Multi-audio input processing circuit and system thereof

Abstract

The utility model belongs to the technical field of audio signal processing, and relates to a multi-audio input processing circuit which comprises a power management module, a plurality of audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module and an audio signal power amplifier. Audio input of multiple input modes is received through the multiple audio interface modules, multiple audio signals can be transmitted at the same time, and the multiple audio signals are sequentially subjected to corresponding audio processing through the audio processor module, the audio sound effect processing module, the audio signal digital-to-analog conversion module and the audio signal power amplifier. The utility model also relates to a multi-audio input processing system. According to the technical scheme provided by the invention, the audio quality and the hearing effect can be improved, the use requirements of various different user scenes can be met, the product performance is improved, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the technical field of audio signal processing, and more specifically, to a multi-audio input processing circuit and its system. Background Art

[0002] Existing earphones are all stereo, and the audio input methods of earphones are relatively single: only Bluetooth or methods such as Bluetooth and 3.5mm JACK, that is, there are fewer audio input interfaces and it is impossible to directly transmit audio signals of 3 or more channels. Secondly, the single audio input method will also make the audio adjustment method of the earphone relatively single, resulting in limited usage scenarios and poor user experience. In addition, to achieve 2 or more channels of 3D audio effects, they are all realized by virtualizing multi-channels through audio algorithms. However, the audio quality after being processed by the audio algorithm is average, the multi-channel audio effect is average, and the stability is not good, making it difficult to meet the needs of users. Summary of the Utility Model

[0003] The technical problem to be solved by this application is the limited usage scenarios caused by the single existing audio input method, and the poor virtual multi-channel audio effect of the existing audio algorithm, which is difficult to meet the needs of users.

[0004] To solve the above technical problems, the embodiments of this application provide a multi-audio input processing circuit, and adopt the following technical solutions:

[0005] It includes a power management module, a variety of audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module, and an audio signal power amplifier;

[0006] The power management module is connected to the variety of audio interface modules and the audio processor module, and is used to provide working power for the variety of audio interface modules, the audio processor module, the display module, the audio sound effect processing module, the audio signal digital-to-analog conversion module, and the audio signal power amplifier;

[0007] The variety of audio interface modules are connected to the audio processor module, and are used to receive audio signals of multiple input modes, and preprocess the audio signals of different input modes and then transmit them to the audio processor module;

[0008] The audio processor module is connected to the audio sound effect processing module, and is used to perform decoding and encoding processing on the preprocessed audio signals to obtain digital audio signals of multiple channels, and respectively transmit them to the audio sound effect processing module;

[0009] The audio sound effect processing module is connected to the audio signal digital-to-analog conversion module, and is used to perform sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit them to the audio signal digital-to-analog conversion module;

[0010] The audio signal digital-to-analog conversion module is connected to the audio signal power amplifier, and is used to convert the enhanced digital audio signals into analog audio signals, and transmit them to the audio signal power amplifier;

[0011] The audio signal power amplifier is connected to the earphone, and is used to perform audio signal amplification processing on the analog audio signals, and output them to the earphone to drive the earphone to emit sound.

[0012] To solve the above technical problems, an embodiment of the present application further provides a multi-audio input processing system, which adopts the following technical solutions:

[0013] It includes an earphone and the multi-audio input processing circuit as described above, and the audio signal power amplifier of the multi-audio input processing circuit is connected to the earphone.

[0014] Compared with the prior art, the present application mainly has the following beneficial effects:

[0015] The multi-audio input processing circuit provided by the present application includes a power management module, a variety of audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module, and an audio signal power amplifier. By receiving audio inputs in a variety of input modes through the variety of audio interface modules, it can transmit a variety of audio signals simultaneously, and perform corresponding audio processing on the variety of audio signals in sequence through the audio processor module, the audio sound effect processing module, the audio signal digital-to-analog conversion module, and the audio signal power amplifier, which can improve the audio quality and listening effect, and can meet the usage requirements of a variety of different user scenarios, increase the product performance, and enhance the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the solutions in the present application, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0017] Figure 1 It is a structural block diagram of an embodiment of the multi-audio input processing circuit provided by the present application;

[0018] Figure 2 It is a circuit schematic diagram of an embodiment of the audio processor module in the multi-audio input processing circuit provided by the present application;

[0019] Figure 3 It is the circuit schematic diagram of an embodiment of the JACK input unit in the multi-audio input processing circuit provided by this application;

[0020] Figure 4 It is the circuit schematic diagram of an embodiment of the USB input unit in the multi-audio input processing circuit provided by this application;

