Photoresist bubble eliminating device and photoetching system

Abstract

The utility model particularly relates to a photoresist bubble eliminating device and a photoetching system, the photoresist bubble eliminating device comprises a main body and a diaphragm, the main body is provided with a first flow channel and a second flow channel, the first flow channel is used for conveying photoresist and is provided with a liquid inlet end and a liquid outlet end, and the second flow channel is used for conveying photoresist. The input end of the second flow channel is communicated with the part, between the liquid inlet end and the liquid outlet end, of the first flow channel, and the second flow channel is used for conveying gas in the photoresist. The diaphragm is arranged on the main body, and at least part of the diaphragm is located between the input ends of the first flow channel and the second flow channel so as to separate the first flow channel from the second flow channel. According to the photoresist bubble eliminating device disclosed by the utility model, when photoresist with bubbles flows in the first flow channel, the bubbles enter the second flow channel through the diaphragm and are discharged, and the photoresist is discharged from the output end of the first flow channel due to the fact that the photoresist cannot pass through the diaphragm, so that the bubbles in the photoresist are removed; therefore, the spraying amount of the photoresist in the photoetching system is ensured to be constant, and the waste of the photoresist is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a photoresist bubble elimination device and a lithography system. Background Art

[0002] The photoresist coating process is an important process in the manufacturing process of semiconductor silicon wafers. During the photoresist coating process, the photoresist nozzle is connected to the lithography system. The lithography system usually includes a connected photoresist supply bottle and a buffer tank. In order to make the photoresist in the new photoresist supply bottle flow into the buffer tank after replacement, high-pressure nitrogen is usually filled into the photoresist supply bottle to promote the flow of the photoresist.

[0003] However, the nitrogen filled into the photoresist supply bottle will cause bubbles in the photoresist. The bubbles will cause wafer defects during coating, so the bubbles need to be removed. However, the existing lithography system removes foam and part of the photoresist by setting a drain pipe on the buffer tank. Such a method not only has a poor effect on removing bubbles, but also because the photoresist is pressed into the buffer tank by nitrogen, air is easily mixed in. It is necessary to drain all this part of the photoresist to avoid defects caused by bubbles, which is likely to cause waste of photoresist. Summary of the Utility Model

[0004] The purpose of the utility model is to at least solve the problem that the existing lithography system is prone to waste of photoresist when eliminating bubbles. This purpose is achieved by the following technical solutions:

[0005] The first aspect of the utility model provides a photoresist bubble elimination device, comprising:

[0006] A main body, the main body has a first flow channel and a second flow channel. Among them, the first flow channel has a liquid inlet end and a liquid outlet end, the first flow channel is used for transporting photoresist, the input end of the second flow channel is connected to a part of the first flow channel between the liquid inlet end and the liquid outlet end, and the second flow channel is used for transporting the gas in the photoresist;

[0007] A diaphragm, arranged on the main body, at least part of the diaphragm is located between the first flow channel and the input end of the second flow channel to separate the first flow channel and the second flow channel.

[0008] The bubble elimination device for photoresist described in the present utility model is provided with a diaphragm at the connection of the first flow channel and the second flow channel of the main body, so that when the photoresist with bubbles flows in the first flow channel, the bubbles in the photoresist can pass through the diaphragm into the second flow channel and be discharged from the second flow channel. At this time, the photoresist cannot pass through the diaphragm and is discharged from the output end of the first flow channel. With such a setting, the bubbles in the photoresist can be removed, ensuring a constant ejection volume of the photoresist in the lithography system. At the same time, the bubble elimination method of the existing lithography system is improved, reducing the waste of photoresist.

[0009] In addition, the bubble elimination device for photoresist according to the present utility model may further have the following additional technical features:

[0010] In some embodiments of the present utility model, the main body includes a first part and a second part connected together. The first flow channel is provided on the first part, the second flow channel is provided on the second part, and the diaphragm is clamped between the first part and the second part.

