Server liquid cooling heat dissipation device and server

Abstract

The utility model relates to a server liquid cooling heat dissipation device and a server. The server liquid cooling heat dissipation device comprises a water inlet pipe, a main water distributor, a water outlet pipe, two first heat dissipation assemblies and two second heat dissipation assemblies. A water inlet of the main water distributor communicates with the water inlet pipe, the main water distributor communicates with the two first heat dissipation assemblies, and each first heat dissipation assembly communicates with the water outlet pipe through the corresponding second heat dissipation assembly. By means of the main water distributor communicated with the water inlet pipe, cooling liquid circulates through the two sets of flow channels connected in parallel, the two sets of flow channels sequentially pass through the first heat dissipation assembly and the second heat dissipation assembly respectively, and therefore heat dissipation can be conducted on a memory bank and a CPU through the first heat dissipation assembly and the second heat dissipation assembly; the heat dissipation degree difference of memory banks and CPUs installed at different positions can be reduced, so that the heat dissipation uniformity is improved, and the running stability of a server is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to a liquid cooling heat dissipation device for a server and a server. Background Art

[0002] With the continuous upgrading of electronic devices such as servers, the heat dissipation problem of their supporting hardware has become increasingly prominent, posing higher requirements on the temperature management strategies of major radiator manufacturers. Memory is an important hardware component in a server, used to store programs and data and can be directly addressed by a Central Processing Unit (CPU). The traditional method for dissipating heat from memory is to rely on the system fan or use a thermal interface material in combination with a metal heat sink. However, due to the continuous upgrading of the memory operating frequency, the memory under the traditional heat dissipation method will maintain a relatively high temperature during operation, and the reliability of long-term operation will be correspondingly reduced. In recent years, the liquid cooling heat dissipation method has developed rapidly and has been applied in various scenarios, and its relative advantages in terms of heat dissipation capacity, power consumption cost, waste heat utilization, user experience, etc. have become increasingly prominent. However, in the process of heat dissipation of existing liquid cooling radiators, there is a problem of poor uniformity, which affects the stability of server operation. Summary of the Utility Model

[0003] Based on this, in view of the technical problem that the existing liquid cooling radiator has poor uniformity in the heat dissipation process, which affects the stability of server operation, it is necessary to provide a liquid cooling heat dissipation device for a server.

[0004] A liquid cooling heat dissipation device for a server includes an inlet pipe, a main water distributor, an outlet pipe, two groups of first heat dissipation components, and two groups of second heat dissipation components;

[0005] The water inlet of the main water distributor is connected to the inlet pipe, and the main water distributor is respectively connected to the two groups of first heat dissipation components, and each group of first heat dissipation components is respectively connected to the outlet pipe through a group of second heat dissipation components.

[0006] In one embodiment, the first heat dissipation component is used to dissipate heat from the memory module, and the second heat dissipation component is used to dissipate heat from the CPU.

[0007] In one embodiment, the first heat dissipation component includes a first cooling member, a second cooling member, and a first water distributor connected in sequence. The first cooling member is connected to the main water distributor, and the second cooling member is connected to the second heat dissipation component.

[0008] In one embodiment, the second cooling member is located outside the first cooling member.

[0009] In one embodiment, the first cooling member or the second cooling member includes a plurality of first cooling plates arranged at intervals. Each of the first cooling plates has a first channel for the coolant to flow through, and there is an installation gap for inserting the memory module between adjacent first cooling plates.

[0010] In one embodiment, the first cooling plate has a notch for avoiding the protruding part on the memory module.

[0011] In one embodiment, the first cooling member or the second cooling member further includes a heat-conducting pad sleeved on the first cooling plate for abutting against the corresponding memory module.

[0012] In one embodiment, the second heat dissipation component includes a second water distributor, a second cooling plate and a liquid passing pipeline. The second water distributor is communicated with the first heat dissipation component. The second cooling plate is used for covering the CPU, and the second cooling plate has a second channel for the coolant to flow through. One end of the second channel is communicated with the second water distributor through the liquid passing pipeline, and the other end of the second channel is communicated with the water outlet pipe.