[0021] Figure 5 It is the circuit schematic diagram of an embodiment of the optical fiber input unit in the multi-audio input processing circuit provided by this application;

[0022] Figure 6 It is the circuit schematic diagram of an embodiment of the HDMI input unit in the multi-audio input processing circuit provided by this application;

[0023] Figure 7 It is the circuit schematic diagram of an embodiment of the DC power input unit in the power management module provided by this application;

[0024] Figure 8 It is the circuit schematic diagram of an embodiment of the DC power output unit in the power management module provided by this application;

[0025] Figure 9 It is the circuit schematic diagram of an embodiment of the power supply unit in the power management module provided by this application;

[0026] Figures 10 to 13 It is the circuit schematic diagram of the audio signal power amplifier provided by this application;

[0027] Figure 14 It is the circuit schematic diagram of an embodiment of the display module in the multi-audio input processing circuit provided by this application;

[0028] Figure 15 It is the circuit schematic diagram of an embodiment of the headphone speaker interface circuit in the multi-audio input processing system provided by this application;

[0029] Figure 16 It is the circuit schematic diagram of an embodiment of the headphone microphone circuit in the multi-audio input processing system provided by this application. Detailed implementation manners

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0031] Reference herein to "embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0032] In order to enable those skilled in the technical field to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the drawings.

[0033] The embodiments of this application provide a multi-audio input processing circuit. As shown in Figure 1 the figure, it includes a power management module 10, a variety of audio interface modules 20, an audio processor module 30, an audio sound effect processing module 40, an audio signal digital-to-analog conversion module 50, and an audio signal power amplifier 60.

[0034] Among them, the power management module 10 is connected to a variety of audio interface modules 20 and an audio processor module 30, and is used to provide operating power for the variety of audio interface modules 20, the audio processor module 30, the audio sound processing module 40, the audio signal digital-to-analog conversion module 50, and the audio signal power amplifier 60; the variety of audio interface modules 20 are connected to the audio processor module 30, and are used to receive audio signals in a variety of input modes, and preprocess the audio signals in different input modes and then transmit them to the audio processor module 30; the audio processor module 30 is connected to the audio sound processing module 40, and is used to perform decoding and encoding processing on the preprocessed audio signals to obtain digital audio signals of multiple channels, and transmit them to the audio sound processing module 40; the audio sound processing module 40 is connected to the audio signal digital-to-analog conversion module 50, and is used to perform sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit them to the audio signal digital-to-analog conversion module 50; the audio signal digital-to-analog conversion module 50 is connected to the audio signal power amplifier 60, and is used to convert the enhanced digital audio signals into analog audio signals, and transmit them to the audio signal power amplifier 60; the audio signal power amplifier 60 is connected to the earphone, and is used to perform audio signal amplification processing on the analog audio signals, and output them to the earphone to drive the earphone to emit sound.

[0035] The variety of audio interface modules 20 can simultaneously receive audio signals in a variety of input modes and transmit them to the audio processor module 30 for encoding and decoding into digital audio signals of multiple channels. The audio sound processing module 40 performs EQ (Equalize) and audio effect processing on the digital audio signals of multiple channels to improve the audio quality and listening effect. Then, the audio signal digital-to-analog conversion module 50 performs digital-to-analog conversion on the audio signals after sound effect processing to convert them into analog audio signals corresponding to multiple channels. The analog audio signals corresponding to multiple channels are then subjected to signal amplification processing by the audio signal power amplifier 60 and output to the speakers of the corresponding channels of the earphone to achieve the listening effect of multi-channel audio sound.

[0036] Among them, the multi-channel can be 4 channels, 6 channels, 8 channels, etc., which is not limited here, and can be specifically set according to the actual situation.

[0037] In some embodiments, the variety of audio interface modules 20 include a JACK input unit 21, a USB input unit 22, a Bluetooth input unit 23, an optical fiber input unit 24, and an HDMI input unit 25.

[0038] Among them, the JACK input unit 21 is connected to the Bluetooth input unit 23 and is used to transmit the received JACK analog audio signal to the Bluetooth input unit 23; the USB input unit 22 is connected to the Bluetooth input unit 23 and is used to transmit the received USB audio signal to the Bluetooth input unit 23; the Bluetooth input unit 23 is connected to the audio processor module 30 and is used to receive the Bluetooth mode audio signal, the JACK analog audio signal, and the USB audio signal, and decode, encode, and transmit the Bluetooth mode audio signal, the JACK analog audio signal, and the USB audio signal to the audio processor module 30; the optical fiber input unit 24 is connected to the audio processor module 30 and is used to convert the received audio optical signal into an audio electrical signal and transmit it to the audio processor module 30; the HDMI input unit 25 is connected to the audio processor module 30 and is used to receive the received HDMI audio signal and transmit it to the audio processor module 30.