[0011] In some embodiments of the present utility model, the first flow channel includes a first section, a second section, and a third section that are sequentially connected. The first section and the second section are arranged at an angle, the third section and the second section are arranged at an angle, and the second flow channel is connected to the second section.

[0012] In some embodiments of the present utility model, both the first section and the third section penetrate through the first part and are spaced apart.

[0013] The second section is configured as a connection groove opened on the surface of the first part, and the opening of the connection groove faces the diaphragm.

[0014] In some embodiments of the present utility model, the runoff area of the second section is smaller than the runoff area of the first section.

[0015] In some embodiments of the present utility model, the diaphragm is set as a polytetrafluoroethylene microporous membrane.

[0016] In some embodiments of the present utility model, the second flow channel includes a buffer section and an output section. The buffer section is connected to the first flow channel, and the runoff area of the buffer section is larger than the runoff area of the output section.

[0017] In some embodiments of the present utility model, the bubble elimination device for photoresist further includes:

[0018] A vacuum pump, which is connected to the output end of the second flow channel.

[0019] The second aspect of the present utility model further provides a lithography system, including a photoresist bubble elimination device as described in the present utility model.

[0020] Compared with the prior art, the lithography system provided by the present utility model has the technical advantages possessed by the above-mentioned photoresist bubble elimination device, which will not be elaborated herein.

[0021] In some embodiments of the present utility model, the lithography system further includes a glue supply device, a buffer device, a glue supply pump and a photoresist nozzle connected in sequence; wherein, the photoresist bubble elimination device is arranged between the glue supply pump and the photoresist nozzle. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of illustrating the preferred embodiments and are not considered to be a limitation of the present utility model. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0023] Figure 1 Schematically shows a schematic structural diagram of a photoresist bubble elimination device according to an embodiment of the present utility model;

[0024] Figure 2 For Figure 1 a schematic diagram of the usage state of the photoresist bubble elimination device described in

[0025] Figure 3 Schematically shows a schematic structural diagram of a lithography system according to an embodiment of the present utility model.

[0026] The reference numerals in the drawings are represented as follows:

[0027] 10. Photoresist bubble elimination device; 20. Glue supply device; 30. Buffer device; 40. Glue supply pump; 50. Photoresist nozzle;

[0028] 1. Main body;

[0029] 11. First part; 12. Second part;

[0030] 2. Diaphragm;

[0031] 3. First flow channel;

[0032] 31. First section; 32. Second section; 33. Third section;

[0033] 4. Second flow channel;

[0034] 41. Buffer section; 42. Output section;

[0035] 5. Vacuum pump.

[0036] 6. First nitrogen supply device;

[0037] 7. Second nitrogen supply device;

[0038] 8. Delivery pipe;

[0039] 91. Intake pipe; 92. Drain pipe; 93. Exhaust pipe; Detailed implementation manners

[0040] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0041] It should be understood that the terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless the order of performance is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0042] Although the terms first, second, third, etc. may be used in this document to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first" and "second" and other numerical terms used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0043] For ease of description, spatial relative relationship terms may be used in the text to describe the relationship of one element or feature shown in the figure relative to another element or feature. These relative relationship terms are, for example, "inside", "outside", "inner side", "outer side", "below", "beneath", "above", "over" and the like. Such spatial relative relationship terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the figure. For example, if the device in the figure is flipped, the element described as "below" or "beneath" other elements or features will then be oriented as "above" or "over" other elements or features. Thus, the exemplary term "below" may include both upward and downward orientations.

[0044] The photoresist coating process is an important process in the manufacturing process of semiconductor silicon wafers. During the photoresist coating process, the photoresist nozzle is connected to the lithography system. The lithography system generally includes a connected photoresist supply bottle and a buffer tank. In order to make the photoresist in the new photoresist supply bottle flow into the buffer tank after replacement, high-pressure nitrogen is usually filled into the photoresist supply bottle to promote the flow of the photoresist.

