Integrated circuit probe alignment device
By using CCD cameras and precision mechanical means to accurately monitor and adjust the X, Y, and Z axes in the integrated circuit probe positioning device, the problems of deformation and manual alignment errors in traditional probe cards during the test are solved, and higher alignment accuracy and production efficiency are achieved.
Patent Information
- Application Number
- CN202421390659.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-06-18
AI Technical Summary
During the test, traditional vertical probe cards are prone to side-bending deformation due to shear force and bending moment, which affects the vertical contact with the test point Pad, and the alignment installation relies on manual operation, which has error and efficiency problems.
An integrated circuit probe device is adopted, including the first CCD and the second CCD, a MEMS probe unit, a sample holder, a rotating platform, a stepper motor controller, a Z-axis slide table and an XY-axis slide table. Through precise monitoring and adjustment of the X, Y, and Z-axis, the horizontal position and angle of the probe are ensured, and operating errors are reduced and production efficiency is improved.
It significantly improves the accuracy of the probe targeting, reduces operational errors, improves production efficiency, increases the pass rate of PRVX tests, and extends the service life of the probe card.
Smart Images
Figure CN222965356U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit probe alignment device. Background Art
[0002] In the field of integrated circuit testing, traditional vertical probe cards face multiple challenges during the testing process. First, the probes not only bear axial forces during testing but are also affected by shear forces and bending moments, which may cause the probes to bend and deform laterally, affecting their vertical contact with the test point Pad. If the deformation is too large, the probes may scratch the Pad, resulting in test failure. Even if the deformation is small, after repeated testing and extrusion, the probes may undergo irreversible bending deformation, affecting the test accuracy and the service life of the probe card.
[0003] Secondly, during the detection process, the probes need to precisely contact the Pad of the object under test. Different products have different Pad sizes and Pitch spacings. By observing the needle marks on the Pad through a microscope, the contact situation between the probes and the Pad can be judged. Ideally, the needle marks should be located at the center of the Pad. Any deviation of the needle marks from the center, whether it is an up / down, left / right offset or not hitting the target, may affect the smooth progress of the test.
[0004] Furthermore, the planarity of the probe card refers to the vertical displacement of the probes from the first electrical contact to the last electrical contact. During the assembly process, the planarity requirement of the probes is extremely strict and shall not exceed 25mm. If the probes do not contact the test object well, it will directly affect the accuracy of the measurement results. Although increasing the contact pressure can prevent poor contact, it may cause excessive needle marks and affect the packaging yield.
[0005] Currently, the alignment and installation mainly rely on manual operation. The approximate welding position is determined by observing through a microscope, and then the Probe Head is manually placed and welded. This manual-dependent method has certain error and efficiency problems. Summary of the Utility Model
[0006] The purpose of the utility model is to solve the deficiencies existing in the prior art, and an integrated circuit probe alignment device is proposed.
[0007] The purpose of the utility model is to solve the deficiencies existing in the prior art, and an integrated circuit probe alignment device is proposed.
[0008] To achieve the above object, the present utility model adopts the following technical solutions: An integrated circuit probe alignment device, comprising a first CCD and a second CCD. A MEMS probe unit is provided at the bottom of the first CCD. A sample holder is fixedly provided at the bottom of the MEMS probe unit. A rotary platform is rotatably connected to the bottom of the sample holder. A stepper motor controller is provided on one side of the rotary platform. A Z-axis slide is slidably connected to one side of the rotary platform. An XY-axis slide is slidably connected to the bottom of the rotary platform.
[0009] As a further description of the above technical solution:
[0010] The first CCD and the second CCD are used to transmit X, Y, Z-axis alignment images.
[0011] As a further description of the above technical solution:
[0012] The MEMS probe unit carries a probe head.
[0013] As a further description of the above technical solution:
[0014] The stepper motor controller controls the rotation of the rotary platform.
[0015] As a further description of the above technical solution:
[0016] The Z-axis slide can be manually moved.
[0017] As a further description of the above technical solution:
[0018] The XY-axis slide can be manually moved.
[0019] The present utility model has the following beneficial effects:
[0020] 1. In the present utility model, by introducing two CCD cameras for the X, Y, Z axes for precise monitoring, the alignment accuracy is significantly improved. By adjusting the offset of the X, Y platform slides and the rotary platform, the horizontal position and angle of the probe can be accurately determined, and the planar difference of the Z axis can be effectively controlled;
[0021] 2. Compared with the traditional manual microscope alignment and welding method, the present utility model directly displays the actual situation of the operation through two CCD cameras, greatly reducing operation errors and improving production efficiency. In addition, by using precise screws and stepper motors to control the platform movement, the alignment of the probe module is ensured to be more precise, improving the standard of the needle card control parameters, thereby significantly increasing the passing rate of the PRVX test. Description of the Drawings
[0022] Figure 1 It is a schematic structural diagram of the integrated circuit probe alignment device proposed by the present utility model.
