Membrane light source for LED plant illumination

Abstract

The utility model discloses a diaphragm light source for LED plant illumination. The diaphragm light source sequentially comprises an upper transparent diaphragm, a lower transparent diaphragm, an LED luminescent device and a metal electrode substrate, the LED light-emitting device comprises CSP LED chips or Micro LED lamp beads of pure white light, warm white light, blue light, red light and near-infrared light, wherein the CSP LED chips or the Micro LED lamp beads are arranged in an array mode. According to the utility model, a transparent diaphragm packaging technology is adopted, CSP chips or Micro LED lamp beads are subjected to optimized array arrangement and packaging to manufacture an LED diaphragm light source, and the diaphragm LED light source is arbitrarily cut to manufacture a plant growth light supplement cultivation light source module, so that the light quality, the light period, the light intensity and the photosynthetic photon flux density of LED elementary substance light are intelligently controlled, and the plant growth light supplement cultivation light source module is formed. And cultivation and growth of plants are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of LED plant lighting, in particular to a diaphragm light source for LED plant lighting. Background Art

[0002] The light environment is one of the essential important environmental factors in plant growth and development. It regulates growth and development by affecting the light quality composition, light intensity, photon flux density, and photoperiod of plant growth photosynthesis. Therefore, in different light sources, different planting devices, and different planting environments, the growth conditions of plants will vary greatly. The spectral characteristics of LED plant cultivation lights can be precisely adjusted according to the needs of different plant species and different growth stages, providing a light source and lighting fixture suitable for plant growth. The controllability of its wavelength range can precisely match the needs of different plant growth stages, thereby increasing the growth rate of plants, increasing yields, and improving quality.

[0003] Currently, in the fields of indoor soilless cultivation, vertical farming, etc., LED lighting planting technology has been widely used. However, in plant cultivation, there are still some technical status quo and deficiencies in the application of this technology: (1) The photosynthesis efficiency needs to be improved. Although the LED light source can provide the light quality and light quantity required by plants, how to improve the photosynthesis efficiency and further increase the plant yield and quality still needs further research. (2) The control of the light cycle is not precise enough. Plant growth and development require strict control of the light cycle. Currently, there are still certain deficiencies in the LED lighting technology in terms of light cycle control. (3) The cost is relatively high. The cost of the LED light source is relatively higher than that of traditional light sources, resulting in a relatively high investment cost for planting plants with LED lighting.

[0004] Traditional plant supplementary lighting devices in the prior art often use supplementary lighting sources such as LED lights arranged above plants for direct downward supplementary lighting, that is, the light shines directly downward from above the plants towards the plants located below the light source. Since the numerous leaves of the plants will intersect and overlap with each other in this direction, especially the leaves and branches in the canopy part of the plants will be blocked. That is to say, the photosynthetic capacity of the canopy is affected not only by the photosynthetic capacity of individual leaves but also by factors such as the light interception capacity and light distribution of the canopy. Under the top-down light-emitting supplementary lighting mode of the above traditional plant supplementary lighting device, the uniformity of plant supplementary lighting, the field of view angle, and the photosynthesis supplementary lighting effect are not good, and the leaf surface of the plant canopy cannot fully receive the supplementary lighting radiation energy. Summary of the Utility Model

[0005] Based on this, the purpose of the present utility model is to provide a film light source for LED plant lighting. By adopting a transparent film encapsulation technology, the CSP chips or Micro LED lamp beads are optimized and arranged in an array for encapsulation to produce an LED film light source. The film LED light source can be arbitrarily cut into a plant growth supplementary light cultivation light source module, so as to intelligently control the light quality, light cycle, light intensity, and photosynthetic photon flux density of the LED single light, which is beneficial to the cultivation and growth of plants.

[0006] The purpose of the present utility model is achieved through the following technical solutions:

[0007] First, the present utility model provides a film light source for LED plant lighting, which sequentially includes an upper transparent film, a lower transparent film, an LED light-emitting device, and a metal electrode substrate.

