Multifunctional LED die bonding equipment

Abstract

The utility model discloses a multifunctional LED die bonding device which structurally comprises a console, a die bonding mechanism, a machine table, a display screen, an exhaust plate and universal wheels, the display screen is installed at the upper end of the console, the die bonding mechanism is embedded and fixed at the upper end of the console, the exhaust plate is installed on the side face of the machine table, the console is embedded and fixed at the upper end of the machine table, and the universal wheels are installed at the lower end of the machine table. According to the utility model, the bonding arm places the wafer at a dispensing position on the circuit board, drives the wafer to slide and extrude the side surface of the inclined block downwards, the upper bevel edge of the wafer is contacted with the lower bevel edge of the inclined block after the wafer passes through, and the connecting plate is driven to obliquely extrude towards the lower left under the elastic force of the trapezoidal plate; therefore, the wafer is blocked and fixed by the inclined block when the bonding arm is separated, the wafer is prevented from easily moving under the contact force and the separation force, and the wafer is blocked by the limiting block when the bonding arm is separated upwards, so that the wafer is prevented from shaking during separation.

Description

Technical Field

[0001] The utility model relates to the technical field of solid crystal equipment, in particular to a multifunctional LED solid crystal equipment. Background Art

[0002] Before bonding, the PCB needs to be placed in the working position and locked. The dispensing mechanism first dispenses glue at the position on the PCB where the wafer needs to be bonded. Then the bonding arm moves from the origin to the wafer suction position. After sucking the wafer, it is placed on the dispensing position on the PCB. At the same time, after the bonding arm is in place, the suction nozzle squeezes the LED wafer below and moves upward to lift up the PCB, so that the LED wafer is squeezed and bonded on the PCB to achieve the installation of the LED wafer.

[0003] However, when the lens is placed by suction, it is necessary to make the lens contact with the glue. At this time, the lens is in a pressed state, and both the upper and lower surfaces are subjected to force. The red glue has a certain adhesion. According to the principle of interaction of forces, at the moment when the suction mechanism separates from the chip, it is easy to drive the chip upward under the contact inertia force of the object below, so that the chip is easy to tilt and shake on the red glue with the force of separation, affecting the accuracy of the chip installation angle, and the PCB board lifted up by the upward movement will be separated from the clamping fixation, and then the PCB board will be irregularly squeezed by the clamping block at the moment of separation, which is easy to tilt and affect the adhesion of the chip at the glue spot position above. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model is implemented through the following technical solutions: a multifunctional LED crystal bonding equipment, whose structure includes a control console, a crystal bonding mechanism, a machine, a display screen, an exhaust plate, and a universal wheel. The display screen is installed on the upper end of the control console, the crystal bonding mechanism is embedded in the upper end of the control console, the exhaust plate is installed on the side of the machine, the control console is embedded in the upper end of the machine, the universal wheel is installed at the lower end of the machine, the control console controls and connects the crystal bonding mechanism, and four universal wheels are provided, which are distributed at the four corners of the lower end of the machine.

[0005] As a further optimization of the present technical solution, the crystal fixing mechanism is provided with a support plate, a circuit board, a bonding arm, a track, a blocking mechanism, a limit block, a plane plate, and a telescopic rod. The track is embedded in the support plate, the bonding arm is installed on the side of the track, the limit block is attached to the inner side of the plane plate, the blocking mechanism is embedded in the surface of the plane plate, the circuit board is located above the telescopic rod, the telescopic rod passes through the inside of the plane plate, the plane plate is installed on the side of the support plate, the support plate is embedded in the upper end of the console, a plurality of "concave" grooves are provided on the plane plate, the bonding arm can be vertically extended and horizontally moved, the lower end of the telescopic rod is connected to a hydraulic machine, which can extend and retract the telescopic rod up and down, and a glue dispenser is provided on the side of the bonding arm.

[0006] As a further optimization of the present technical solution, the limit block is provided with a connecting plate, an inclined block, and a trapezoidal plate. The connecting plate is embedded in the side of the trapezoidal plate, the inclined block is engaged in the side of the connecting plate, the trapezoidal plate is engaged in the inner side of the plane plate, the trapezoidal plate is made of rubber material, and the interior is in a sealed hollow state and has a certain elasticity, and the inclined block is in an isosceles triangle state.

