Automatic dust-free paper removing device and wafer bale breaker

Abstract

The utility model relates to the technical field of wafer unpacking equipment, in particular to an automatic dust-free paper removing device and a wafer unpacking machine. The utility model provides an automatic dust-free paper removing device which comprises a wafer conveying line, a first adsorption mechanism, a second adsorption mechanism and a manipulator. The wafer conveying line is used for conveying stacked wafers, and the first adsorption mechanism and the second adsorption mechanism are sequentially arranged in the conveying direction of the wafer conveying line. The first adsorption mechanism is used for removing dust-free paper above the stacked wafers; the second adsorption mechanism is used for adsorbing dust-free paper below the stacked wafers; and the manipulator is used for taking away the stacked wafer when the second adsorption mechanism adsorbs the dust-free paper below the stacked wafer. The first adsorption mechanism, the second adsorption mechanism, the manipulator and the wafer conveying line are matched to automatically remove dust-free paper on the upper side and the lower side of the stacked wafer, manual intervention is not needed in the whole process, the production cost is low, the efficiency is high, and meanwhile the problem that the wafer is prone to being damaged when the dust-free paper is removed manually is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip unpacking equipment, in particular to an automatic dust-free paper removing device and a chip unpacking machine. Background Art

[0002] The wafer of a solar cell is the core component of a solar cell. It is made by processing semiconductor materials (usually silicon) into thin slices, and then subjecting them to a series of treatments, and finally making a device that can convert sunlight into electrical energy. The incoming wafers of a solar cell are usually multiple wafers stacked and contained in a packaging box, and dust-free paper protection is set on both sides of the stacked wafers to prevent damage to the surface of the wafers during transportation. The incoming wafers of a solar cell generally need to be unpacked with unpacking equipment, and the stacked wafers in the packaging box are taken out. Since dust-free paper protection is set on both sides of the stacked wafers, when the stacked wafers are removed from the packaging box and subsequently processed, the dust-free paper on both sides of the stacked wafers needs to be removed. In the prior art, the dust-free paper on both sides of the stacked wafers is mostly removed manually at the wafer conveyor line, resulting in low efficiency and high cost. At the same time, the probability of damaging the wafers during manual handling is high. Utility Model Content

[0003] (I) The problem to be solved by the utility model is that the existing wafer unpacking equipment uses a manual method to remove the dust-free paper, which is inefficient, costly, and has the risk of damaging the wafer.

[0004] (II) Technical solution

[0005] In order to solve the above technical problems, an embodiment of the utility model provides an automatic dust-free paper removal device for removing dust-free paper on both sides of the stacked wafers;

[0006] The automatic dust-free paper removal device comprises: a wafer conveying line, a first adsorption mechanism, a second adsorption mechanism and a robot;

[0007] The wafer conveying line is used to convey stacked wafers, and along the conveying direction of the wafer conveying line, the first adsorption mechanism and the second adsorption mechanism are sequentially arranged at the wafer conveying line;

[0008] The first adsorption mechanism is used to remove the dust-free paper above the stacked wafers;

[0009] The second adsorption mechanism is used to adsorb the dust-free paper under the stacked wafers;

[0010] The robot arm is used to take away the stacked wafers when the second adsorption mechanism adsorbs the dust-free paper under the stacked wafers, so as to separate the stacked wafers from the dust-free paper under the stacked wafers.

[0011] Further, the first adsorption mechanism includes a first vertical displacement component and at least one first suction cup;

[0012] The first suction cup is arranged on the first vertical displacement component, and the first vertical displacement component is used to drive the first suction cup to move vertically, so that the first suction cup can remove the dust-free paper above the stacked wafers.

[0013] Further, the first adsorption mechanism further includes a first lateral displacement component;

[0014] The first vertical displacement component is connected to the first lateral displacement component, and the first lateral displacement component is used to drive the first vertical displacement component and the first suction cup located on the first vertical displacement component to move horizontally, so that the first suction cup can move to or away from above the wafer conveying line.

[0015] Further, a plurality of the first adsorption mechanisms are provided, and all the first adsorption mechanisms are sequentially arranged at intervals along the conveying direction of the wafer conveying line.

