Detection device for wafer surface defects

Abstract

The utility model discloses a detection device for wafer surface defects, which comprises a working bin, an electric rotating disc arranged in the working bin, a plurality of positioning seats arranged on the electric rotating disc, a placing disc arranged in the plurality of positioning seats, wafers arranged in the placing disc, a supporting mechanism arranged at the bottom of the placing disc, and a limiting assembly arranged at one end of each positioning seat. The center of the electric rotating disc is provided with a mounting table, the mounting table is provided with a plurality of laser line scanning detectors, a moving mechanism is arranged above the electric rotating disc, the moving mechanism is provided with a moving frame, the moving frame is provided with a detection assembly, and wafers are detected through the detection assembly. The wafer detection device has the advantages that positioning detection and flexible detection of the wafers in batches can be carried out, all-around detection recording of the wafers can be carried out, dust collection treatment is carried out on the surfaces of the wafers, and the influence on the detection precision is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing and detection, and more specifically, particularly relates to a detection device for wafer surface defects. Background Technique

[0002] At present, a Chinese patent with the publication number CN207540992U discloses a wafer surface defect detection device, which includes: a wafer stage for placing a wafer; a light emitting device whose emitted light is inclined to the surface of the wafer to be detected; a convex lens which is arranged directly above the wafer and parallel to it; a projection screen which is arranged directly above the convex lens and parallel to it; an image acquisition device for acquiring image information on the projection screen; and a computer control terminal for receiving the image information and performing processing and analysis. This wafer surface defect detection device can complete the on-line detection of wafer surface defects through visual imaging means, with high detection efficiency and high detection accuracy, greatly reducing the labor intensity of workers, and preventing wafers with surface defects exceeding the standard from flowing into the next process.

[0003] Although this can detect wafers, there are the following problems: the detection accuracy of this device is low, there is no positioning for the wafer and the wafer stage, the detection stability is poor, and it cannot meet the requirements of batch detection. The wafer is prone to dust adhesion in a high-light environment, resulting in dust on its surface and affecting the detection accuracy. The detection method is relatively single, and it cannot improve the detection accuracy of wafers and ensure the quality of wafers through multiple detection methods. Content of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a detection device for wafer surface defects to solve the problems put forward in the above background technique.

[0005] To achieve the above objectives, the present utility model is realized through the following technical solutions: A detection device for wafer surface defects, including a working chamber, observation ports are provided on both sides and the rear side of the working chamber for observing the operation process. An electric rotating disk is installed in the working chamber, and a plurality of positioning seats are arranged on the electric rotating disk. The plurality of positioning seats are distributed in a circular pattern. A U-shaped card slot is arranged in the plurality of positioning seats, and a placement disk is installed in the U-shaped card slot. A wafer component is arranged in the placement disk. A support mechanism is arranged at the bottom of the placement disk. A limiting component is arranged at one end of the positioning seat. An installation platform is arranged at the center of the electric rotating disk, and a plurality of laser line scanners are arranged on the installation platform. The plurality of laser line scanners respectively correspond to the positioning seats. A detection port is arranged on the positioning seat, and the laser line scanner detects the surface of the wafer component through the detection port. A moving mechanism is arranged above the electric rotating disk. A moving frame is arranged on the moving mechanism, and a detection component is arranged on the moving frame. The detection component performs a comprehensive detection on the wafer component on the electric rotating disk. A dust suction mechanism is also arranged in the working chamber. The dust suction mechanism is located on one side of the electric rotating disk, and the dust in the air and on the wafer component is adsorbed through the dust suction mechanism.

[0006] As an optional solution of the present utility model, a plurality of opening slots are arranged on the electric rotating disk. The plurality of opening slots are distributed in a circular pattern, and guide rollers are installed in the plurality of opening slots.

[0007] As an optional solution of the present utility model, the support mechanism includes a support seat. The support seat is slidably matched in the electric rotating disk. A first cylinder is arranged at the bottom of the support seat, and the first cylinder is located at the bottom of the electric rotating disk. The support seat is pushed out by the first cylinder.

[0008] As an optional solution of the present utility model, the limiting component includes a second cylinder. The second cylinders are symmetrically distributed on both sides of the positioning seat. Limiting holes are arranged on both sides of the positioning seat. A side pressure wheel is installed at the pushing end of the second cylinder, and the side pressure wheel passes through the limiting hole to press the placement disk.