[0013] In one embodiment, the water inlet of the second channel is located in the middle area of the second cooling plate. The liquid passing pipeline includes a communicating section and a bending section which are communicated with each other. The communicating section is communicated with the second water distributor, and the bending section is communicated with the water inlet of the second cooling plate.

[0014] The utility model further provides a server, which can solve at least one of the above technical problems.

[0015] A server includes the server liquid cooling and heat dissipation device as described above.

[0016] Beneficial effects:

[0017] The server liquid cooling device provided by the embodiment of the utility model includes a water inlet pipe, a main water distributor, a water outlet pipe, two groups of first heat dissipation components and two groups of second heat dissipation components; the water inlet of the main water distributor is connected to the water inlet pipe, and the main water distributor is respectively connected to the two groups of first heat dissipation components, and each group of first heat dissipation components is respectively connected to the water outlet pipe through a group of second heat dissipation components. In the present application, the coolant is circulated through two groups of parallel flow channels through the main water distributor connected to the water inlet pipe, so that the two groups of flow channels pass through a group of first heat dissipation components and a group of second heat dissipation components in turn, and flow out through the water outlet pipe, so that the memory bar and the CPU in the server can be cooled by the first heat dissipation component and the second heat dissipation component, and compared with the mode of connecting each flow channel in series, the parallel setting of the two groups of flow channels in the present application can reduce the difference in the degree of heat dissipation of each group of first heat dissipation components and second heat dissipation components to the memory bar and CPU installed at different positions, thereby improving the heat dissipation uniformity and improving the stability of server operation.

[0018] The utility model also provides a server, comprising the above-mentioned server liquid cooling and heat dissipation device, and the server can achieve at least one of the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a server liquid cooling device provided in one embodiment of the utility model.

[0020] Figure 2 A schematic diagram of a first heat dissipation component in a server liquid cooling device provided in an embodiment of the utility model.

[0021] Figure 3 An exploded view of a first cooling plate in a server liquid cooling device according to an embodiment of the present invention.

[0022] Figure 4 A schematic diagram of the cooperation between the thermal pad and the first cooling plate in a server liquid cooling device provided by an embodiment of the utility model.

[0023] Figure Number:

[0024] 100-water inlet pipe; 200-main water distributor; 300-water outlet pipe; 310-transfer pipe; 320-circulation pipe;

[0025] 400-first heat dissipation component; 410-first cooling element; 420-second cooling element; 430-first water distributor; 440-first cooling plate; 441-first channel; 442-installation gap; 443-notch; 444-first pressure plate; 445-second pressure plate; 450-thermal pad; 451-avoidance; 500-second heat dissipation component; 510-second water distributor; 520-second cooling plate; 530-liquid pipeline; 531-connecting section; 532-bending section; 600-three-way valve. Detailed implementation manners

[0026] To make the above objects, features and advantages of the present utility model more obvious and understandable, the following will describe in detail the specific implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0027] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0029] In the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0032] Refer to Figure 1 , Figure 1 is a schematic diagram of a server liquid cooling and heat dissipation device provided by an embodiment of the present utility model. An embodiment of the present utility model provides a server liquid cooling and heat dissipation device, which includes an inlet pipe 100, a main water distributor 200, an outlet pipe 300, two groups of first heat dissipation components 400 and two groups of second heat dissipation components 500; the water inlet of the main water distributor 200 is communicated with the inlet pipe 100, and the main water distributor 200 is respectively communicated with the two groups of first heat dissipation components 400, and each group of first heat dissipation components 400 is respectively communicated with the outlet pipe 300 through a group of second heat dissipation components 500.

[0033] Specifically, in the present application, through the main water distributor 200 communicated with the inlet pipe 100, the coolant is circulated through two groups of parallel flow channels, so that the two groups of flow channels sequentially pass through a group of first heat dissipation components 400 and a group of second heat dissipation components 500, and flow out through the outlet pipe 300, so that the memory modules and CPUs in the server can be cooled by the first heat dissipation components 400 and the second heat dissipation components 500. Compared with the way of series connection of each flow channel, the parallel setting of the two groups of flow channels in the present application can reduce the difference in the heat dissipation degree of the memory modules and CPUs installed at different positions by the first heat dissipation components 400 and the second heat dissipation components 500, thereby improving the heat dissipation uniformity and the stability of the server operation.