[0007] As a further optimization of the present technical solution, the blocking mechanism is provided with a spring, a roller, a force-bearing plate, and a connecting rod. The spring is embedded in the lower end of the force-bearing plate, the connecting rod is installed on the side of the force-bearing plate, the connecting rod is engaged at the middle two ends of the roller, and the spring is embedded in the surface of the plane plate. The left and right bending amplitude of the spring is small, and the elastic force is large.

[0008] As a further optimization of the present technical solution, the roller is provided with a rotating ring, a fixed rod, and a force ring. The force ring is attached to the outside of the rotating ring, and the rotating ring and the outside of the fixed rod move frictionally. The fixed rod and the force ring are located on the same central axis. The connecting rod is engaged with the side of the fixed rod. The gap between the fixed rod and the rotating ring is small. The force ring is made of rubber and has an extrusion force effect. Beneficial Effects

[0009] Compared with the prior art, the utility model of a multifunctional LED solid crystal device has the following advantages:

[0010] In the utility model, the bonding arm places the wafer at the glue dispensing position on the circuit board, drives the wafer to slide downward and press against the side of the inclined block, and the upper bevel of the wafer contacts the lower bevel position of the inclined block after the wafer passes, and drives the connecting plate to tilt and press toward the lower left under the elastic force of the trapezoidal plate, so that when the bonding arm is disengaged, the wafer is blocked and fixed by the inclined block to prevent the wafer from moving easily under the contact force and disengagement force, and when the bonding arm is disengaged upward, the limit block blocks the wafer to prevent the wafer from shaking when it is disengaged.

[0011] When the circuit board is lifted and moved by the telescopic rod, the side surface of the circuit board drives the force-bearing ring to be squeezed and rotated, so that the rotating ring rotates frictionally on the outside of the fixed rod, and the movement of the circuit board is slightly blocked under the friction rotation force of the rotating ring, and the force-bearing plate generates a compression force on the side surface under the elastic force of the spring, so that the circuit board slides and lifts up on the side surface of the roller. Since the lifting amplitude is small, the roller always squeezes and slides on the side surface of the circuit board, thereby preventing the circuit board from tilting and shaking under the clamping force when it is lifted up. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0013] Figure 1The utility model is a structural schematic diagram of a multifunctional LED die-bonding device.

[0014] Figure 2 It is a schematic diagram of the planar structure of a crystal fixing mechanism of the utility model.

[0015] Figure 3 It is a side structural schematic diagram of a limit block of the utility model.

[0016] Figure 4 It is a side structural schematic diagram of a blocking mechanism of the utility model.

[0017] Figure 5 It is a schematic diagram of the side structure of a roller of the utility model.

[0018] In the figure: control console-1, crystal bonding mechanism-2, machine-3, display screen-4, exhaust plate-5, universal wheel-6, support plate-21, circuit board-22, bond arm-23, track-24, blocking mechanism-25, limit block-26, plane plate-27, telescopic rod-28, connecting plate-w1, tilting block-w2, trapezoidal plate-w3, spring-e1, roller-e2, force plate-e3, connecting rod-e4, rotating ring-e21, fixed rod-e22, force ring-e23. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the preferred implementation scheme of the present invention is further described below in conjunction with specific implementation schemes and accompanying drawings. Example

[0020] See also Figure 1-Figure 5 The utility model provides a multifunctional LED crystal bonding equipment, which structure includes a control console 1, a crystal bonding mechanism 2, a machine table 3, a display screen 4, an exhaust plate 5, and a universal wheel 6. The display screen 4 is installed on the upper end of the control console 1, the crystal bonding mechanism 2 is embedded in the upper end of the control console 1, the exhaust plate 5 is installed on the side of the machine table 3, the control console 1 is embedded in the upper end of the machine table 3, and the universal wheel 6 is installed at the lower end of the machine table 3. The control console 1 controls and connects the crystal bonding mechanism 2. Four universal wheels 6 are provided, which are distributed at the four corners of the lower end of the machine table 3, so that parameters are input in the control console 1 to control the crystal bonding mechanism 2 to assemble the wafers.