[0008] Further, the LED light-emitting device includes CSP LED chips or Micro LED lamp beads arranged in an array of positive white light, warm white light, blue light, red light, and near-infrared light.

[0009] Further, the color temperature range of the positive white light is 5000 - 6500K, the color temperature range of the warm white light is 2700 - 3500K, the wavelength range of the blue light is 420 - 480nm, the wavelength range of the red light is 630 - 680nm, and the wavelength range of the near-infrared light is 720 - 980nm.

[0010] Further, the CSP LED chips or Micro LED lamp beads of red light and near-infrared light in the LED light-emitting device form a red light LED; the CSP LED chips or Micro LED lamp beads of positive white light, warm white light, and blue light in the LED light-emitting device form a blue light LED.

[0011] Further, the quantity ratio of the red light LED to the blue light LED in the LED light-emitting device is 4:1, 7:2, or 8:3.

[0012] Further, the quantity ratio of the CSP LED chips or Micro LED lamp beads of red light and near-infrared light in the red light LED is 1:1, and the quantity ratio of the CSP LED chips or Micro LED lamp beads of positive white light, warm white light, and blue light in the blue light LED is 1:1:1.

[0013] Further, both the upper transparent film and the lower transparent film are selected from one of cyclic olefin polymer films, polyimide films, polypropylene films, polyethylene terephthalate films, and polyethylene naphthalate films, and the thickness of both the upper transparent film and the lower transparent film is 2 - 5mm.

[0014] Further, the metal electrode substrate includes a transparent substrate and metal electrode lines disposed on the transparent diaphragm, and the thickness of the transparent substrate is 2-5 mm.

[0015] Further, the transparent diaphragm is selected from one of cyclic olefin polymer films, polyimide films, polypropylene films, polyethylene terephthalate films, and polyethylene naphthalate films.

[0016] Further, the transparent substrate is also coated with an indium tin oxide thin film layer, and the thickness of the indium tin oxide thin film layer is 10-100 μm.

[0017] The beneficial effects of the present utility model are as follows:

[0018] The present utility model utilizes a transparent diaphragm encapsulation technology, and uses CSP chips or MicroLED lamp beads of five colors, namely positive white light, warm white light, blue light, red light, and near infrared, to optimize the array arrangement for encapsulation to make an LED diaphragm light source. It can not only adjust the LED irradiation intensity and light quality ratio, but also arbitrarily cut the large-area LED diaphragm light source for plant illumination into a plant growth supplementary light cultivation light source module, so as to be installed on LED plant illumination cultivation devices or LED plant lighting fixtures of different sizes and shapes, thereby enabling intelligent control of light quality, light cycle, light intensity, and photosynthetic photon flux density of LED single light for the cultivation and growth of plants. Description of the Drawings

[0019] Figure 1 Overall structural schematic diagram of the diaphragm light source of the present utility model;

[0020] Figure 2 Exploded structural schematic diagram of the diaphragm light source of the present utility model;

[0021] Figure 3 Wiring schematic diagram of the diaphragm light source of the present utility model;

[0022] Figure 4 For Figure 3 Partial enlarged schematic diagram of the LED light source arrangement of the diaphragm light source in

[0023] Reference Signs:

[0024] 10 - upper transparent diaphragm; 20 - lower transparent diaphragm; 30 - LED light-emitting device; 40 - metal electrode substrate; 31 - positive white light lamp bead (or chip); 32 - warm white light lamp bead (or chip); 33 - blue light lamp bead (or chip); 34 - red light lamp bead (or chip); 35 - near infrared light lamp bead (or chip). Detailed Embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0026] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "vertical direction", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, "first", "second", "third", "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be a direct connection or a connection through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0028] The present utility model provides a film light source for LED plant lighting, which sequentially includes an upper transparent film 10, an LED light-emitting device 30, a metal electrode circuit board 40, and a lower transparent film 20.

