Visible component detection device
By standardizing and modularizing components in the existing partial detection device, combining the computing control chip of NPU/GPU and general computing CPU/ARM processor, the integration problem of process control and AI computing capabilities in the device is solved, and efficient functional division of labor and cost reduction effects are achieved.
Patent Information
- Application Number
- CN202421518624.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-30
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-06-30
AI Technical Summary
How to effectively integrate process control capabilities and AI computing capabilities in a partial detection device to reduce R&D difficulty and equipment costs, and solve the problem of system complexity and cost considerations.
By standardizing and modulating the components that perform different functions within the complex component detection device, a standardized industrial chain is formed, and computing control chips such as NPU/GPU and general computing CPU/ARM processors are used respectively to realize the division of labor in graphics computing and control operations, reducing hardware costs and R&D difficulties.
It realizes functional division of labor with higher computing and processing efficiency, reduces the difficulty of system research and development and hardware costs, and at the same time, it facilitates the update and management of AI data sets through separate memory, improving the accuracy and flexibility of detection.
Smart Images
Figure CN222965695U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of medical device technology, and particularly relates to a formed element detection device. Background Art
[0002] The formed element detection device for medical testing is a highly precise and complex medical instrument, including a precise microscopic imaging system and an image analysis and processing system. It is an integrated combination of disciplines such as biotechnology, medical technology, high-precision instruments, computer science, and artificial intelligence graphics analysis technology. The system is complex and requires a large number of sensors, control and detection devices. How to schedule the functions of each component of the control system and how to establish a powerful AI computing ability are huge technical challenges.
[0003] CPU (Central Processing Unit): The central processing unit is the computing and control core of a computer, responsible for executing programs, processing data, and coordinating other components of the computer system.
[0004] GPU (Graphics Processing Unit): The graphics processing unit is good at parallel computing and is especially suitable for processing large-scale data sets and graphics rendering tasks.
[0005] NPU (Neural Processing Unit): The neural processing unit is specifically used for neural network computing and inference and has high efficiency for artificial intelligence tasks such as deep learning.
[0006] TPU (Tensor Processing Unit): The tensor processing unit is optimized for machine learning tasks and can efficiently process large-scale tensor calculations.
[0007] DPU (Deep Learning Processing Unit): The deep learning processing unit focuses on accelerating the calculation of deep learning tasks.
[0008] IPU (Intelligent Processing Unit): The intelligent processing unit integrates highly optimized hardware and software to achieve efficient artificial intelligence computing.
[0009] MCU (Micro Control Unit), also called microcontroller, refers to the integration of computer CPU, RAM, ROM, timer counter and various I / O interfaces on a chip with the emergence and development of large-scale integrated circuits, forming a chip-level chip, such as 51, AVR, Cortex-M, which have RAM and ROM in addition to CPU, and can run code by adding simple peripheral devices (resistors, capacitors). However, MPUs such as x86 and ARM cannot directly put code, they are just enhanced versions of CPU, so RAM and ROM must be added.
[0010] SOC (System on Chip) refers to system on chip. MCU is only a chip-level chip, while SOC is a system-level chip. It has built-in RAM and ROM like MCU (51, avr) and is as powerful as MPU. It can store not only simple code but also system-level code, that is to say, it can run operating system (it can be regarded as the combination of the advantages of MCU integration and MPU strong processing power).
[0011] A computer chip is a thin sheet made of silicon. A chip is made up of hundreds of microcircuits connected together. It is very small and is covered with microcircuits that generate pulsed current. Computer chips use these microcurrents to complete the operations required to control computers, automation devices, and other various equipment. The circuits in a computer chip are very small, and the current it uses is also very small, so the chip is also called a microelectronic device. The main chips in a microcomputer are microprocessor chips, interface chips, and memory chips.
[0012] Computing control chips, also known as main control chips, are the core of today's automation equipment. They play a role in computing and controlling in various intelligent devices. Currently, the main control chips commonly found on the market are mainly divided into two architectures: x86 architecture and ARM architecture. Among them, x86 architecture chips are widely used in desktop and server computers, while ARM architecture chips are mainly used in mobile devices such as smartphones and tablets.