[0045] However, the nitrogen filled into the photoresist supply bottle will cause bubbles in the photoresist. The bubbles will cause wafer defects during the coating of the photoresist. Therefore, it is necessary to remove the bubbles. However, the existing lithography system uses a drain pipe provided on the buffer tank to discharge the photoresist and the bubbles, and then clean the bubbles in the photoresist. Such a method not only has a poor effect on removing bubbles, but also because the photoresist is pressed into the buffer tank by nitrogen pressure, air is easily mixed in, and it is necessary to discharge all of this section of the photoresist to avoid defects caused by bubbles, which is likely to cause waste of the photoresist.

[0046] To solve the above problems, the present utility model proposes a photoresist bubble elimination device 10, which is used to help solve the problem of waste of photoresist caused by the existing lithography system during bubble elimination after replacing the photoresist in a semiconductor lithography device.

[0047] In the overall design, the photoresist bubble elimination device 10 includes a main body 1 and a diaphragm 2. Among them, the main body 1 has a first flow channel 3 and a second flow channel 4. Among them, the first flow channel 3 has a liquid inlet end and a liquid outlet end. The first flow channel 3 is used to transport the photoresist. The input end of the second flow channel 4 is connected to a part of the first flow channel 3 located between the liquid inlet end and the liquid outlet end. The second flow channel 4 is used to transport the gas in the photoresist. At the same time, the diaphragm 2 is arranged on the main body 1, and at least part of the diaphragm 2 is located between the first flow channel 3 and the input end of the second flow channel 4 to separate the first flow channel 3 and the second flow channel 4.

[0048] Specifically, by disposing a diaphragm 2 at the connection of the first flow channel 3 and the second flow channel 4 of the main body 1, when the photoresist with bubbles flows in the first flow channel 3, the bubbles in the photoresist can pass through the diaphragm 2 into the second flow channel 4 and be discharged from the second flow channel 4. At this time, since the photoresist cannot pass through the diaphragm 2, it is discharged from the output end of the first flow channel 3. With such a setting, the bubbles in the photoresist can be removed, ensuring a constant ejection volume of the photoresist in the lithography system. At the same time, it improves the existing method for eliminating bubbles in the lithography system and reduces the waste of the photoresist.

[0049] It should be understood that the above-mentioned diaphragm 2 is a filter membrane that can allow gas to pass through, and the photoresist cannot pass through the diaphragm 2. When the above-mentioned photoresist bubble elimination device 10 is installed in the lithography system, the photoresist can flow at a certain speed and flow towards the photoresist nozzle 50 after flowing through the photoresist bubble elimination device 10. When the photoresist flows in the first flow channel 3 of the main body 1 at a certain speed, since the second flow channel 4 is connected to the first flow channel 3 through the diaphragm 2 and the second flow channel 4 is connected to the external environment, the pressure difference on both sides of the diaphragm 2 is relatively large, and the bubbles in the photoresist can pass through the diaphragm 2 under the action of pressure and finally flow out from the second flow channel 4, thereby realizing the elimination of the bubbles in the photoresist, which helps to improve the method for eliminating bubbles in the photoresist in the existing lithography system and helps to reduce the discharge of the photoresist.

[0050] Furthermore, the main body 1 includes a first part 11 and a second part 12 which are connected. The first flow channel 3 is disposed on the first part 11, and the second flow channel 4 is disposed on the second part 12. The diaphragm 2 is clamped between the first part 11 and the second part 12.