[0034] Among them, two parallel flow channels are provided in the present application. Compared with the way of setting multiple parallel flow channels, it can reduce the disorder of the flow channel arrangement. At the same time, it can also reduce the flow resistance and improve the stability of the coolant flow.

[0035] It should be noted that the CPU and the memory module are core components within the server. To ensure the stable operation of the server, heat dissipation needs to be carried out for the CPU and the memory module. Therefore, the first heat dissipation component 400 and the second heat dissipation component 500 are used for heat dissipation of the CPU and the memory module.

[0036] Refer to Figure 1 , in one embodiment, the first heat dissipation component 400 is used for heat dissipation of the memory module, and the second heat dissipation component 500 is used for heat dissipation of the CPU.

[0037] Specifically, the coolant first passes through the first heat dissipation component 400 via the main and branch water pipes and then through the second heat dissipation component 500. Then, the heat dissipation effect of the first heat dissipation component 400 is better, so that more heat on the memory module can be taken away. That is, under the condition of meeting the CPU operating temperature requirements, the heat dissipation effect of the first heat dissipation component 400 is maximized, and the operating stability of the memory module is improved.

[0038] Refer to Figure 1 and Figure 2 , in one embodiment, the first heat dissipation component 400 includes a first cooling member 410, a first water distributor 430, and a second cooling member 420 that are connected in sequence. The first cooling member 410 is connected to the main and branch water distributor 200, and the second cooling member 420 is connected to the second heat dissipation component 500.

[0039] Specifically, the setting of the first water distributor 430 can facilitate the arrangement of the first cooling member 410 and the second cooling member 420, thereby reducing the volume of the first heat dissipation component 400 and reducing the occupation of the internal space of the server.

[0040] Among them, taking the attached Figure 1 of the specification as an example, there are 4 preset positions in the server for installing the memory module. The 4 preset positions are arranged in sequence from left to right. Two first cooling members 410 are used to install the memory modules at 2 of the preset positions, and two second cooling members 420 are used to cool the memory modules installed at the other 2 preset positions. That is, the colder coolant first passes through each memory module to reduce the temperature difference of each memory module and improve the operating stability of the server.

[0041] It should be noted that in other embodiments, the number of preset positions can be 6, then each group of the first heat dissipation components 400 includes two second cooling members 420 and two first water distributors 430; the number of preset positions can be 8, then each group of the first heat dissipation components 400 includes three second cooling members 420 and three first water distributors 430. The preset positions can also be others. The rule is the same as above, and the connection method is also the same, so it will not be elaborated here.

[0042] Refer to Figure 1 and Figure 2, in one embodiment, the second cooling member 420 is located outside the first cooling member 410, so that the first cooling member 410 cools the memory module at a preset position in the middle region, and the second cooling member 420 cools the memory module at a preset position in the outer region, thereby facilitating the arrangement of the main water distributor 200, the first water distributor 430 and the flow channels, reducing the volume of the main water distributor 200, and reducing the occupation of the internal space of the server.

[0043] Refer to Figure 1 , Figure 2 and Figure 3 , Figure 3 FIG. Figure 3 is an exploded view of the first cooling plate in the server liquid cooling and heat dissipation device provided by an embodiment of the present invention. In one embodiment, the first cooling member 410 or the second cooling member 420 includes a plurality of first cooling plates 440 arranged at intervals, and each first cooling plate 440 has a first channel 441 for the coolant to flow through, and there is an installation gap 442 for inserting the memory module between adjacent first cooling plates 440.

[0044] Specifically, a plurality of first cooling plates 440 arranged at intervals are installed at each preset position. The shape of the first cooling plate 440 corresponds to the shape of the memory module, and a first cooling plate 440 is provided on both sides of each memory module, so as to ensure efficient heat dissipation of the memory module. Among them, the number of first cooling plates 440 provided at each preset position in this embodiment is four. In other embodiments, it may also be other numbers.

