Heat dissipation structure and camera with same

Abstract

The utility model belongs to the technical field of heat dissipation, and discloses a heat dissipation structure and a camera. The heat dissipation structure comprises heat dissipation fins, a heat dissipation fan and a heat conduction film, the heat dissipation fins are located on one side of the part to be cooled and are in thermal contact with the part to be cooled, the heat dissipation fan is located on one side of the heat dissipation fins, and the heat dissipation fan can blow external air and pass through the heat dissipation fins so as to reduce the temperature of the heat dissipation main face of the part to be cooled. The two sides of the heat conduction film are connected to the cooling fins and the part to be cooled in an attached mode respectively. Through the effect of the heat conduction film, heat generated by the to-be-cooled part can be conducted to the direction of the cooling fins, so that the heat dissipation efficiency of the to-be-cooled part can be improved, the temperature rise of the to-be-cooled part is avoided, and the safety and reliability of the to-be-cooled part during use are ensured. The heat dissipation structure is arranged in the camera, so that the part to be subjected to heat dissipation can be kept in a proper temperature range during long-time working, the temperature is prevented from being too high, the use performance of the camera is effectively improved, and the service life of the camera is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a camera. Background Art

[0002] With the continuous development of camera technology, the application scenarios of cameras with large image sensors and high resolutions are increasing. As the functions of cameras are continuously improved, the large data stream brings new challenges to the heat dissipation problem of cameras. Traditional camera heat dissipation often adopts passive heat dissipation, that is, passive heat dissipation is carried out through the camera housing, but the heat dissipation capacity is limited and cannot dissipate the heat generated by the camera motherboard chip, power chip, etc., resulting in limited heat dissipation function of the camera.

[0003] The prior art provides a heat dissipation structure for a camera. Aiming at the defects of the traditional camera heat dissipation method, a heat dissipation plate and a heat dissipation fan are arranged in the motherboard assembly of the heat dissipation structure. Driven by the heat dissipation fan, the cold air outside the camera enters the camera interior and passes through the motherboard assembly and the heat sink, thereby actively blowing out the heat of the motherboard assembly, and then reducing the temperature of the motherboard assembly. Moreover, the power of the heat dissipation fan can be adjusted through a temperature sensor, thereby balancing the power of the heat dissipation fan and reducing the energy consumption. However, the ability of the above heat dissipation structure to transfer the heat of the motherboard assembly to the heat dissipation plate is still limited. When the camera runs for a long time or the power of the motherboard assembly is large, a large amount of heat generated on the motherboard assembly cannot be transferred to the heat dissipation plate in time and effectively, resulting in heat accumulation, and then causing the temperature inside the camera to rise, and the use safety of the camera still cannot be guaranteed.

[0004] Therefore, there is an urgent need for a heat dissipation structure and a camera with it to solve the problems existing in the prior art. Summary of the Utility Model

[0005] An object of the utility model is to provide a heat dissipation structure, which can further improve the heat dissipation and temperature reduction ability for the component to be dissipated.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A heat dissipation structure for dissipating heat and reducing the temperature of a component to be dissipated. The heat dissipation structure includes heat dissipation fins, a heat dissipation fan, and a heat conduction film. The heat dissipation fins are located on one side of the component to be dissipated and are in thermal contact with the component to be dissipated. The heat dissipation fan is located on one side of the heat dissipation fins. The heat dissipation fan can blow external air and pass it through the heat dissipation fins to reduce the temperature of the main heat dissipation surface of the component to be dissipated. The two sides of the heat conduction film are respectively adhered and connected to the heat dissipation fins and the component to be dissipated.

[0008] Preferably, the air supply direction of the heat dissipation fan is parallel to the heat dissipation surface of the heat dissipation fins.