[0039] In this embodiment, the multiple audio interface modules 20 can receive audio signals in different input modes, including but not limited to the 3.5mm JACK input mode, the Bluetooth input mode, the USB input mode, the optical fiber input mode, and the HDMI input mode. Different input modes are processed by the corresponding input unit for encoding and decoding.

[0040] In some embodiments, the audio processor module 30 includes an audio processor chip. The audio processor chip 31 is provided with a Bluetooth module signal transmission pin, an optical fiber signal transmission pin, an HDMI signal transmission pin, an audio signal transmission pin, and a power transmission pin; the Bluetooth module signal transmission pin is connected to the Bluetooth input unit 23; the optical fiber signal transmission pin is connected to the optical fiber input unit 24; the HDMI signal transmission pin is connected to the HDMI input unit 25; the audio signal transmission pin is connected to the audio sound processing module 40; the power transmission pin is connected to the power management module 10.

[0041] Specifically, refer to Figure 2 As shown, the Bluetooth module signal transmission pins include pin 3, pin 4, pin 25, pin 26, pin 49, and pin 54; the HDMI signal transmission pins include pin 28, pin 29, pin 73, and pins 83 to 92; the audio signal transmission pins include pins 9 to 15 and pin 44 that are connected to the audio sound processing module 40; the optical fiber signal transmission pin is pin 72; the power transmission pins include pin 1 as the 5V power supply input and pin 47 as the 3.3V power supply output.

[0042] In some embodiments, current-limiting resistors are respectively arranged between the pins where the audio processor chip U31 is connected to the audio sound processing module 40.

[0043] In some embodiments, the JACK input unit 21 includes a JACK analog audio interface J01. The JACK analog audio interface J01 is provided with an audio data input pin, a left analog audio signal input pin, and a right analog audio signal input pin. The audio data input pin is connected to the Bluetooth input unit 23 through a current-limiting resistor. The left analog audio signal input pin is connected to the Bluetooth input unit 23 through a series-connected resistor and capacitor. The right analog audio signal input pin is connected to the Bluetooth input unit 23 through a series-connected resistor and capacitor.

[0044] Specifically, referring to Figure 3 As shown, the audio data input pin is pin 2, the left analog audio signal input pin is pin 4, and the right analog audio signal input pin is pin 5. Pin 2 is connected to the Bluetooth input unit 23 through a current-limiting resistor R3. Pin 4 is connected to the Bluetooth input unit 23 through a series-connected resistor R4 and capacitor C4, and pin 5 is connected to the Bluetooth input unit 23 through a series-connected resistor R5 and capacitor C5. The common connection point of pin 1 and pin 3 is connected to the Bluetooth input unit 23 through isolation capacitors C6 and C7.

[0045] In some embodiments, the common connection point of pin 1 and pin 3 is grounded through a resistor R1. An electrostatic protection tube ESD3 is provided between pin 2 and the current-limiting resistor R3, an electrostatic protection tube ESD2 is provided between pin 4 and the resistor R4, and an electrostatic protection tube ESD1 is provided between pin 5 and the resistor R5. A grounding resistor R7 is provided between the resistor R4 and the capacitor C4, and a grounding resistor R6 is provided between the resistor R5 and the capacitor C5. One end of the capacitor C1 is connected to one end of the capacitor C4 and the capacitor C3 respectively, and the other end of the capacitor C1 is connected between the resistor R5 and the capacitor C5. One end of the capacitor C2 is connected between the resistor R5 and the capacitor C5, and the other end is grounded. The other end of the capacitor C3 is grounded. In addition, the JACK input unit 21 is also provided with a resistor R2, and both ends of the resistor R2 are respectively connected to pin 2 and the working power supply VCC.

[0046] Referring to Figure 4As shown, the USB input unit 22 includes a USB interface J02, a first electrostatic tube ESD5, a second electrostatic tube ESD6, a first resistor R10, and a second resistor R11. The USB interface J02 is provided with positive audio signal pins DP1, DP2 and negative audio signal pins DN1, DN2. The positive audio signal pins DP1, DP2 are connected to the Bluetooth input unit 23 through the first resistor R10, and the negative audio signal pins DN1, DN2 are connected to the Bluetooth input unit 23 through the second resistor R11. The first end of the first electrostatic tube ESD5 is respectively connected to the positive audio signal pins DP1, DP2 and the first resistor R10, and the second end of the first electrostatic tube ESD5 is grounded. The first end of the second electrostatic tube ESD6 is connected to the negative audio signal pins DN1, DN2 and the second resistor R11, and the second end of the second electrostatic tube ESD6 is grounded.

