LED packaging mold easy to disassemble and assemble

Abstract

The utility model relates to the technical field of LED packaging, in particular to an LED packaging mold easy to disassemble and assemble, which comprises a base and an ejection device, a lower mold is installed on the surface of the base, an installation frame is installed on the surface of the base, an upper mold is arranged on the lower surface of the installation frame, the ejection device is arranged in the inner wall of the lower mold, and the ejection device comprises an installation ring. The surface of the mounting ring is fixedly connected with an air pump, the driving end of the air pump is fixedly connected with an air pipe, the surface of the lower mold is fixedly connected with a box body, the box body is hollow, the surface of the box body is provided with a first hole, the first hole in the surface of the box body is slidably connected with a column body, and the side, away from the air pump, of the air pipe communicates with the box body; according to the chip ejection device, a machined chip can be conveniently and rapidly ejected out, the usability of equipment is improved, the operation difficulty of the equipment is reduced, the safety of the equipment is improved, the discharging speed is conveniently increased, and use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a mold for LED packaging that is easy to disassemble and assemble. Background Art

[0002] The mold for LED packaging is a key component to ensure the quality and performance of LED products. It adopts high-precision manufacturing processes and can precisely shape the appearance and structure of LEDs. This kind of mold is usually made of high-quality steel, has excellent wear resistance and corrosion resistance, can operate stably for a long time, and has a well-designed structure that can effectively control the flow of packaging materials to ensure that the LED chips are evenly covered, thereby improving the luminous efficiency and stability.

[0003] In the prior art, such as the utility model with the publication number of CN203391230U, which relates to the field of molds and specifically to an LED packaging mold for PCB boards. It includes: an upper mold, a lower mold, convex ribs, and ejector pins; the PCB board is fixed on the upper surface of the lower mold; there are multiple cavities for accommodating LED sealant on the lower mold, and the cavities are arranged in multiple columns on the upper surface of the lower mold; there are multiple convex ribs arranged on the upper surface of the lower mold and located between adjacent columns of cavities; the convex ribs arranged on both sides of each column of cavities form an independent flow channel; the ejector pins are arranged on both sides of the lower mold. The LED packaging mold for PCB boards provided by the utility model has the independent flow channels arranged such that the LED sealant fills each cavity along each independent flow channel, reducing the situation of insufficient LED sealant in the cavities located behind the LED packaging mold, and thus avoiding the generation of bubbles during the LED packaging process; the setting of the independent glue ports enables the LED products to be better separated from the residual glue. However, after processing, the LED chips are easily adhered and stuck on the lower mold, making it difficult to remove them, which affects the processing efficiency of the equipment.

[0004] In order to solve the problem that after processing, the LED chips are easily adhered and stuck on the lower mold, making it difficult to remove them and affecting the processing efficiency of the equipment, the prior art uses the method of prying with tools for treatment. However, it is easy to damage the chips during the prying process, which further leads to the problem of inconvenient use of the equipment. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the disadvantages in the prior art that after processing, the LED chips are easily adhered and stuck on the lower mold, making it difficult to remove them and affecting the processing efficiency of the equipment, and to propose a mold for LED packaging that is easy to disassemble and assemble.

[0006] To achieve the above object, the present utility model adopts the following technical solutions: A mold for LED packaging that is easy to disassemble and assemble, comprising a base and an ejection device. A lower mold is installed on the surface of the base, and a mounting frame is installed on the surface of the base. An upper mold is provided on the lower surface of the mounting frame. The ejection device is arranged inside the inner wall of the lower mold. The ejection device includes a mounting ring, the mounting ring is fixedly connected to the base, an air pump is fixedly connected to the surface of the mounting ring, a trachea is fixedly connected to the driving end of the air pump, a box body is fixedly connected to the surface of the lower mold, the box body is hollow, a hole one is opened on the surface of the box body, and a column is slidably connected to the hole one on the surface of the box body. By providing the ejection device, it is convenient to quickly eject and discharge the processed chips, increasing the discharging efficiency of the equipment and the usability of the equipment.

[0007] Preferably, the side of the trachea away from the air pump is communicated with the box body, and a sealing ring is fixedly connected to the side of the box body close to the column. By providing the sealing ring, it is convenient to seal the sliding part of the column, facilitate the sliding of the column, and reduce the situation of gas leakage.

[0008] Preferably, there are two box bodies, and the two box bodies are arranged in mirror symmetry. By providing the box bodies, it is convenient to cooperate with the columns to eject the chips, increasing the usability of the equipment, reducing the operation difficulty of the equipment, and increasing the usability of the equipment.