[0009] Preferably, the heat dissipation structure includes a plurality of the heat dissipation fins, the plurality of heat dissipation fins are sequentially arranged at intervals in a direction perpendicular to the air outlet direction, a air supply channel for the external air to pass through is formed between adjacent heat dissipation fins, and the heat conduction film is connected to a plurality of the heat dissipation fins at the same time.

[0010] Preferably, the heat conduction film is adhesively connected to the component to be heat dissipated and a plurality of the heat dissipation fins.

[0011] Preferably, the heat conduction film includes any one of a heat conductive silica gel film, a heat conductive silicone grease film or an epoxy resin film.

[0012] Preferably, the heat conduction film is a heat conductive silicone grease film.

[0013] Preferably, along the direction away from the heat conduction film, the size of the heat dissipation fin is set as h, and 10 mm ≤ h ≤ 20 mm;

[0014] Along the direction parallel to the air outlet direction, the size of the heat dissipation fin is set as L, and 30 mm ≤ L ≤ 60 mm.

[0015] Another object of the present invention is to provide a camera. By using the above heat dissipation structure, when the camera is in use, the internal temperature can be maintained within a suitable range, preventing the temperature from being too high, thereby ensuring the use safety of the camera.

[0016] To achieve this purpose, the present invention adopts the following technical solutions:

[0017] A camera, including an outer frame body, a substrate, a main board component and the above heat dissipation structure, an imaging lens is installed on the outer frame body, the substrate is installed on the outer frame body, and the main board component is fixedly arranged on the substrate. The main board component has the main heat dissipation surface, and the heat dissipation structure is arranged on one side of the main board component and is heat transfer connected to the main board component.

[0018] Preferably, the camera further includes a driving motor and a temperature sensor arranged on the main board component. The driving motor is connected to the main board component and the heat dissipation fan of the heat dissipation structure. The temperature sensor is communicatively connected to the main board component. The temperature sensor is used to detect the real-time temperature of the main board component, and the main board component can control the opening and closing of the heat dissipation fan through the driving motor according to the real-time temperature.

[0019] Preferably, the camera further includes an image signal processor. The image signal processor is connected to the main board component. When the change value of the real-time temperature exceeds a set value within a set time difference, the main board component can control the image signal processor to turn off.

[0020] The beneficial effects of the present invention:

[0021] This embodiment provides a heat dissipation structure. In this heat dissipation structure, a heat conduction film is clamped between the heat dissipation fins and the component to be cooled. Through the action of the heat conduction film, the heat generated by the component to be cooled can be conducted towards the heat dissipation fins, thereby accelerating the efficiency of heat dissipation from the component to be cooled, avoiding the increase in the temperature of the component to be cooled, and ensuring the safety and reliability of the component to be cooled during use.

[0022] This embodiment also provides a camera. The camera includes the above heat dissipation structure. The structure of the camera is simple. In addition, in the heat dissipation structure, since the heat conduction film is clamped between the component to be cooled and the heat dissipation fins, the efficiency of heat dissipation from the component to be cooled can be accelerated, enabling the component to be cooled to maintain an appropriate temperature range during long-term operation, avoiding overheating, and thus effectively improving the performance and service life of the camera. Description of the Drawings

[0023] Figure 1 is a schematic structural diagram of the camera provided by the present utility model;

[0024] Figure 2 is an exploded view of the structure of the camera provided by the present utility model;

[0025] Figure 3 is a top view of the camera provided by the present utility model;

[0026] Figure 4 is Figure 3 a partial enlarged view of part A in

[0027] Figure 5 is a side view of the heat dissipation fins provided by the present utility model.

[0028] In the figure:

[0029] 100, main board components; 200, heat dissipation structure; 201, air supply channel; 300, outer frame; 400, substrate;

[0030] 210, heat dissipation fins;

[0031] 220, heat dissipation fan. Detailed Embodiments

[0032] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of description, only parts related to the present utility model are shown in the drawings, rather than all structures.