[0047] In some embodiments, the USB interface J02 is further provided with an output power supply pin VBUS and communication pins CC1, CC2. Among them, the output power supply pin VBUS is connected to the working power supply VDC. An electrostatic protection tube ESD4, a capacitor C8, and a capacitor C9 are provided between the output power supply pin VBUS and the working power supply VDC for filtering out interference signals. The pin CC1 is grounded through a resistor R9, and the pin CC2 is grounded through a resistor R8.

[0048] See Figure 5 As shown, the optical fiber input unit 24 includes an optical fiber interface J03, a third electrostatic tube ESD7, a fourth electrostatic tube ESD8, a first bead FB01, a second bead FB02, a first filter capacitor C10, a second filter capacitor C11, and a third filter capacitor C12. The optical fiber interface is provided with a power supply access pin VCC, a signal output pin VOUT, and a ground pin GND. The power supply access pin VCC is connected to the working power supply VCC through the first bead FB01. The signal output pin VOUT is respectively connected to the first end of the second bead FB02 and the first end of the fourth electrostatic tube ESD8, and the ground pin GND is grounded. The first end of the third electrostatic tube ESD7 is connected to the power supply access pin VCC, and the second end of the third electrostatic tube ESD7 is grounded. The first end of the first filter capacitor C10 is connected to the power supply access pin VCC, and the second end of the first filter capacitor C10 is grounded. The first end of the second filter capacitor C11 is connected to the working power supply VCC, and the second end of the second filter capacitor C11 is grounded. The second end of the fourth electrostatic tube ESD8 is grounded. The second end of the second bead FB02 is connected to the audio processor module 30. The first end of the third filter capacitor C12 is connected to the second end of the second bead FB02, and the second end of the third filter capacitor C12 is grounded.

[0049] In some embodiments, the HDMI input unit 25 includes an HDMI input interface J04, and the HDMI input interface J04 is provided with corresponding pins connected to the audio processor module 30. For the specific connection circuit, refer to Figure 6 as shown.

[0050] In some embodiments, the Bluetooth input unit 23 includes a Bluetooth receiving chip, which decodes and encodes Bluetooth mode audio signals, JACK analog audio signals, and USB audio signals.

[0051] In some embodiments, the power management module 10 includes a connected DC power input unit 11, a first DC power conversion output unit 12, and a second DC power conversion output unit 13. The DC power input unit 11 is used to receive a DC input power supply and transmit it to the first DC power conversion output unit 12; the first DC power conversion output unit 12 is used to convert the DC input power supply into a working power supply and transmit it to the audio processor module 30, the audio signal digital-to-analog conversion module 50, the audio signal power amplifier 60, and the second DC power conversion output unit 13; the second DC power conversion output unit 13 is connected to the Bluetooth input unit 23 and is used to transmit the working power supply to the Bluetooth input unit 23.

[0052] In some embodiments, refer to Figure 7 , the DC power input unit 11 includes a power interface J05, an ESD protection tube ESD13, a first capacitor C14, a second capacitor C15, a third capacitor C16, a fourth capacitor C17, a fifth capacitor C18, a sixth capacitor C19, a third magnetic bead FB03, a fourth magnetic bead FB04, and a third resistor R20; the power interface is provided with pins 1 to 5. Pin 1 is connected to the DC input power supply VCC_DCIN through the third magnetic bead FB03. The common connection point of pins 2 and 3 is grounded through the fourth magnetic bead FB04. Pins 4 and 5 are grounded; the first end and the second end of the ESD protection tube ESD13 are connected to the common connection point of pins 2 and 3, and the third end of the ESD protection tube ESD13 is connected to pin 1; the first capacitor C14, the second capacitor C15, the third capacitor C16, the fourth capacitor C17, and the fifth capacitor C18 are connected in parallel with the ESD protection tube ESD13; the first end of the sixth capacitor C19 is connected to the DC input power supply VCC_DCIN through the third resistor R20, and the second end of the sixth capacitor C19 is grounded.

