Alignment detection device and process control system

Abstract

The utility model provides an alignment detection device and a process control system, the alignment detection device comprises a processor and an alignment processing module, and the alignment processing module comprises a signal transmitting unit and a signal reflecting unit; the signal transmitting unit and the signal reflecting unit are respectively positioned on the two to-be-tested structures at the outermost end; in a calibration alignment state, the signal transmitting unit, each positioning hole and the signal reflecting unit are located on the same alignment datum line; during actual alignment detection, the signal transmitting unit is used for transmitting an initial signal; the signal reflection unit is used for emitting a reflection signal; the processor is used for receiving the reflection signal and sending out a first prompt signal for representing the alignment state between different structures to be detected; and / or sending a first alignment adjustment instruction used for representing the alignment processing operation. According to the invention, accurate alignment detection and adjustment can be carried out on multiple modules anytime and anywhere, and accurate butt joint between the modules and the stability of the overall structure are ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of industrial manufacturing technology, and in particular to an alignment detection device and a process control system. Background Art

[0002] In modern industrial manufacturing, especially in integrated circuit wafer manufacturing, it is crucial to ensure that multiple equipment modules maintain precise horizontal alignment during production, transportation and final installation.

[0003] However, in the traditional production and transportation process, it is often impossible to guarantee that the multiple modules can still achieve the alignment accuracy in the initial state after experiencing long-distance transportation, changes in the on-site environment and other factors, which affects the entire process. Summary of the invention

[0004] The technical problem to be solved by the present disclosure is to overcome the defects existing in the above-mentioned prior art and to provide an alignment detection device and a process control system.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] The present disclosure provides an alignment detection device, the alignment detection device comprising a processor and N alignment processing modules, the alignment processing module comprising a signal transmitting unit and a signal reflecting unit communicatively connected to the processor, N is a positive integer;

[0007] When performing alignment detection on different structures to be tested in any detection state, the signal transmitting unit and the signal reflecting unit are respectively located on the two outermost structures to be tested, and a positioning hole is provided on each structure to be tested;

[0008] In a calibrated alignment state, the signal transmitting unit, each of the positioning holes and the signal reflecting unit are located on the same alignment reference line;

[0009] When performing actual alignment detection on different structures to be tested, the signal transmitting unit is used to transmit an initial signal along a preset transmission direction;

[0010] The signal reflecting unit is used for sending a reflected signal to the signal transmitting unit based on the initial signal;

[0011] The processor is used to receive the reflection signal, issue a first prompt signal for representing the alignment status between different structures to be tested; and / or issue a first alignment adjustment instruction for representing an alignment processing operation.

[0012] Preferably, the signal reflection unit includes a reflection surface structure disposed opposite to the signal transmission unit, and the reflection surface structure is configured to reflect the incoming initial signal so as to reflect the reflected signal to the signal transmission unit.

[0013] Preferably, the reflection surface structure includes a circular reflection surface, and the center of the circular reflection surface is on the alignment reference line in the calibrated alignment state;

[0014] Wherein, the circular reflection surface is sequentially provided with M different annular regions from the center to the periphery, and the roughness increases sequentially; M≥2 and is an integer.

[0015] Preferably, the signal transmission unit includes a laser emitter, and the initial signal is a laser signal;

[0016] and / or

[0017] A laser level is used to emit a laser in the preset transmission direction to perforate different measured structures, so as to obtain a plurality of positioning holes on the same alignment reference line.

[0018] Preferably, different measured structures include different steel frame structures configured to cooperate with a preset object;

[0019] Wherein, after different steel frame structures are installed and connected, the signal transmission unit is disposed on the outermost structure of one steel frame structure at one end, and the signal reflection unit is disposed on the inner side wall of the outermost structure of one steel frame structure at the other end;

[0020] Preferably, when N≥2, in the calibrated alignment state, the signal transmission unit, each positioning hole, and the signal reflection unit of the same alignment processing module are located on the same alignment reference line, and different alignment processing modules correspond to different alignment reference lines;

[0021] The processor is configured to receive the reflected signals in each alignment processing module in the same actual alignment detection state, and issue a second prompt signal for characterizing the alignment state between different measured structures; and / or issue a second alignment adjustment instruction for characterizing the alignment processing operation.