[0016] Further, the second adsorption mechanism includes a second vertical displacement component and a plurality of second suction cups;

[0017] When the stacked wafers are located on the wafer conveying line, both sides of the stacked wafers perpendicular to the conveying direction are suspended; all the second suction cups are distributed on both sides of the wafer conveying line and are connected to the second vertical displacement component; the second vertical displacement component is used to drive all the second suction cups to move vertically simultaneously, so that the second suction cups can adsorb the dust-free paper under the stacked wafers.

[0018] Further, a third adsorption mechanism is further included; after the manipulator takes away the stacked wafers, the third adsorption mechanism is used to take away the dust-free paper on the wafer conveying line.

[0019] Further, the third adsorption mechanism is arranged opposite to the second adsorption mechanism;

[0020] Or, along the conveying direction of the wafer conveying line, the third adsorption mechanism is arranged downstream of the second adsorption mechanism.

[0021] Further, the third adsorption mechanism includes a third lateral displacement component, a third vertical displacement component and a third suction cup;

[0022] The third suction cup is disposed on the third vertical displacement assembly, and the third vertical displacement assembly is disposed on the third horizontal displacement assembly; the third horizontal displacement assembly is configured to drive the third vertical displacement assembly and the third suction cup located on the third vertical displacement assembly to move horizontally, so that the third suction cup can move to or away from above the wafer conveying line; the third vertical displacement assembly is configured to drive the third suction cup to move vertically, so that the third suction cup approaches or departs from the wafer conveying line.

[0023] Further, the manipulator includes a robotic arm and a gripper.

[0024] One end of the robotic arm is connected to the gripper and drives the gripper to move; the gripper includes a claw body and a driving member, the claw body is L-shaped, there are two claw bodies, and the two claw bodies are oppositely arranged, the driving member is connected to the two claw bodies and drives the two claw bodies to approach or move away from each other.

[0025] Another embodiment of the present invention further provides a wafer unpacking machine, including the automatic dust-free paper removing device in any of the above embodiments.

[0026] Advantages of the present invention:

[0027] An automatic dust-free paper removing device provided by the present invention is used to remove the dust-free paper on both sides of stacked wafers; the automatic dust-free paper removing device includes: a wafer conveying line, a first adsorption mechanism, a second adsorption mechanism, and a manipulator; the wafer conveying line is configured to convey stacked wafers, along the conveying direction of the wafer conveying line, the first adsorption mechanism and the second adsorption mechanism are sequentially disposed at the wafer conveying line; the first adsorption mechanism is configured to remove the dust-free paper above the stacked wafers; the second adsorption mechanism is configured to adsorb the dust-free paper below the stacked wafers; the manipulator is configured to take away the stacked wafers when the second adsorption mechanism adsorbs the dust-free paper below the stacked wafers, so that the stacked wafers are separated from the dust-free paper below the stacked wafers.

[0028] The first adsorption mechanism can automatically remove the dust-free paper above the stacked wafers, and the second adsorption mechanism and the manipulator cooperate to automatically remove the dust-free paper below the stacked wafers. The stacked wafers are automatically conveyed at the first adsorption mechanism and the second adsorption mechanism through the wafer conveying line, and the whole process does not require manual intervention; compared with the prior art, it has low production cost and high efficiency, and effectively solves the problem that manual removal of dust-free paper is likely to damage the wafers. Description of the Drawings

[0029] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 Structural schematic diagram of the automatic dust-free paper removing device provided by the embodiment of the present invention;

[0031] Figure 2 Structural schematic diagram when the clamping jaw grabs the stacked wafers.

[0032] Icon: 11 - Stacked wafers; 12 - Dust-free paper;

[0033] 2 - Wafer conveying line;

[0034] 3 - First adsorption mechanism; 31 - First lateral displacement component; 32 - First vertical displacement component; 33 - First suction cup;

[0035] 4 - Second adsorption mechanism; 41 - Second vertical displacement component; 42 - Second suction cup;

[0036] 5 - Third adsorption mechanism; 51 - Third lateral displacement component; 52 - Third vertical displacement component; 53 - Third suction cup;