[0009] As an optional solution of the present utility model, the moving mechanism includes a first linear module. The first linear module is located on one side of the electric rotating disk. A slide rail is arranged on the other side of the electric rotating disk. A slider is slidably matched on the slide rail. Support frames are installed on both the slider and the moving end of the first linear module. A second linear module is installed at the top of the support frame, and the moving end of the second linear module is connected to the moving frame.

[0010] As an alternative solution of the present utility model, the detection component includes an electric control box which is installed on a moving frame. One side of the electric control box is provided with an optical detection microscope for performing a full-range detailed detection on the surface of the wafer component. One side of the optical detection microscope is further provided with a positioning frame which is fixed on one side of the moving frame. A short-wave infrared camera is installed on the positioning frame for automatically detecting the surface of the wafer. One side of the short-wave infrared camera is provided with an LED light board for continuously illuminating the wafer component below.

[0011] As an alternative solution of the present utility model, the dust suction mechanism includes a mounting frame. A first electric cylinder is arranged inside the mounting frame. The pushing end of the first electric cylinder is provided with a lifting plate. Guide rods are arranged at the four corners of the bottom of the lifting plate. The guide rods are slidably matched inside the mounting frame. A second electric cylinder is fixed on the lifting plate. The pushing end of the second electric cylinder is provided with a fixing seat. A dust collector is arranged on the top of the fixing seat. The bottom of the dust collector is communicated with a dust suction hood through a pipeline for quickly sucking the surface of the wafer component below through the dust suction.

[0012] The present utility model provides a detection device for wafer surface defects, having the following

[0013] Beneficial effects:

[0014] Driven by the second cylinder, the side pressure wheel is positioned and fixed to ensure the stability of the placement tray. Multiple placement trays are sequentially placed through the rotation of the electric rotating disk. Driven by the first linear module and the second linear module, the optical detection microscope and the short-wave infrared camera perform a full-range detection and recording on the wafer component, which can meet the requirements of batch detection. At the same time, the LED light board continuously illuminates to improve the detection brightness and facilitate detailed detection. The laser line scan detector on the electric rotating disk can detect the surface of the wafer component from the side to avoid defects. The dust collector is moved by the first electric cylinder and the second electric cylinder to suck the wafer component on the electric rotating disk to ensure the cleanliness of the surface of the wafer component and improve the detection accuracy. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of the present utility model;

[0016] Figure 2 is a partial enlarged view of the present utility model;

[0017] Figure 3 is a front view of the present utility model;

[0018] Figure 4 is an A-A cross-sectional view of the present utility model;

[0019] Figure 5This is a C-C cross-sectional view of the present utility model.

[0020] In the figure: 1, working bin; 101, observation port; 2, first linear module; 201, support frame; 3, slide rail; 301, slider; 4, second linear module; 5, moving frame; 501, LED light board; 6, electric control box; 7, optical inspection microscope; 8, positioning frame; 801, short-wave infrared camera; 10, electric rotating disk; 11, opening groove; 111, guide roller; 112, first air cylinder; 113, support seat; 12, positioning seat; 121, second air cylinder; 122, side pressing wheel; 13, placing disk; 131, wafer component; 14, mounting table; 141, laser line scanning detector; 15, mounting frame; 151, first electric cylinder; 16, lifting plate; 161, guide rod; 17, second electric cylinder; 171, fixed seat; 18, vacuum cleaner; 181, dust suction hood. Specific embodiments

[0021] The following further describes in detail the embodiments of the present utility model in conjunction with the drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0022] Please refer to Figures 1 to 5 , the present utility model provides a technical solution: a detection device for wafer surface defects, including a working bin 1, observation ports 101 are provided on both sides and the rear side of the working bin 1 for observing the operation process, an electric rotating disk 10 is installed in the working bin 1, a plurality of opening grooves 11 are provided on the electric rotating disk 10, the plurality of opening grooves 11 are distributed in a circular pattern, guide rollers 111 are installed in the plurality of opening grooves 11 to facilitate the conveying of workpieces, a plurality of positioning seats 12 are provided on the electric rotating disk 10, the plurality of positioning seats 12 are distributed in a circular pattern, a U-shaped card slot is provided in the plurality of positioning seats 12, a placing disk 13 is installed in the U-shaped card slot, a wafer component 131 is provided in the placing disk 13, a support mechanism is provided at the bottom of the placing disk 13, the support mechanism includes a support seat 113, the support seat 113 is slidably engaged in the electric rotating disk 10, a first air cylinder 112 is provided at the bottom of the support seat 113, the first air cylinder 112 is located at the bottom of the electric rotating disk 10, and the support seat 113 is driven by the first air cylinder 112 to eject, so as to facilitate the removal of the wafer component 131 after the detection is completed, and a limiting component is provided at one end of the positioning seat 12.

