Circuit board, display module and display device

Abstract

The utility model discloses a circuit board, a display module and a display device. The circuit board comprises a circuit board body; the at least one circuit board device is arranged on the circuit board body, and a device area is formed on the circuit board body; the fence surrounds the circuit board device and / or the device area and is arranged on the circuit board body, and the minimum height difference between the fence and the circuit board device is smaller than or equal to 0.10 mm; and the waterproof glue is filled in the fence and is used for encapsulating the circuit board device.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of display devices, and particularly relates to a circuit board, a display module, and a display device. Background Art

[0002] With the development of display technology, the requirements for the thickness of display modules are becoming increasingly stringent. The thickness of the display module is positively correlated with the thickness of the display panel, the thickness of the circuit board back glue, the thickness of the circuit board body, the height of the circuit board devices, and the thickness of the glue overflow in the device area. How to reduce the thickness of the display module on this basis is an urgent problem to be solved in this field.

[0003] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Utility Model

[0004] The present disclosure aims to at least solve to some extent the technical problem of how to reduce the thickness of the display module. To this end, the present disclosure provides a circuit board, a display module, a display device, and a encapsulation method.

[0005] A circuit board provided by an embodiment of the present disclosure, the circuit board includes: a circuit board body; at least one circuit board device, the circuit board device is disposed on the circuit board body, and a device area is formed on the circuit board body; a fence, the fence surrounds the circuit board device and / or surrounds the device area, and is disposed on the circuit board body, and the minimum height difference between the fence and the circuit board device is less than or equal to 0.10 mm; and, a waterproof glue, the waterproof glue is filled in the fence and encapsulates the circuit board device.

[0006] In some embodiments, the fence includes a resin fence and / or a metal fence, and the resin fence and / or the metal fence are attached to the periphery of the device area.

[0007] In some embodiments, the material of the resin fence includes any one or several of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyimide, and polyethylene thermoplastic elastomer.

[0008] In some embodiments, the minimum distance between the resin fence and / or the metal fence and the circuit board device is 1.0 mm to 3.0 mm.

[0009] In some embodiments, the material of the fence includes a first thermosetting resin, the viscosity of the first thermosetting resin is 20 pa·s to 150 pa·s, and the first thermosetting resin is coated around the circuit board device and / or the device area to form the fence.

[0010] In some embodiments, the material of the waterproof glue includes a second thermosetting resin, and the viscosity of the second thermosetting resin is 2 Pa·s to 5 Pa·s.

[0011] In some embodiments, the minimum height difference between the fence and the circuit board device is 0.03 mm to 0.10 mm.

[0012] In some embodiments, the fence is rectangular or circular, or the fence conforms to the circuit board device and / or the device area.

[0013] In some embodiments, the circuit board is a flexible circuit board.

[0014] An embodiment of the present disclosure also provides a display module, which includes: a display panel, the display panel includes a display area, a bending area, and a bonding area connected in sequence, and the bonding area is bent to the back of the display area through the bending area; the above-mentioned circuit board, the circuit board is bonded to the bonding area; and, a circuit board back glue, the circuit board back glue is disposed between the circuit board body and the back of the display area.

[0015] An embodiment of the present disclosure also provides a display device, which includes the above-mentioned display module.

[0016] The embodiments of the present disclosure have at least the following beneficial effects:

[0017] For the above-mentioned circuit board, by arranging a fence around the circuit board device or the device area, and making the minimum height difference between the fence and the circuit board device less than or equal to 0.10 mm, that is, making the height difference between the fence and the circuit board device with the largest height less than or equal to 0.10 mm, by controlling the height of the fence, the filling amount of the waterproof glue inside the fence can be accurately controlled, and then the filling height of the waterproof glue inside the fence can be restricted by the fence. It can not only make the waterproof glue encapsulate and protect the circuit board device to ensure the protection effect on the circuit board device, but also control the overflow thickness of the waterproof glue below 0.10 mm, so that the overall thickness of the circuit board can be reduced to a certain extent; when the circuit board is applied to a display module or a display device, the overall thickness of the display module and the display device can be reduced, thereby reserving more space for the whole machine, having a larger design space, and meeting the development requirements of the light and thin of the display module and the display device. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0019] Figure 1 Shows a cross-sectional view of a circuit board in the related art;

[0020] Figure 2 Shows a schematic diagram of the process of pressing the waterproof glue film for encapsulating circuit board devices in the circuit board in the related art;

[0021] Figure 3 Shows Figure 2 a cross-sectional view of the circuit board in;

[0022] Figure 4 Shows a schematic diagram of the process of encapsulating circuit board devices with waterproof glue in the circuit board according to the embodiments of the present disclosure;

[0023] Figure 5 Shows Figure 4 a cross-sectional view of the circuit board in;

[0024] Figure 6 Shows a schematic diagram of the process of encapsulating circuit board devices with waterproof glue in the circuit board according to another embodiment of the present disclosure;