[0022] Preferably, each alignment processing module is sequentially disposed on the same detection surface corresponding to all the steel frame structures according to a preset layout manner;

[0023] and / or

[0024] Different measured structures installed at both ends are provided with different identification information.

[0025] Preferably, the alignment detection device further includes a plurality of alignment adjustment structures provided on each of the structures to be measured, and the alignment adjustment structures are communicatively connected to the processor;

[0026] The processor is configured to send a first alignment adjustment instruction to the matching alignment adjustment structure to drive and adjust the position of the corresponding structure to be measured to a target position.

[0027] Preferably, the alignment adjustment structure includes a driving unit communicatively connected to the processor, and an execution unit connected to the driving unit and provided at the bottom position of the structure to be measured;

[0028] The driving unit is configured to drive the execution unit to drive the structure to be measured to move to the target position based on the first alignment adjustment instruction sent by the processor;

[0029] Wherein, the execution unit includes a plurality of horizontal moving components and / or lifting moving components.

[0030] Preferably, the alignment detection device further includes a prompting unit communicatively connected to the processor;

[0031] The prompting unit is configured to perform a prompting operation based on the received first prompting signal or the second prompting signal;

[0032] Or,

[0033] The prompting unit is configured to perform a prompting operation based on an abnormal signal received indicating that no feedback signal has been received within a preset time period;

[0034] Wherein, the prompting unit includes at least one of a lighting prompting component, a voice prompting component, and a display interface component for text prompting.

[0035] The present disclosure also provides a process control system, the process control system includes the alignment detection device as described above, and a process operation component;

[0036] The alignment detection device is configured to perform alignment adjustment on different structures to be measured;

[0037] The process operation component is configured to perform corresponding process operations on a preset object based on the transportation paths provided by the different structures to be measured after alignment adjustment.

[0038] On the basis of conforming to the common knowledge in the art, the above preferred conditions can be combined arbitrarily to obtain various preferred examples of the present disclosure.

[0039] The positive and progressive effects of the present disclosure are as follows:

[0040] The alignment detection device of the present disclosure can achieve timely and accurate detection of the alignment state between multiple modules at any alignment detection scenario and any alignment detection moment, and can automatically drive alignment adjustment or remind manual participation for adjustment when the alignment state does not reach the preset alignment accuracy, so as to quickly achieve the purpose of alignment adjustment, thereby effectively ensuring alignment detection and adjustment between multiple modules at any time and anywhere, ensuring the precise docking between modules and the stability of the overall structure, achieving high-quality detection of the alignment situation between multiple modules throughout the entire process of the process scenario, ensuring that the module installation in different scenarios reaches the accuracy that enables the manipulator to move normally, and further ensuring the smoothness and reliability of the entire process flow.

[0041] In addition, the automated alignment detection solution in this solution can not only improve the production efficiency of the entire process, but also optimize the product quality, ensuring the close cooperation between modules; this alignment detection solution can be applied to various application scenarios using module steel frames, with good compatibility, adaptability and reliability, and can significantly improve the professionalism and fineness of the entire production process. Brief Description of the Drawings

[0042] Figure 1 It is a module schematic diagram of the alignment detection device according to Embodiment 1 of the present disclosure.

[0043] Figure 2 It is a structural schematic diagram of the alignment detection device according to Embodiment 2 of the present disclosure.

[0044] Figure 3 It is a structural schematic diagram of the circular reflecting surface according to Embodiment 2 of the present disclosure.

[0045] Figure 4 It is a module schematic diagram of the alignment detection device according to Embodiment 2 of the present disclosure.

[0046] Figure 5 It is a module schematic diagram of the process control system according to Embodiment 3 of the present disclosure. Detailed Embodiments

[0047] The present disclosure will be further described below by way of embodiments, but the present disclosure is not limited thereto within the scope of the described embodiments.

