so as to replace the wireless communication module, the control module and the thermal imaging acquisition module.

9. A thermal imaging data acquisition and transmission system, characterized in that: A thermal imaging data acquisition and transmission device comprising any one of claims 1 to 8, further comprising a host computer; The host computer is connected to the wireless communication module and is used to send an identification code to the wireless communication module and receive thermal imaging data sent out by the wireless communication module.

10. The thermal imaging data acquisition and transmission system according to claim 9, characterized in that: There are at least two thermal imaging data acquisition and transmission devices; The host computer is used to send at least one identification code to all thermal imaging data acquisition and sending devices.

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