[0053] In some embodiments, refer to Figure 8, the first DC power conversion output unit 12 includes a first power chip U120, a power input filtering sub-unit 121, an output control sub-unit 122, and a power output filtering sub-unit 123; the first power chip U11 is provided with a high-voltage drive pin BS, an input pin IN, a power signal pin PG, an enable pin EN, a power switch pin LX, a voltage feedback pin FB, a soft start control pin SS, and a ground pin GND; the high-voltage drive pin BS is connected to the output control sub-unit 122, the input pin IN is connected to the DC input power supply VCC_DCIN, the power signal pin PG and the enable pin EN are connected to the power input filtering sub-unit 121, the power switch pin LX and the voltage feedback pin FB are connected to the output control sub-unit 122, the soft start control pin SS is grounded through a filtering capacitor C23, and the ground pin GND is grounded; the power input filtering sub-unit 121 is connected to the DC input power supply VCC_DCIN; the output control sub-unit 122 is connected to the power output filtering sub-unit 123; the power output filtering sub-unit 123 outputs the working power supply VDD.

[0054] Specifically, for the component parts and connection circuits of the power input filtering sub-unit 121, the output control sub-unit 122, and the power output filtering sub-unit 123, refer to Figure 8 as shown.

[0055] In some embodiments, refer to Figure 9 as shown, the second DC power conversion output unit 13 includes a power output chip U131 and a voltage adjustment sub-unit 132; the power output chip U1131 is provided with a DC power input pin VIN, an enable pin EN, a power output pin VOUT, and an adjustable voltage pin ADJ, the DC power input pin VIN is connected to the working power supply VDD, the enable pin EN is connected to the audio processor module 30, the power output pin VOUT is respectively connected to the voltage adjustment sub-unit 132 and the Bluetooth input unit 23, the adjustable voltage pin ADJ is connected to the voltage adjustment sub-unit 132, the voltage adjustment sub-unit 132 is connected to the Bluetooth input unit 23, and the power supply VBAT_BT output through the power output pin VOUT powers the Bluetooth input unit 23.

[0056] In some embodiments, the voltage adjustment sub-unit 132 includes a capacitor 31, a resistor 29, and a resistor R30. Among them, both ends of the capacitor 31 are respectively connected to the power output pin VOUT and the adjustable voltage pin ADJ, the resistor 29 and the resistor R30 are connected in series and then connected to the power output pin VOUT, and the other end of the resistor R30 is grounded.

[0057] The enable pin EN is connected to the audio processor module 30 through a voltage dividing circuit. The voltage dividing circuit includes a resistor R27 and a resistor R28. Among them, both ends of the resistor R27 are respectively connected to the enable pin EN and the audio processor module 30. One end of the resistor R28 is connected to the enable pin EN, and the other end is grounded.

[0058] In this embodiment, the power supply unit 13 is also provided with filter capacitors C32 - C35 to filter out interference for the circuit and ensure the stability of the circuit.

[0059] In some embodiments, the audio sound effect processing module 40 includes a sound effect processing chip. Corresponding pins are provided on the sound effect processing chip and connected to the audio processor module 30 and the audio signal digital - to - analog conversion module 50. The sound effect processing chip performs sound effect processing on the received digital audio signals of multiple channels, and after obtaining enhanced digital audio signals, transmits them to the audio signal digital - to - analog conversion module 50.

[0060] In some embodiments, the audio signal power amplifier 60 includes a first two - channel amplification unit 61, a second channel signal amplification unit 62, a third channel signal amplification unit 63, and a fourth channel signal amplification unit 64, where:

[0061] The first channel signal amplification unit 61 is used to perform first - channel audio signal amplification processing on the received analog audio signal; the second channel signal amplification unit 62 is used to perform second - channel audio signal amplification processing on the received analog audio signal; the third channel signal amplification unit 63 is used to perform third - channel audio signal amplification processing on the received analog audio signal; the fourth channel signal amplification unit 64 is used to perform fourth - channel audio signal amplification processing on the received analog audio signal.

[0062] In this embodiment, the first - channel audio signal includes a first left - channel signal and a first right - channel signal, the second - channel audio signal includes a second left - channel signal and a second right - channel signal, the third - channel audio signal includes a third left - channel signal and a third right - channel signal, and the fourth - channel audio signal includes a fourth left - channel signal and a fourth right - channel signal. The audio signal power amplifier 60 amplifies the audio signals of eight channels. Correspondingly, the audio processor module 30 can perform decoding and encoding processing on the audio signals input in various input modes into digital audio signals of 8 channels for output. After the digital audio signals of 8 channels are subjected to corresponding processing by the audio sound effect processing module 40 and the audio signal digital - to - analog conversion module 50, they are transmitted to the corresponding two - channel signal amplification units of the audio signal power amplifier 60 for signal amplification processing and output to 8 speakers of the left and right headphones, realizing the listening effect of 8 - channel audio sound effects.