[0037] 6 - Manipulator; 61 - Driving part; 62 - Claw body. Specific embodiments

[0038] The following will clearly and completely describe the technical solutions of the present invention in combination with the embodiments. Obviously, the described embodiments are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0039] Such as Figure 1 And to Figure 2As shown in the figure, an embodiment of the present utility model provides an automatic dust-free paper removing device for removing the dust-free papers 12 on both sides of the stacked wafers 11. The automatic dust-free paper removing device is arranged on the wafer conveying line 2, and the wafer conveying line 2 is used for conveying the stacked wafers 11. The automatic dust-free paper removing device includes: a first adsorption mechanism 3, a second adsorption mechanism 4 and a manipulator 6. The first adsorption mechanism 3 is used for removing the dust-free paper 12 above the stacked wafers 11. Along the conveying direction of the wafer conveying line 2, the second adsorption mechanism 4 is arranged downstream of the first adsorption mechanism 3, and the second adsorption mechanism 4 is used for adsorbing the dust-free paper 12 below the stacked wafers 11. The manipulator 6 is used for taking away the stacked wafers 11 when the second adsorption mechanism 4 adsorbs the dust-free paper 12 on the lower side of the stacked wafers 11.

[0040] The automatic dust-free paper removing device provided in this embodiment is used for a wafer unpacking machine, specifically for removing the dust-free papers 12 on both sides of the stacked wafers 11 during the unpacking process of the wafer unpacking machine. The automatic dust-free paper removing device can be connected downstream of the non-destructive testing device in the wafer unpacking machine. The non-destructive testing device is used for inspecting the appearance of the stacked wafers 11 after taking out the stacked wafers 11 (at this time, there are dust-free papers 12 on both sides of the stacked wafers 11) from the packaging box to detect whether the stacked wafers 11 are damaged or not. The automatic dust-free paper removing device includes a wafer conveying line 2, a first adsorption mechanism 3, a second adsorption mechanism 4 and a manipulator 6. The dust-free paper 12 above the stacked wafers 11 is located at the top layer of the stacked wafers 11. Therefore, the first adsorption mechanism 3 can directly remove the dust-free paper 12 above the stacked wafers 11. However, there are stacked wafers 11 stacked above the dust-free paper 12 below the stacked wafers 11. Therefore, when removing the dust-free paper 12 below the stacked wafers 11, the second adsorption mechanism 4 and the manipulator 6 need to cooperate. Specifically, first, the second adsorption mechanism 4 sucks the dust-free paper 12 below the stacked wafers 11, and then, the manipulator 6 takes away the stacked wafers 11, so that the stacked wafers 11 are separated from the dust-free paper 12 below the stacked wafers 11. For the convenience of operation, the dust-free papers 12 above and below the stacked wafers 11 are sequentially removed on the wafer conveying line 2. The wafer conveying line 2 is used for conveying the stacked wafers 11 so that the stacked wafers 11 can be sequentially processed by the first adsorption mechanism 3 and the second adsorption mechanism 4. Correspondingly, the first adsorption mechanism 3 and the second adsorption mechanism 4 are sequentially arranged at the wafer conveying line 2 along the conveying direction of the wafer conveying line 2. In addition to separating the stacked wafers 11 from the dust-free paper 12 below the stacked wafers 11, the manipulator 6 can also undertake the task of conveying the stacked wafers 11 after removing the dust-free paper 12 to the next production beat. Therefore, the specific position of the manipulator 6 can be not limited.

[0041] The automatic dust-free paper removing device provided by this embodiment. The first adsorption mechanism 3 can automatically remove the dust-free paper 12 above the stacked wafers 11. The second adsorption mechanism 4 and the manipulator 6 cooperate to automatically remove the dust-free paper 12 below the stacked wafers 11. The stacked wafers 11 are automatically conveyed at the first adsorption mechanism 3 and the second adsorption mechanism 4 through the wafer conveying line 2, and no manual intervention is required throughout the process. Compared with the prior art, it has low production cost and high efficiency, and effectively solves the problem that manual removal of the dust-free paper 12 is likely to damage the wafers.

[0042] Optionally, in this embodiment, the above-mentioned conveying line is a conveyor belt. Further, the conveying line includes two conveyor belts arranged in parallel. The two conveyor belts convey the stacked wafers 11 simultaneously to facilitate the arrangement of other structures in the automatic dust-free paper removing device or the wafer unpacking machine. A plurality of partitions are arranged at intervals on the conveyor belt. The partitions are used to limit the stacked wafers 11 to prevent the stacked wafers 11 from moving under the action of inertia when the conveyor belt changes from running to stopping, which affects production.

[0043] The automatic dust-free paper removing device provided by the embodiment of the present utility model, as Figure 1 shown, the first adsorption mechanism 3 includes a first vertical displacement component 32 and at least one first suction cup 33; the first suction cup 33 is arranged on the first vertical displacement component 32, and the first vertical displacement component 32 is used to drive the first suction cup 33 to move vertically, so that the first suction cup 33 can remove the dust-free paper 12 above the stacked wafers 11.