[0033] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above the top of", and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below the bottom of", and "under the bottom of" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0035] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", and "left" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0036] Combined with Figures 1 to 5 As shown, the embodiment of the present utility model provides a heat dissipation structure 200 and a camera having the same. Among them, the camera further includes a main board component 100. In the main board component 100 provided in this embodiment, when the camera operates for a long time, the camera image processing chip has the largest power consumption and heat generation. The heat dissipation structure 200 is disposed on one side of the main board component 100 and is heat-transfer connected to the main heat dissipation surface 101 of the main board component 100, so as to be able to at least dissipate heat from the image processing chip on the main board component 100 and keep it within a suitable working temperature range. It should be noted that the present utility model does not limit the type of the camera. For example, digital single-lens reflex cameras, surveillance cameras, action cameras, UAV cameras, etc. can all be installed with and apply the heat dissipation structure 200 provided in this embodiment.

[0037] Specifically, the heat dissipation structure 200 includes heat dissipation fins 210 and a heat dissipation fan 220. Among them, the heat dissipation fins 210 are located on one side of the component to be cooled (i.e., the motherboard component 100 above) and are in thermal contact with the motherboard component 100, so that the heat generated by the motherboard component 100 can be conducted to the heat dissipation fins 210; the heat dissipation fan 220 is located on one side of the heat dissipation fins 210. The heat dissipation fan 220 can transport external air into the camera. After passing through the heat dissipation surface 211 of the heat dissipation fins 210, it is then discharged outward, so that the wind blown by the heat dissipation fan 220 can blow along the heat dissipation surface 211 of the heat dissipation fins 210, thereby taking away the heat of the heat dissipation fins 210 and further reducing the temperature of the motherboard component 100.

[0038] The implementation method provided in this embodiment is as Figure 4 shown, the air supply direction of the heat dissipation fan 220 is parallel to the heat dissipation surface 211 of the heat dissipation fins 210, so that the wind blown by the heat dissipation fan 220 can just blow along the heat dissipation surface 211 of the heat dissipation fins 210, thereby reducing the resistance of the heat dissipation fins 210 to the wind, and the wind can more effectively take away the heat on the heat dissipation surface 211, thus improving the heat dissipation efficiency.

[0039] Furthermore, in this embodiment, the heat dissipation structure 200 includes a plurality of heat dissipation fins 210. The number of the heat dissipation fins 210 is not limited. The plurality of heat dissipation fins 210 are arranged at intervals in a direction perpendicular to the air outlet direction. An air supply channel 201 for external air to pass through is formed between adjacent heat dissipation fins 210. By providing a plurality of spaced-apart heat dissipation fins 210, the heat dissipation effect of the heat dissipation structure 200 on the motherboard component 100 can be further increased. Even further, two heat dissipation fans 220 are provided, and the two heat dissipation fans 220 are arranged in parallel in a direction perpendicular to the air outlet direction to ensure a good heat dissipation effect.

[0040] In order to ensure that when the camera runs for a long time or the power of the motherboard component 100 is relatively large, a large amount of heat generated on the motherboard component 100 can be transferred to the heat dissipation fins 210 in a timely and effective manner, and avoid the accumulation of heat on the motherboard component 100. The heat dissipation structure 200 provided in this embodiment further includes a heat conduction film. The two sides of the heat conduction film are respectively attached and connected to a plurality of heat dissipation fins 210 and the motherboard component 100. Through the action of the heat conduction film, the heat generated by the motherboard component 100 can be conducted in the direction of the heat dissipation fins 210, thereby improving the efficiency of heat dissipation on the motherboard component 100, avoiding the temperature rise of the motherboard component 100, and ensuring the safety and reliability of the motherboard component 100 during use.

[0041] Specifically, the implementation method provided in this embodiment is that the heat-conducting film is adhesively connected to the main board component 100 and multiple heat dissipation fins 210, which can ensure good thermal contact between the heat dissipation fins 210 and the main board component 100, thereby contributing to improving the heat transfer efficiency. Exemplarily, in this embodiment, the heat-conducting film is a heat-conducting silicone grease film, which has good chemical stability and temperature resistance performance, ensuring a long-term reliable heat-conducting effect and meeting the usage requirements under actual working conditions.