[0025] Figure 7 Shows Figure 6 a cross-sectional view of the circuit board in;

[0026] Figure 8 Shows Figure 6 a schematic diagram of the preparation state of the fence in the circuit board in;

[0027] Figure 9 Shows Figure 6 a schematic diagram of the preparation state of the waterproof glue in the circuit board in;

[0028] Figure 10 Shows a cross-sectional view of the circuit board according to another embodiment of the present disclosure;

[0029] Figure 11 Shows the encapsulation effect diagram of the circuit board according to some embodiments of the present disclosure;

[0030] Figure 12 Shows the encapsulation effect diagram of the circuit board according to other embodiments of the present disclosure;

[0031] Figure 13 Shows a sliced diagram of the encapsulation effect of the circuit board;

[0032] Figure 14Shows a sliced view of the encapsulation effect of a circuit board in some embodiments;

[0033] Figure 15 Shows a sliced view of the encapsulation effect of a circuit board in some other embodiments;

[0034] Figure 16 Shows a cross-sectional view of a display device in an embodiment of the present disclosure.

[0035] Reference numerals:

[0036] 100, circuit board body; 200, circuit board device; 300, fence; 400, waterproof glue; 500, film; 600, dispensing head; 1000, display panel; 1100, display area; 1200, bending area; 1210, bending protection glue; 1300, bonding area; 1310, chip; 2000, back film; 3000, polyimide glue layer; 4000, support layer; 5000, bending cushion layer; 6000, battery; 7000, middle frame; ΔH, minimum height difference; A, overflow glue thickness; D, minimum distance. Detailed implementation manners

[0037] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0038] In addition, the present disclosure may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0039] The present disclosure will be described below with reference to the accompanying drawings and specific embodiments:

[0040] With the development of display technology, the requirements for the thickness of display modules are becoming increasingly stringent. For example, with the popularization of foldable display devices such as foldable screen mobile phones, thin and light has become the trend of the development of foldable display devices.

[0041] Such as Figure 16As shown, the thickest position of the folding screen is located in the device area of the circuit board. The thickness at this position can be decomposed into the thickness of the display panel 1000, the thickness of the circuit board back glue, the thickness of the circuit board body 100, the height of the circuit board device 200, and the thickness A of the glue overflow in the device area. The reduction of each of the above thicknesses is beneficial to the reduction of the overall thickness of the machine. Among them, the thickness of the display panel 1000 is mainly related to the bending trajectory. Affected by bending misalignment, etc., after preliminary simulation, prediction and other evaluations, there is basically no chance of further reduction. The thickness of the circuit board back glue has now been reduced to the lowest value of the available glue thickness (about 30um). If the thickness of the circuit board back glue is further reduced, there will be a risk that the circuit board will not be firmly adhered. There is no reduction space for the circuit board back glue. In the circuit board, the circuit board device 200 needs to be selected according to the layout evaluation. The height of the circuit board device 200 is fixed and cannot be reduced. There is no reduction space for the height of the circuit board device 200. The chip 1310 covering film is a tape covering the surface of the circuit board, which can play a role in shielding and protection. Affected by the thickness, it is generally hollowed out in the device area, and the chip 1310 covering film can be removed. There is no reduction space for the chip 1310 covering film.

[0042] In the device area on the circuit board, as Figures 4 to 10 shown, the circuit board device 200 or the device area can be encapsulated with a waterproof glue 400 so that the circuit board device 200 and the device area can be waterproof. The encapsulation methods of the devices on the circuit board include encapsulating glue, full encapsulating glue, pressing glue with a mylar film 500, covering a shielding cover, etc. The waterproof effect of the semi-encapsulating glue is poor, and it is generally rarely used in folding screen products. The latter three encapsulation methods are used more and all have good waterproof effects.

[0043] As Figure 1 shown, in the related art, the waterproof glue 400 can be point-coated in the device area on the circuit board body 100' so that the waterproof glue 400 encapsulates the circuit board device 200'. The glue overflow thickness A' in the device area is shown in the figure. The glue overflow thickness A' in the device area can generally be controlled within 0.15mm to 0.20mm. As Figure 2 and Figure 3 shown, in the related art, after the waterproof glue 400' is point-coated in the device area, the glue overflow thickness A' can also be reduced by pressing the mylar film 500'. The thinnest glue overflow thickness A' can be controlled at 0.13mm, and there is a risk that the circuit board device 200' will be partially exposed due to the pressing of the film 500'. In the case where there is no reduction space for the thickness of other components, the inventive concept of the present disclosure is how to reduce the overall thickness by reducing the glue overflow thickness A.

[0044] It should be noted that in the related description of the present disclosure, as Figures 4 to 10 shown, the glue overflow thickness A refers to the thickness of the waterproof glue 400 covering the top of the circuit board device 200.