[0045] Furthermore, the first cooling plate 440 includes a first pressing plate 444 and a second pressing plate 445. The first pressing plate 444 and the second pressing plate 445 are buckled to form the first cooling plate 440 and enclose the first channel 441. The buckling arrangement of the first pressing plate 444 and the second pressing plate 445 facilitates the inspection of the first channel 441.

[0046] Refer to Figure 1 , Figure 2 and Figure 3 , in one embodiment, the first cooling plate 440 has a notch 443 for avoiding the protruding part on the memory module, so as to be able to adapt to different types of memory modules and improve adaptability. Among them, the first cooling plate 440 is made of copper or stainless steel.

[0047] Refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 4Schematic diagram of the cooperation between the heat conduction pad and the first cooling plate in the server liquid cooling and heat dissipation device provided by an embodiment of the present utility model. In one embodiment, the first cooling member 410 or the second cooling member 420 further includes a heat conduction pad 450, and the heat conduction pad 450 is sleeved on the first cooling plate 440 for abutting against the corresponding memory module.

[0048] Specifically, the heat conduction pad 450 has elasticity, which can effectively ensure good fitting and heat conduction between the heat conduction pad 450 and the memory module. Among them, the heat conduction pad 450 is a wear-resistant heat conduction interface material.

[0049] Furthermore, the cross-section of the heat conduction pad 450 is in an n-shaped structure, and the inner side of the heat conduction pad 450 has adhesiveness, so that it can be bonded to the first cooling plate 440. During the process of inserting and removing the memory module, the heat conduction pad 450 will not move relative to the first cooling plate 440, ensuring the heat conduction effect of the heat conduction pad 450. Among them, the heat conduction pad 450 has an avoidance opening 451 aligned with the notch 443 for avoiding the protruding part on the memory module.

[0050] Refer to Figure 1 , in one embodiment, the second heat dissipation component 500 includes a second water distributor 510, a second cooling plate 520 and a liquid passing pipeline 530. The second water distributor 510 is connected to the first heat dissipation component 400. The second cooling plate 520 is used to cover the CPU, and the second cooling plate 520 has a second channel for the coolant to flow through. One end of the second channel is connected to the second water distributor 510 through the liquid passing pipeline 530, and the other end of the second channel is connected to the water outlet pipe 300.

[0051] Specifically, as described in the Figure 1 specification appendix, in this embodiment, the number of CPUs is two, and they are respectively arranged on the left and right sides of the preset positions in the middle area. The two second cooling plates 520 are respectively located between the first cooling member 410 and the second cooling member 420 in each group of the first heat dissipation components 400 to dissipate heat from the two CPUs.

[0052] Refer to Figure 1 , in one embodiment, the water inlet of the second channel is located in the middle area of the second cooling plate 520. The liquid passing pipeline 530 includes a communicating section 531 and a bending section 532 that are connected to each other. The communicating section 531 is connected to the second water distributor 510, and the bending section 532 is connected to the water inlet of the second cooling plate 520.

[0053] Specifically, the algorithm in the middle area of the CPU is more complex, so the temperature is the highest. The relatively cold coolant enters through the water inlet arranged in the middle area of the second cooling plate 520, so that the middle area of the CPU can be better cooled first, improving the uniformity of the CPU temperature. Among them, the setting of the bent section 532 can reasonably arrange the positions of the water inlet and outlet of the second channel and can reduce the interference with the water outlet pipe 300.

[0054] Refer to Figure 1 , in one embodiment, the water outlet pipe 300 includes a flow-through pipe 320, two adapter pipes 310 and a three-way valve 600. One ends of the two adapter pipes 310 are respectively communicated with the water outlets of the two second channels and are communicated with the two valve ports of the three-way valve 600, and the flow-through pipe 320 is communicated with the outlet of the three-way valve 600.