[0048] In the embodiments of the present disclosure, prefix words such as "first" and "second" are only used to distinguish different described objects, and have no restrictive effect on the position, order, priority, quantity, content, etc. of the described objects. The use of prefix words such as ordinal numbers for distinguishing described objects in the embodiments of the present disclosure does not constitute a limitation on the described objects. The statements of the described objects refer to the descriptions in the context of the claims or embodiments, and should not constitute redundant limitations due to the use of such prefix words. In addition, in the description of this embodiment, unless otherwise specified, the meaning of "a plurality" is two or more.

[0049] In the process of integrated circuit manufacturing, the manipulator of the equipment holds the wafer and transports it back and forth multiple times along a straight track between multiple modules; if the installation between multiple modules cannot reach the preset alignment accuracy, when the equipment is working, the manipulator transporting the wafer along the straight line is very likely to be affected because the straight tracks of the modules are not aligned, resulting in its inability to perform normal and orderly straight-line motion work; further affecting the normal electroplating work rhythm, thus causing a great impact on the entire process flow; and the existing solutions cannot solve the alignment deviation problems that may occur during the transportation and on-site installation of multiple modules.

[0050] In the present disclosure, in view of the above existing problems, an alignment detection device is innovatively proposed, which can timely and accurately detect the alignment state between multiple modules at any alignment detection scenario and any alignment detection moment, and can automatically drive alignment adjustment or remind manual participation for adjustment when the alignment state does not reach the preset alignment accuracy, so as to quickly achieve the purpose of alignment adjustment, enabling the installation of multiple modules in different scenarios to reach the accuracy that allows the manipulator to move normally, and further ensuring the smoothness and reliability of the entire process flow. Specifically:

[0051] Embodiment 1

[0052] As Figure 1 shown, the alignment detection device of this embodiment includes a processor 1 and N alignment processing modules 2. The alignment processing module 2 includes a signal transmitting unit 3 and a signal reflecting unit 4 that are communicatively connected to the processor 1, and N is a positive integer;

[0053] Among them, the signal transmitting unit 3 includes, but is not limited to, a laser emitter; the signal transmitting unit 3 can be integrally provided with the processor 1, or the processor 1 can be independent of the signal transmitting unit 3. How to set it specifically can be designed or adjusted according to actual scenario requirements.

[0054] Specifically, the alignment detection device is integrally provided on an existing structure to be measured (or called a module) to achieve high-quality detection of whether the preset alignment accuracy is reached between two or more structures to be measured (or called multiple modules) after installation.

[0055] When performing alignment detection on different structures to be measured in any detection state, the signal transmitting unit 3 and the signal reflecting unit 4 are respectively located on the two outermost structures to be measured, and positioning holes are provided on each structure to be measured;

[0056] In the calibrated alignment state, the signal transmitting unit 3, each positioning hole, and the signal reflecting unit 4 are located on the same alignment reference line;

[0057] When performing actual alignment detection on different structures to be measured, the signal transmitting unit 3 is used to transmit an initial signal along a preset transmission direction;

[0058] The signal reflecting unit 4 is used to emit a reflected signal to the signal transmitting unit 3 based on the initial signal;

[0059] The processor 1 is used to receive the reflected signal and issue a first prompt signal for characterizing the alignment state between different structures to be measured; and / or issue a first alignment adjustment instruction for characterizing the alignment processing operation.

[0060] After multiple modules are produced and initially determined to reach a horizontal state, the alignment detection device is used to determine whether the multiple modules are in a preset alignment state, such as a horizontal alignment state, in this actual alignment state. In this solution, it is possible to detect the alignment state between multiple modules in a timely and accurate manner at any alignment detection scenario and any alignment detection moment, and to automatically drive alignment adjustment or remind manual participation for adjustment when the alignment state does not reach the preset alignment accuracy, so as to quickly achieve the purpose of alignment adjustment, thereby effectively ensuring the alignment detection and adjustment of multiple modules at any time and place, ensuring the precise docking between modules and the stability of the overall structure, realizing high-quality detection of the alignment situation between multiple modules in the entire process of the process scenario, ensuring that the module installation in different scenarios reaches the accuracy that can enable the manipulator to move normally, and further ensuring the smoothness and reliability of the entire process flow.