[0042] Of course, in other embodiments, the heat-conducting film can also be a heat-conducting silicone rubber film or an epoxy resin film. The specific type of the heat-conducting film can be determined according to factors such as the camera specifications, usage scenarios, the size and quantity of the heat dissipation fins 210, etc. The present utility model does not limit this.

[0043] Exemplarily, in this embodiment, as Figure 5 shown, along the direction away from the heat-conducting film, the size of the heat dissipation fin 210 is set as h, 10 mm ≤ h ≤ 20 mm. For example, it can be 10 mm, 12 mm, 14 mm, 16 mm, 18 mm or 20 mm, etc. Along the direction parallel to the air outlet direction, the size of the heat dissipation fin 210 is set as L, 30 mm ≤ L ≤ 60 mm. For example, it can be 30 mm, 35 mm, 40 mm, 45 mm, 50 mm, 55 mm or 60 mm, etc.

[0044] Another object of this embodiment is to provide a camera, which includes an outer frame 300, a substrate 400, the above-mentioned main board component 100 and the above-mentioned heat dissipation structure 200. Among them, a camera lens for shooting is installed on the outer frame 300, the substrate 400 is installed on the outer frame 300, and the main board component 100 is fixedly arranged on the substrate 400. The structure of this camera is simple, and it can keep the main board component 100 within an appropriate temperature range during long-term operation, improving the usage performance and service life of the camera.

[0045] It should be noted that an image sensor is also fixedly installed on one side of the substrate 400 relative to the outer frame 300. The image sensor is arranged relative to the camera lens for shooting, so that the image sensor can receive the light captured by the camera lens for shooting and is used to convert these lights into electrical signals, which are processed to form image data after that. The image sensor and the camera lens for shooting both belong to the conventional component structures of existing cameras and have the same working principle, so the present utility model will not elaborate on them here.

[0046] Specifically, the camera further includes a driving motor and a temperature sensor disposed on the main board component 100. The driving motor is communicatively connected to the main board component 100 and electrically connected to the cooling fan 220, and the temperature sensor is communicatively connected to the main board component 100. The temperature sensor is used to detect the real-time temperature of the main board component 100, and the main board component 100 can control the opening and closing of the cooling fan 220 through the driving motor according to the real-time temperature. One specific implementation is that the driving motor is fixedly arranged on the substrate 400 by screws and is used to control the start and stop of the cooling fan 220.

[0047] Exemplarily, when the camera is in specific use, when the temperature sensor detects that the real-time temperature of the main heat dissipation surface 101 of the main board component 100 is higher than the first preset temperature, the main board component 100 controls the cooling fan 220 to turn on to actively dissipate heat from the main board component 100; when the temperature sensor detects that the real-time temperature of the main heat dissipation surface 101 of the main board component 100 is lower than the first preset temperature, the main board component 100 controls the cooling fan 220 to turn off, so as to realize intelligent heat dissipation of the camera by dynamically adjusting the working state of the cooling fan 220, while reducing energy consumption and saving the camera power.

[0048] More specifically, the camera further includes an image signal processor. The image signal processor is connected to the main board component 100, and the image signal processor is connected to the above-mentioned image sensor and is used to form image data from the electrical signal to generate high-quality digital images. The image signal processor is also connected to the main board component 100. When the change value of the real-time temperature within the set time difference exceeds the set value, the main board component 100 can control the image signal processor to turn off.