[0044] In this embodiment, the above-mentioned first adsorption mechanism 3 includes a first vertical displacement component 32 and a first suction cup 33; the first suction cup 33 is a pneumatic suction cup, which is communicated with a vacuum source through a pipeline and adsorbs the dust-free paper 12 above the stacked wafers 11 by means of vacuum pumping. The first vertical displacement component 32 is used to drive the first suction cup 33 to move in the vertical direction, so as to make the suction cup approach or move away from the stacked wafers 11 to adsorb the dust-free paper 12 above the stacked wafers 11. To improve stability, preferably a plurality of first suction cups 33 are provided, and when a plurality of first suction cups 33 are provided, all the first suction cups 33 need to be on the same plane. The first vertical displacement component 32 can adopt a telescopic cylinder such as a cylinder or an oil cylinder, or can also adopt a linear guide rail structure. For example, the first vertical displacement component 32 includes a guide rail, a slider, a mounting frame, a driving motor and a screw drive assembly; the slide rail is arranged vertically, the slider is slidably mounted on the guide rail, the mounting frame is connected to the slider, and the first suction cup 33 is arranged on the mounting frame; the driving motor is connected to the slider through the screw drive assembly and drives the slider to slide on the guide rail, so as to achieve the purpose that the first vertical displacement component 32 is used to drive the first suction cup 33 to move vertically.

[0045] The automatic dust-free paper removing device provided by the embodiment of the present utility model, as Figure 1As shown, the first adsorption mechanism 3 further includes a first lateral displacement assembly 31; the first vertical displacement assembly 32 is connected to the first lateral displacement assembly 31, and the first lateral displacement assembly 31 is used to drive the first vertical displacement assembly 32 and the first suction cup 33 located on the first vertical displacement assembly 32 to move horizontally, so that the first suction cup 33 can move to or away from above the wafer transfer line 2.

[0046] As mentioned above, the first adsorption mechanism 3 includes a first vertical displacement assembly 32, which is used to drive the suction cup to move vertically, so as to approach or move away from the stacked wafers 11 on the wafer transfer line 2. Further, in this embodiment, the first adsorption mechanism 3 further includes a first lateral displacement assembly 31; the first lateral displacement assembly 31 is used to drive the first vertical displacement assembly 32 and the first suction cup 33 provided on the first vertical displacement assembly 32 to move horizontally, so that the first suction cup 33 can move above the wafer transfer line 2, or so that the first suction cup 33 can move away from above the wafer transfer line 2, that is, the movement direction of the first lateral displacement assembly 31 is not parallel to the transfer direction of the wafer transfer line 2. In this embodiment, the first adsorption mechanism 3 is provided with the first lateral displacement assembly 31, which can realize the function of discharging the dust-free paper 12. Specifically, the automatic dust-free paper removing device in this embodiment further includes a first dust-free paper buffer station, which is used to buffer the removed dust-free paper 12. Therefore, the first lateral displacement assembly 31 drives the first vertical displacement assembly 32 and the first suction cup 33 provided on the first vertical displacement assembly 32 to move horizontally, so that the first suction cup 33 moves between the wafer transfer line 2 and the first dust-free paper buffer station. When the first suction cup 33 moves above the wafer transfer line 2, the first suction cup 33 can adsorb the dust-free paper 12 above the stacked wafers; when the first suction cup 33 moves above the first dust-free paper buffer station, the first suction cup 33 can place the adsorbed dust-free paper 12 into the first dust-free paper buffer station.

[0047] Optionally, in this embodiment, the first lateral displacement assembly 31 can adopt a telescopic cylinder such as a cylinder or an oil cylinder, or can also adopt a linear guide rail structure. For example, the first lateral displacement assembly 31 includes a guide rail, a slider, a mounting frame, a driving motor and a screw drive assembly; the slide rail is arranged horizontally, preferably perpendicular to the transfer direction of the wafer transfer line 2, the slider is slidably mounted on the guide rail, the mounting frame is connected to the slider, and the first vertical displacement assembly 32 is arranged on the mounting frame; the driving motor is connected to the slider through the screw drive assembly and drives the slider to slide on the guide rail, so as to achieve the purpose that the first lateral displacement assembly 31 is used to drive the first vertical displacement assembly 32 and the first suction cup 33 provided on the first vertical displacement assembly 32 to move horizontally.