[0061] In addition, the automated alignment detection solution in this solution can not only improve the production efficiency of the entire process, but also optimize the product quality, ensuring the close cooperation between modules; this alignment detection solution can be applied to various application scenarios using module steel frames, with good compatibility, adaptability and reliability, and can significantly improve the professionalism and fineness of the entire production process.

[0062] Embodiment 2

[0063] The alignment detection device of this embodiment is a further improvement of Embodiment 1. Specifically:

[0064] In an implementable solution, a laser level is used to emit a laser in a preset transmission direction to perforate different structures to be measured, so as to obtain a number of positioning holes on the same alignment baseline.

[0065] Specifically, in the production stage, after each structure to be measured is installed and connected, a laser level is used to precisely mark and perforate these structures to be measured along the preset transmission direction, so as to establish a stable alignment baseline for the through-module.

[0066] As Figure 2 shown, a signal transmitting unit 3 and a signal reflecting unit 4 are respectively arranged at the same height position where these positioning holes are located, and the position parameters corresponding to the laser level during perforation are used as the position parameters of the signal transmitting unit 3 and remain unchanged, so as to ensure that at this position and angle, the laser signal emitted by the signal transmitting unit 3 can accurately pass through all the positioning holes and fall on the signal reflecting unit 4 and reflect the reflected signal to the laser transmitter, forming a clear alignment baseline ( Figure 2 the dotted line in).

[0067] In addition, according to the actual alignment accuracy requirements, these positioning holes can be precisely processed, such as precisely processing round holes with a diameter of 3-5 mm. These round holes not only serve as the transmission path of the laser signal, but also allow adjustment by manual adjustment outside this error range to prevent laser diffraction, ensure the straight-line propagation of the laser signal, ensure the effectiveness of the reflected laser signal, and thus ensure the quality and reliability of the subsequent determination of the alignment deviation.

[0068] In an implementable solution, the signal reflecting unit 4 includes a reflecting surface structure arranged opposite to the signal transmitting unit 3, and the reflecting surface structure is used to reflect the incoming initial signal so as to reflect the reflected signal to the signal transmitting unit 3.

[0069] In this solution, through the design of the reflecting surface structure, the signal emitted by the signal reflecting unit 4 is effectively reflected, ensuring that the signal transmitting unit 3 can receive and transmit it to the processor 1. Then, the processor 1 processes and analyzes the intensity and position of the reflected signal to obtain the alignment deviation situation (deviation in the horizontal direction and deviation in the vertical direction) between different structures to be measured, providing quantitative alignment data for facilitating the subsequent automatic adjustment of the position of the alignment module; or facilitating relevant personnel to quickly identify the alignment deviation and perform manual intervention adjustment to ensure the precise docking between modules and the stability of the overall structure.

[0070] In an implementable solution, the reflecting surface structure includes a circular reflecting surface, and the center of the circular reflecting surface is on the alignment baseline in the calibrated alignment state;

[0071] Among them, the circular reflecting surface is successively provided with M different annular regions from the center to the periphery, and the roughness increases successively; M≥2 and is an integer.

[0072] The signal transmitting unit 3 includes a laser transmitter, and the initial signal is a laser signal; among them, the linearity of the laser signal can meet the module structure of high-precision cooperation, ensuring the precise alignment between modules.

[0073] Specifically, the different roughnesses of the annular regions have different reflection performances on the emitted laser signal. In this way, the alignment deviation degree between multiple modules can be determined according to the strength of the reflected signal per unit area;

[0074] The stronger the intensity of the reflected signal per unit area, the closer the reflection point where the emitted laser signal falls on the circular reflecting surface is to the center position, and the lower the alignment deviation degree; conversely, the lower the intensity of the reflected signal per unit area, the farther the reflection point where the emitted laser signal falls on the circular reflecting surface is from the center position, and the higher the alignment deviation degree.