[0045] In view of the technical problem of how to reduce the thickness A of the overflow glue, an embodiment of the present disclosure provides a circuit board, as Figures 4 to 15 shown, the circuit board includes a circuit board body 100, at least one circuit board device 200, a fence 300, and a waterproof glue 400. Among them, the circuit board device 200 is disposed on the circuit board body 100 to form a device area on the circuit board body 100; the fence 300 surrounds the circuit board device 200 and / or surrounds the device area, and is disposed on the circuit board body 100, and the minimum height difference ΔH between the fence 300 and the circuit board device 200 is less than or equal to 0.10 mm; the waterproof glue 400 is filled in the fence 300 and encapsulates the circuit board device 200.

[0046] For the circuit board proposed in some embodiments of the present disclosure, by arranging the fence 300 around the periphery of the circuit board device 200 or the device area, and making the minimum height difference ΔH between the fence 300 and the circuit board device 200 less than or equal to 0.10 mm, that is to say, making the height difference between the fence 300 and the circuit board device 200 with the largest height less than or equal to 0.10 mm, by controlling the height of the fence 300, the filling amount of the waterproof glue 400 in the fence 300 can be accurately controlled, and then the filling height of the waterproof glue 400 in the fence 300 is restricted by the fence 300. It can not only make the waterproof glue 400 encapsulate and protect the circuit board device 200 to ensure the protection effect on the circuit board device 200, but also control the overflow glue thickness A of the waterproof glue 400 below 0.10 mm, so that the overall thickness of the circuit board can be reduced to a certain extent; when the circuit board is applied to a display module or a display device, the overall thickness of the display module and the display device can be reduced, so as to reserve more space for the whole machine, have a larger design space, and meet the development requirements of the thin and light of the display module and the display device.

[0047] In some embodiments of the present disclosure, the circuit board device 200 in the circuit board may include devices such as capacitors, resistors, crystal oscillators, Flash, etc. After the circuit board device 200 is soldered on the circuit board body 100, the circuit board device 200 is encapsulated by the waterproof glue 400 to provide protection for the circuit board device 200. The embodiment of the present disclosure controls the overflow glue thickness A of the waterproof glue 400 through the fence 300. The overflow glue thickness A can be reduced by 30% compared with the related technology, and the overflow glue thickness A can be reduced by at least 30 μm. While the overflow glue thickness A is reduced, it can be ensured that the circuit board device 200 is not affected by water vapor. In addition, through encapsulation, the protection effect of the circuit board can be ensured, and it can be ensured that the compression resistance and drop resistance performance of the circuit board meet the design requirements.

[0048] In some embodiments of the present disclosure, the range surrounded by the fence 300 can be selected according to the layout of the circuit board device 200 on the circuit board body 100.

[0049] For example, when multiple circuit board devices 200 on the circuit board body 100 are concentratedly arranged, the area where the multiple circuit board devices 200 with concentrated arrangement are located can be regarded as a device area, and the device area is enclosed by a fence 300. Furthermore, the height of the waterproof glue 400 in the device area is restricted by the fence 300, so that the waterproof glue 400 can completely encapsulate the tops of the multiple circuit board devices 200, forming a good waterproof effect for the circuit board devices 200. At the same time, the thickness A of the overflow glue can also be reduced.

[0050] Again, when multiple circuit board devices 200 on the circuit board body 100 are dispersedly arranged, separate fences 300 can be provided for the multiple circuit board devices 200 with dispersed arrangement. The circuit board devices 200 are separately enclosed by the multiple fences 300. Furthermore, the height of the waterproof glue 400 in the device area is restricted by the fence 300, so that the waterproof glue 400 can completely encapsulate the tops of the multiple circuit board devices 200, forming a good waterproof effect for the circuit board devices 200. At the same time, the thickness A of the overflow glue can also be reduced.

[0051] Again, on the circuit board body 100, multiple circuit board devices 200 may have both concentrated arrangement and individual arrangement. Thus, the multiple circuit board devices 200 with concentrated arrangement can be enclosed in the device by the fence 300, and at the same time, the circuit board devices 200 with individual arrangement can be enclosed therein by the multiple fences 300 respectively, so as to form multiple fence 300 areas on the circuit board body 100. The waterproof glue 400 is dot-coated in each fence 300 area, so that the waterproof glue 400 encapsulates the multiple circuit board devices 200 with concentrated arrangement, or the waterproof glue 400 separately encapsulates the circuit board devices 200 with individual arrangement.

[0052] As an alternative embodiment, as Figure 4 and Figure 5 shown, the fence 300 includes a resin fence 300 and / or a metal fence 300, and the resin fence 300 and / or the metal fence 300 are attached to the periphery of the circuit board device 200 and / or the periphery of the device area.

[0053] In some embodiments of the present disclosure, the fence 300 may be a resin fence 300 prepared from a resin material, or a metal fence 300 prepared from a metal material. The resin fence 300 and / or the metal fence 300 can be attached to the periphery of the circuit board device 200, and can also be attached to the periphery of the device area. For example, the resin fence 300 and / or the metal fence 300 may be preset with an adhesive layer to form a tape structure.

