Wafer feeding and discharging device and wafer chamfering machine

Abstract

The utility model relates to a wafer feeding and discharging device and a wafer chamfering machine. The wafer feeding and discharging device comprises a feeding assembly, a discharging assembly and a carrying assembly. The carrying assembly comprises a first carrying module, a second carrying module, a third carrying module and a fourth carrying module, the first carrying module is movably arranged on the second carrying module, the third carrying module is movably arranged on the fourth carrying module, the first carrying module is matched with the feeding assembly, and the third carrying module is matched with the discharging assembly. The wafer feeding and discharging device has a feeding state that the first carrying module moves to the position above the chamfering platform or a discharging state that the third carrying module moves to the position above the chamfering platform. According to the technical scheme, the problems that in the prior art, a wafer feeding and discharging device is large in occupied space and low in feeding and discharging efficiency are effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing equipment, and more particularly, to a wafer loading and unloading device and a wafer chamfering machine. Background Art

[0002] In various fields such as aerospace and optical fibers, semiconductor wafers are very important materials. During the processing of wafers, after cutting the ingot into wafers, if lapping is directly performed, chipping is likely to occur, resulting in wafer scrapping. Therefore, chamfering of the wafers is required before lapping.

[0003] When chamfering wafers, wafer loading and unloading of the wafer chamfering machine is involved. When some existing wafer chamfering machines perform loading and unloading, it is usually necessary to separately use a fixture, a robotic arm or a wafer picking device to carry the wafers. (For example: the authorized announcement number is: CN 221102046U, the name is: a semiconductor wafer picking device) By setting a suction component to suck the wafers, and then realizing the movement of the wafer position through a rotating component. To ensure loading and unloading, two sets of wafer picking devices can be separately set, located on one side or both sides of the wafer chamfering machine respectively, so as to realize the loading and unloading of the wafer chamfering machine. However, this kind of wafer loading and unloading device occupies a large space. One set of wafer picking device can also be set, adsorbing the wafers to be chamfered and then rotating to place the wafers to be chamfered on the chamfering machine. After the chamfering is completed, the chamfered wafers are transferred. After the transfer is completed, the wafers to be chamfered are adsorbed again. Although this setting method can realize loading and unloading, the efficiency is relatively low. Summary of the Utility Model

[0004] The present application provides a wafer loading and unloading device and a wafer chamfering machine to solve the problems of large space occupation and low loading and unloading efficiency of the wafer loading and unloading device in the prior art.

[0005] According to a wafer loading and unloading device provided by the present application, it includes: a loading component, a unloading component and a handling component. The handling component includes a first handling module, a second handling module, a third handling module and a fourth handling module. The first handling module is movably arranged on the second handling module, and the third handling module is movably arranged on the fourth handling module. The first handling module cooperates with the loading component, and the third handling module cooperates with the unloading component. The wafer loading and unloading device has a loading state where the first handling module moves above the chamfering platform, or an unloading state where the third handling module moves above the chamfering platform.

[0006] In some embodiments, the loading assembly includes a pushing structure, which includes a pushing cylinder, a wafer placement bin, a placement platform, and a support plate. The pushing cylinder and the placement platform are respectively located on both sides of the wafer placement bin, and the pushing cylinder and the placement platform are oppositely arranged. The wafer placement bin is arranged on the support plate. The wafer placement bin has openings on both sides facing the pushing cylinder and the placement platform, and the wafer placement bin has multiple layers.

[0007] In some embodiments, the loading assembly further includes a double-layer support frame and a lifting electric push rod. The double-layer support frame has a first-layer support frame and a second-layer support frame. The second-layer support frame is located below the first-layer support frame. The pushing cylinder is arranged on the first-layer support frame, and the lifting electric push rod is arranged on the second-layer support frame. The support plate is connected to the lifting electric push rod.

[0008] In some embodiments, the handling assembly further includes a first support frame. Both the second handling module and the fourth handling module are arranged on the first support frame. The second handling module includes a first driving motor, a first lead screw, and a first nut seat. The first driving motor is connected to the first end of the first support frame, the first driving motor is in transmission connection with the first end of the first lead screw, the second end of the first lead screw is rotatably arranged at the second end of the first support frame, and the first nut seat is movably sleeved on the circumferential outer side of the first lead screw.