[0023] The limiting component includes a second cylinder 121, which is symmetrically distributed on both sides of the positioning seat 12. Limiting holes are provided on both sides of the positioning seat 12. A side pressure wheel 122 is installed at the pushing end of the second cylinder 121. The side pressure wheel 122 passes through the limiting hole and presses the placement plate 13 to ensure the stability of the detection of the wafer component 131 in the placement plate 13. An installation table 14 is provided in the center of the electric rotating disk 10. A plurality of laser line scanners 141 are provided on the installation table 14. The plurality of laser line scanners 141 respectively correspond to the positioning seats 12. A detection port is provided on the positioning seat 12. The laser line scanner 141 detects the surface of the wafer component 131 through the detection port. A moving mechanism is provided above the electric rotating disk 10. A moving frame 5 is provided on the moving mechanism. The moving mechanism includes a first linear module 2, which is located on one side of the electric rotating disk 10. A slide rail 3 is provided on the other side of the electric rotating disk 10. A slider 301 is slidably fitted on the slide rail 3. Support frames 201 are installed on both the slider 301 and the moving end of the first linear module 2. A second linear module 4 is installed on the top of the support frame 201. The moving end of the second linear module 4 is connected to the moving frame 5. A detection component is provided on the moving frame 5 to perform a full-range detection of the wafer component 131 on the electric rotating disk 10.

[0024] The detection component includes an electric control box 6, which is installed on the moving frame 5. An optical detection microscope 7 is provided on one side of the electric control box 6 to perform a full-range detailed detection of the surface of the wafer component 131 through the optical detection microscope 7. A positioning frame 8 is also provided on one side of the optical detection microscope 7. The positioning frame 8 is fixed on one side of the moving frame 5. A short-wave infrared camera 801 is installed on the positioning frame 8 to perform an automated detection of the wafer surface to detect whether there are defects on its surface. An LED light board 501 is provided on one side of the short-wave infrared camera 801 to continuously illuminate the wafer component 131 below for defect detection photography. A dust suction mechanism is also provided in the working chamber. The dust suction mechanism is located on one side of the electric rotating disk 10 to adsorb the dust in the air and on the wafer component 131 to avoid affecting the detection accuracy.

[0025] The dust suction mechanism includes an installation frame 15. A first electric cylinder 151 is provided inside the installation frame 15. A lifting plate 16 is provided at the pushing end of the first electric cylinder 151. Guide rods 161 are provided at the four corners of the bottom of the lifting plate 16. The guide rods 161 are slidably fitted inside the installation frame 15. A second electric cylinder 17 is fixed on the lifting plate 16. A fixed seat 171 is provided at the pushing end of the second electric cylinder 17. A dust collector 18 is provided on the top of the fixed seat 171. The bottom of the dust collector 18 is connected to a dust suction hood 181 through a pipeline to quickly suck the dust on the surface of the wafer component 131 below through the dust suction hood.