[0029] In the present utility model, the LED light-emitting device 30 includes CSP LED chips or Micro LED lamp beads of positive white light, warm white light, blue light, red light, and near-infrared light arranged in an array.

[0030] In the present utility model, the color temperature range of the positive white light is 5000 - 6500K, the color temperature range of the warm white light is 2700 - 3500K, the wavelength range of the blue light is 420 - 480nm, the wavelength range of the red light is 630 - 680nm, and the wavelength range of the near-infrared light is 720 - 980nm.

[0031] In the present utility model, the red light and near-infrared light CSP LED chips or MicroLED beads in the LED light-emitting device 30 form a red light LED; the CSP LED chips or Micro LED beads of positive white light, warm white light and blue light in the LED light-emitting device 30 form a blue light LED.

[0032] In the present utility model, the quantity ratio of the red light LED to the blue light LED in the LED light-emitting device 30 is 4:1, 7:2 or 8:3.

[0033] In the present utility model, the quantity ratio of the red light and near-infrared light CSP LED chips or Micro LED beads in the red light LED is 1:1, and the quantity ratio of the CSP LED chips or Micro LED beads of positive white light, warm white light and blue light in the blue light LED is 1:1:1.

[0034] In the present utility model, both the upper transparent film 10 and the lower transparent film 20 are selected from one of cyclic olefin polymer films, polyimide films, polypropylene films, polyethylene terephthalate films and polyethylene naphthalate films, and the thickness of the upper transparent film 10 and the lower transparent film 20 is 2 - 5 mm.

[0035] In the present utility model, the metal electrode substrate 40 includes a transparent substrate and metal electrode lines disposed on the transparent film, and the thickness of the transparent substrate is 2 - 5 mm.

[0036] In the present utility model, the transparent film is selected from one of cyclic olefin polymer films, polyimide films, polypropylene films, polyethylene terephthalate films and polyethylene naphthalate films.

[0037] In the present utility model, the transparent substrate is further plated with an indium tin oxide thin film layer, and the thickness of the indium tin oxide thin film layer is 10 - 100 μm

[0038] Specifically, the embodiment of the present utility model provides a packaging method for a film light source for LED plant lighting, including the following steps:

[0039] The first step, array arrangement design of the LED light-emitting device 30:

[0040] The distribution of the LED light source can be designed according to the Lambert-Beer law distribution. By deriving the superposition formula of the irradiance of the array and optimizing the array according to the superposition formula, the uniformity of the photosynthetic photon flux density on the irradiation plane is analyzed by the optical simulation software TracePro. A lighting model is established according to the actual plant lighting application situation. Multiple white LED beads (or chips) 31, warm white LED beads (or chips) 32, blue LED beads (or chips) 33, red LED beads (or chips) 34, and near-infrared LED beads (or chips) 35 are combined into an array layout to meet the light quality and spectral requirements of greenhouse plants. Through reasonable array layout design, the R / B ratio is made uniform on the irradiation area, and an LED electronic layout wiring diagram and a design position diagram are made. Generally, the number ratio of red LED and blue LED in the array is arranged in three ways: 4:1, 7:2, or 8:3. Among them, the number ratio of the red light of 630-680nm and the near-infrared light of 720-980nm in the red LED is 1:1, and the number ratio of the white light of 5000-6500K, the warm white light of 2700-3500K, and the blue light of 420-480nm in the blue LED is 1:1:1.

[0041] Specifically, in this embodiment, the number ratio of red LED and blue LED in the array is 4:1. In other embodiments, the number ratio of red LED and blue LED in the array can also be 7:2 or 8:3.

[0042] The second step, substrate selection and cleaning:

[0043] Cut the cyclic olefin polymer film, polyimide film, polypropylene film, polyethylene terephthalate film, or polyethylene naphthalate film into the required size and shape, clean the dust and water vapor on the film surface, and passivate the film surface using a nanoscale molecular passivation technology to form a transparent film with a thickness of 2-5 mm.