[0051] Specifically, by providing the main body 1 with the first part 11 and the second part 12, the diaphragm 2 can be clamped between the first part 11 and the second part 12, thereby realizing the assembly of the photoresist bubble elimination device 10, which helps to reduce the preparation difficulty of the photoresist bubble elimination device 10. Moreover, by respectively disposing the first flow channel 3 and the second flow channel 4 on the first part 11 and the second part 12, it helps to reduce the manufacturing difficulty of the main body 1, and can also effectively ensure the mating connection of the first flow channel 3, the second flow channel 4 and the diaphragm 2, thereby ensuring that the bubbles in the photoresist can pass through the diaphragm 2 from the first flow channel 3 and enter the second flow channel 4.

[0052] It should be understood that a first flow channel 3 is provided on the first part 11. Among them, the first flow channel 3 has a liquid inlet end and a liquid outlet end, and a conveying channel connecting the liquid inlet end and the liquid outlet end. Correspondingly, the second flow channel 4 has a gas inlet end and a gas outlet end, and a connection channel connecting the gas inlet end and the gas outlet end. The first part 11 and the second part 12 can be connected by clamping or screwed together by a screw connector. When the first part 11 and the second part 12 are fixedly connected, the diaphragm 2 is clamped between the first part 11 and the second part 12. At this time, the gas inlet end of the second flow channel 4 is communicated with the conveying channel through the diaphragm 2, and the gas outlet end of the second flow channel 4 is communicated with the external environment for conveying.

[0053] It should be noted that since the second flow channel 4 is connected to the first flow channel 3 and the second flow channel 4 is directly connected to the outside, when the photoresist with bubbles passes through the connection between the first flow channel 3 and the second flow channel 4 at a certain flow rate, the pressure difference on both sides of the diaphragm 2 is relatively large, and the bubbles in the photoresist can flow through the diaphragm 2 to the second flow channel 4, while the photoresist will flow out from the first flow channel 3, thereby removing the bubbles in the photoresist.

[0054] Furthermore, the first flow channel 3 includes a first section 31, a second section 32, and a third section 33 that are connected in sequence. Among them, the first section 31 and the second section 32 are arranged at an angle, the third section 33 and the second section 32 are arranged at an angle, and the second flow channel 4 is connected to the second section 32.

[0055] Specifically, by setting the first flow channel 3 as the first section 31, the second section 32, and the third section 33 that are connected in sequence, and defining that both the first section 31 and the third section 33 are arranged at an angle with the second section 32, the moving direction of the photoresist in the first flow channel 3 can be changed. At the same time, since the second flow channel 4 is connected to the second section 32, the pressure on the side of the diaphragm 2 close to the photoresist is further increased, which helps to better improve the separation efficiency of the bubbles and the photoresist.

[0056] It should be understood that in this embodiment, the angle between the first section 31 and the second section 32 of the first flow channel 3 is 90°, and the angle between the second section 32 and the third section 33 is 90°. By changing the liquid inlet directions at both ends of the second section 32, it helps to disrupt the speed or flow direction of the photoresist in the second section 32. At the same time, the second flow channel 4 is connected to the second section 32, that is, the second flow channel 4 is connected to the second section 32 through the diaphragm 2, so that when the photoresist with bubbles flows through the second section 32, not only there are changes in speed and flow direction, but also due to the different pressures on both sides of the diaphragm 2, it can ensure that the bubbles pass through the diaphragm 2 and flow out to the greatest extent.

[0057] It is further understood that both the first section 31 and the third section 33 penetrate through the first part 11 and are arranged at intervals. The second section 32 is configured as a connecting groove opened on the surface of the first part 11, and the opening of the connecting groove faces the diaphragm 2.

[0058] Specifically, both the first section 31 and the third section 33 are arranged as connecting holes penetrating through the main body 1, the first section 31 and the third section 33 are arranged at intervals, and the second section 32 is arranged as a connecting groove communicating the first section 31 and the third section 33. By defining the first section 31 and the third section 33 as connecting holes and the second section 32 as a connecting groove, it helps to reduce the manufacturing difficulty of the first part 11 and improve the manufacturing effect of the main body 1. Moreover, it can also ensure the matching effect between the second part 12 and the second part 12.