[0048] During use, when the wafer transfer line 2 transfers the stacked wafers 11 to a predetermined position, the first lateral displacement assembly 31 operates to drive the first vertical displacement assembly 32 and the first suction cup 33 on the first vertical displacement assembly 32 to move towards the wafer transfer line 2, so that the first suction cup 33 moves above the wafer transfer line 2; after the first suction cup 33 moves above the wafer transfer line 2, the first vertical displacement assembly 32 drives the first suction cup 33 to move downward, so that the first suction cup 33 adsorbs the dust-free paper 12 above the stacked wafers 11; after the first suction cup 33 sucks the dust-free paper 12, the first vertical displacement assembly 32 drives the first suction cup 33 to move upward, and the first lateral displacement assembly 31 drives the first vertical displacement assembly 32 and the first suction cup 33 on the first vertical displacement assembly 32 to move away from the wafer transfer line 2, so that the first suction cup 33 moves above the first dust-free paper buffer station. Then, the first vertical displacement assembly 32 drives the first suction cup 33 to move downward, so that the first suction cup 33 places the dust-free paper 12 in the first dust-free paper buffer station. Among them, the position of the stacked wafers 11 on the wafer transfer line 2 can be monitored by setting a vision sensor or a proximity sensor, etc., so as to control the operation of the first adsorption mechanism 3.

[0049] Preferably, a plurality of first adsorption mechanisms 3 are provided in the automatic dust-free paper removing device provided in this embodiment, and all the first adsorption mechanisms 3 are sequentially arranged at intervals along the conveying direction of the wafer transfer line 2, so as to improve production efficiency.

[0050] The automatic dust-free paper removing device provided in the embodiment of the present utility model, as Figure 1 and Figure 2 shown, the second adsorption mechanism 4 includes a second vertical displacement assembly 41 and a plurality of second suction cups 42; when the stacked wafers 11 are located on the wafer transfer line 2, both sides of the stacked wafers 11 perpendicular to the conveying direction are suspended; all the second suction cups 42 are distributed on both sides of the wafer transfer line 2 and are connected to the second vertical displacement assembly 41; the second vertical displacement is used to drive all the second suction cups 42 to move vertically at the same time, so that the second suction cups 42 can adsorb the dust-free paper 12 below the stacked wafers 11.

[0051] In this embodiment, after the stacked wafers 11 are placed on the wafer transfer line 2, both sides of the stacked wafers 11 perpendicular to the conveying direction of the wafer transfer line 2 are suspended. Thus, all the second suction cups 42 are arranged on both sides of the wafer transfer line 2. When the stacked wafers 11 are conveyed to the second adsorption mechanism 4, the second vertical displacement assembly 41 drives the second suction cups 42 to move upward, and the second suction cups 42 suck the dust-free paper 12 below the stacked wafers 11. Then, the stacked wafers 11 can be taken away by the manipulator 6.

[0052] Preferably, in this embodiment, since the dust-free paper 12 is made of a flexible material, after the second suction cup 42 sucks the dust-free paper 12 under the stacked wafers 11, the second vertical displacement assembly 41 continues to operate, lifting the dust-free paper 12 under the stacked wafers 11 together with the stacked wafers 11. At this time, the four sides of the dust-free paper 12 under the stacked wafers 11 bend downward under the action of gravity, as Figure 2 shown. In this way, it is convenient for the manipulator 6 to separate the stacked wafers 11 from the dust-free paper 12 under the stacked wafers 11.

[0053] Optionally, in this embodiment, the second vertical displacement assembly 41 can be a telescopic cylinder such as a cylinder or an oil cylinder, or can be arranged with reference to the above-mentioned first vertical displacement assembly 32, and its specific structure will not be elaborated here.

[0054] The automatic dust-free paper removing device provided by the embodiment of the present invention, as Figure 1 shown, further includes a third adsorption mechanism 5; after the manipulator 6 takes away the stacked wafers 11, the third adsorption mechanism 5 is used to take away the dust-free paper 12 on the wafer conveyor line 2.

[0055] In this embodiment, after the stacked wafers 11 are separated from the dust-free paper 12 under the stacked wafers 11, the dust-free paper 12 under the stacked wafers 11 still remains on the wafer conveyor line 2. For this reason, the automatic dust-free paper removing device further includes a third adsorption mechanism 5 for taking away the dust-free paper 12 remaining on the wafer conveyor line 2.