[0054] The fence 300 is arranged around the circuit board device 200 and / or the device area and adhered to the circuit board body 100 through an adhesive layer. For another example, the resin fence 300 and / or the metal fence 300 are injection-molded or cast separately, and then the fence 300 is arranged around the circuit board device 200 and / or the device area and adhered to the circuit board body 100 through an adhesive.

[0055] In some embodiments of the present disclosure, as Figure 4 and Figure 5 shown, the resin fence 300 and / or the metal fence 300 with corresponding dimensions can be prefabricated according to the structural and dimensional parameters of the circuit board device 200 and the structural and dimensional parameters of the device area. Then, by using the method of attaching the carrier film, the resin fence 300 and / or the metal fence 300 can be aligned with the circuit board device 200 and / or the device area on the circuit board through a jig or equipment, so that the circuit board device 200 and / or the device area surrounded by the resin fence 300 and / or the metal fence 300 are attached to the circuit board body 100.

[0056] In some embodiments of the present disclosure, as Figure 4 and Figure 5 shown, when multiple circuit board devices 200 are relatively concentratedly arranged on the circuit board body 100, the area where these circuit board devices 200 are located can be regarded as a device area, and the shape of this device area is approximately rectangular. Therefore, the shape and size of the resin fence 300 and / or the metal fence 300 can be determined according to the shape and size of this rectangle; at the same time, the height of the resin fence 300 and / or the metal fence 300 can be determined according to the height of the highest circuit board device 200 among these circuit board devices 200, so that the height of the resin fence 300 and / or the metal fence 300 is within 0.10 mm higher than the height of the highest circuit board device 200, and the minimum height difference ΔH between the resin fence 300 and / or the metal fence 300 and the circuit board device 200 satisfies the condition of being less than or equal to 0.10 mm.

[0057] As an alternative embodiment, the material of the resin fence 300 includes any one or several of polyethylene glycol terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), and polyethylene thermoplastic elastomer (PRT).

[0058] In some embodiments of the present disclosure, the material of the resin fence 300 forms a fence 300 in a shape such as a ring or a rectangular frame through processes such as injection molding, and then the fence 300 can be arranged around the circuit board device 200 and / or the device area.

[0059] As an alternative embodiment, the minimum distance D between the resin fence 300 and / or the metal fence 300 and the circuit board device 200 is 1.0 mm to 3.0 mm.

[0060] In some embodiments of the present disclosure, the resin fence 300 and / or the metal fence 300 are pre-formed, so there are certain manufacturing errors in the resin fence 300 and / or the metal fence 300; the resin fence 300 and / or the metal fence 300 adopt a carrier film lamination method and are attached to the periphery of the circuit board device 200 and / or the periphery of the electrical area through a jig or equipment, so there are certain attachment errors in the resin fence 300 and / or the metal fence 300. For the circuit board in some embodiments of the present disclosure, by making the minimum distance D between the resin fence 300 and / or the metal fence 300 and the circuit board device 200 be 1.0 mm to 3.0 mm, the manufacturing errors and attachment errors of the resin fence 300 and / or the metal fence 300 can be adapted through this minimum distance D, which facilitates the positioning and attachment of the resin fence 300 and / or the metal fence 300, avoids the increase in the overall thickness caused by the resin fence 300 and / or the metal fence 300 being attached to the circuit board device 200, and at the same time can avoid the bottom of the resin fence 300 and / or the metal fence 300 being suspended and unable to limit the filling range of the waterproof glue 400.

[0061] As an alternative embodiment, as Figure 6 and Figure 7 shown, the material of the fence 300 includes a first thermosetting resin, and the viscosity of the first thermosetting resin is 20 pa·s to 150 pa·s. The first thermosetting resin is coated on the periphery of the circuit board device 200 and / or the device area to form the fence 300.

[0062] In some embodiments of the present disclosure, as Figure 6 and Figure 7 shown, the fence 300 can be prepared from the first thermosetting resin. When the first thermosetting resin is coated on the periphery of the device area to form the fence 300, since the viscosity of the first thermosetting resin is 20 pa·s to 150 pa·s, the viscosity of the first thermosetting resin is relatively large and the fluidity is relatively low. When coated on the periphery of the circuit board device 200 and / or the device area, it can maintain a certain structural form to form the fence 300, so that the minimum height difference ΔH between the formed fence 300 and the circuit board device 200 is maintained within a range less than or equal to 0.10 mm.

[0063] In some embodiments of the present disclosure, since the first thermosetting resin forms the fence 300 by coating around the circuit board device 200 and / or the device area, the first thermosetting resin can be attached to the side wall of the circuit board device 200 during coating, and the attachment of the first thermosetting resin to the side wall of the circuit board device 200 does not affect its limiting effect on the range of the waterproof glue 400 and the overflow glue thickness A.