[0009] In some embodiments, the first handling module includes a first cylinder and a first suction cup. The first cylinder includes a cylinder body, a piston, and a piston rod. The piston is movably arranged in the cylinder body, the piston rod is connected to the piston, the cylinder body is connected to the first nut seat, the first suction cup is connected to the piston rod, and the first suction cup is communicated with an externally provided negative pressure generating device.

[0010] In some embodiments, a slide rail is arranged on the first support frame. One side of the cylinder body facing the first support frame has a chute, and the chute is matched with the slide rail.

[0011] In some embodiments, the unloading assembly includes a second support frame and a placement box. The placement box is placed on the second support frame, and the placement box is correspondingly arranged with the third handling module.

[0012] The present application also provides a wafer chamfering machine, which is matched with the wafer loading and unloading device.

[0013] In some embodiments, the wafer chamfering machine includes a machine body and a chamfering platform. The chamfering platform is arranged on the machine body. The loading assembly and the unloading assembly are respectively located on both sides of the machine body, and the handling assembly is located above the chamfering platform.

[0014] In some embodiments, the side wall of the machine body has a placement groove, and the loading assembly is installed in the placement groove.

[0015] Applying the technical solution of the present application, the loading component is used to place the wafers to be chamfered, and the unloading component is used to place the wafers after chamfering. The first handling module is movably arranged on the second handling module, and the third handling module is movably arranged on the fourth handling module. The first handling module cooperates with the loading component, and the first handling module drives the wafers to be chamfered to move. The third handling module cooperates with the unloading component, and the third handling module drives the wafers after chamfering to move. This setting method makes the structures of the first handling module and the third handling module compact, occupying less space. Moreover, the first handling module and the third handling module are respectively arranged corresponding to the loading component and the unloading component, resulting in higher efficiency during handling. In the loading state, at this time, the first handling module moves the wafers to be chamfered to the chamfering platform, and the wafer chamfering process is carried out during the return movement of the first handling module. After the chamfering process is completed, it is exactly in the unloading state. At this time, the third handling module moves away the wafers after chamfering. This setting method can enable the loading, chamfering, and unloading to proceed in an orderly manner, and the speeds of wafer loading and unloading match each other, thereby greatly improving the production efficiency. The technical solution of the present application effectively solves the problems of large space occupation and low loading and unloading efficiency of the wafer loading and unloading device in the prior art. Description of the Drawings

[0016] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Shows the schematic structural diagram of the wafer loading and unloading device according to the embodiment of the present application;

[0019] Figure 2 Shows Figure 1 The partial enlarged schematic diagram at A in

[0020] Figure 3 Shows the schematic structural diagram of the handling component according to the embodiment of the present application;

[0021] Figure 4 Shows the schematic structural diagram of the loading component according to the embodiment of the present application.

[0022] Among them, the above-mentioned drawings include the following reference numerals:

[0023] 10. Loading component; 11. Pushing structure; 111. Pushing cylinder; 112. Wafer placement bin; 113. Placement platform; 114. Support plate; 12. Double-layer support frame; 13. Lifting electric push rod; 20. Unloading component; 21. Second support frame; 22. Placement box; 30. Handling component; 31. First handling module; 311. First cylinder; 312. First suction cup; 32. Second handling module; 321. First driving motor; 33. Third handling module; 34. Fourth handling module; 35. First support frame; 110. Machine body; 120. Chamfering platform. Detailed implementation manners

[0024] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The following will describe the present application in detail with reference to the drawings and in combination with the embodiments.

[0025] It should be pointed out that the following detailed descriptions are all illustrative and are intended to provide further descriptions of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0026] For the sake of description convenience, spatial relative terms such as "above...", "over...", "on the upper surface of...", "upper..." etc. can be used here to describe the spatial position relationship between a device or feature shown in the figure and other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the figure is inverted, the device described as "above other devices or structures" or "over other devices or structures" will be positioned as "below other devices or structures" or "under other devices or structures" afterwards. Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and corresponding explanations are made for the spatial relative descriptions used here.