[0059] In this embodiment, the first part 11 can be arranged as a cylindrical structure. Along the axial direction of the first part 11, two connecting holes are opened on the first part 11, and the two connecting holes are arranged at intervals. The connecting holes penetrate through the first part 11. At the same time, a connecting groove is opened on the surface of the first part 11, and both ends of the connecting groove are respectively communicated with one end of the two connecting holes. When the diaphragm 2 is clamped between the first part 11 and the second part 12 and the opening of the connecting groove faces the diaphragm 2, such an arrangement helps to increase the connection area between the diaphragm 2 and the first flow channel 3, thereby improving the filtering effect of the diaphragm 2.

[0060] It should be noted that the cross-sectional shape of the second section 32 can be a polygon or a circle. If the cross-section of the second section 32 is a polygon, the diaphragm 2 can be used as at least one side of the polygon. If the cross-section of the second section 32 is a circle, at this time, a mating groove needs to be opened on the second part 12, and a limiting protrusion is arranged on the first part 11. When the second part 12 is connected to the first part 11, the mating groove and the connecting groove cooperate to form a circular cross-section of the second section 32. At the same time, the mating groove fits and connects with the limiting protrusion, and the diaphragm 2 is clamped between the mating groove and the limiting protrusion so that the diaphragm 2 fits with the mating groove.

[0061] It needs to be further understood that the runoff area of the second section 32 is smaller than the runoff area of the first section 31.

[0062] Specifically, by defining that the runoff area of the second section 32 is smaller than the runoff area of the first section 31, it helps to further change the pressure of the photoresist in the first flow channel 3. At the same time, since the second flow channel 4 is communicated with the second section 32, the pressure on the side of the diaphragm 2 close to the photoresist can be further increased, which helps to further improve the separation efficiency of the bubbles and the photoresist.

[0063] It should be understood that the runoff area is the cross-sectional area perpendicular to the flow direction of the photoresist when the photoresist flows through the first flow channel. In this embodiment, both the first section 31 and the third section 33 are circular holes, and at this time, the radial cross-sectional areas of the first section 31 and the third section 33 are the runoff areas. The runoff area of the second section 32 is the cross-sectional area perpendicular to the extension direction of the second section 32. Preferably, the runoff area of the first section 31 is the same as that of the third section 33 and is larger than the runoff area of the second section 32. With such a setting, while ensuring the conveying efficiency of the photoresist, the bubble separation effect in the photoresist can be improved.

[0064] It should be noted that in addition to defining the runoff area of the second section 32, the pressure of the second section 32 can also be increased by defining the structure of the third section 33, such as adopting a tortuous structure, or the runoff area of the third section 33 is smaller than that of the first section 31, etc.

[0065] It should be further understood that the diaphragm 2 is set as a polytetrafluoroethylene microporous membrane. The polytetrafluoroethylene membrane is a semi-finished product obtained by extruding rods and tapes of polytetrafluoroethylene and then calendering them into films. After stretching and heat setting at a temperature below the melting point, a porous product is obtained. Due to its property of being permeable to gas but impermeable to water, the polytetrafluoroethylene microporous membrane can be used as a gas dialysis membrane. In this embodiment, by using the polytetrafluoroethylene microporous membrane as the diaphragm 2, not only can the separation effect between bubbles and the photoresist be effectively ensured, but also the influence of the external environment on the photoresist can be reduced, and the use effect of the photoresist can be guaranteed.

[0066] Furthermore, the second flow channel 4 includes a buffer section 41 and an output section 42. The buffer section 41 is connected to the first flow channel 3, and the runoff area of the buffer section 41 is larger than that of the output section 42.