[0075] For example, as Figure 3 shown, the circular reflecting surface a includes 2 different annular regions b1 and b2: a circular region with low roughness in the center and an annular region with high roughness on the periphery. The roughness of the circular region is controlled within the range of 6.3<Ra<3.2 (Ra is the roughness symbol), and the outer annular region is within the range of 8.3<Ra<6.2. In addition, black or transparent materials are used to optimize the reflection performance of the emitted laser signal, ensuring the quality of the reflected signal, and further ensuring the accuracy of the alignment result finally determined by the processor 1.

[0076] Of course, specifically, the processor 1 analyzes the intensity and position of the reflected signal to obtain the alignment deviation data (deviation in the horizontal direction and deviation in the vertical direction) between different structures to be measured.

[0077] In this solution, multiple reflection regions with different roughnesses are arranged on the circular reflecting surface. Through the different effects of different reflection regions on the same laser signal to different degrees, it is possible to directly determine the position range where the emitted laser signal falls at a position deviating from the center position of the circular reflecting surface based on the reflected signal, that is, to determine whether multiple modules have achieved high-precision alignment and the degree of deviation; if not, automatic or manual adjustment is performed so that after adjustment, for multiple modules, the laser signal passes through the positioning holes of each module and then falls at the center position of the circular reflecting surface and is reflected back to the signal transmitting unit 3, ensuring the effect of high-precision alignment adjustment.

[0078] In an implementable solution, different structures to be measured include different steel frame structures for cooperating with a preset object;

[0079] Among them, after different steel frame structures are installed and connected, a signal transmitting unit 3 is arranged on the outermost structure of one steel frame structure at one end, and a signal reflecting unit 4 is arranged on the inner side wall of the outermost structure of one steel frame structure at the other end.

[0080] As Figure 2 shown, taking the structure after the installation of 2 structures to be measured (steel frame structure A and steel frame structure B) as an example, a laser transmitter C is arranged on the steel frame structure A, and a reflecting surface structure D cooperating with the laser transmitter is arranged on the steel frame structure B. The laser transmitter emits a laser signal in a preset transmission direction, passes through the positioning holes E opened on the steel frame structure A and the steel frame structure B in sequence to reach the reflecting surface structure for reflection, and the reflected signal is transmitted back to the laser transmitter, and whether the steel frame structure A and the steel frame structure B are aligned is obtained through the laser transmitter C or the processor 1.

[0081] In an implementable solution, when N≥2, in the calibrated alignment state, the signal transmitting unit 3, each positioning hole, and the signal reflecting unit 4 of the same alignment processing module 2 are located on the same alignment reference line, and different alignment processing modules 2 correspond to different alignment reference lines;

[0082] The processor 1 is configured to receive the reflected signals in each alignment processing module 2 in the same actual alignment detection state, and issue a second prompt signal for characterizing the alignment state between different structures to be measured; and / or issue a second alignment adjustment instruction for characterizing the alignment processing operation.

[0083] In this solution, for multiple modules, alignment detection can be performed through a group of alignment processing modules 2, or through two or more groups of alignment processing modules 2; for example, when two groups of alignment processing modules 2 are set for alignment detection, each group of alignment processing modules 2 is similar to Figure 2 the above settings. The difference is that two groups of alignment processing modules 2 are arranged from top to bottom. The reflected signals obtained by the two groups of alignment processing modules 2 in the same alignment detection state are jointly analyzed, that is, it can effectively avoid relying only on a group of alignment processing modules 2. If the alignment processing module 2 fails, it will cause situations such as inability to perform alignment detection and inaccurate alignment detection results. The alignment result is determined jointly by the reflected signals of the two groups of alignment processing modules 2. If the alignment results determined based on the two reflected signals are consistent, the alignment result is determined to be valid; or when another reflected signal cannot be obtained, at this time, the final alignment result is determined based on the obtained one reflected signal, thus effectively ensuring the accuracy of the final alignment offset determination, and further ensuring the accuracy of the alignment adjustment of multiple modules. In an implementable solution, each alignment processing module 2 is arranged on the same detection surface corresponding to all steel frame structures in sequence from top to bottom according to a preset layout method;

[0084] If the structure to be measured is a regular hexahedron, such asFigure 2 As shown, the same detection surface can be a regular detection surface formed after different structures to be measured are installed and connected; if the structure to be measured is irregular in shape, the corresponding detection surface will be different depending on the specific structure shape, which will not be elaborated here.