[0013] In specific control scenarios, some computing control chips tend to be more process control, such as MCU and SOC widely used in the industrial control field; some tend to be more computing applications, such as GPU used in graphics cards; daily computers need to take into account both process control and computing, and x86 architecture chips are compatible with process control and computing applications.
[0014] The applicant has filed a number of Chinese patent applications for formed element detection devices in medical testing, proposing to combine microscope imaging with AI recognition to achieve the detection of blood components, urine components, and fecal components. This type of detection application scenario requires relatively complex process control and, even more so, powerful AI graphic recognition computing capabilities. How to integrate process control capabilities and AI computing capabilities on a small device, and how to allocate various control functions and AI computing to different types of computing control chips, while taking into account performance and cost, is a huge challenge. Summary of the Invention
[0015] This application proposes to standardize and reasonably modularize the components with different functions inside the complex formed element detection device, which can form a standardized industrial chain. Different manufacturers can research different modules, which can greatly reduce the R & D difficulty and equipment cost.
[0016] The technical solution for this application to solve the technical problem is a formed element detection device, which includes a system control module, a drive module, an execution module A, an execution module B, and a control input module; the execution module A includes a camera component and a support member A; the support member A is used to support the above camera component; the execution module B includes a support member B, a horizontal slide table component, and a chip illumination component; the support member B is used to carry the above horizontal slide table component; an external formed element A detection chip can be detachably placed on the above horizontal slide table component, and the horizontal slide table component can drive the formed element A detection chip to move on a horizontal plane; the drive module includes a horizontal slide table component drive sub-module, and the horizontal slide table component drive sub-module is used to drive the motor of the horizontal slide table component to operate; the system control module is electrically connected to the above camera component, and the camera component is used to capture an image of the sample in the above formed element A detection chip; the system control module includes an image AI calculation module and a test control module; the test control module is electrically connected to the above drive module, and the test control module is used to control the working state of the above drive module; the image AI calculation module includes a calculation control chip A, and the test control module includes a calculation control chip B.
[0017] The above formed element detection device includes any one of the following technical features: TA1: The above calculation control chip A is any one of an NPU and a GPU; the above calculation control chip B is a general-purpose computing CPU or an ARM processor; TA2: The above calculation control chip A is any one of an NPU and a GPU; the above calculation control chip B is a 51 series single-chip microcomputer or a general-purpose MCU single-chip microcomputer; TA3: The above calculation control chip A is an MCU integrated with a graphics processor inside, and the above calculation control chip B is an MCU single-chip microcomputer; TA4: The above image AI calculation module is connected to the above test control module through a board-to-board connector.
[0018] The above-mentioned formed component detection device further includes a separable memory, which is used to store the AI feature data of formed component detection.
[0019] The above-mentioned separable memory is a USB storage device, a TF storage device, a CF storage device or an optical drive device.
[0020] The above-mentioned formed component detection device further includes a display module and an insertion port for the formed component A detection chip. The display module and the insertion port for the formed component A detection chip are on the same side, and the display module is above or below the insertion port for the formed component A detection chip; the external formed component A detection chip is placed on the above-mentioned horizontal slide assembly through the insertion port for the formed component A detection chip.
[0021] In the above-mentioned formed component detection device, the control input module includes a touch screen, and the touch screen is integrated with the above-mentioned display module.
[0022] The above-mentioned formed component detection device further includes a Z-axis slide assembly. The support member A is used to carry the above-mentioned Z-axis slide assembly; the Z-axis slide assembly is used to carry the imaging assembly, and the Z-axis slide assembly can drive the imaging assembly to move in the Z-axis direction; the drive module includes a Z-axis motor drive sub-module, and the Z-axis motor drive sub-module is used to drive the motor in the Z-axis slide assembly to operate.
[0023] In the above-mentioned formed component detection device, the execution module B includes a chip horizontal adjustment module, and the chip horizontal adjustment module is used to adjust the level of the formed component A detection chip; the above-mentioned chip horizontal adjustment module includes at least 3 height adjustment devices, and the height adjustment device is used to adjust the height or tilt angle of the formed component A detection chip.
[0024] In the above-mentioned formed component detection device, the above-mentioned execution module A is above the above-mentioned execution module B; or the above-mentioned execution module A is below the above-mentioned execution module B.