[0063] As a specific example, the circuit designs corresponding to the first two-channel amplification unit 61, the second-channel signal amplification unit 62, the third-channel signal amplification unit 63, and the fourth-channel signal amplification unit 64 can be referred to Figures 10 to 13 .

[0064] In some embodiments, the multi-audio input processing circuit further includes a display module 70. The display module 70 is connected to the audio processor module 30 and is driven by the audio processor module 30, and can display information such as the audio signal input interface type, the audio effect mode, and the volume size.

[0065] Among them, referring to Figure 14 as shown, the display module 70 includes a display interface J06. The display interface J06 is provided with a data / command selection RS pin (pin 2), a chip selection CS pin (pin 3), a clock signal transmission SCL pin (pin 4), a data and address transmission SDA pin (pin 5), a reset RESET pin (pin 6), a power supply voltage VCC pin (pin 7), an LED-A pin (pin 9), and an LED-K pin (pin 10); the data / command selection RS pin, the chip selection CS pin, the clock signal transmission SCL pin, the data and address transmission SDA pin, the reset RESET pin, and the LED-K pin are respectively connected to the audio processor module 30, and the power supply voltage VCC pin and the LED-A pin are connected to the working power supply VCC.

[0066] Among them, the display module 70 can be implemented using an LCD display screen. In this embodiment, corresponding ESD tubes are respectively provided for pins 2 to 7, pin 9, and pin 10, which are ESD14 to ESD21 respectively, and filter capacitors C36 to C39 are respectively provided for pin 6, pin 7, and pin 9 for filtering. For the specific connection, see Figure 14 as shown.

[0067] The display module 70 of the present application can display relevant device working information, including the audio signal input interface type, the audio effect mode, the volume size, etc., improving the user experience and facilitating the user to use.

[0068] The present application also provides a multi-audio input processing system, including a headset and the multi-audio input processing circuit as described above. The audio signal power amplifier 60 of the multi-audio input processing circuit is connected to the headset, as Figure 1 shown.

[0069] In some embodiments, the headset includes a headset speaker interface circuit and a headset microphone circuit. The headset speaker interface circuit is provided with a headset speaker interface, and is respectively connected to the audio processor module 30, the audio signal power amplifier 60, and the headset microphone circuit through corresponding pins provided on the headset speaker interface; the headset microphone circuit is connected to the multiple audio interface modules 20.

[0070] Among them, the earphone is composed of a left speaker 81 and a right speaker 82. The earphone speaker interface circuit and the earphone microphone circuit are respectively arranged in the left speaker 81 and the right speaker 82.

[0071] The earphone speaker interface circuit includes a MINIDP interface. On the MINIDP interface, there are an ML0+ pin and an ML0- pin connected to the first two-channel amplification unit 61, an ML1+ pin and an ML1- pin connected to the second-channel signal amplification unit 62, an ML2+ pin and an ML2- pin connected to the third-channel signal amplification unit 63, and an ML3+ pin and an ML3- pin connected to the fourth-channel signal amplification unit 64. For the specific circuit design, see Figure 15 as shown.

[0072] The earphone microphone circuit is connected to the earphone speaker interface circuit through the MIC_IN terminal, and is connected to the Bluetooth input unit 23 through the MICINR terminal and the MICINL terminal. For the specific circuit design, see Figure 16 as shown.

[0073] It should be noted that the regular parameters of components such as resistors, capacitors, ESD protection tubes, and magnetic beads involved in this application can be selected according to actual needs.

[0074] The multi-audio input processing circuit and its system provided by this application have rich product functions, can meet the usage requirements of a variety of different user scenarios, such as games, live broadcasts, movies, etc., and solve the drawback of few audio input interfaces of existing products, providing rich audio input interfaces for users to use. At the same time, it can achieve an 8-channel multi-channel audio effect, and also has an LCD display of usage information, enhancing product performance and improving user experience.

[0075] Obviously, the embodiments described above are only a part of the embodiments of this application, rather than all the embodiments. The accompanying drawings give preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of this application more thorough and comprehensive. Although this application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structures directly or indirectly using the content of the specification and drawings of this application in other related technical fields are equally within the scope of the patent protection of this application.