[0049] Since the image signal processor generates a large amount of heat when processing images, when the change value of the real-time temperature within the set time difference exceeds the set value, it indicates that at this time, due to the instantaneous high temperature, the temperature sensor reading is distorted, damaged, the response is delayed, etc., or the power of the image signal processor is relatively high, resulting in too fast a temperature rise rate of the main board component 100. At this time, the main board component 100 can immediately turn off the image signal processor, so as to timely limit the use of the image enhancement function on the camera, such as the image enhancement function of the video, etc., to ensure that the real-time temperature of the main heat dissipation surface 101 of the main board component 100 does not exceed the temperature threshold and is damaged, thereby improving the reliability and stability of the camera.

[0050] In the description of this specification, the descriptions referring to terms such as "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0051] Obviously, the above embodiments of the present utility model are merely examples given for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included in the protection scope of the claims of the present utility model.

Claims

1. A heat dissipation structure, used to dissipate heat and cool down the heat dissipation element, characterized in that: The heat dissipation structure (200) comprises a heat dissipation fin (210), a heat dissipation fan (220) and a heat conductive film; the heat dissipation fin (210) is located on one side of the heat dissipation component to be dissipated and is in thermal contact with the heat dissipation component to be dissipated; the heat dissipation fan (220) is located on one side of the heat dissipation fin (210); the heat dissipation fan (220) can blow external air through the heat dissipation fin (210) to reduce the temperature of the heat dissipation main surface (101) of the heat dissipation component to be dissipated; and two sides of the heat conductive film are respectively bonded to the heat dissipation fin (210) and the heat dissipation component to be dissipated.

2. The heat dissipation structure according to claim 1, characterized in that: The air supply direction of the heat dissipation fan (220) is parallel to the heat dissipation surface (211) of the heat dissipation fins (210).

3. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure (200) comprises a plurality of heat dissipation fins (210), wherein the plurality of heat dissipation fins (210) are arranged in sequence and spaced apart in a direction perpendicular to an air outlet direction, and an air supply channel (201) for the external air to pass through is formed between adjacent heat dissipation fins (210), and the thermal conductive film is simultaneously connected to the plurality of heat dissipation fins (210).

4. The heat dissipation structure according to claim 3, characterized in that: The heat-conductive film is adhesively connected to the heat dissipation component and the plurality of heat dissipation fins (210).

5. The heat dissipation structure according to claim 4, characterized in that: The thermally conductive film includes any one of a thermally conductive silicone film, a thermally conductive silicone grease film or an epoxy resin film.

6. The heat dissipation structure according to claim 5, characterized in that: The heat-conducting film is a heat-conducting silicone grease film.

7. The heat dissipation structure according to claim 3, characterized in that: In a direction away from the heat-conducting film, the size of the heat dissipation fin (210) is set to h, 10 mm ≤ h ≤ 20 mm; Along a direction parallel to the air outlet direction, the size of the heat dissipation fin (210) is set to L, 30mm≤L≤60mm.

8. A camera, characterized in that The invention comprises an outer frame (300), a substrate (400), a main board component (100) and a heat dissipation structure (200) according to any one of claims 1 to 7, wherein a camera lens is mounted on the outer frame (300), the substrate (400) is mounted on the outer frame (300), and the main board component (100) is fixedly mounted on the substrate (400), the main board component (100) has the heat dissipation main surface (101), and the heat dissipation structure (200) is arranged on one side of the main board component (100) and is heat-conductingly connected to the main board component (100).

9. The camera according to claim 8, characterized in that The camera also includes a driving motor and a temperature sensor disposed on the main board component (100); the driving motor is connected to the main board component (100) and a cooling fan (220) of the cooling structure (200); the temperature sensor is communicatively connected to the main board component (100); the temperature sensor is used to detect the real-time temperature of the main board component (100); and the main board component (100) can control the opening and closing of the cooling fan (220) through the driving motor according to the real-time temperature.

10. The camera according to claim 9, characterized in that The camera also includes an image signal processor, which is connected to the main board component (100). When the change value of the real-time temperature exceeds a set value within a set time difference, the main board component (100) can control the image signal processor to shut down.

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