[0025] The technical solution for solving the technical problem in this application is a formed component detection device, which includes a host, an insertion port for a formed component A detection chip and a separable memory; the insertion port for the formed component A detection chip is used for inserting an external formed component A detection chip; an image AI calculation module is provided in the host, which is used for AI recognition of the microscopic magnified image of the sample in the formed component A detection chip; the host is provided with a connection port for connecting the host and the separable memory; the separable memory is used to store the AI feature data of formed component detection, and the AI feature data of formed component detection is used for AI recognition by the image AI calculation module.
[0026] The host described above includes Memory A, which is used to store the detection AI feature data corresponding to the ingredient A; the separate memory is used to store the detection AI feature data corresponding to the ingredient B. The technical effect of the above technical solution is that the computing control chip A and the computing control chip B are separately provided, and can be dedicated to their respective functions, resulting in higher computing and processing efficiency.
[0027] The technical effect of the above technical solution is that the computing control chip A and the computing control chip B are separately provided, and the AI module can be developed independently and sold as an independent module, reducing the difficulty of system development.
[0028] The technical effect of the above technical solution is that the computing control chip A is an NPU or GPU, which is very suitable for graphics computing, and the computing control chip B is a general-purpose computing CPU or ARM processor, which is more suitable for control operations. Such a combination has higher operating efficiency and can reduce the overall hardware cost.
[0029] The technical effect of the above technical solution is that the computing control chip A is an NPU or GPU, which is very suitable for graphics computing, and the computing control chip B is a 51 series single-chip microcomputer or a general-purpose MCU single-chip microcomputer, which is more suitable for control operations. Such a combination has higher operating efficiency and can further reduce the overall hardware cost.
[0030] The technical effect of the above technical solution is that the computing control chip A is an MCU integrated with a graphics processor, and the computing control chip B is an MCU single-chip microcomputer. Such a combination has higher operating efficiency and can further reduce the overall hardware cost. In some cases where the requirements for image processing are not high, it can reduce the hardware cost under the condition of meeting the functions.
[0031] The technical effect of the above technical solution is that the separate memory, which is used to store the detection AI feature data of the ingredient detection, can facilitate the update and management of the AI data set.
[0032] The technical effect of the above technical solution is that the chip level adjustment module is used to adjust the levelness of the ingredient A detection chip to ensure the imaging flatness. The height adjustment device is used to adjust the height or tilt angle of the ingredient A detection chip, which can finely adjust the object distance of imaging, reduce the difficulty of Z-axis adjustment or remove the Z-axis adjustment mechanism, and simplify the structure of the execution module A.
[0033] The technical effect of the above technical solution is that the display module is located above the insertion port of the above ingredient A detection chip, which is convenient for observation. The display module is located below the insertion port of the above ingredient A detection chip, which is convenient for chip operation.
[0034] The technical effect of the above technical solution is that the execution module A is located below the above execution module B, which is convenient for photographing the bottom of the chip.
[0035] The technical effects of the above technical solution are as follows: Inside the above host, there is a memory A, which is used to store the detection AI feature data corresponding to the formed component A; the separate memory is used to store the detection AI feature data corresponding to the formed component B. By setting the separate memory, the performance can be easily expanded, and the AI recognition of different formed components can be completed. It can also upgrade the original detection AI feature data of the formed component and improve the accuracy of recognition. Description of the Drawings
[0036] Figure 1 It is a schematic block diagram of the formed component detection device Figure 1 ;
[0037] Figure 2 It is a schematic block diagram of the system control module;
[0038] Figure 3 It is a schematic block diagram of the connection between the system control module and the separate memory;
[0039] Figure 4 It is a schematic block diagram of the formed component detection device Figure 2 ;
[0040] Figure 5 It is a schematic diagram of Embodiment 1 of the formed component detection device Figure 1 ;
[0041] Figure 6 It is a schematic diagram of Embodiment 1 of the formed component detection device Figure 2 ;
[0042] Figure 7 It is a schematic diagram of Embodiment 1 of the formed component detection device Figure 3 ;
[0043] Figure 8 It is a schematic diagram of the system control module Figure 1 ;
[0044] Figure 9 It is a schematic diagram of the system control module Figure 2 ;
[0045] Figure 10 It is a schematic diagram of the system control module Figure 3 ;
[0046] Figure 11 It is a schematic diagram of Embodiment 2 of the formed component detection device Figure 1 ;
[0047] Figure 12 It is a schematic diagram of Embodiment 2 of the formed component detection device Figure 2 ;
[0048] Figure 13 Schematic diagram of Embodiment 2 of the formed component detection device Figure 3 . Specific implementation manners
[0049] The following further details the content of the present application in conjunction with each drawing.