[0085] In an implementable solution, different identification information is provided on different structures to be measured installed at both ends.

[0086] In this solution, after different structures to be measured are installed, the structures to be measured at both ends can be distinguished by whether a signal transmitting unit 3 and a signal reflecting unit 4 are installed thereon, and identification information for distinction, including but not limited to labels, patterns, etc., can also be preset on the structures to be measured that need to be installed at both ends, so as to avoid the situation where the alignment detection cannot meet the actual scenario requirements due to incorrect installation.

[0087] In an implementable solution, as Figure 4 shown, the alignment detection device further includes a plurality of alignment adjustment structures 5 provided on each structure to be measured, and the alignment adjustment structures 5 are communicatively connected to the processor 1;

[0088] The processor 1 is configured to send a first alignment adjustment instruction to the matching alignment adjustment structure 5 to drive and adjust the position of the corresponding structure to be measured to the target position.

[0089] Of course, a person can also adjust the alignment adjustment structure 5 according to the alignment adjustment signal sent by the processor 1; in addition, according to the requirements of the actual installation environment, the alignment adjustment structure 5 can be directly adjusted flexibly in the horizontal or vertical direction.

[0090] In this solution, each structure to be measured is provided with a structure that can be adjusted. When the modules do not meet the alignment requirements, the positions of one or more modules can be adjusted in the horizontal and vertical directions to achieve the preset high-precision alignment requirements between these modules. Compared with manual adjustment, the adjustment speed is fast and unnecessary human errors are avoided.

[0091] In an implementable solution, the alignment adjustment structure 5 includes a driving unit communicatively connected to the processor 1, and an execution unit connected to the driving unit and provided at the bottom position of the structure to be measured;

[0092] The driving unit is configured to drive the execution unit to drive the structure to be measured to move to the target position based on the first alignment adjustment instruction sent by the processor 1;

[0093] Among them, the execution unit includes several horizontal moving components and / or lifting moving components, moving in the horizontal direction through the horizontal moving components and moving in the vertical direction through the lifting moving components. Both the horizontal moving components and the lifting moving components have a fine-tuning function and can be fine-tuned to adapt to minute height or horizontal deviation adjustments, ensuring the effectiveness and reliability of the alignment adjustment and also ensuring the stability of the overall structure.

[0094] The driving unit includes one or more motors; one motor can be used to drive all the horizontal moving components and lifting moving components, or a part of the motors can drive the horizontal moving components and a part of the motors can drive the lifting moving components, etc.; preferably, each horizontal moving component and lifting moving component is provided with one motor to ensure the timeliness and accuracy of the adjustment.

[0095] In this solution, several execution units are arranged at different positions at the bottoms of the steel frame structure A and the steel frame structure B, and the positions of each steel frame structure are horizontally and vertically adjusted through specific alignment adjustment instructions, realizing precise and rapid alignment adjustment and ensuring the precise docking between the modules.

[0096] Among them, as Figure 2 shown, the horizontal moving components include but are not limited to ground wheels F, and the lifting moving components include a support mechanism G that can be telescoped up and down; the specific structures and specific quantities of the horizontal moving components and the lifting moving components are not limited, as long as the corresponding alignment adjustment can be achieved.

[0097] In addition, the alignment adjustment structure 5 is also provided with a braking structure. After the adjustment in the horizontal and vertical directions is completed, the alignment adjustment structure 5 is locked and fixed to ensure the stability of the overall structure after the alignment adjustment, avoid the occurrence of the situation where the adjustment is not in place caused by other external factors, and avoid unnecessary multiple adjustments, thereby ensuring the reliability and efficiency of the alignment adjustment.