[0055] The heat transfer path in this application is as follows: The low-temperature coolant is introduced into the main water distributor 200 through the water inlet pipe 100, and then reaches the first cooling plates 440 in the two first cooling members 410 respectively through the main water distributor 200. The heat generated by the operation of the memory module is conducted to the corresponding first cooling plate 440 through the thermal conductive pad 450 here. The coolant circulating in the first cooling plate 440 takes away the heat, and then reaches the first cooling plates 440 in the two second cooling members 420 through the two first water distributors 430. Similarly, the coolant takes away the heat of the memory module here, and then flows through the two second cooling plates 520 through the second water distributors 510 respectively, taking away the heat generated by the operation of the CPU. The coolant in the left and right flow channels converges at the three-way valve 600 and flows out of the server liquid cooling and heat dissipation device through the flow-through pipe 320. The coolant storing heat is cooled after heat exchange outside and then flows back into the water inlet pipe 100 again, repeating the above process to complete the heat dissipation process of the components covered by the server liquid cooling and heat dissipation device in the server.

[0056] Refer to Figure 1 , Figure 2 and Figure 4 , the embodiment of the present utility model further provides a server, including the above-mentioned server liquid cooling and heat dissipation device.

[0057] Specifically, in the present application, through the main water distributor 200 connected to the water inlet pipe 100, the coolant is circulated through two groups of parallel flow channels, so that the two groups of flow channels sequentially pass through a group of first heat dissipation components 400 and a group of second heat dissipation components 500, and flow out through the water outlet pipe 300. Thus, the first heat dissipation components 400 and the second heat dissipation components 500 can dissipate heat from the memory modules and the CPU in the server. Compared with the way of series connection of each flow channel, the parallel arrangement of the two groups of flow channels in the present application can reduce the difference in the heat dissipation degree of each group of first heat dissipation components 400 and second heat dissipation components 500 for the memory modules and the CPU installed at different positions, thereby improving the heat dissipation uniformity and the stability of the server operation.

[0058] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0059] The above-described embodiments only represent several implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A server liquid cooling device, characterized in that: The server liquid cooling device comprises a water inlet pipe, a main water distributor, a water outlet pipe, two groups of first heat dissipation components and two groups of second heat dissipation components; The water inlet of the main water distributor is connected to the water inlet pipe, and the main water distributor is respectively connected to two groups of the first heat dissipation components, and each group of the first heat dissipation components is respectively connected to the water outlet pipe through a group of the second heat dissipation components.

2. The server liquid cooling device according to claim 1, characterized in that: The first heat dissipation component is used to dissipate heat for the memory bar, and the second heat dissipation component is used to dissipate heat for the CPU.

3. The server liquid cooling device according to claim 2, characterized in that: The first heat dissipation component includes a first cooling element, a second cooling element and a first water distributor which are connected in sequence. The first cooling element is connected to the main water distributor, and the second cooling element is connected to the second heat dissipation component.

4. The server liquid cooling device according to claim 3, characterized in that: The second cooling member is located outside the first cooling member.

5. The server liquid cooling device according to claim 3, characterized in that: The first cooling member or the second cooling member includes a plurality of first cooling plates arranged at intervals, each of the first cooling plates has a first channel for circulating a cooling liquid, and adjacent first cooling plates have an installation gap for inserting the memory stick.

6. The server liquid cooling device according to claim 5, characterized in that: The first cooling plate has a notch for avoiding the protrusion on the memory bar.

7. The server liquid cooling device according to claim 5, characterized in that: The first cooling member or the second cooling member further includes a thermal pad, and the thermal pad is sleeved on the first cooling plate to abut against the corresponding memory bar.

8. The server liquid cooling device according to any one of claims 2 to 7, characterized in that: The second heat dissipation component includes a second water distributor, a second cooling plate and a liquid pipeline. The second water distributor is connected to the first heat dissipation component. The second cooling plate is used to cover the CPU, and the second cooling plate has a second channel for circulating coolant. One end of the second channel is connected to the second water distributor through the liquid pipeline, and the other end of the second channel is connected to the water outlet pipe.

9. The server liquid cooling device according to claim 8, characterized in that: The water inlet of the second channel is located in the middle area of ​​the second cooling plate, and the liquid pipeline includes a connecting section and a bending section that are interconnected. The connecting section is connected to the second water distributor, and the bending section is connected to the water inlet of the second cooling plate.

10. A server, characterized in that: A server liquid cooling device comprising any one of claims 1-9.

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