Claims

1. A multi-audio input processing circuit, characterized in that: It includes a power management module, various audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module, and an audio signal power amplifier; The power management module is connected to the various audio interface modules and the audio processor module, and is used to provide working power for the various audio interface modules, the audio processor module, the audio sound effect processing module, the audio signal digital-to-analog conversion module, and the audio signal power amplifier; The multiple audio interface modules are connected to the audio processor module, and are used to receive audio signals of multiple input modes, and transmit the audio signals of different input modes to the audio processor module after pre-processing; The audio processor module is connected to the audio and sound effect processing module, and is used to decode and encode the pre-processed audio signal to obtain digital audio signals of multiple channels, and transmit them to the audio and sound effect processing module; The audio effect processing module is connected to the audio signal digital-to-analog conversion module, and is used to perform sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit them to the audio signal digital-to-analog conversion module; The audio signal digital-to-analog conversion module is connected to the audio signal power amplifier, and is used to convert the enhanced digital audio signal into an analog audio signal, and transmit it to the audio signal power amplifier; The audio signal power amplifier is connected to the earphone, and is used to perform audio signal amplification processing on the analog audio signal, and output the amplified audio signal to the earphone, so as to drive the earphone to produce sound.

2. The multi-audio input processing circuit according to claim 1, characterized in that: The multiple audio interface modules include a JACK input unit, a USB input unit, a Bluetooth input unit, an optical fiber input unit and an HDMI input unit; The JACK input unit is connected to the Bluetooth input unit and is used to transmit the received JACK analog audio signal to the Bluetooth input unit; The USB input unit is connected to the Bluetooth input unit and is used to transmit the received USB audio signal to the Bluetooth input unit; The Bluetooth input unit is connected to the audio processor module, and is used to receive the Bluetooth mode audio signal, the JACK analog audio signal, and the USB audio signal, and decode and encode the Bluetooth mode audio signal, the JACK analog audio signal, and the USB audio signal, and transmit them to the audio processor module; The optical fiber input unit is connected to the audio processor module and is used to convert the received audio optical signal into an audio electrical signal and transmit it to the audio processor module; The HDMI input unit is connected to the audio processor module, and is used for decoding and processing the received HDMI audio signal, and transmitting the decoded signal to the audio processor module.

3. The multi-audio input processing circuit according to claim 2, characterized in that: The audio processor module comprises an audio processor chip, and the audio processor chip is provided with a Bluetooth module signal transmission pin, an optical fiber signal transmission pin, an HDMI signal transmission pin, an audio signal transmission pin and a power transmission pin; The Bluetooth module signal transmission pin is connected to the Bluetooth input unit; the optical fiber signal transmission pin is connected to the optical fiber input unit; the HDMI signal transmission pin is connected to the HDMI input unit; the audio signal transmission pin is connected to the audio and sound effect processing module; and the power transmission pin is connected to the power management module.

4. The multi-audio input processing circuit according to claim 2, characterized in that: The JACK input unit includes a JACK analog audio interface, which is provided with an audio data input pin, a left analog audio signal input pin and a right analog audio signal input pin; the audio data input pin is connected to the Bluetooth input unit through a current limiting resistor; the left analog audio signal input pin is connected to the Bluetooth input unit through a series resistor and a capacitor; the right analog audio signal input pin is connected to the Bluetooth input unit through a series resistor and a capacitor; The USB input unit comprises a USB interface, a first electrostatic tube, a second electrostatic tube, a first resistor and a second resistor, the USB interface is provided with a positive audio signal pin and a negative audio signal pin, the positive audio signal pin is connected to the Bluetooth input unit through the first resistor, and the negative audio signal pin is connected to the Bluetooth input unit through the second resistor; the first end of the first electrostatic tube is respectively connected to the positive audio signal pin and the first resistor, and the second end of the first electrostatic tube is grounded; the first end of the second electrostatic tube is respectively connected to the negative audio signal pin and the second resistor, and the second end of the second electrostatic tube is grounded; The optical fiber input unit includes an optical fiber interface, a third electrostatic tube, a fourth electrostatic tube, a first magnetic bead, a second magnetic bead, a first filter capacitor, a second filter capacitor and a third filter capacitor. The optical fiber interface is provided with a power access pin, a signal output pin and a ground pin; the power access pin is connected to the working power supply through the first magnetic bead, the signal output pin is respectively connected to the first end of the second magnetic bead and the first end of the fourth electrostatic tube, and the ground pin is grounded; the first end of the third electrostatic tube is connected to the power access pin, and the second end of the third electrostatic tube is grounded; the first end of the first filter capacitor is connected to the power access pin, and the second end of the first filter capacitor is grounded; the first end of the second filter capacitor is connected to the working power supply, and the second end of the second filter capacitor is grounded; the second end of the fourth electrostatic tube is grounded; the second end of the second magnetic bead is connected to the audio processor module; The first end of the third filter capacitor is connected to the second end of the second magnetic bead, and the second end of the third filter capacitor is grounded.