[0021] As a further optimization of the present technical solution, the solid crystal mechanism 2 is provided with a support plate 21, a circuit board 22, a bonding arm 23, a track 24, a blocking mechanism 25, a limit block 26, a plane plate 27, and a telescopic rod 28. The track 24 is embedded in the support plate 21, the bonding arm 23 is installed on the side of the track 24, the limit block 26 is attached to the inner side of the plane plate 27, the blocking mechanism 25 is embedded in the surface of the plane plate 27, the circuit board 22 is located above the telescopic rod 28, the telescopic rod 28 runs through the inside of the plane plate 27, the plane plate 27 is installed on the side of the support plate 21, the support plate 21 is embedded in the upper end of the console 1, and the plane plate 27 is provided with a plurality of "recesses" The bonding arm 23 can be extended vertically and moved horizontally. The lower end of the telescopic rod 28 is connected to a hydraulic device, which can make the telescopic rod 28 extend and retract up and down. A glue dispenser is provided on the side of the bonding arm 23, so that the circuit board 22 is engaged in the position of the blocking mechanism 25. After the red glue is applied by the glue dispenser, the bonding arm 23 is controlled to move on the track 24, and the wafer is sucked from the "concave" groove on the surface of the plane plate 27, so that the bonding arm 23 places the wafer at the glue dispensing position on the circuit board 22, and then the telescopic rod 28 is controlled to extend and retract slightly upward, driving the circuit board 22 and the wafer to be squeezed and fixed, and when the bonding arm 23 is disengaged upward, the limit block 26 blocks the wafer to prevent the wafer from shaking when it is disengaged.

[0022] As a further optimization of the present technical solution, the limit block 26 is provided with a connecting plate w1, an inclined block w2, and a trapezoidal plate w3. The connecting plate w1 is embedded in the side of the trapezoidal plate w3, the inclined block w2 is engaged in the side of the connecting plate w1, and the trapezoidal plate w3 is engaged in the inner side of the flat plate 27. The trapezoidal plate w3 is made of rubber material, and the interior is sealed and hollow, with a certain elasticity. The inclined block w2 is in an isosceles triangle state, so that when the chip is bonded to the circuit board 22, it slides and squeezes the side of the inclined block w2. After the chip passes, the upper bevel of the chip contacts the lower bevel position of the inclined block w2. Under the elastic force of the trapezoidal plate w3, the connecting plate w1 is driven to tilt and squeeze to the lower left, so that when the bond arm 23 is detached, the chip is blocked and fixed by the inclined block w2 to prevent the chip from moving easily under the contact force and detachment force.

[0023] As a further optimization of the present technical solution, the blocking mechanism 25 is provided with a spring e1, a roller e2, a force plate e3, and a connecting rod e4. The spring e1 is embedded in the lower end of the force plate e3, the connecting rod e4 is installed on the side of the force plate e3, the connecting rod e4 is clamped at the middle two ends of the roller e2, and the spring e1 is embedded in the surface of the flat plate 27. The left and right bending amplitude of the spring e1 is small and the elastic force is large, so that the side of the circuit board 22 contacts the side of the roller e2. Under the compression of the elastic force of the spring e1, the force plate e3 generates a compression force on the side, and then the circuit board 22 slides and lifts up on the side of the roller e2. Due to the small lifting amplitude, the roller e2 is always squeezed and slid on the side of the circuit board 22, preventing the circuit board 22 from tilting and shaking under the clamping force when it is lifted.

[0024] As a further optimization of the present technical solution, the roller e2 is provided with a rotating ring e21, a fixed rod e22, and a force ring e23, the force ring e23 is attached to the outside of the rotating ring e21, the rotating ring e21 and the outside of the fixed rod e22 are frictionally movable, the fixed rod e22 and the force ring e23 are located on the same central axis, the connecting rod e4 is engaged with the side of the fixed rod e22, the gap between the fixed rod e22 and the rotating ring e21 is small, the force ring e23 is made of rubber and has an extrusion force effect, so that when the side of the circuit board 22 rises and is lifted up, the side of the circuit board 22 drives the force ring e23 to be squeezed and rotated, so that the rotating ring e21 frictionally rotates on the outside of the fixed rod e22, and the movement of the circuit board 22 is slightly blocked under the friction rotation force of the rotating ring e21, thereby generating stability for the movement of the circuit board 22 and preventing the circuit board 22 from easily disengaging and tilting when it is lifted up.