[0098] In an implementable solution, as Figure 4 shown, the alignment detection device further includes a prompting unit 6 communicatively connected to the processor 1;

[0099] Among them, the prompting unit 6 includes a lighting prompting component, a voice prompting component, and a display interface component for text prompting.

[0100] The prompting unit 6 is used to perform a prompting operation based on the received first prompting signal or second prompting signal;

[0101] In this solution, the prompting unit 6 timely reminds information such as whether the multi-modules are aligned, the alignment deviation situation, and how to specifically perform the alignment adjustment, so as to inform the relevant personnel in a timely manner, facilitate the relevant personnel to know, or facilitate manual direct participation in the adjustment.

[0102] The prompting unit 6 is configured to perform a prompting operation based on an abnormal signal received to represent that no feedback signal has been received within a preset time period;

[0103] In this solution, for an abnormal situation that occurs, such as when the laser emitter is offset, resulting in the emitted laser signal not passing through the positioning hole to reach the reflecting surface structure and no reflected signal is generated. This abnormal situation belongs to an abnormal situation, which will cause the operations of alignment detection and alignment adjustment to be unable to be completed. Therefore, it is necessary to specifically remind relevant personnel to be aware of it, so as to perform intervention processing based on it and promptly eliminate the corresponding abnormal situation to ensure that the alignment detection device can be used normally and complete the operations of alignment detection and alignment adjustment.

[0104] The working principle of the alignment detection device in this embodiment will be specifically described below:

[0105] When performing the calibration work between steel frame structures, it is first necessary to start the laser emitter on the steel frame structure A. This steel frame structure is integrally arranged on the steel frame structure A, and the laser emitted by the laser emitter will naturally pass through all the positioning holes on the steel frame structure A;

[0106] The steel frame structure B needs to be moved to a position aligned with the steel frame structure A. If the laser signal emitted by the laser emitter does not pass through the positioning hole of the steel frame structure B, the laser emitter will not receive the reflected signal. At this time, the laser emitter will emit an abnormal prompt signal to prompt relevant personnel to perform timely intervention processing;

[0107] On-site workers need to visually adjust the position of the steel frame structure B until the laser emitter can receive the reflected signal and issue a position indication; once the laser emitter displays the calibration data in the vertical and horizontal directions, the workers can adjust the positions of the horizontal moving component and the lifting moving component according to these calibration data for fine adjustment to ensure the precise alignment between the modules.

[0108] Embodiment 3

[0109] As Figure 5 shown, the process control system of the present disclosure includes the alignment detection device 7 of the above Embodiment 1 or 2, and a process operation component 8, etc.

[0110] The alignment detection device 7 is configured to perform alignment adjustment on different structures to be measured;

[0111] The process operation component 8 is configured to perform corresponding process operations on a preset object based on the transportation path provided by different structures to be measured after alignment adjustment.

[0112] Specifically, the process operation component includes a manipulator, and the preset object includes a wafer;

[0113] In this solution, the alignment accuracy of the multi-module after alignment adjustment by the alignment detection device has reached the preset accuracy requirement. The manipulator holds the wafer and transports the wafer back and forth along the linear track between the multi-modules for multiple times, ensuring normal and orderly linear motion work, thereby ensuring the smoothness and reliability of the overall process flow, and greatly improving the overall product performance of the process control system.

[0114] Although the specific embodiments of the present disclosure have been described above, those skilled in the art should understand that this is only an example, and the protection scope of the present disclosure is defined by the appended claims. Without departing from the principles and essence of the present disclosure, those skilled in the art can make various changes or modifications to these embodiments, but these changes and modifications all fall within the protection scope of the present disclosure.

Claims

1. An alignment detection device, characterized in that: The alignment detection device comprises a processor and N alignment processing modules, wherein the alignment processing module comprises a signal transmitting unit and a signal reflecting unit communicatively connected to the processor, and N is a positive integer; When performing alignment detection on different structures to be tested in any detection state, the signal transmitting unit and the signal reflecting unit are respectively located on the two outermost structures to be tested, and a positioning hole is provided on each structure to be tested; In a calibrated alignment state, the signal transmitting unit, each of the positioning holes and the signal reflecting unit are located on the same alignment reference line; When performing actual alignment detection on different structures to be tested, the signal transmitting unit is used to transmit an initial signal along a preset transmission direction; The signal reflecting unit is used for sending a reflected signal to the signal transmitting unit based on the initial signal; The processor is used to receive the reflection signal and send a first prompt signal for indicating the alignment status between different structures to be tested; And / or, issuing a first alignment adjustment instruction for representing an alignment processing operation.