5. The multi-audio input processing circuit according to claim 2, characterized in that: The power management module includes a connected DC power input unit, a first DC power conversion output unit, and a second DC power conversion output unit; The DC power input unit is used to receive DC input power and transmit it to the first DC power conversion output unit; the first DC power conversion output unit is used to convert the DC input power into working power and transmit it to the second DC power conversion output unit; the second DC power conversion output unit is connected to the audio processor module and the Bluetooth input unit, and is used to transmit the working power to the audio processor module and the Bluetooth input unit.

6. The multi-audio input processing circuit according to claim 5, characterized in that: The DC power input unit includes a power interface, an ESD protection tube, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a third magnetic bead, a fourth magnetic bead and a third resistor; the power interface is provided with pins 1 to 5, the pin 1 is connected to the DC input power supply through the third magnetic bead, the common connection point of the pin 2 and the pin 3 is grounded through the fourth magnetic bead, and the pin 4 and the pin 5 are grounded; the first end and the second end of the ESD protection tube are connected to the common connection point of the pin 2 and the pin 3, and the third end of the ESD protection tube is connected to the pin 1; the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, and the fifth capacitor are connected in parallel with the ESD protection tube; the first end of the sixth capacitor is connected to the DC input power supply through the third resistor, and the second end of the sixth capacitor is grounded; The first DC power conversion and output unit comprises a first power chip, a power input filter subunit, an output control subunit and a power output filter subunit; the first power chip is provided with a high-voltage drive pin BS, an input pin IN, a power signal pin PG, an enable pin EN, a power switch pin LX, a voltage feedback pin FB, a soft start control pin SS and a ground pin GND; the high-voltage drive pin BS is connected to the output control subunit, the input pin IN is connected to the DC input power supply, the power signal pin PG and the enable pin EN are connected to the power input filter subunit, the power switch pin LX and the voltage feedback pin FB are connected to the output control subunit, the soft start control pin SS is grounded through a filter capacitor, and the ground pin GND is grounded; the power input filter subunit is connected to the DC input power supply; the output control subunit is connected to the power output filter subunit; the power output filter subunit outputs the working power supply; The second DC power conversion and output unit includes a power output chip and a voltage adjustment subunit; the power output chip is provided with a DC power input pin VIN, an enable pin EN, a power output pin VOUT and an adjustable voltage pin ADJ, the DC power input pin VIN is connected to the working power supply, the enable pin EN is connected to the audio processor module, the power output pin VOUT is respectively connected to the voltage adjustment subunit and the Bluetooth input unit, the adjustable voltage pin ADJ is connected to the voltage adjustment subunit, and the voltage adjustment subunit is connected to the Bluetooth input unit.

7. The multi-audio input processing circuit according to claim 2, characterized in that: The audio signal power amplifier comprises a first channel signal amplifying unit, a second channel signal amplifying unit, a third channel signal amplifying unit, and a fourth channel signal amplifying unit, wherein: The first channel signal amplifying unit is used to perform first channel audio signal amplification processing on the received analog audio signal; The second channel signal amplifying unit is used to perform second channel audio signal amplification processing on the received analog audio signal; The third channel signal amplifying unit is used to perform third channel audio signal amplification processing on the received analog audio signal; The fourth channel signal amplifying unit is used to perform fourth channel audio signal amplification processing on the received analog audio signal.

8. The multi-audio input processing circuit according to any one of claims 1 to 7, characterized in that: The circuit further comprises a display module, wherein the display module is connected to the audio processor module; Among them, the display module includes a display interface, and the display interface sets a data / command selection RS pin, a chip selection CS pin, a clock signal transmission SCL pin, a data and address transmission SDA pin, a reset RESET pin, a power supply voltage VDD pin, an LED-A pin and an LED-K pin; the data / command selection RS pin, the chip selection CS pin, the clock signal transmission SCL pin, the data and address transmission SDA pin, the reset RESET pin and the LED-K pin are respectively connected to the audio processor module, and the power supply voltage VDD pin and the LED-A pin are connected to the working power supply.

9. A multi-audio input processing system, characterized in that: The invention comprises an earphone and the multi-audio input processing circuit according to any one of claims 1 to 8, wherein an audio signal power amplifier of the multi-audio input processing circuit is connected to the earphone.

10. The multi-audio input processing system according to claim 9, characterized in that: The earphone includes an earphone speaker interface circuit and an earphone microphone circuit. The earphone speaker interface circuit is provided with an earphone speaker interface, and the audio processor module, the audio signal power amplifier and the earphone microphone circuit are respectively connected through corresponding pins provided on the earphone speaker interface; the earphone microphone circuit is connected with the multiple audio interface modules.

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