[0067] It should be understood that the cross-sections of both the buffer section 41 and the output section 42 are circular, and among them, the length of the buffer section 41 is greater than that of the output section 42. By defining that the second flow channel 4 has a buffer section 41 and an output section 42, where the buffer section 41 is connected to the first flow channel 3 and the runoff area of the buffer section 41 is larger than that of the output section 42, on the one hand, the connection area between the second flow channel 4 and the first flow channel 3 is increased, which helps to improve the bubble separation effect between the bubbles and the photoresist; on the other hand, the cross-sectional size of the output section 42 is defined, which helps to reduce the entry of external impurities into the second flow channel 4 to contaminate and affect the use effect of the diaphragm 2. At the same time, the setting of the buffer section 41 also helps to increase the pressure difference of the diaphragm 2, improve the dialysis effect of the bubbles, and reduce the impact of the bubbles on the second flow channel 4, ensuring the connection effect between the first part 11 and the second part 12.

[0068] Furthermore, the photoresist bubble elimination device 10 further includes a vacuum pump 5, and the vacuum pump 5 is connected to the output end of the second flow channel 4.

[0069] Specifically, by connecting the vacuum pump 5 to the output end of the second flow channel 4, it helps to further increase the pressure difference across the diaphragm 2, thereby improving the dialysis effect of the bubbles, ensuring the separation effect between the photoresist and the bubbles. At the same time, it also helps to expand the applicable range of the photoresist bubble elimination device 10 and improve the conveying efficiency of the photoresist.

[0070] It should be understood that the vacuum pump 5 can be an existing product and can be directly purchased and used. When the photoresist bubble elimination device 10 is directly installed on the lithography system and the vacuum pump 5 is not provided, when the conveying speed of the photoresist is in the range of 0.5 - 2.0 ml / min, the separation effect between the photoresist and the bubbles can be ensured. When the photoresist bubble elimination device 10 is installed in the lithography system and is equipped with the vacuum pump 5, the conveying speed of the photoresist can reach 60 ml / min. Within this range, when the photoresist with bubbles passes through the photoresist bubble elimination device 10, the elimination effect of the bubbles can be maximally ensured.

[0071] In addition, this embodiment also relates to a lithography system, which includes the photoresist bubble elimination device 10 as described above.

[0072] Compared with the prior art, the lithography system proposed by the present utility model has the technical advantages possessed by the above-mentioned photoresist bubble elimination device 10, which will not be elaborated herein.

[0073] Furthermore, the lithography system further includes a glue supply device 20, a buffer device 30, a glue supply pump 40, and a photoresist nozzle 50 that are connected in sequence. Among them, the photoresist bubble elimination device 10 is arranged between the glue supply pump 40 and the photoresist nozzle 50.

[0074] Specifically, by defining the installation position of the photoresist bubble elimination device 10, the bubbles in the photoresist are maximally eliminated before entering the glue supply pump 40, which helps to reduce the impact of the bubbles on the glue supply pump 40, thereby ensuring the output volume of the photoresist and further guaranteeing the coating effect of the photoresist.

[0075] It should be understood that as Figure 2 shown, the lithography system includes a glue supply device 20, a buffer device 30, a photoresist bubble elimination device 10, a glue supply pump 40, and a photoresist nozzle 50. Among them, the glue supply device 20, the buffer device 30, the photoresist bubble elimination device 10, the glue supply pump 40, and the photoresist nozzle 50 are connected in sequence through a delivery pipe 8. In this embodiment, the glue supply device 20 is set as a bottle with a capacity of 4L and needs to be replaced regularly. The glue supply device 20 is connected to the first nitrogen supply device 6 through an intake pipe 91. By supplying nitrogen to the glue supply device 20 by the first nitrogen supply device 6, the photoresist can enter the delivery pipe 8 and flow into the buffer device 30. However, at this time, some bubbles will enter the photoresist.