2. The alignment detection device according to claim 1, characterized in that: The signal reflecting unit comprises a reflecting surface structure arranged opposite to the signal transmitting unit, and the reflecting surface structure is used to reflect the transmitted initial signal so as to reflect the reflected signal to the signal transmitting unit.

3. The alignment detection device according to claim 2, characterized in that: The reflective surface structure comprises a circular reflective surface, and in a calibrated alignment state, the center of the circular reflective surface is on the alignment reference line; Wherein, the circular reflective surface is provided with M different annular areas from the center to the periphery, and the roughness increases successively; M≥2 and is an integer.

4. The alignment detection device according to claim 1, characterized in that: The signal transmitting unit comprises a laser transmitter, and the initial signal is a laser signal; and / or, A laser level is used to emit laser in the preset transmission direction to perform through-punching on different structures to be measured, so as to obtain a plurality of positioning holes on the same alignment reference line.

5. The alignment detection device according to any one of claims 1 to 4, characterized in that: Different structures to be tested include different steel frame structures for matching with preset objects; Among them, after the different steel frame structures are installed and connected, the signal transmitting unit is set on the outermost structure of a steel frame structure located at one end, and the signal reflecting unit is set on the inner wall of the outermost structure of a steel frame structure located at the other end.

6. The alignment detection device according to claim 5, characterized in that: When N≥2, in the calibration alignment state, the signal transmitting unit, each positioning hole and the signal reflecting unit of the same alignment processing module are located on the same alignment reference line, and different alignment processing modules correspond to different alignment reference lines; The processor is used to receive the reflection signal in each alignment processing module under the same actual alignment detection state, and send out a second prompt signal for representing the alignment state between different structures to be tested; And / or, issuing a second alignment adjustment instruction for representing the alignment processing operation.

7. The alignment detection device according to claim 5, characterized in that: Each of the alignment processing modules is arranged in sequence from top to bottom on the same detection surface corresponding to all of the steel frame structures according to a preset arrangement method; and / or, Different identification information is provided on the different structures to be tested installed at the two ends.

8. The alignment detection device according to claim 6, characterized in that: The alignment detection device further comprises a plurality of alignment adjustment structures provided on each of the structures to be tested, wherein the alignment adjustment structures are communicatively connected with the processor; The processor is used to send a first alignment adjustment instruction to the matching alignment adjustment structure to drive the adjustment of the position of the corresponding structure to be measured to a target position.

9. The alignment detection device according to claim 8, characterized in that: The alignment adjustment structure includes a driving unit connected to the processor in communication, and an execution unit connected to the driving unit and disposed at the bottom of the structure to be measured; The driving unit is used for driving the execution unit to move the structure to be tested to the target position based on the first alignment adjustment instruction sent by the processor; Wherein, the execution unit includes a plurality of horizontal moving parts and / or lifting moving parts.

10. The alignment detection device according to claim 6, characterized in that: The alignment detection device further includes a prompting unit communicatively connected to the processor; The prompt unit is used to perform a prompt operation based on the received first prompt signal or the second prompt signal; or, The prompting unit is used to perform a prompting operation based on receiving an abnormal signal indicating that no feedback signal has been received within a preset period of time; Wherein, the prompt unit includes at least one of a light prompt component, a voice prompt component, and a display interface component for text prompts.

11. A process control system, characterized in that: The process control system comprises an alignment detection device as claimed in any one of claims 1 to 10, and a process operation component; The alignment detection device is used to perform alignment adjustment on different structures to be tested; The process operation component is used to perform corresponding process operations on a preset object based on the transportation paths provided by the different structures to be tested after alignment adjustment.

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