[0050] It should be noted that the following is a description of the preferred embodiments of the present application and does not constitute any limitation to the present application. The description of the preferred embodiments of the present application is only for the illustration of the general principle of the present application. The embodiments described in the present application are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.
[0051] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals such as 1, 2, 3, etc., as well as numbers such as "A", "B", are only for descriptive purposes and are only for the convenience of description, and do not represent a sequential relationship in time or space; they cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined with "first", "second", and numbered with Arabic numerals such as 1, 2, 3, etc. may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "several" is two or more unless otherwise specifically defined.
[0052] As Figure 1, In an embodiment of a formed element detection device, it includes a system control module, a drive module, an execution module A, an execution module B, and a control input module; the execution module A includes a camera component and a support member A; the support member A is used to support the above-mentioned camera component; the execution module B includes a support member B, a horizontal slide table component, and a chip illumination component; the support member B is used to carry the above-mentioned horizontal slide table component; an external formed element A detection chip can be detachably placed on the above-mentioned horizontal slide table component, and the horizontal slide table component can drive the formed element A detection chip to move on a horizontal plane; the drive module includes a horizontal slide table component drive sub-module, and the horizontal slide table component drive sub-module is used to drive the motor of the horizontal slide table component to operate; the system control module is electrically connected to the above-mentioned camera component, and the camera component is used to take images of samples in the above-mentioned formed element A detection chip; the system control module includes an image AI calculation module and a test control module; the test control module is electrically connected to the above-mentioned drive module, and the test control module is used to control the working state of the above-mentioned drive module; the image AI calculation module includes a calculation control chip A, and the test control module includes a calculation control chip B.
[0053] In some embodiments, the above-mentioned calculation control chip A is any one of an NPU and a GPU; the above-mentioned calculation control chip B is a general-purpose computing CPU or an ARM processor.
[0054] In some embodiments, the above-mentioned calculation control chip A is any one of an NPU and a GPU; the above-mentioned calculation control chip B is a 51 series single-chip microcomputer or a general MCU single-chip microcomputer.
[0055] In some embodiments, the above-mentioned calculation control chip A is an MCU integrated with a graphics processor internally, and the above-mentioned calculation control chip B is an MCU single-chip microcomputer.
[0056] In some embodiments, the above-mentioned image AI calculation module is connected to the above-mentioned test control module through a board-to-board connector.
[0057] As Figure 3 and Figure 4 , In an embodiment of a formed element detection device, it further includes a separable memory, and the separable memory is used to store formed element detection AI feature data. The above-mentioned separable memory is a USB storage device, a TF storage device, a CF storage device, or an optical drive device.
[0058] As Figure 4, the above-mentioned formed element detection device further includes a display module and an insertion port for the formed element A detection chip. The display module and the insertion port for the formed element A detection chip are located on the same side, and the display module is located above or below the insertion port for the formed element A detection chip; the external formed element A detection chip is placed on the above-mentioned horizontal slide assembly through the insertion port for the formed element A detection chip. The above-mentioned control input module includes a touch screen, and the touch screen is integrated with the above-mentioned display module.
[0059] As Figure 4 , in the embodiment of the above-mentioned formed element detection device, it further includes a Z-axis slide assembly, and the support member A is used to carry the above-mentioned Z-axis slide assembly; the Z-axis slide assembly is used to carry the imaging assembly, and the Z-axis slide assembly can drive the imaging assembly to move in the Z-axis direction; the drive module includes a Z-axis motor drive sub-module, and the Z-axis motor drive sub-module is used to drive the motor in the Z-axis slide assembly to operate.