[0076] In this embodiment, the buffer device 30 is set as a buffer tank with a capacity of 45 cc to 300 cc. And a liquid level sensor or a bubble sensor is provided on the buffer tank to detect the liquid level height of the photoresist in the buffer tank. At the same time, an air inlet pipe 91, a drain pipe 92 and an exhaust pipe 93 are also provided on the buffer device 30. At this time, the buffer device 30 can discharge part of the bubbles and photoresist through the drain pipe 92 and the exhaust pipe 93 to reduce the bubble content in the photoresist. The second nitrogen supply device 7 can control the flow direction of the photoresist to the supply pump 40 through the air inlet pipe 91.

[0077] Still as Figure 2 shown, the supply pump 40 can transport the photoresist to the photoresist nozzle 50 and finally distribute it onto the wafer. In this embodiment, a filter is provided on the supply pump 40 to remove contaminants. It should be noted that the supply pump 40 can be used to control the ejection amount of the photoresist and ensure that the ejection amount is constant each time. Since the presence of bubbles will affect the constancy of the ejection amount, a photoresist bubble elimination device 10 is provided between the buffer device 30 and the supply pump 40 to be able to eliminate the bubbles in the photoresist before the photoresist enters the supply pump 40, thereby reducing the influence of the bubbles on the supply pump 40.

[0078] It needs to be further understood that in this embodiment, the photoresist bubble elimination device 10 includes a vacuum pump 5. The vacuum pump 5 is connected to the second flow channel 4 of the main body 1 to ensure the separation effect of the bubbles and the photoresist, and can also ensure the conveying efficiency of the photoresist and guarantee the normal use of the supply pump 40.

[0079] As described above, only the preferred specific embodiments of the present invention are given, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A photoresist bubble elimination device, characterized in that: include: A main body, the main body having a first flow channel and a second flow channel, wherein the first flow channel has a liquid inlet end and a liquid outlet end, the first flow channel is used to transport photoresist, the input end of the second flow channel is connected to a portion of the first flow channel located between the liquid inlet end and the liquid outlet end, and the second flow channel is used to transport gas in the photoresist; A diaphragm is provided on the main body, and at least a part of the diaphragm is located between the input ends of the first flow channel and the second flow channel to separate the first flow channel from the second flow channel.

2. The photoresist bubble elimination device according to claim 1, characterized in that: The main body comprises a first part and a second part which are connected to each other, the first part is provided with a first flow channel, the second part is provided with a second flow channel, and the diaphragm is sandwiched between the first part and the second part.

3. The photoresist bubble elimination device according to claim 2, characterized in that: The first flow channel includes a first section, a second section and a third section which are connected in sequence; the first section is arranged at an angle with the second section, the third section is arranged at an angle with the second section, and the second flow channel is connected with the second section.

4. The photoresist bubble elimination device according to claim 3, characterized in that: The first section and the third section are both arranged through the first portion, and the first section and the third section are arranged at intervals; The second section is configured as a connecting groove opened on the surface of the first portion, and the opening of the connecting groove is arranged toward the diaphragm.

5. The photoresist bubble elimination device according to claim 4, characterized in that: The runoff area of ​​the second section is smaller than the runoff area of ​​the first section.

6. The photoresist bubble elimination device according to claim 1, characterized in that: The diaphragm is configured as a polytetrafluoroethylene microporous membrane.

7. The photoresist bubble elimination device according to claim 1, characterized in that: The second flow channel includes a buffer section and an output section. The buffer section is connected to the first flow channel, and a runoff area of ​​the buffer section is larger than a runoff area of ​​the output section.

8. The photoresist bubble elimination device according to claim 1, characterized in that: The photoresist bubble elimination device also includes: A vacuum pump is connected to the output end of the second flow channel.

9. A photolithography system, characterized in that: It comprises a photoresist bubble elimination device as described in any one of claims 1-8.

10. The photolithography system according to claim 9, characterized in that: The photolithography system further comprises a glue supply device, a buffer device, a glue supply pump and a photoresist nozzle which are sequentially connected and arranged; wherein the photoresist bubble elimination device is arranged between the glue supply pump and the photoresist nozzle.

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