[0026] Specific usage mode and function of this embodiment: The placement tray 13 and the wafer component 131 inside it are placed in the U-shaped groove of the positioning seat 12 by a manipulator. The second cylinder 121 is started to drive the side pressure wheel 122 for positioning and fixing to ensure the stability of the placement tray 13. The electric rotating disk 10 rotates to sequentially place multiple placement trays 13. After positioning, the first linear module 2 and the second linear module 4 are started to drive the optical detection microscope 7 and the short-wave infrared camera 801 to perform all-round detection and recording on the wafer component 131. At the same time, the LED light board 501 continuously illuminates to improve the detection brightness and facilitate detailed detection. The laser line scan detector 141 on the electric rotating disk 10 can detect the surface of the wafer component 131 from the side to avoid defects. The first electric cylinder 151 and the second electric cylinder 17 are used to move the vacuum cleaner 18 to vacuum the wafer component 131 on the electric rotating disk 10 to ensure the cleanliness of the surface of the wafer component 131 and improve the detection accuracy. After the detection is completed, the second cylinder 121 is started to loosen, and the placement tray 13 is ejected by the first cylinder 112 to facilitate material taking.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A device for detecting wafer surface defects, characterized in that: The invention comprises a working chamber (1), wherein both sides and the rear side of the working chamber (1) are provided with observation ports (101) for observing the progress of the operation, an electric rotating disk (10) is installed in the working chamber (1), a plurality of positioning seats (12) are arranged on the electric rotating disk (10), the plurality of positioning seats (12) are distributed in a circumference, a U-shaped card slot is arranged in the plurality of positioning seats (12), a placement disk (13) is installed in the U-shaped card slot, a wafer (131) is arranged in the placement disk (13), a supporting mechanism is arranged at the bottom of the placement disk (13), a limiting component is arranged at one end of the positioning seat (12), a mounting platform (14) is arranged in the center of the electric rotating disk (10), a plurality of lasers are arranged on the mounting platform (14), and a plurality of lasers are arranged on the mounting platform (14). A line scan detector (141), wherein the plurality of laser line scan detectors (141) correspond to the positioning seat (12) respectively, the positioning seat (12) is provided with a detection port, and the laser line scan detector (141) performs defect detection on the surface of the wafer (131) through the detection port; a moving mechanism is provided above the electric rotating disk (10), a moving frame (5) is provided on the moving mechanism, and a detection component is provided on the moving frame (5), and the wafer (131) on the electric rotating disk (10) is fully detected by the detection component; a dust suction mechanism is also provided in the working chamber, and the dust suction mechanism is located on one side of the electric rotating disk (10), and dust in the air and on the wafer (131) is adsorbed by the dust suction mechanism.

2. The device for detecting wafer surface defects according to claim 1, characterized in that: The electric rotating disk (10) is provided with a plurality of open slots (11), the plurality of open slots (11) are distributed in a circumference, and guide rollers (111) are installed in the plurality of open slots (11).

3. The device for detecting wafer surface defects according to claim 1, characterized in that: The support mechanism comprises a support seat (113), the support seat (113) is slidably fitted in the electric rotating disk (10), a first cylinder (112) is arranged at the bottom of the support seat (113), the first cylinder (112) is located at the bottom of the electric rotating disk (10), and the support seat (113) is driven to be ejected by the first cylinder (112).

4. The device for detecting wafer surface defects according to claim 1, characterized in that: The limiting assembly comprises a second cylinder (121), the second cylinder (121) is symmetrically distributed on both sides of the positioning seat (12), limiting holes are arranged on both sides of the positioning seat (12), and a side pressure wheel (122) is installed at the pushing end of the second cylinder (121), and the side pressure wheel (122) passes through the limiting hole to press the placement plate (13).

5. The device for detecting wafer surface defects according to claim 1, characterized in that: The moving mechanism comprises a first linear module (2), the first linear module (2) is located on one side of the electric rotating disk (10), a slide rail (3) is provided on the other side of the electric rotating disk (10), a slider (301) is slidably matched on the slide rail (3), a support frame (201) is installed on the slider (301) and the moving end of the first linear module (2), a second linear module (4) is installed on the top of the support frame (201), and the moving end of the second linear module (4) is connected to the moving frame (5).

6. The device for detecting wafer surface defects according to claim 1, characterized in that: The detection component comprises an electric control box (6), the electric control box (6) is mounted on a movable frame (5), an optical detection microscope (7) is arranged on one side of the electric control box (6), and a full range of detailed detection of the surface of the wafer (131) is performed through the optical detection microscope (7), a positioning frame (8) is also arranged on one side of the optical detection microscope (7), the positioning frame (8) is fixed on one side of the movable frame (5), a short-wave infrared camera (801) is installed on the positioning frame (8), and the wafer surface is automatically detected through the short-wave infrared camera (801), and an LED light board (501) is arranged on one side of the short-wave infrared camera (801), and the wafer (131) below is continuously illuminated through the LED light board (501).

7. The device for detecting wafer surface defects according to claim 1, characterized in that: The dust suction mechanism comprises a mounting frame (15), a first electric cylinder (151) is arranged in the mounting frame (15), a lifting plate (16) is arranged at the push-out end of the first electric cylinder (151), guide rods (161) are arranged at the four corners of the bottom of the lifting plate (16), the guide rods (161) are slidably fitted in the mounting frame (15), a second electric cylinder (17) is fixed on the lifting plate (16), a fixing seat (171) is arranged at the push-out end of the second electric cylinder (17), a dust collector (18) is arranged on the top of the fixing seat (171), and the bottom of the dust collector (18) is connected to a dust hood (181) through a pipeline, so that the surface of the wafer (131) below is quickly dusted by the dust suction.

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