[0064] In some embodiments of the present disclosure, as Figure 6 and Figure 7 shown, when the first thermosetting resin is coated around the circuit board device 200 and / or the device, it can maintain a certain structural form to form the fence 300, and the fence 300 can be maintained at a preset height. Therefore, after the first thermosetting resin is coated to form the fence 300, a certain amount of waterproof glue 400 can be filled within the range surrounded by the fence 300. The flow range of the waterproof glue 400 is controlled by the fence 300, so that the waterproof glue 400 can encapsulate the circuit board device 200, and at the same time ensure that the overflow glue thickness A is kept within 0.10 mm.

[0065] In some embodiments of the present disclosure, as Figure 6 and Figure 7 shown, when the first thermosetting resin is coated around the circuit board device 200 and / or the device, it can maintain a certain structural form to form the fence 300, and the fence 300 can be maintained at a preset height state. After the first thermosetting resin is coated, heat treatment can be performed to cure the first thermosetting resin to form a fence 300 with a stable structural form. Then, a certain amount of waterproof glue 400 can be filled within the range surrounded by the fence 300. The flow range of the waterproof glue 400 is controlled by the fence 300, so that the waterproof glue 400 can encapsulate the circuit board device 200, and at the same time ensure that the overflow glue thickness A is kept within 0.10 mm.

[0066] In some embodiments of the present disclosure, the fence 300 formed after the first thermosetting resin is thermally cured has a relatively high hardness, which can make the structural form of the fence 300 more stable and firm, thereby improving the height limiting effect on the waterproof glue 400 and ensuring that the overflow glue thickness A is kept within 0.10 mm.

[0067] As an alternative embodiment, as Figures 4 to 10 shown, the material of the waterproof glue 400 includes a second thermosetting resin, and the viscosity of the second thermosetting resin is 2 Pa·s to 5 Pa·s.

[0068] In some embodiments of the present disclosure, as Figures 4 to 10As shown in the figure, the material of the waterproof glue 400 can be a second thermosetting resin. Since the viscosity of the second thermosetting resin is 2 Pa·s to 5 Pa·s, the viscosity of the second thermosetting resin is relatively low and the fluidity is relatively high. Therefore, when the second thermosetting resin used as the waterproof glue 400 is filled within the range surrounded by the fence 300, the second thermosetting resin can flow and fill the spaces such as the gap between the circuit board device 200 and the fence 300 and the gap between the circuit board devices 200 by itself. When the filling amount of the second thermosetting resin exceeds a certain range, the second thermosetting resin flows over the fence 300 to the outside of the fence 300. Therefore, the second thermosetting resin used as the waterproof glue 400 can be controlled within a certain height range, achieving the purpose of effectively controlling the overflow glue thickness A of the waterproof glue 400, so that the second thermosetting resin used as the waterproof glue 400 can not only encapsulate the circuit board device 200, but also ensure that the overflow glue thickness A is less than or equal to 0.10 mm, ensuring that the overall thickness of the circuit board can be thinned.

[0069] As an alternative embodiment, the minimum height difference ΔH between the fence 300 and the circuit board device 200 is 0.03 mm to 0.10 mm.

[0070] In some embodiments of the present disclosure, as Figures 4 to 10 shown, by making the minimum height difference ΔH between the fence 300 and the circuit board device 200 be 0.03 mm to 0.10 mm, the overflow glue thickness A formed when the waterproof glue 400 is filled within the range of the fence 300 can be maintained at 0.03 mm to 0.10 mm. Thus, while making the circuit board thinner, it is ensured that the overflow glue thickness A of the waterproof glue 400 is within the range of 0.03 mm to 0.10 mm, so that the waterproof glue 400 has a better encapsulation effect. Optionally, the minimum height difference ΔH between the fence 300 and the circuit board device 200 can be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, or any thickness between these thickness values.

[0071] As an alternative embodiment, the fence 300 is rectangular or circular, or the fence 300 is conformal with the circuit board device 200 and / or the device area.

[0072] In some embodiments of the present disclosure, as Figures 4 to 10 and Figure 11As shown, when the circuit board device 200 and / or the device area is rectangular, the fence 300 can be made into a corresponding rectangular structure, and the waterproof glue 400 is filled in the fence 300 to form a rectangular encapsulation structure, encapsulating the circuit board device 200 in the waterproof glue 400. When the circuit board device 200 and / or the device area is circular or quasi-circular, the fence 300 can be made into a corresponding circular structure, and the waterproof glue 400 is filled in the fence 300 to form a circular encapsulation structure, encapsulating the circuit board device 200 in the waterproof glue 400.

[0073] In some embodiments of the present disclosure, such as Figures 4 to 10 and Figure 11 As shown, when the fence 300 adopts a resin fence 300 and / or a metal fence 300, since the resin fence 300 and / or the metal fence 300 are prefabricated structures, the resin fence 300 and / or the metal fence 300 can be prefabricated into a rectangle or a circle, which can not only facilitate the prefabrication of the resin fence 300 and / or the metal fence 300, but also facilitate the positioning and fitting of the resin fence 300 and / or the metal fence 300.