[0009] Preferably, a cleaning device is provided on one side of the base. The cleaning device includes a guide rail, the guide rail is fixedly connected to the base, a slider is slidably connected to the surface of the guide rail, a nozzle is fixedly connected to the surface of the slider, a connecting pipe is fixedly connected to one side of the slider, the side of the connecting pipe away from the slider is fixedly connected to the trachea, and the connecting pipe is communicated with the nozzle. By providing the cleaning device, it is convenient to clean the lower mold, reducing the situation that impurities accumulate on the surface of the lower mold and affect processing, and reducing the maintenance burden of the equipment.

[0010] Preferably, a clamping block is fixedly connected to one side of the slider, and a threaded hole is opened on the surface of the clamping block. By providing the slider, during use, the slider is convenient to drive the nozzle to move, increasing the usability of the equipment, reducing the operation difficulty of the equipment, and improving the cleaning efficiency of the equipment.

[0011] Preferably, a driving machine is fixedly connected to one side of the guide rail, a lead screw is fixedly connected to the driving end of the driving machine, and the lead screw is threadedly connected to the threaded hole on the surface of the clamping block. By providing the driving machine, during use, it is convenient to drive the lead screw to rotate and cooperate with the slider to move, increasing the usability of the equipment and reducing the operation difficulty of the equipment.

[0012] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0013] In the present utility model, by providing an ejection device and a cleaning device, after the processing is completed, the air pump is started. The air pump drives the air flow to enter the box body through the air pipe. At this time, the air pressure in the box body squeezes the cylinder to slide upward and eject the chip. At the same time, during the process of ejecting the chip, the air flow reaches the nozzle through the connecting pipe and is ejected through the nozzle. At this time, the driving machine is started. The driving machine drives the screw rod to rotate, which is convenient for driving the nozzle to move and clean the surface of the lower mold. By providing the present utility model, it is convenient to quickly eject the processed chip, improving the usability of the equipment, reducing the operation difficulty of the equipment, enhancing the safety of the equipment, facilitating the acceleration of the blanking speed, and being convenient for use. Description of the Drawings

[0014] Figure 1 Fig. is a three-dimensional structural schematic diagram of a mold for LED packaging that is easy to disassemble and assemble proposed by the present utility model;

[0015] Figure 2 Fig. is a partial structural schematic diagram of a mold for LED packaging that is easy to disassemble and assemble proposed by the present utility model;

[0016] Figure 3 Fig. is a structural schematic diagram of the ejection device of a mold for LED packaging that is easy to disassemble and assemble proposed by the present utility model;

[0017] Figure 4 Fig. is a Figure 3 mold for LED packaging that is easy to disassemble and assemble proposed by the present utility model

[0018] Figure 5 Fig. is a structural schematic diagram of the cleaning device of a mold for LED packaging that is easy to disassemble and assemble proposed by the present utility model.

[0019] Legend: 1, base; 2, lower mold; 3, upper mold; 4, mounting frame; 5, ejection device; 51, box body; 52, air pipe; 53, air pump; 54, mounting ring; 55, cylinder; 56, sealing ring; 6, cleaning device; 61, slider; 62, nozzle; 63, clamping block; 64, screw rod; 65, guide rail; 66, driving machine; 67, connecting pipe. Detailed Embodiment

[0020] Please refer to Figures 1-5 , the present utility model provides a technical solution: a mold for LED packaging that is easy to disassemble and assemble, including a base 1 and an ejection device 5. The lower mold 2 is installed on the surface of the base 1, the mounting frame 4 is installed on the surface of the base 1, the upper mold 3 is arranged on the lower surface of the mounting frame 4, and the ejection device 5 is arranged inside the inner wall of the lower mold 2.

[0021] Next, the specific settings and functions of its ejection device 5 and cleaning device 6 will be specifically described.

[0022] In this embodiment: the ejection device 5 includes a mounting ring 54, the mounting ring 54 is fixedly connected to the base 1, the surface of the mounting ring 54 is fixedly connected to an air pump 53, the driving end of the air pump 53 is fixedly connected to an air pipe 52, the surface of the lower mold 2 is fixedly connected to a box body 51, the box body 51 is hollow, a hole 1 is opened on the surface of the box body 51, and a column 55 is slidably connected to the hole 1 on the surface of the box body 51. By setting the ejection device 5, it is convenient to quickly eject and unload the chips after processing, thereby increasing the unloading efficiency of the equipment and increasing the ease of use of the equipment.

[0023] Specifically, the side of the air pipe 52 away from the air pump 53 is connected to the box body 51, and the side of the box body 51 close to the column 55 is fixedly connected with a sealing ring 56. By providing the sealing ring 56, it is convenient to seal the sliding part of the column 55, so that the column 55 can slide easily and reduce gas leakage.

[0024] Specifically, there are two box bodies 51, and the two box bodies 51 are arranged in a mirror-symmetrical manner. By arranging the box bodies 51, it is convenient to cooperate with the column 55 to push out the chip, which increases the usability of the device, reduces the difficulty of operating the device, and increases the usability of the device.