[0056] The automatic dust-free paper removing device provided by the embodiment of the present invention, as Figure 1 shown, the third adsorption mechanism 5 is disposed opposite to the second adsorption mechanism 4; or, along the conveying direction of the wafer conveyor line 2, the third adsorption mechanism 5 is disposed downstream of the second adsorption mechanism 4.

[0057] Optionally, the third adsorption mechanism 5 can be disposed opposite to the second adsorption mechanism 4, that is, along the conveying direction of the wafer conveyor line 2, the third adsorption mechanism 5 and the second adsorption mechanism 4 are disposed at the same location, on both sides of the wafer conveyor line 2, to facilitate the layout of the automatic dust-free paper removing device. Or, the third adsorption mechanism 5 can also be disposed downstream of the second adsorption mechanism 4. After the manipulator 6 takes away the stacked wafers 11, the wafer conveyor line 2 conveys the dust-free paper 12 remaining on the wafer conveyor line 2 to the third adsorption mechanism 5, and the third adsorption mechanism 5 takes it away.

[0058] The automatic dust-free paper removing device provided by the embodiment of the present invention, as Figure 1As shown in the figure, the third adsorption mechanism 5 includes a third lateral displacement component 51, a third vertical displacement component 52, and a third suction cup 53; the third suction cup 53 is arranged on the third vertical displacement component 52, and the third vertical displacement component 52 is arranged on the third lateral displacement component 51; the third lateral displacement component 51 is used to drive the third vertical displacement component 52 and the third suction cup 53 located on the third vertical displacement component 52 to move horizontally, so that the third suction cup 53 can move to or away from above the wafer conveying line 2; the third vertical displacement component 52 is used to drive the third suction cup 53 to move vertically, so that the third suction cup 53 approaches or departs from the wafer conveying line 2.

[0059] In this embodiment, preferably, the third adsorption mechanism 5 is disposed opposite to the second adsorption mechanism 4; the automatic dust-free paper removing device further includes a second dust-free paper buffer station. The above-mentioned first dust-free paper buffer station is used to buffer the dust-free paper 12 above the stacked wafers 11, and the second dust-free paper buffer station here is used to buffer the dust-free paper 12 below the stacked wafers 11. The structure of the third lateral displacement component 51 can be set with reference to the structure of the first lateral displacement component 31, and the structure of the third vertical displacement component 52 can be set with reference to the structure of the first vertical displacement component 32, so it will not be elaborated here. By driving the third suction cup 53 through the third lateral displacement component 51 and the third vertical displacement component 52, the dust-free paper 12 remaining on the wafer conveying line 2 can be transferred to the second dust-free paper buffer station.

[0060] The automatic dust-free paper removing device provided by the embodiment of the present utility model, as Figure 2 shown, the manipulator 6 includes a robotic arm and a gripper; one end of the robotic arm is connected to the gripper and drives the gripper to move; the gripper includes a claw body 62 and a driving member 61. The claw body 62 is L-shaped, there are two claw bodies 62, and the two claw bodies 62 are arranged opposite to each other. The driving member 61 is connected to the two claw bodies 62 and drives the two claw bodies 62 to approach or move away from each other.

[0061] In this embodiment, the manipulator 6 is composed of a robotic arm and a gripper. The robotic arm is composed of a plurality of arm bodies connected in a rotating or sliding manner in sequence (not shown in the accompanying drawings of the specification). The gripper is used to grasp the stacked wafers 11. The gripper includes two claw bodies 62 arranged opposite to each other and in an L shape. The claw body 62 being set in an L shape can achieve an initial wafer sorting effect when grasping the stacked wafers 11, making the stacked wafers 11 regular and facilitating subsequent steps.

[0062] Another embodiment of the present utility model further provides a wafer unpacking machine, including the automatic dust-free paper removing device described in any of the above embodiments.