[0074] In some embodiments of the present disclosure, such as Figure 12 As shown, when the circuit board device 200 and / or the device area is irregular, the fence 300 can follow the morphological structure of the circuit board device 200 and / or the device area to form a corresponding conforming structure, and the waterproof glue 400 is filled in the fence 300 to form an encapsulation structure, encapsulating the circuit board device 200 in the waterproof glue 400. By making the fence 300 conform to the circuit board device 200 and / or the device area, the range of the fence 300 can be made to match the contour of the circuit board device 200 and / or the device area as much as possible, so that the range enclosed by the fence 300 is smaller, which can reduce the amount of the waterproof glue 400 to a certain extent and reduce the material cost.

[0075] As an alternative embodiment, the circuit board is a flexible circuit board.

[0076] In some embodiments of the present disclosure, in order to enable the circuit board to be used in a folding display module or a curved display module and adapt to the folding and bending forms of the folding display module or the curved display module, the circuit board can be a flexible circuit board, so that the form of the flexible circuit board can change with the folding of the folding display module or the bending of the curved display module.

[0077] In some embodiments of the present disclosure, when the circuit board is a flexible circuit board, since the flexible circuit board has flexibility and can be bent, the circuit board device 200 needs to have higher waterproof requirements.

[0078] In some embodiments of the present disclosure, the circuit board device 200 in the circuit board needs to have a certain waterproof effect. Especially when the circuit board is applied in a foldable display module or a curved display module, due to the need for folding operation in the foldable display module and the curved shape maintained in the curved display module, higher waterproof requirements are imposed on the circuit board device 200 in the circuit board. In the circuit board of some embodiments of the present disclosure, by providing the fence 300, the overflow glue thickness A and the encapsulation range of the waterproof glue 400 can be restricted, ensuring a better waterproof effect while reducing the overall thickness of the circuit board. In addition, the fence 300 can improve the structural stability of the waterproof glue 400 and the bonding effect between the waterproof glue 400, the circuit board device 200, and the circuit board body 100, enabling the waterproof glue 400 to maintain a stable structural form and bonding effect during the frequent folding operation of the foldable display module, thereby improving the waterproof effect on the circuit board device 200.

[0079] In some embodiments of the present disclosure, the circuit board body 100 of the flexible circuit board may have a multi-layer structure. For example, the circuit board body 100 of the flexible circuit board has a two-layer structure, a three-layer structure, a four-layer structure, a six-layer structure, etc. The specific number of layers of the circuit board body 100 of the flexible circuit board can be set according to the performance requirements of the circuit board, which will not be elaborated here.

[0080] In some embodiments of the present disclosure, as Figures 13 to 15 shown, a sectional view of the encapsulation effect of the circuit board of some embodiments of the present disclosure is presented. At the same time, Table 1 shows the sectional data of the encapsulation effect of the circuit board of some embodiments of the present disclosure. From Figures 13 to 15 and Table 1, it can be seen that for the circuit board of the embodiments of the present disclosure, the overflow glue thickness A of the waterproof glue 400 can be precisely controlled, and the overflow glue thickness A is basically maintained between 0.025 mm and 0.100 mm.

[0081] Table 1 Sectional data of the encapsulation effect of the circuit board

[0082]

[0083]

[0084] *W is the overflow glue width, that is, the extension distance of the waterproof glue 400 around the circuit board device 200;

[0085] **H is the maximum overflow glue thickness A, that is, the maximum thickness of the waterproof glue 400 on the top of the circuit board device 200;

[0086] ***S is the minimum overflow glue thickness A, that is, the minimum thickness of the waterproof glue 400 on the top of the circuit board device 200.

[0087] Based on the same inventive concept, embodiments of the present disclosure propose a display module, as Figure 16As shown, the display module includes a display panel 1000, the above-mentioned circuit board, and a circuit board adhesive. Among them, the display panel 1000 includes a display area 1100, a bending area 1200, and a bonding area 1300 that are connected in sequence. The bonding area 1300 is bent to the back of the display area 1100 through the bending area 1200; the circuit board is bonded to the bonding area 1300; the circuit board adhesive is provided between the circuit board body 100 and the back of the display area 1100.

[0088] Since the display module provided by the present utility model includes the circuit board of the above technical solution, the display module provided by the present utility model has all the beneficial effects of the above circuit board, which will not be elaborated here.

[0089] In some embodiments of the present disclosure, the display panel 1000 may be an Organic Light-Emitting Diode (OLED) display panel 1000. Optionally, the display panel 1000 may be a flexible OLED display panel 1000.