[0023] Legend Explanation:
[0024] 1. First CCD; 2. Second CCD; 3. Stepper motor controller; 4. MEMS probe unit; 5. Sample holder; 6. Rotating platform; 7. Z-axis slide; 8. XY-axis slide. Specific Embodiment
[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0026] Refer to Figure 1 , an embodiment provided by the present invention: an integrated circuit probe alignment device, including a first CCD 1 and a second CCD 2. A MEMS probe unit 4 is provided at the bottom of the first CCD 1. A sample holder 5 is fixedly provided at the bottom of the MEMS probe unit 4. The sample holder 5 is rotatably connected to a rotating platform 6 at the bottom. A stepper motor controller 3 is provided on one side of the rotating platform 6. A Z-axis slide 7 is slidably connected to one side of the rotating platform 6. An XY-axis slide 8 is slidably connected to the bottom of the rotating platform 6.
[0027] The first CCD 1 and the second CCD 2 are used to transmit X, Y, Z-axis alignment images.
[0028] Two CCD cameras are respectively responsible for capturing X, Y, Z-axis alignment images, ensuring the visualization and accuracy of the alignment process.
[0029] The MEMS probe unit 4 carries the probe. The MEMS probe unit 4 serves as the carrier of the probe, and its bottom is fixed to the sample holder 5, while the sample holder 5 is connected to the rotating platform 6. This design allows the probe to be flexibly adjusted in three-dimensional space.
[0030] The stepper motor controller 3 controls the rotation of the rotating platform 6. The Z-axis slide 7 can be manually moved, and the XY-axis slide 8 can be manually moved.
[0031] Working Principle:
[0032] Image Capture and Transmission: The first CCD 1 and the second CCD 2 cameras are respectively aligned with the probe and the Pad, capturing and transmitting X, Y, Z-axis alignment images. These images provide intuitive visual feedback to the operator, making the alignment process more intuitive and controllable.
[0033] Initial alignment: The operator observes the image transmitted by the CCD camera and preliminarily adjusts the XY-axis stage 8 to bring the probe close to the predetermined position of the Pad in the horizontal direction. This step is achieved through manual operation and lays the foundation for subsequent precise alignment.
[0034] Precise alignment: By using the stepper motor controller 3, the operator can precisely control the rotation of the rotating platform 6, thereby adjusting the contact angle between the probe and the Pad. This step ensures the vertical alignment of the probe and the Pad and improves the accuracy of contact.
[0035] Z-axis height adjustment: By monitoring the height difference of the Z-axis through the CCD camera, the operator can manually adjust the Z-axis stage 7 to precisely control the distance between the probe and the Pad. This adjustment reduces poor contact or excessive pressure caused by the height difference and ensures stable contact between the probe and the Pad during the welding process.
[0036] Final confirmation and welding: After completing the above steps, the operator confirms the position and angle of the probe again through the CCD camera to ensure that everything meets the test requirements. Subsequently, the welding operation can be carried out to fix the probe in the appropriate position and complete the alignment process.
[0037] The present utility model focuses on the equipment research and development of the probe alignment device, which is applicable to vertical pin cards and can be widely applied to the alignment and assembly of various pin card modules.
[0038] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. An integrated circuit probe alignment device, comprising a first CCD (1) and a second CCD (2), characterized in that: A MEMS probe unit (4) is arranged at the bottom of the first CCD (1), a sample holder (5) is fixedly arranged at the bottom of the MEMS probe unit (4), a rotating platform (6) is rotatably connected to the bottom of the sample holder (5), a stepping motor controller (3) is arranged on one side of the rotating platform (6), a Z-axis slide table (7) is slidably connected to one side of the rotating platform (6), and an XY-axis slide table (8) is slidably connected to the bottom of the rotating platform (6).
2. The integrated circuit probe alignment device according to claim 1, characterized in that: The first CCD (1) and the second CCD (2) are used to transmit X-axis, Y-axis and Z-axis alignment images.
3. The integrated circuit probe alignment device according to claim 2, characterized in that: The MEMS probe unit (4) carries a probe.
4. The integrated circuit probe alignment device according to claim 3, characterized in that: The stepper motor controller (3) controls the rotation of the rotating platform (6).
5. The integrated circuit probe alignment device according to claim 4, characterized in that: The Z-axis slide table (7) can be moved manually.
6. The integrated circuit probe alignment device according to claim 5, characterized in that: The XY axis slide table (8) can be moved manually.