[0027] Such as Figures 1 to 4As shown in the figure, a wafer loading and unloading device provided by an embodiment includes a loading component 10, an unloading component 20, and a handling component 30. The handling component 30 includes a first handling module 31, a second handling module 32, a third handling module 33, and a fourth handling module 34. The first handling module 31 is movably disposed on the second handling module 32, and the third handling module 33 is movably disposed on the fourth handling module 34. The first handling module 31 corresponds to the loading component 10, and the third handling module 33 corresponds to the unloading component 20. The wafer loading and unloading device has a loading state in which the first handling module 31 moves above the chamfering platform, or an unloading state in which the third handling module 33 moves above the chamfering platform.

[0028] Applying the technical solution of this embodiment, the loading component 10 is used to place the wafers to be chamfered, and the unloading component 20 is used to place the wafers after chamfering. The first handling module 31 is movably disposed on the second handling module 32, and the third handling module 33 is movably disposed on the fourth handling module 34. The first handling module 31 cooperates with the loading component 10, and the first handling module 31 drives the wafers to be chamfered to move. The third handling module 33 cooperates with the unloading component 20, and the third handling module 33 drives the wafers after chamfering to move. This setting method makes the structures of the first handling module 31 and the third handling module 33 compact, occupying less space, and the first handling module 31 and the third handling module 33 are respectively arranged corresponding to the loading component 10 and the unloading component 20, with higher efficiency during handling. In the loading state, at this time, the first handling module 31 moves the wafers to be chamfered to the chamfering platform 120, and the wafer chamfering process is carried out during the return movement of the first handling module 31. After the chamfering process is completed, it is exactly in the unloading state. At this time, the third handling module 33 moves away the wafers after chamfering. This setting method can make the loading, chamfering, and unloading proceed in an orderly manner, and the speeds of wafer loading and unloading match each other, thereby greatly improving the production efficiency. The technical solution of this embodiment effectively solves the problems of large space occupation and low loading and unloading efficiency of the wafer loading and unloading device in the prior art.

[0029] Such as Figure 2As shown, in some embodiments, the loading assembly 10 includes a pushing structure 11, and the pushing structure 11 includes a pushing cylinder 111, a wafer placement bin 112, a placement platform 113 and a support plate 114. The pushing cylinder 111 and the placement platform 113 are respectively located on both sides of the wafer placement bin 112, and the pushing cylinder 111 and the placement platform 113 are arranged relative to each other. The pushing cylinder 111 can push the wafer placed on the wafer placement bin 112 to the placement platform 113. The wafer placement bin 112 is arranged on the support plate 114. The wafer placement bin 112 has openings on both sides facing the pushing cylinder 111 and the placement platform 113. This arrangement enables the pushing cylinder 111 to push the wafer against the top of the wafer to achieve the pushing of the wafer, and the wafer can be pushed from the opening to the placement platform 113. The wafer placement bin 112 has multiple layers, and wafers are placed on each layer. The placement platform 113 has a groove that fits the outer side of the wafer in the circumferential direction, and the groove can limit the position of the wafer.

[0030] like Figure 4 As shown, in some embodiments, the loading assembly 10 further includes a double-layer support frame 12 and a lifting electric push rod 13, the double-layer support frame 12 has a first-layer support frame and a second-layer support frame, the second-layer support frame is located below the first-layer support frame, the push cylinder 111 is arranged on the first-layer support frame, the placement platform 113 is arranged on the first-layer support frame, the first-layer support frame has a lifting port, the support plate 114 is located in the lifting port, the lifting electric push rod 13 is arranged on the second-layer support frame, the support plate 114 is connected to the lifting electric push rod 13, and the lifting electric push rod 13 can drive the support plate 114 to rise and fall, thereby driving the wafer placement bin 112 to rise and fall. The lifting speed of the wafer placement bin 112 matches the pushing speed of the push cylinder 111, and the height of the wafer placement bin 112 rising or falling each time is the thickness of a wafer.

