Inductor based on layered via hole type printed circuit board
By setting vias on the connecting layer circuit board and the coil layer circuit board of the inductor, the intermediate tap of the spiral coil is led out to the pad of the connecting layer circuit board, which solves the problem of increasing the number of printed circuit board layers in the prior art, and achieves the effect of simplifying design and reducing costs.
Patent Information
- Application Number
- CN202421603874.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-07-08
AI Technical Summary
In the process of implementing the inductor intermediate tap extraction, the number of layers of the printed circuit board needs to be increased, resulting in increased design complexity and cost.
By providing vias on the connecting layer circuit board and the coil layer circuit board of the inductor, the intermediate tap of the helical coil is led out to the pad of the connecting layer circuit board, thereby reducing the number of layers of the printed circuit board.
The function of keeping the inductor mid-tap leads while reducing the number of printed circuit board layers is realized, simplifying the design and reducing costs.
Smart Images
Figure CN222965896U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic circuits, and particularly to an inductor based on a hierarchical via printed circuit board. Background Art
[0002] In the case of a conventional printed circuit board (PCB) design encountering traces with multiple intermediate taps, it will cause the printed circuit board to add one more layer or set more layers to implement the function of the intermediate taps. For example, in Figure 1 the shown inductor coil, the 7th pin, the 10th pin, and the 13th pin are all intermediate taps, and additional layers need to be added during design to implement them.
[0003] Refer to Figure 2 , Figure 2 which shows a schematic diagram of a multi-layer printed circuit board decomposed into different layer circuit boards in an inductor implemented based on a multi-layer printed circuit board, including a first coil layer circuit board 11, a second coil layer circuit board 12, a third coil layer circuit board 13, a fourth coil layer circuit board 14, a fifth coil layer circuit board 15, a sixth coil layer circuit board 16, a seventh coil layer circuit board 17, an eighth coil layer circuit board 18, a ninth coil layer circuit board 19, and a connection layer circuit board 20 arranged in sequence from bottom to top. A spiral coil is arranged on each coil layer circuit board, and pads are arranged on the connection layer circuit board 20 for connection to different spiral coils. A total of 10 layer circuit boards are required to implement this inductor design.
[0004] Further refer to Figure 3 , Figure 4 and Figure 5, on the second coil layer circuit board 12, there are a first through hole 121, a second through hole 122, a third through hole 123, and a fourth through hole 124. On the third coil layer circuit board 13, there are a fifth through hole 131, a sixth through hole 132, a seventh through hole 133, and an eighth through hole 134. On the connection layer circuit board 20, there are a first pad 201, a second pad 202, a third pad 203, a ninth through hole 204, and a metal wire 205. Among them, the first through hole 121, the fifth through hole 131, and the first pad 201 are connected to each other. The third through hole 123, the seventh through hole 133, and the third pad 203 are connected to each other. The fourth through hole 123, the eighth through hole 134, and the ninth through hole 204 are connected to each other. The ninth through hole 2054 is connected to the second pad 202 through the metal wire 205. The starting end of the spiral coil 101 is connected to the first through hole 121, the ending end of the spiral coil 101 is connected to the third through hole 123, and the center tap of the spiral coil 101, that is, one of the preset turns of the coil, is connected to the fourth through hole 124 and the eighth through hole 134, and then is connected to the second pad 202 through the metal wire 205, realizing the extraction of the center tap. How to achieve the same center tap extraction function while reducing the number of printed circuit board layers used is the problem to be solved currently. Summary of the Invention
[0005] The purpose of the present invention is to provide an inductor based on a hierarchical via printed circuit board that can save the number of PCB layers.
[0006] To achieve the above purpose, the present invention provides an inductor based on a hierarchical via printed circuit board, which includes: a connection layer circuit board and a first coil layer circuit board. The connection layer circuit board includes a first pad, a second pad, and a third pad. On the first coil layer circuit board, there are a first spiral coil, a first via, a second via, and a third via; the first via is arranged at the starting end of the first spiral coil, the second via is arranged at the ending end of the first spiral coil, the third via is arranged at the first preset turn of the coil between the starting end and the ending end of the first spiral coil. The starting end of the first spiral coil is connected to the first via, the ending end of the first spiral coil is connected to the second via, the first preset turn of the first spiral coil is connected to the third via, the first via is connected to the first pad, the second via is connected to the second pad, and the third via is connected to the third pad.
[0007] As can be seen from the above solution, the present invention leads out the center tap of the spiral coil on the coil layer circuit board to the connection layer circuit board by setting different vias, which can reduce the number of printed circuit board layers used.
[0008] A further solution is that the connection layer circuit board further includes a fourth via and a fifth via. The fourth via is respectively connected to the first via and the first pad, and the fifth via is respectively connected to the third via and the third pad.