[0025] Specifically, a cleaning device 6 is provided on one side of the base 1, and the cleaning device 6 includes a guide rail 65, which is fixedly connected to the base 1, a slider 61 is slidably connected to the surface of the guide rail 65, a nozzle 62 is fixedly connected to the surface of the slider 61, a connecting pipe 67 is fixedly connected to one side of the slider 61, a side of the connecting pipe 67 away from the slider 61 is fixedly connected to the air pipe 52, and the connecting pipe 67 is communicated with the nozzle 62.

[0026] In this embodiment: by providing a cleaning device 6, it is convenient to clean the lower mold 2, thereby reducing the accumulation of impurities on the surface of the lower mold 2 that affect processing and reducing the maintenance burden of the equipment.

[0027] Specifically, a clamping block 63 is fixedly connected to one side of the sliding block 61 , and a threaded hole is formed on the surface of the clamping block 63 .

[0028] In this embodiment, by providing a slider 61, when in use, the slider 61 facilitates the movement of the nozzle 62, thereby increasing the usability of the device, reducing the difficulty of operating the device, and improving the cleaning efficiency of the device.

[0029] Specifically, a driving machine 66 is fixedly connected to one side of the guide rail 65 , a screw rod 64 is fixedly connected to a driving end of the driving machine 66 , and the screw rod 64 is threadedly connected to a threaded hole on the surface of the clamping block 63 .

[0030] In this embodiment, by providing a driving machine 66, when in use, it is convenient to drive the screw rod 64 to rotate and move the slider 61, thereby increasing the usability of the device and reducing the difficulty of operating the device.

[0031] Working principle: By setting the ejecting device 5 and the cleaning device 6, after the processing is completed, the air pump 53 is started. The air pump 53 drives the air flow to enter the box body 51 through the air pipe 52. At this time, the air pressure in the box body 51 squeezes the cylinder 55 to slide upward and eject the chip. At the same time, during the process of ejecting the chip, the air flow reaches the nozzle 62 through the connecting pipe 67 and is ejected through the nozzle 62. At this time, the driving machine 66 is started, and the driving machine 66 drives the screw rod 64 to rotate to drive the nozzle 62 to move and clean the surface of the lower mold 2. By setting the present utility model, it is convenient to quickly eject the processed chip, improves the usability of the equipment, reduces the operation difficulty of the equipment, improves the safety of the equipment, facilitates accelerating the blanking speed, and is convenient for use.

Claims

1. An easily disassembled LED encapsulation mold, comprising a base (1) and an ejection device (5), characterized in that: A lower mold (2) is mounted on the surface of the base (1), a mounting frame (4) is mounted on the surface of the base (1), an upper mold (3) is arranged on the lower surface of the mounting frame (4), the ejection device (5) is arranged in the inner wall of the lower mold (2), the ejection device (5) comprises a mounting ring (54), the mounting ring (54) is fixedly connected to the base (1), an air pump (53) is fixedly connected to the surface of the mounting ring (54), a driving end of the air pump (53) is fixedly connected to an air pipe (52), a box body (51) is fixedly connected to the surface of the lower mold (2), the box body (51) is hollow, a hole (1) is opened on the surface of the box body (51), and a column (55) is slidably connected to the hole (1) on the surface of the box body (51).

2. The easily disassembled LED packaging mold according to claim 1, characterized in that: The side of the air pipe (52) away from the air pump (53) is connected to the box body (51), and the side of the box body (51) close to the column (55) is fixedly connected with a sealing ring (56).

3. The easily disassembled LED packaging mold according to claim 1, characterized in that: There are two box bodies (51), and the two box bodies (51) are arranged in a mirror-symmetrical manner.

4. The easily disassembled LED packaging mold according to claim 1, characterized in that: A cleaning device (6) is provided on one side of the base (1), and the cleaning device (6) comprises a guide rail (65), the guide rail (65) is fixedly connected to the base (1), a slider (61) is slidably connected to the surface of the guide rail (65), a nozzle (62) is fixedly connected to the surface of the slider (61), a connecting pipe (67) is fixedly connected to one side of the slider (61), a side of the connecting pipe (67) away from the slider (61) is fixedly connected to the air pipe (52), and the connecting pipe (67) is communicated with the nozzle (62).

5. The easily disassembled LED packaging mold according to claim 4, characterized in that: A clamping block (63) is fixedly connected to one side of the sliding block (61), and a threaded hole is provided on the surface of the clamping block (63).

6. The easily disassembled LED packaging mold according to claim 4, characterized in that: A driving machine (66) is fixedly connected to one side of the guide rail (65), a driving end of the driving machine (66) is fixedly connected to a screw rod (64), and the screw rod (64) is threadedly connected to a threaded hole on the surface of the clamping block (63).

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