[0031] like Figure 3 and Figure 4 As shown, in some embodiments, the transport assembly 30 also includes a first support frame 35, the second transport module 32 and the fourth transport module 34 are both arranged on the first support frame 35, the second transport module 32 includes a first drive motor 321, a first lead screw and a first nut seat, the first drive motor 321 is connected to the first end of the first support frame 35 to support the first drive motor 321, the first drive motor 321 is transmission-connected to the first end of the first lead screw, the first drive motor 321 drives the first lead screw to rotate, the second end of the first lead screw is rotatably arranged at the second end of the first support frame 35, and a rotating hole is set on the first support frame 35 or a bearing seat is installed to support the first lead screw, the first nut seat is movably sleeved on the circumferential outer side of the first lead screw, and as the first lead screw rotates, the first nut seat moves along the extension direction of the first lead screw.

[0032] like Figure 3As shown, in some embodiments, the first handling module 31 includes a first cylinder 311 and a first suction cup 312. The first cylinder 311 includes a cylinder block, a piston, and a piston rod. The piston is movably disposed within the cylinder block. The piston rod is connected to the piston. The cylinder block is connected to the first nut seat. The first nut seat drives the cylinder block to move synchronously. The first suction cup 312 is connected to the piston rod. The piston rod drives the first suction cup 312 to move up and down to adjust the height, facilitating the first suction cup 312 to adsorb the wafer on the placement platform 113. The first suction cup 312 is connected to an external negative pressure generating device, and the negative pressure generating device provides the adsorption force.

[0033] In some embodiments, a slide rail is provided on the first support frame 35. One side of the cylinder block facing the first support frame 35 has a chute, and the chute is matched with the slide rail. This setting makes the cylinder block more stable during the movement process. It should be noted that the fourth handling module 34 includes a second driving motor, a second lead screw, and a second nut seat. The second driving motor is connected to the third end of the first support frame 35. The second driving motor is drivingly connected to the first end of the second lead screw. The second end of the second lead screw is rotatably disposed on the second end of the first support frame 35. The second nut seat is movably sleeved on the circumferential outer side of the second lead screw. The third handling module 33 includes a second cylinder and a second suction cup. The fourth handling module 34 and the second handling module 32 have the same structure and the same principle. The third handling module 33 and the first handling module 31 have the same structure and the same principle, and will not be described in detail here.

[0034] As Figure 4 As shown, in some embodiments, the blanking assembly 20 includes a second support frame 21 and a placement box 22. The placement box 22 is placed on the second support frame 21. The placement box 22 is correspondingly arranged with the third handling module 33. The second suction cup moves the chamfered wafer into the placement box 22. A through hole is provided on the side wall of the body 110 of the wafer chamfering machine. At least part of the placement box 22 is movably passed through the through hole. The purpose of this setting is to be able to move the placement box 22 to fill the chamfered wafers along the extending direction of the placement box 22, and the movement path of the third handling module 33 does not need to be adjusted.

[0035] It should be noted that the wafer loading and unloading device further includes a controller and multiple groups of displacement sensors. The controller is electrically connected to the pushing cylinder 111, the lifting electric push rod 13, the first driving motor 321, the first cylinder 311, the second driving motor, and the second cylinder for control. The multiple groups of displacement sensors can be set according to actual use. The displacement sensors can detect the lifting height of the lifting electric push rod 13, the moving distance of the first handling module 31, and the moving distance of the third handling module 33. And the multiple groups of displacement sensors are electrically connected to the controller and can transmit the detected signals to the controller.

[0036] As Figure 1As shown in the figure, this embodiment further provides a wafer chamfering machine, which cooperates with a wafer loading and unloading device. The wafer chamfering machine includes a body 110 and a chamfering platform 120. The chamfering platform 120 is arranged on the body 110. The loading component 10 and the unloading component 20 are respectively located on both sides of the body 110, and the handling component 30 is located above the chamfering platform 120. There is a notch on the side wall of the body 110, and a part of the first support frame 35 is inserted into the notch. This setting method enables the wafer loading and unloading device to greatly reduce the occupied space while loading and unloading the wafer chamfering machine.

[0037] As Figure 4 shown in the figure, in some embodiments, there is a placement groove on the side wall of the body 110, and the loading component 10 is installed in the placement groove to ensure loading while reducing the occupied space.