[0009] It can be seen that by providing vias on the connection layer circuit board that are connected to the coil layer circuit board and then connecting to the corresponding pads through the connection layer circuit board, the vias on the connection layer circuit board can be on the same vertical line as the vias on the coil layer circuit board, facilitating the routing of the printed circuit board.
[0010] A further solution is that there is a second coil layer circuit board, on which a second spiral coil, a sixth via, a seventh via, and an eighth via are provided; the connection layer circuit board further includes a fourth pad, a fifth pad, and a sixth pad; the sixth via is provided at the start end of the second spiral coil, the seventh via is provided at the end of the second spiral coil, the eighth via is provided at the second preset turn coil between the start end and the end of the second spiral coil, the start end of the second spiral coil is connected to the sixth via, the end of the second spiral coil is connected to the seventh via, the second preset turn coil of the second spiral coil is connected to the eighth via, the sixth via is connected to the fourth pad, the seventh via is connected to the fifth pad, the eighth via is connected to the sixth pad; the first spiral coil is not connected to the eighth via, and the second spiral coil is not connected to the third via.
[0011] It can be seen that multiple coil layer circuit boards can be provided, and the center taps of the spiral coils on each coil layer circuit board can be led out to the pads on the connection layer circuit board.
[0012] A further solution is that the first via is provided within the winding range of the first spiral coil, and the sixth via is provided within the winding range of the second spiral coil.
[0013] It can be seen that it is convenient for the vias to connect to the spiral coils.
[0014] A further solution is that the first coil layer circuit board and the second coil layer circuit board are respectively arranged parallel to each other on the upper and lower sides of the connection layer circuit board.
[0015] A further solution is that the first coil layer circuit board and the second coil layer circuit board are arranged parallel to each other on the same side of the connection layer circuit board, and the second coil layer circuit board is arranged between the first coil layer circuit board and the connection layer circuit board; the second coil layer circuit board is further provided with a ninth via, a tenth via, and an eleventh via, the position of the ninth via corresponds to the position of the first via, the position of the tenth via corresponds to the position of the second via, and the position of the eleventh via corresponds to the position of the third via.
[0016] It can be seen that vias can be provided on the coil layer circuit board to facilitate the center taps of the spiral coils on other coil layer circuit boards to be led out to the connection layer circuit board.
[0017] A further solution is that the connection layer circuit board further includes a twelfth via and a thirteenth via, the twelfth via is respectively connected to the sixth via and the fourth pad, and the thirteenth via is respectively connected to the eighth via and the sixth pad. Description of the Drawings
[0018] Figure 1 is a schematic diagram of an inductor coil with a center tap in the prior art.
[0019] Figure 2 is an exploded view of each layer of the circuit board in an inductor implemented by a multi-layer printed circuit board in the prior art.
[0020] Figure 3 is Figure 2 the structural diagram of the second coil layer circuit board in
[0021] Figure 4 is Figure 2 the structural diagram of the third coil layer circuit board in
[0022] Figure 5 is Figure 2 the structural diagram of the connection layer circuit board in
[0023] Figure 6 is an exploded view of each layer of the circuit board in the inductor based on a hierarchical via printed circuit board in the embodiment of the present invention.
[0024] Figure 7 is Figure 6 the structural diagram of the first coil layer circuit board in
[0025] Figure 8 is Figure 6 the structural diagram of the connection layer circuit board in
[0026] Figure 9 is Figure 6 the structural diagram of the second coil layer circuit board in
[0027] The present invention will be further described below in conjunction with the drawings and embodiments. Detailed Embodiments
[0028] In the inductor based on a hierarchical via printed circuit board of the present invention, vias are provided on circuit boards of different layers, and spiral coils are connected through the vias, so as to realize the extraction of the center tap while reducing the number of layers of the printed circuit board used.
[0029] Referring to Figure 6 , the inductor based on a hierarchical via printed circuit board of this embodiment includes a zero coil layer circuit board 30, a first coil layer circuit board 31, a second coil layer circuit board 32, a third coil layer circuit board 33, a fourth coil layer circuit board 34, a fifth coil layer circuit board 35, and a connection layer circuit board 40. Among them, the first coil layer circuit board 31, the second coil layer circuit board 32, and the third coil layer circuit board 33 are all coil layer circuit boards that need to lead out the center tap to the connection layer circuit board 40.
[0030] Participate Figure 7 , on the first coil layer circuit board 31, a first spiral coil 801, a first via 311, a second via 312, and a third via 313 are provided.
[0031] Refer to Figure 8 , the connection layer circuit board 40 includes a first pad 401, a second pad 402, a third pad 403, a fourth pad 404, a fifth pad 405, a sixth pad 406, a fourth via 407, a fifth via 408, a twelfth via 409, and a thirteenth via 410.