[0090] In some embodiments of the present disclosure, as Figure 16 shown, in the display module, a back film 2000, a polyimide adhesive layer 3000, and a support layer 4000 are sequentially stacked on the back of the display area 1100. Optionally, a bending protection adhesive 1210 may be provided on the outer side of the bend of the bending area 1200 to protect the bending area 1200; optionally, a back film 2000 is stacked on the back of the bonding area 1300 to protect the back of the bonding area 1300; optionally, when bending to the back of the display area 1100, a bending cushion layer is provided between the back film 2000 of the bonding area 1300 and the support layer 4000, and the bonding area 1300 is cushioned by the bending cushion layer 5000 to avoid defects such as creases caused by excessive bending of the bending area 1200. In some embodiments of the present disclosure, as Figure 16 shown, in the display module, the stacking structures at different positions are different. Among them, the thickest position of the display module is located in the device area of the circuit board, and the thickness of this position can be decomposed into the thickness of the display panel 1000, the thickness of the circuit board adhesive, the thickness of the circuit board body 100, the height of the circuit board device 200, and the thickness A of the overflow glue in the device area. The embodiments of the present disclosure mainly achieve the purpose of thinning the display module by thinning the thickness A of the overflow glue in the device area.

[0091] In some embodiments of the present disclosure, as Figure 16As shown in the figure, in the display module, the chip 1310 (IC) and its cover film (IC Cover Tape) are located on the bonding area 1300. After the chip 1310 is bonded to the bonding area 1300, a cover film can also be provided to protect the chip 1310 to prevent the chip 1310 from being exposed and damaged by bumps. In addition, the cover film can only be set after the chip 1310 is bonded to the bonding area 1300. Therefore, the material of the cover film is not suitable to be a thermosetting resin material to avoid damage to the display panel 1000 caused by the high temperature during the thermal curing of the thermosetting resin material used as the cover film. Optionally, the material of the cover film for the chip 1310 can be a photocuring resin material, and the photocuring resin material is cured by ultraviolet light. Based on the same inventive concept, an embodiment of the present disclosure provides a display device, and the display device includes the above-mentioned display module.

[0092] Since the display device provided by the present utility model includes the display module of the above technical solution, the display device provided by the present utility model has all the beneficial effects of the above display module, which will not be elaborated here.

[0093] In some embodiments of the present disclosure, as Figure 16 shown, in the display device, a battery 6000 can be provided at a position on the non-display side of the display module and adjacent to the circuit board. At the same time, a middle frame 7000 can also be provided on the back of the display device to support the battery 6000 and the display module.

[0094] Based on the same inventive concept, an embodiment of the present disclosure provides a method for encapsulating the above-mentioned circuit board, as Figure 8 and Figure 9 shown, the encapsulation method includes the following steps:

[0095] Fence 300 preparation step: Stick a fence 300 or spray a fence 300 material around the circuit board device 200 or the device area on the circuit board body 100 to form a fence 300; and,

[0096] Waterproof glue 400 preparation step: Fill the waterproof glue 400 within the fence 300.

[0097] In some embodiments of the present disclosure, during the encapsulation process of the circuit board, first, a fence 300 is adhered around the circuit board device 200 or the device area on the circuit board body 100, so as to set a fence 300 around the circuit board device 200 or the device area on the circuit board body 100. Then, a waterproof glue 400 can be dot-coated / applied within the range surrounded by the fence 300 through a dispensing head 600. The waterproof glue 400 has a certain fluidity and can flow within the range surrounded by the fence 300, so that the waterproof glue 400 can fill the spaces such as the gaps between the circuit board device 200 and the fence 300, and the gaps between the circuit board devices 200, etc., and the waterproof glue 400 encapsulates each circuit board device 200. Due to the existence of the fence 300 structure, the flow range of the waterproof glue 400 can be restricted. At the same time, combined with the dot-application amount of the waterproof glue 400, while restricting the flow range of the waterproof glue 400, the thickness of the waterproof glue 400 can also be restricted, and further, the overflow glue thickness A at the top of the circuit board device 200 can be precisely controlled. This can not only make the waterproof glue 400 have a good encapsulation effect, but also reduce the overflow glue thickness A to a certain extent, and finally achieve the purpose of reducing the overall thickness of the circuit board.

[0098] In some embodiments of the present disclosure, optionally, after the preparation step of the waterproof glue 400, the circuit board can be heated to thermally cure the waterproof glue 400.

[0099] In some embodiments of the present disclosure, as Figure 8 and Figure 9 shown, during the encapsulation process of the circuit board, first, on the circuit board body 100, a fence 300 material is sprayed around the circuit board device 200 or the device area through a dispensing head 600 to form a fence 300, so as to form a fence 300 around the circuit board device 200 or the device area on the circuit board body 100. Then, a waterproof glue 400 can be dot-coated / applied within the range surrounded by the fence 300 through a dispensing head 600. The waterproof glue 400 has a certain fluidity and can flow within the range surrounded by the fence 300, so that the waterproof glue 400 can fill the spaces such as the gaps between the circuit board device 200 and the fence 300, and the gaps between the circuit board devices 200, etc., and the waterproof glue 400 encapsulates each circuit board device 200. Due to the existence of the fence 300 structure, the flow range of the waterproof glue 400 can be restricted. At the same time, combined with the dot-application amount of the waterproof glue 400, while restricting the flow range of the waterproof glue 400, the thickness of the waterproof glue 400 can also be restricted, and further, the overflow glue thickness A at the top of the circuit board device 200 can be precisely controlled. This can not only make the waterproof glue 400 have a good encapsulation effect, but also reduce the overflow glue thickness A to a certain extent, and finally achieve the purpose of reducing the overall thickness of the circuit board.