[0025] Working principle: In the utility model, parameters are input into the control console 1 to control the crystal fixing mechanism 2 to assemble the wafer, and then the circuit board 22 is engaged in the position of the blocking mechanism 25. After the red glue is applied by the glue dispenser, the bonding arm 23 is controlled to move on the track 24, and the wafer is sucked from the "concave" groove on the surface of the plane plate 27. Thus, the bonding arm 23 places the wafer at the glue dispensing position on the circuit board 22, and drives the wafer to slide downward and squeeze the side of the inclined block w2. After the wafer passes, the upper bevel of the wafer contacts the lower bevel position of the inclined block w2, and under the elastic force of the trapezoidal plate w3, the connecting plate w1 is driven to tilt and squeeze to the lower left, so that when the bonding arm 23 is disengaged, the wafer is blocked and fixed by the inclined block w2 to prevent the wafer from moving easily under the contact force and the disengagement force, and then the telescopic rod 28 is controlled to slightly extend and retract upward, driving the circuit board 22 and the wafer to be squeezed and fixed, and when the bonding arm 23 is disengaged upward, the limit block 26 blocks the wafer to prevent the wafer from shaking when it is disengaged.

[0026] When the circuit board 22 is lifted up by the telescopic rod 28 in the utility model, the side surface of the circuit board 22 contacts the side surface of the roller e2, and at the same time, the side surface of the circuit board 22 drives the force ring e23 to be squeezed and rotated, so that the rotating ring e21 rotates frictionally on the outside of the fixed rod e22, and the movement of the circuit board 22 is slightly blocked under the friction rotation force of the rotating ring e21, thereby generating stability for the movement of the circuit board 22, and preventing the circuit board 22 from being easily disengaged and tilted when it is lifted up, and under the elastic force of the spring e1, the force plate e3 generates a compressive force on the side surface, and then the circuit board 22 slides and lifts up on the side surface of the roller e2. Since the lifting amplitude is small, the roller e2 always squeezes and slides on the side surface of the circuit board 22, preventing the circuit board 22 from being easily tilted and shaking under the locking force when it is lifted up.

[0027] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit or basic features of the utility model, the utility model can be implemented in other specific forms and various changes and improvements can be made. These changes and improvements all fall within the scope of the utility model to be protected. Therefore, the scope of protection of the utility model is defined by the attached claims and their equivalents, rather than the above description.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multifunctional LED crystal bonding equipment, comprising a control console (1), a crystal bonding mechanism (2), a machine platform (3), a display screen (4), an exhaust plate (5), and a universal wheel (6), wherein the display screen (4) is mounted on the upper end of the control console (1), the crystal bonding mechanism (2) is embedded in the upper end of the control console (1), the exhaust plate (5) is mounted on the side of the machine platform (3), the control console (1) is embedded in the upper end of the machine platform (3), and the universal wheel (6) is mounted on the lower end of the machine platform (3); The crystal fixing mechanism (2) is provided with a support plate (21), a circuit board (22), a bonding arm (23), a track (24), a blocking mechanism (25), a limit block (26), a plane plate (27), and a telescopic rod (28); the track (24) is embedded in the support plate (21); the bonding arm (23) is mounted on the side of the track (24); the limit block (26) is attached to the inside of the plane plate (27); the blocking mechanism (25) is embedded in the surface of the plane plate (27); the circuit board (22) is located above the telescopic rod (28); the telescopic rod (28) passes through the plane plate (27); the plane plate (27) is mounted on the side of the support plate (21); the support plate (21) is embedded in the upper end of the console (1); 2. The multifunctional LED die bonding device according to claim 1, characterized in that: The limit block (26) is provided with a connecting plate (w1), an inclined block (w2), and a trapezoidal plate (w3); the connecting plate (w1) is embedded in a side surface of the trapezoidal plate (w3); the inclined block (w2) is engaged with a side surface of the connecting plate (w1); and the trapezoidal plate (w3) is engaged with an inner side of the plane plate (27).

3. The multifunctional LED die bonding device according to claim 1, characterized in that: The blocking mechanism (25) is provided with a spring (e1), a roller (e2), a force-bearing plate (e3), and a connecting rod (e4); the spring (e1) is embedded in the lower end of the force-bearing plate (e3); the connecting rod (e4) is installed on the side of the force-bearing plate (e3); the connecting rod (e4) is engaged with the middle ends of the roller (e2); and the spring (e1) is embedded in the surface of the plane plate (27).

4. The multifunctional LED die bonding device according to claim 3, characterized in that: The roller (e2) is provided with a rotating ring (e21), a fixed rod (e22), and a force ring (e23); the force ring (e23) is fitted on the outside of the rotating ring (e21); the rotating ring (e21) and the outside of the fixed rod (e22) move by friction; the fixed rod (e22) and the force ring (e23) are located on the same central axis; and the connecting rod (e4) is engaged with the side of the fixed rod (e22).

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