[0032] Refer to Figure 9 , on the second coil layer circuit board 32, a second spiral coil 901, a sixth via 326, a seventh via 327, an eighth via 328, a ninth via 329, a tenth via 320, and an eleventh via 321 are provided.
[0033] In the inductor based on the hierarchical via-type printed circuit board of this embodiment, the zero-th coil layer circuit board 30, the first coil layer circuit board 31, the second coil layer circuit board 32, the third coil layer circuit board 33, the fourth coil layer circuit board 34, the fifth coil layer circuit board 35, and the connection layer circuit board 40 are sequentially fixed from bottom to top by existing PCB processes such as lamination to form a multi-layer circuit board. The coils on the zero-th coil layer circuit board 30, the first coil layer circuit board 31, the second coil layer circuit board 32, the third coil layer circuit board 33, the fourth coil layer circuit board 34, and the fifth coil layer circuit board 35 are insulated from each other. Specifically, each layer of spiral coil is printed on the corresponding circuit board, and each layer of circuit board is made of an electrically insulating material, so that the spiral coils of each layer are insulated from each other.
[0034] The first via 311 is provided at the starting end of the first spiral coil 801, the second via 312 is provided at the ending end of the first spiral coil 801, the third via 313 is provided at the first preset turn coil between the starting end and the ending end of the first spiral coil 801. The starting end of the first spiral coil 801 is connected to the first via 311, the ending end of the first spiral coil 801 is connected to the second via 312, the first preset turn coil of the first spiral coil 801 is connected to the third via 313. The first via 311 is connected to the fourth via 407, the fourth via 407 is connected to the first pad 401 through the first metal wire 408, the second via 312 is connected to the second pad 402 through the second metal wire 411, the third via 313 is connected to the fifth via 408, and the fifth via 408 is connected to the third pad 403.
[0035] The first via 311 is disposed within the winding range of the first spiral coil 801. The first spiral coil 801 starts winding clockwise from the first via 311 for multiple turns to the second via 312. The sixth via 326 is disposed within the winding range of the second spiral coil 901. The second spiral coil 901 starts winding clockwise from the sixth via 326 for multiple turns to the seventh via 317. The projection of the first via 311 on the second coil layer circuit board 32 is also within the winding range of the second spiral coil 901. The projection of the sixth via 326 on the second coil layer circuit board 32 is also within the winding range of the first spiral coil 801. The first coil layer circuit board 31 and the second coil layer circuit board 32 are disposed in parallel on the same side of the connection layer circuit board 40, wherein the second coil layer circuit board 32 is disposed between the first coil layer circuit board 31 and the connection layer circuit board 40. The position of the ninth via 329 corresponds to the position of the first via 311, the position of the tenth via 320 corresponds to the position of the second via 312, and the position of the eleventh via 321 corresponds to the position of the third via 313.
[0036] The sixth via 326 is disposed at the start end of the second spiral coil 901, the seventh via 327 is disposed at the end end of the second spiral coil 901, and the eighth via 328 is disposed at a second preset turn coil between the start end and the end end of the second spiral coil 901. The start end of the second spiral coil 901 is connected to the sixth via 326, the end end of the second spiral coil 901 is connected to the seventh via 327, and the second preset turn coil of the second spiral coil 901 is connected to the eighth via 328. The sixth via 326 is connected to the twelfth via 409. The twelfth via 409 is connected to the fourth pad 404 through the third metal wire 414. The seventh via 327 is connected to the fifth pad 405. The eighth via 328 is connected to the thirteenth via 410. The thirteenth via 410 is connected to the sixth pad 406 through the fifth metal wire 413.
[0037] The start end of the first spiral coil 801 refers to the end where the first spiral coil 801 starts winding on the first coil layer circuit board 31, and the end end of the first spiral coil 801 refers to the end where the first spiral coil 801 ends winding on the first coil layer circuit board 31. The start end of the second spiral coil 901 refers to the end where the second spiral coil 901 starts winding on the second coil layer circuit board 32, and the end end of the second spiral coil 901 refers to the end where the second spiral coil 901 ends winding on the second coil layer circuit board 32. Both the first spiral coil 801 and the second spiral coil 901 can be disposed on the first coil layer circuit board 31 by existing methods such as copper plating.
[0038] Thus, the starting end of the first spiral coil 801 is led out through the first pad 401, the ending end of the first spiral coil 801 is led out through the second pad 402, and the center tap of the first spiral coil 801 is led out through the third pad 403. The starting end of the second spiral coil 901 is led out through the fourth pad 404, the ending end of the second spiral coil 901 is led out through the fifth pad 405, and the center tap of the second spiral coil 901 is led out through the sixth pad 406.