[0044] Specifically, in this embodiment, the transparent film material is selected from polyimide films, and the thickness of the polyimide film is 3 mm. In other embodiments, the transparent film material can also be selected from cyclic olefin polymer films, polypropylene films, polyethylene terephthalate films, or polyethylene naphthalate films.

[0045] The third step, preparation of the metal electrode circuit board 40. In the present invention, the preparation of the metal electrode circuit board 40 can use the following two methods:

[0046] For the first method, select a polyimide transparent film with a thickness of 3 mm, deposit indium tin oxide thin film material on the polyimide film, and the thickness of the indium tin oxide thin film is 20 μm. According to the wiring pattern of the LED electronic arrangement, use the laser etching method to perform the laser etching process on the coated transparent film, and expose the required connections between the LED chip pins to form the metal electrode circuit board 40.

[0047] For the second method, select a polyimide transparent film with a thickness of 3 mm, print the LED electronic arrangement wiring pattern on the polyimide transparent film, paste nano Ag wires on its surface, perform photolithography treatment using a photolithography machine, and perform ultraviolet curing to form the metal electrode circuit board 40.

[0048] In this embodiment, the first method is used to prepare the metal electrode circuit board 40. In other embodiments, the second method can also be used to prepare the metal electrode circuit board 40.

[0049] The fourth step is to mount the LED light-emitting device 30 on the metal electrode circuit board 40 to form a plant lighting source light-emitting module, which can be achieved by the following two methods:

[0050] For the first method, select CSP flip-chip LED chips. According to the array arrangement design of the LED light-emitting device 30, the electrodes of the CSP flip-chip chips of positive white light, warm white light, blue light, red light, and near-infrared light are mounted on the metal electrode circuit board 40 through an LED precision bonding machine.

[0051] For the second method, select Micro LED lamp beads. According to the array arrangement design of the LED light-emitting device 30, the Micro LED lamp beads of positive white light, warm white light, blue light, red light, and near-infrared light are mounted on the metal electrode circuit board 40 through a precision mounter.

[0052] In this embodiment, the first method is used to mount the LED light-emitting device 30 on the metal electrode circuit board 40. In other embodiments, the second method can also be used to mount the LED light-emitting device 30 on the metal electrode circuit board 40.

[0053] The fifth step is the heat dissipation treatment of the LED light-emitting device 30:

[0054] The heat dissipation treatment is a key step in preparing the LED plant lighting source. Fill the nano-zinc oxide composite silica gel filler in the gaps of the metal electrodes of the CSP chip to ensure that the temperature of the LED chip will not be too high.

[0055] The sixth step is gluing and laminating:

[0056] Select a polyimide film with a thickness of 3 mm as the lower transparent film 20. According to the arrangement design of the CSP flip-chip array, glue the LED light-emitting device 30 processed in step (5) on the surface of the lower transparent film 20, ensure the position and angle of each LED chip, and use the film covering technology to transparently protect the LED light-emitting device 30.

[0057] Step 7, connection and wiring:

[0058] Connect the CSP flip-chip array in series or parallel according to the required electrical configuration to form the secondary circuit connection of the LED plant lighting module.

[0059] In this embodiment, conductive glue and welding are used for wiring. It is necessary to connect and wire the CSP flip-chip array to form a functional LED plant lighting module.

[0060] Step 8, encapsulation of the upper transparent film 10:

[0061] Select a polyimide film with a thickness of 3 mm as the upper transparent film 10. Glue the upper transparent film 10 to the opposite side of the lower transparent film 20 of the LED light-emitting device 30 processed in step (7), and perform thermal compression encapsulation to obtain the film light source for LED plant lighting.

[0062] It should be noted that the materials and material thicknesses of the upper transparent film 10 and the lower transparent film 20 can be the same or different.