[0038] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of the present application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0040] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer loading and unloading device, characterized in that: include: Feeding assembly (10); A blanking assembly (20); A conveying assembly (30), wherein the conveying assembly (30) comprises a first conveying module (31), a second conveying module (32), a third conveying module (33), and a fourth conveying module (34); the first conveying module (31) is movably arranged on the second conveying module (32); the third conveying module (33) is movably arranged on the fourth conveying module (34); the first conveying module (31) cooperates with the loading assembly (10); the third conveying module (33) cooperates with the unloading assembly (20); the wafer unloading and loading device has a loading state in which the first conveying module (31) moves to a position above a chamfering platform (120), or a unloading state in which the third conveying module (33) moves to a position above the chamfering platform (120).

2. The wafer loading and unloading device according to claim 1, characterized in that: The loading assembly (10) comprises a pushing structure (11), and the pushing structure (11) comprises a pushing cylinder (111), a wafer placement bin (112), a placement platform (113) and a support plate (114). The pushing cylinder (111) and the placement platform (113) are respectively located on two sides of the wafer placement bin (112), and the pushing cylinder (111) and the placement platform (113) are arranged opposite to each other. The wafer placement bin (112) is arranged on the support plate (114). The wafer placement bin (112) has openings on both sides facing the pushing cylinder (111) and the placement platform (113), and the wafer placement bin (112) has multiple layers.

3. The wafer loading and unloading device according to claim 2, characterized in that: The loading assembly (10) also includes a double-layer support frame (12) and a lifting electric push rod (13), the double-layer support frame (12) has a first-layer support frame and a second-layer support frame, the second-layer support frame is located below the first-layer support frame, the pushing cylinder (111) is arranged on the first-layer support frame, the lifting electric push rod (13) is arranged on the second-layer support frame, and the support plate (114) and the lifting electric push rod (13) are connected.

4. The wafer loading and unloading device according to claim 1, characterized in that: The transport assembly (30) further comprises a first support frame (35), the second transport module (32) and the fourth transport module (34) are both arranged on the first support frame (35), the second transport module (32) comprises a first drive motor (321), a first lead screw and a first nut seat, the first drive motor (321) is connected to the first end of the first support frame (35), the first drive motor (321) is transmission-connected to the first end of the first lead screw, the second end of the first lead screw is rotatably arranged on the second end of the first support frame (35), and the first nut seat is movably sleeved on the circumferential outer side of the first lead screw.

5. The wafer loading and unloading device according to claim 4, characterized in that: The first transport module (31) includes a first cylinder (311) and a first suction cup (312), the first cylinder (311) includes a cylinder body, a piston and a piston rod, the piston is movably arranged in the cylinder body, the piston rod is connected to the piston, the cylinder body is connected to the first nut seat, the first suction cup (312) is connected to the piston rod, and the first suction cup (312) is connected to an external negative pressure generating device.

6. The wafer loading and unloading device according to claim 5, characterized in that: The first support frame (35) is provided with a slide rail, and the cylinder body has a slide groove on one side facing the first support frame (35), and the slide groove cooperates with the slide rail.

7. The wafer loading and unloading device according to claim 1, characterized in that: The unloading assembly (20) comprises a second supporting frame (21) and a placement box (22), wherein the placement box (22) is placed on the second supporting frame (21), and the placement box (22) and the third transport module (33) are arranged correspondingly.

8. A wafer chamfering machine, characterized in that: The wafer chamfering machine cooperates with the wafer loading and unloading device, and the wafer loading and unloading device is the wafer loading and unloading device according to any one of claims 1 to 7.

9. The wafer chamfering machine according to claim 8, characterized in that: The wafer chamfering machine comprises a body (110) and the chamfering platform (120), wherein the chamfering platform (120) is arranged on the body (110), the loading assembly (10) and the unloading assembly (20) are respectively located on two sides of the body (110), and the transport assembly (30) is located above the chamfering platform (120).

10. The wafer chamfering machine according to claim 9, characterized in that: The side wall of the fuselage (110) has a placement groove, and the loading assembly (10) is installed in the placement groove.

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