[0063] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0064] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations. In addition, in the description of the present utility model, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0065] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An automatic dust-free paper removal device, used for removing dust-free paper (12) on both sides of a stacked wafer (11); It is characterized in that The automatic dust-free paper removal device comprises: a wafer conveying line (2), a first adsorption mechanism (3), a second adsorption mechanism (4) and a robot (6); The wafer conveying line (2) is used to convey stacked wafers (11), and along the conveying direction of the wafer conveying line (2), the first adsorption mechanism (3) and the second adsorption mechanism (4) are sequentially arranged at the wafer conveying line (2); The first adsorption mechanism (3) is used to remove the dust-free paper (12) above the stacked wafers (11); The second adsorption mechanism (4) is used to adsorb the dust-free paper (12) below the stacked wafer (11); The robot (6) is used to remove the stacked wafer (11) when the second adsorption mechanism (4) adsorbs the dust-free paper (12) below the stacked wafer (11), so as to separate the stacked wafer (11) from the dust-free paper (12) below the stacked wafer (11).

2. The automatic dust-free paper removal device according to claim 1, characterized in that: The first adsorption mechanism (3) comprises a first vertical displacement component (32) and at least one first suction cup (33); The first suction cup (33) is arranged on the first vertical displacement assembly (32), and the first vertical displacement assembly (32) is used to drive the first suction cup (33) to move vertically, so that the first suction cup (33) can remove the dust-free paper (12) above the stacked wafers (11).

3. The automatic dust-free paper removal device according to claim 2, characterized in that: The first adsorption mechanism (3) further comprises a first lateral displacement component (31); The first vertical displacement component (32) is connected to the first lateral displacement component (31), and the first lateral displacement component (31) is used to drive the first vertical displacement component (32) and the first suction cup (33) located on the first vertical displacement component (32) to move in a lateral direction, so that the first suction cup (33) can move to or away from above the wafer conveying line (2).

4. The automatic dust-free paper removal device according to any one of claims 1 to 3, characterized in that: A plurality of the first adsorption mechanisms (3) are provided, and all of the first adsorption mechanisms (3) are arranged in sequence and at intervals along the conveying direction of the wafer conveying line (2).

5. The automatic dust-free paper removal device according to claim 1, characterized in that: The second adsorption mechanism (4) comprises a second vertical displacement component (41) and a plurality of second suction cups (42); When the stacked wafer (11) is located on the wafer conveying line (2), the stacked wafer (11) is suspended on both sides perpendicular to the conveying direction; all the second suction cups (42) are distributed on both sides of the wafer conveying line (2) and are connected to the second vertical displacement assembly (41); the second vertical displacement assembly (41) is used to drive all the second suction cups (42) to move vertically at the same time, so that the second suction cups (42) can absorb the dust-free paper (12) under the stacked wafer (11).

6. The automatic dust-free paper removal device according to claim 1 or 5, characterized in that: It also includes a third adsorption mechanism (5); after the robot (6) takes away the stacked wafers (11), the third adsorption mechanism (5) is used to take away the dust-free paper (12) on the wafer conveying line (2).

7. The automatic dust-free paper removal device according to claim 6, characterized in that: The third adsorption mechanism (5) is arranged opposite to the second adsorption mechanism (4); Alternatively, along the conveying direction of the wafer conveying line (2), the third adsorption mechanism (5) is arranged downstream of the second adsorption mechanism (4).

8. The automatic dust-free paper removal device according to claim 7, characterized in that: The third adsorption mechanism (5) comprises a third lateral displacement component (51), a third vertical displacement component (52) and a third suction cup (53); The third suction cup (53) is arranged on the third vertical displacement assembly (52), and the third vertical displacement assembly (52) is arranged on the third lateral displacement assembly (51); the third lateral displacement assembly (51) is used to drive the third vertical displacement assembly (52) and the third suction cup (53) located on the third vertical displacement assembly (52) to move in the lateral direction, so that the third suction cup (53) can move to or away from above the wafer conveying line (2); the third vertical displacement assembly (52) is used to drive the third suction cup (53) to move in the vertical direction, so that the third suction cup (53) is close to or away from the wafer conveying line (2).

9. The automatic dust-free paper removal device according to claim 1, characterized in that: The manipulator (6) comprises a manipulator arm and a gripper; One end of the mechanical arm is connected to the clamping claw and drives the clamping claw to move; the clamping claw comprises a claw body (62) and a driving member (61); the claw body (62) is L-shaped; two claw bodies (62) are provided and the two claw bodies (62) are arranged opposite to each other; the driving member (61) is connected to the two claw bodies (62) and drives the two claw bodies (62) to move closer to or away from each other.

10. A wafer unpacking machine, characterized in that: It comprises the automatic dust-free paper removal device as described in any one of claims 1 to 9.

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