[0063] Step 9, film covering, testing and inspection:

[0064] Coat a transparent protective resin layer on the surface of the film light source for LED plant lighting, and perform tests on the electrical performance and optical performance of the film light source for LED plant lighting, including the brightness, color, light quality, circuit connection, uniformity performance, etc. of the LED, to ensure that its quality meets the requirements and complies with the standards of LED flexible thin-film plant lighting. Coat a transparent protective resin layer on the surface of the film light source for LED plant lighting to protect the light-emitting layer and the circuit from environmental influence or scratching damage.

[0065] Step 10, cutting and processing:

[0066] According to the application requirements, cut the large-area film light source for LED plant lighting into the required size and shape for installation on LED plant lighting cultivation devices or LED plant lighting fixtures with different sizes and shapes.

[0067] The diaphragm light source for LED plant lighting provided by the present utility model uses a transparent diaphragm encapsulation technology to optimize the array arrangement of CSP LED chips or Micro LED lamp beads of LEDs. CSP LED chips or Micro LED lamp beads of five colors, namely positive white light, warm white light, blue light, red light, and near-infrared light, are used for optimized array arrangement and encapsulation to produce an LED diaphragm light source, thereby adjusting the LED irradiation intensity and light quality ratio to provide an intelligent control light source for plant growth.

[0068] The above only expresses the preferred technical solution of the present utility model, and its description is relatively specific and detailed, but it should not be understood as a limitation to the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and the present utility model also intends to include these changes and modifications.

Claims

1. A diaphragm light source for LED plant lighting, characterized in that: It includes an upper transparent film, a lower transparent film, an LED light-emitting device and a metal electrode substrate in sequence; the LED light-emitting device includes CSP LED chips or Micro LED lamp beads arranged in an array to emit pure white light, warm white light, blue light, red light, and near-infrared light.

2. The membrane light source for LED plant lighting according to claim 1, characterized in that: The color temperature range of the true white light is 5000-6500K, the color temperature range of the warm white light is 2700-3500K, the wavelength range of the blue light is 420-480nm, the wavelength range of the red light is 630-680nm, and the wavelength range of the near infrared light is 720-980nm.

3. The membrane light source for LED plant lighting according to claim 1, characterized in that: The CSP LED chips or Micro LED lamp beads of red light and near-infrared light in the LED light-emitting device constitute red light LEDs; the CSP LED chips or Micro LED lamp beads of pure white light, warm white light and blue light in the LED light-emitting device constitute blue light LEDs.

4. The membrane light source for LED plant lighting according to claim 3, characterized in that: The ratio of the number of red LEDs to the number of blue LEDs in the LED light emitting device is 4:1, 7:2 or 8:

3.

5. The membrane light source for LED plant lighting according to claim 3, characterized in that: The ratio of the number of CSP LED chips or Micro LED lamp beads for red light and near-infrared light in the red light LED is 1:1, and the ratio of the number of CSP LED chips or Micro LED lamp beads for pure white light, warm white light and blue light in the blue light LED is 1:1:

1.

6. The membrane light source for LED plant lighting according to claim 1, characterized in that: The upper transparent film and the lower transparent film are both selected from one of cyclic olefin polymer film, polyimide film, polypropylene film, polyethylene terephthalate film and polyethylene naphthalate film, and the thickness of the upper transparent film and the lower transparent film is 2-5mm.

7. The membrane light source for LED plant lighting according to claim 1, characterized in that: The metal electrode substrate comprises a transparent substrate and a metal electrode circuit arranged on the transparent film. The thickness of the transparent substrate is 2-5 mm.

8. The membrane light source for LED plant lighting according to claim 7, characterized in that: The transparent film is selected from one of cyclic olefin polymer film, polyimide film, polypropylene film, polyethylene terephthalate film and polyethylene naphthalate film.

9. The membrane light source for LED plant lighting according to claim 7, characterized in that: The transparent substrate is also plated with an indium tin oxide thin film layer, and the thickness of the indium tin oxide thin film layer is 10-100 μm.

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