[0060] As Figures 5 to 7 , in some embodiments, the above-mentioned execution module A is located below the above-mentioned execution module B. As Figures 5 to 7 , in the embodiment of the formed element detection device, it includes a system control module, a drive module 870, an execution module A830, an execution module B850, and an insertion port 860 for the formed element A detection chip; the execution module A830 includes an imaging assembly 831 and a support member A832; the support member A832 is used to support the above-mentioned imaging assembly 831; the execution module B850 includes a support member B, a horizontal slide assembly, and a chip illumination assembly; the support member B is used to carry the above-mentioned horizontal slide assembly; the formed element A detection chip can be detachably placed on the above-mentioned horizontal slide assembly; the horizontal slide assembly is used to drive the externally inserted formed element A detection chip to move on the horizontal plane. The above-mentioned display module is located below the insertion port 860 for the formed element A detection chip; the above-mentioned execution module A830 is located below the above-mentioned execution module B850.
[0061] As Figure 11 , the execution module B includes a chip horizontal adjustment module, and the chip horizontal adjustment module is used to adjust the level of the formed element A detection chip; the above-mentioned chip horizontal adjustment module includes at least 3 height adjustment devices, and the height adjustment devices are used to adjust the height or tilt angle of the formed element A detection chip.
[0062] As Figures 11 to 13 , in some embodiments, the above-mentioned execution module A is located above the above-mentioned execution module B.
[0063] As Figures 11 to 13, in an embodiment of the formed element detection device, it includes a system control module 110, a driving module 170, an execution module A 130, an execution module B 150, and a control input module 120; the execution module A 130 includes a camera assembly and a support member A; the support member A is used to support the above-mentioned camera assembly; the execution module B 150 includes a support member B, a horizontal slide table assembly, and a chip illumination assembly; the support member B is used to carry the above-mentioned horizontal slide table assembly; an external formed element A detection chip can be detachably placed on the above-mentioned horizontal slide table assembly, and the horizontal slide table assembly can drive the formed element A detection chip to move on a horizontal plane; the driving module includes a horizontal slide table assembly driving sub-module, and the horizontal slide table assembly driving sub-module is used to drive the motor of the horizontal slide table assembly to operate; the system control module is electrically connected to the above-mentioned camera assembly, and the camera assembly is used to capture an image of the sample in the above-mentioned formed element A detection chip. Figure 12 The reference numeral 700 in the figure is the power supply module that supplies power to each module.
[0064] Such as Figures 8 to 10 , the system control module 110 includes an image AI calculation module and a test control module; the test control module is electrically connected to the above-mentioned driving module, and the test control module is used to control the working state of the above-mentioned driving module; the image AI calculation module includes a calculation control chip A, and the test control module includes a calculation control chip B.
[0065] Such as Figures 11 to 13 , for the above-mentioned formed element detection device, the above-mentioned system control module 110 is located behind the above-mentioned execution module A 130 or execution module B 150.
[0066] Such as Figures 11 to 13 , the above-mentioned system control module 110 is located above the above-mentioned execution module A 130 or execution module B 150; the above-mentioned display module 180 includes a display screen, and the display screen is not parallel to the vertical direction and forms a certain angle with the vertical direction; the above-mentioned driving module 170 is located behind the above-mentioned execution module A 130 or execution module B 150. The above-mentioned control input module 120 includes a touch screen, and the touch screen is integrated with the above-mentioned display module 180.
[0067] Such as Figures 11 to 13 , in an embodiment of the formed element detection device, the above-mentioned display module 180 is located above the formed element A detection chip insertion port 160; the above-mentioned execution module A 130 is located above the above-mentioned execution module B 150.
[0068] A formed element detection device includes a main unit, an insertion port for a formed element A detection chip, and a separable memory; the insertion port for the formed element A detection chip is used for inserting an external formed element A detection chip; an image AI calculation module is provided in the main unit for performing AI recognition on the microscopic magnified image of the sample in the formed element A detection chip; the main unit is provided with a connection port for connecting the main unit and the separable memory; the separable memory is used for storing formed element detection AI feature data, and the formed element detection AI feature data is used for the AI recognition of the image AI calculation module.