[0039] Similarly, the center tap of the third spiral coil of the third coil layer circuit board can also be led out to an independent pad of the connection layer circuit board 40, so that the center taps of the first spiral coil 801, the second spiral coil 901, and the third spiral coil in this embodiment can all be led out to the connection layer circuit board 40.
[0040] Through the above design, the structure of this embodiment that can lead out the center tap of the first spiral coil 801 to the connection layer circuit board 40 only requires two-layer circuit boards. Compared with the prior art Figure 3 、 Figure 4 and Figure 5 the structure implemented by three-layer circuit boards is reduced by one layer of circuit board. Generally speaking, for the design where the center tap of the spiral coil needs to be led out to the connection layer circuit board 40, it can be achieved by setting corresponding vias. Thus, this embodiment of Figure 5 compared with Figure 2 of the prior art, the use of three-layer circuit boards can be reduced. The utility model can reduce the use of the number of printed circuit board layers while realizing the leading out of the center tap of the coil.
[0041] Finally, it should be emphasized that the above are only the preferred embodiments of the utility model and are not used to limit the utility model. For those skilled in the art, the utility model can have various changes and modifications. For example, in other embodiments, the first coil layer circuit board and the second coil layer circuit board are respectively arranged parallel to the upper and lower sides of the connection layer circuit board. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included within the protection scope of the utility model.
Claims
1. An inductor based on a layered through-hole printed circuit board, characterized in that: include: A connecting layer circuit board and a first coil layer circuit board, wherein the connecting layer circuit board comprises a first solder pad, a second solder pad and a third solder pad, and the first coil layer circuit board is provided with a first spiral coil, a first via hole, a second via hole and a third via hole; The first via is arranged at the starting end of the first spiral coil, the second via is arranged at the end of the first spiral coil, and the third via is arranged at the first preset turn coil between the starting end and the end of the first spiral coil, the starting end of the first spiral coil is connected to the first via, the end of the first spiral coil is connected to the second via, the first preset turn coil of the first spiral coil is connected to the third via, the first via is connected to the first pad, the second via is connected to the second pad, and the third via is connected to the third pad.
2. The inductor based on a layered through-hole printed circuit board as claimed in claim 1, characterized in that: The connection layer circuit board further includes a fourth via hole and a fifth via hole, wherein the fourth via hole is respectively connected to the first via hole and the first pad, and the fifth via hole is respectively connected to the third via hole and the third pad.
3. The inductor based on a layered through-hole printed circuit board according to claim 1 or 2, characterized in that: Also includes: a second coil layer circuit board, on which a second spiral coil, a sixth via hole, a seventh via hole and an eighth via hole are disposed; The connection layer circuit board also includes a fourth pad, a fifth pad and a sixth pad; The sixth via hole is arranged at the starting end of the second spiral coil, the seventh via hole is arranged at the end of the second spiral coil, the eighth via hole is arranged at the second preset turn coil between the starting end and the end of the second spiral coil, the starting end of the second spiral coil is connected to the sixth via hole, the end of the second spiral coil is connected to the seventh via hole, the second preset turn coil of the second spiral coil is connected to the eighth via hole, the sixth via hole is connected to the fourth pad, the seventh via hole is connected to the fifth pad, and the eighth via hole is connected to the sixth pad; The first spiral coil is not connected to the eighth via hole, and the second spiral coil is not connected to the third via hole.
4. The inductor based on a layered through-hole printed circuit board according to claim 3, characterized in that: include: The first via hole is disposed within a winding range of the first spiral coil, and the sixth via hole is disposed within a winding range of the second spiral coil.
5. The inductor based on a layered through-hole printed circuit board as claimed in claim 3, characterized in that: The first coil layer circuit board and the second coil layer circuit board are respectively arranged in parallel on the upper and lower sides of the connection layer circuit board.
6. The inductor based on a layered through-hole printed circuit board as claimed in claim 3, characterized in that: The first coil layer circuit board and the second coil layer circuit board are arranged in parallel on the same side of the connection layer circuit board, and the second coil layer circuit board is arranged between the first coil layer circuit board and the connection layer circuit board; The second coil layer circuit board is also provided with a ninth via, a tenth via and an eleventh via, the position of the ninth via corresponds to the position of the first via, the position of the tenth via corresponds to the position of the second via, and the position of the eleventh via corresponds to the position of the third via.
7. The inductor based on a layered through-hole printed circuit board as claimed in claim 3, characterized in that: The connection layer circuit board further includes a twelfth via hole and a thirteenth via hole, the twelfth via hole is respectively connected to the sixth via hole and the fourth pad, and the thirteenth via hole is respectively connected to the eighth via hole and the sixth pad.