[0100] In some embodiments of the present disclosure, as Figure 8 and Figure 9As shown, optionally, after the preparation step of the fence 300, the circuit board can be heated to thermally cure the fence 300 material; after the preparation step of the waterproof adhesive 400, the circuit board can be heated to thermally cure the waterproof adhesive 400. Optionally, after the preparation step of the waterproof adhesive 400, the circuit board can be heated to thermally cure the fence 300 material and the waterproof adhesive 400 simultaneously.

[0101] As an alternative embodiment, as Figure 9 and Figure 10 shown, in the preparation step of the waterproof adhesive 400, it further includes:

[0102] Pressing the waterproof adhesive 400 inside the fence 300 through the thin film 500.

[0103] In some embodiments of the present disclosure, by pressing the waterproof adhesive 400 inside the fence 300 with the thin film 500 during the preparation step of the waterproof adhesive 400, the speed of the waterproof adhesive 400 inside the fence 300 entering each gap during the pressing action of the thin film 500 can be increased, improving the preparation efficiency; it can also make the surface of the waterproof adhesive 400 smoother, avoiding the overall thickness of the circuit board being affected by the local excessive height of the waterproof adhesive 400; in addition, when the filling amount of the waterproof adhesive 400 within the range of the fence 300 is precisely controlled, the fence 300 can limit the flow range and height of the waterproof adhesive 400, and the pressing of the thin film 500 can simultaneously limit the height of the waterproof adhesive 400. Through the dual limitations of the fence 300 and the pressing of the thin film 500, it can be ensured that the part of the waterproof adhesive 400 covering the top of the circuit board device 200 is continuous and flat, which can not only avoid local bare defects but also make the overflow glue thickness A uniform, and keep the overflow glue thickness A within the minimum height difference ΔH between the fence 300 and the circuit board device 200.

[0104] In the present disclosure, unless otherwise clearly specified and defined, the first feature being “on” or “under” the second feature may include the first and second features being in direct contact, or may also include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being “above”, “over” and “on” the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being “under”, “beneath” and “under” the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0105] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present disclosure.

[0106] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure.

[0107] In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0108] Although the embodiments of the present disclosure have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present disclosure, and the scope of the present disclosure is defined by the claims and their equivalents.

Claims

1. A circuit board, characterized in that: The circuit board comprises: Circuit board body; At least one circuit board component, the circuit board component is arranged on the circuit board body to form a component area on the circuit board body; A fence, the fence surrounds the circuit board component and / or surrounds the component area and is arranged on the circuit board body, and the minimum height difference between the fence and the circuit board component is less than or equal to 0.10 mm; and Waterproof glue is filled in the fence and encapsulates the circuit board components.

2. The circuit board according to claim 1, characterized in that The fence includes a resin fence and / or a metal fence, and the resin fence and / or the metal fence are attached to the four sides of the circuit board device and / or the four sides of the device area.

3. The circuit board according to claim 2, characterized in that: The minimum distance between the resin fence and / or the metal fence and the circuit board component is 1.0 mm to 3.0 mm.

4. The circuit board according to claim 1, characterized in that: The material of the fence includes a first thermosetting resin, the viscosity of the first thermosetting resin is 20 Pa.s to 150 Pa.s, and the first thermosetting resin is coated around the circuit board device and / or the device area to form the fence.

5. The circuit board according to claim 1, wherein: The material of the waterproof glue includes a second thermosetting resin, and the viscosity of the second thermosetting resin is 2 Pa.s to 5 Pa.s.

6. The circuit board according to claim 1, wherein: The minimum height difference between the fence and the circuit board component is 0.03 mm to 0.10 mm.

7. The circuit board according to claim 1, characterized in that: The fence is rectangular or circular, or the fence follows the shape of the circuit board component and / or the component area.

8. The circuit board according to claim 1, wherein: The circuit board is a flexible circuit board.

9. A display module, characterized in that: The display module comprises: A display panel, the display panel comprising a display area, a bending area and a binding area connected in sequence, the binding area being bent to the back side of the display area through the bending area; A circuit board as described in any one of claims 1 to 8, wherein the circuit board is bound to the binding area; and a circuit board adhesive is arranged between the circuit board body and the back of the display area.

10. A display device, characterized in that: The display device comprises the display module as claimed in claim 9.

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