[0069] The interior of the above-mentioned main unit includes a memory A, and the memory A is used for storing the detection AI feature data corresponding to the formed element A; the separable memory is used for storing the detection AI feature data corresponding to the formed element B. By setting the separable memory, the performance can be easily expanded to complete the AI recognition of different formed elements. The original formed element detection AI feature data can also be upgraded to improve the accuracy of recognition. Although this application is described and illustrated according to preferred embodiments and several alternative solutions, the application will not be limited by the specific descriptions in this specification. Other alternative or equivalent components can also be used to practice this application.
Claims
1. A shaped component detection device, characterized in that: Including system control module, drive module, execution module A, execution module B, control input module; The execution module A includes a camera assembly and a supporting member A; the supporting member A is used to support the camera assembly; The execution module B includes a support component B, a horizontal slide assembly, and a chip lighting assembly; the support component B is used to carry the horizontal slide assembly; The external shaped component A detection chip can be detachably placed on the horizontal slide assembly, and the horizontal slide assembly can drive the shaped component A detection chip to move on the horizontal plane; the driving module includes a horizontal slide assembly driving sub-module, and the horizontal slide assembly driving sub-module is used to drive the motor of the horizontal slide assembly to operate; The system control module is in electrical signal communication with the camera assembly, and the camera assembly is used to capture an image of the sample in the formed component A detection chip; The system control module includes an image AI computing module and a test control module; The test control module is in electrical signal communication with the driving module, and the test control module is used to control the working state of the driving module; the image AI computing module includes a computing control chip A, and the test control module includes a computing control chip B.
2. The shaped component detection device according to claim 1, characterized in that: Including any of the following technical features: TA1: The computing control chip A is any one of NPU and GPU; the computing control chip B is a general computing CPU or ARM processor; TA2: The computing control chip A is any one of NPU and GPU; the computing control chip B is a 51 series single-chip microcomputer or a general-purpose MCU single-chip microcomputer; TA3: The computing control chip A is an MCU with an internally integrated graphics processor, and the computing control chip B is an MCU single-chip microcomputer; TA4: The image AI computing module is connected to the test control module via a board-to-board connector.
3. The shaped component detection device according to claim 1, characterized in that: It also includes a separate memory, which is used to store AI feature data for formed component detection.
4. The shaped component detection device according to claim 3, characterized in that: The separate storage device is a USB storage device, a TF storage device, a CF storage device or an optical drive device.
5. The shaped component detection device according to claim 1, characterized in that: It also includes a display module and a shaped component A detection chip insertion port, the display module and the shaped component A detection chip insertion port are located on the same side, and the display module is located above or below the shaped component A detection chip insertion port; The external shaped component A detection chip is placed on the horizontal slide assembly through the shaped component A detection chip insertion port.
6. The shaped component detection device according to claim 5, characterized in that: The control input module includes a touch screen, and the touch screen is integrated with the display module.
7. The shaped component detection device according to claim 1, characterized in that: It also includes a Z-axis slide assembly, and the support member A is used to carry the Z-axis slide assembly; the Z-axis slide assembly is used to carry the camera assembly, and the Z-axis slide assembly can drive the camera assembly to move in the Z-axis direction; The drive module includes a Z-axis motor drive sub-module, and the Z-axis motor drive sub-module is used to drive the motor in the Z-axis slide assembly to operate.
8. The shaped component detection device according to claim 1, characterized in that: The execution module B includes a chip level adjustment module, which is used to adjust the level of the formed component A detection chip; the chip level adjustment module includes at least 3 height adjustment devices, which are used to adjust the height or tilt angle of the formed component A detection chip.
9. The shaped component detection device according to claim 1, characterized in that: The execution module A is located above the execution module B; Or the execution module A is located below the execution module B.
10. A shaped component detection device, characterized in that: It includes a host, a visible component A detection chip insertion port and a separate memory; The tangible component A detection chip insertion port is used for inserting an external tangible component A detection chip; The host is equipped with an image AI computing module, which is used to perform AI recognition on the microscopic magnified image of the sample in the formed component A detection chip; The host is provided with a connection port for connecting the host and the separate storage; The separate memory is used to store AI feature data for tangible component detection, and the AI feature data for tangible component detection is used for AI recognition of the image AI computing module.
11. The shaped component detection device according to claim 10, characterized in that: The host includes a memory A, which is used to store the detection AI feature data corresponding to the formed component A; The separate memory is used to store the detection AI feature data corresponding to the formed component B.