Supporting plate for electrode sintering of thermistor chip

Abstract

The utility model discloses a supporting plate for thermistor chip electrode sintering, which comprises a body, a plurality of chip grooves are arranged on the body, the chip grooves are arranged on the body at intervals in an array mode, and the distance between every two adjacent chip grooves is 3-4mm. The bottom of the chip groove is of a hollow structure, a supporting flange is arranged in the chip groove, and the supporting flange abuts against the edge of the thermistor chip and is used for supporting the thermistor chip; according to the utility model, the chip groove with the hollow structure is arranged on the body of the supporting plate, and the supporting flange is arranged in the chip groove, so that the bottom of the thermistor chip is not contacted with the body of the supporting plate in the sintering process, the yield can be improved, and the subsequent processing operation is facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of thermistor chip processing, and particularly relates to a pallet for electrode sintering infiltration of a thermistor chip. Background Technique

[0002] After a thermistor adopts screen-printed electrodes, electrode sintering infiltration needs to be carried out in a high-temperature sintering infiltration furnace to form an electrode layer with stable performance and dense structure; the electrode sintering infiltration of the thermistor is usually carried out by using a stainless-steel mesh frame as a loading carrier. After the electrodes are printed and dried on the surface of the thermistor, the thermistor is transferred to the stainless-steel mesh by means of turning, loaded in a flat and non-overlapping manner, and finally the stainless-steel mesh frame together with the thermistor is sent into the high-temperature sintering infiltration furnace for electrode sintering infiltration to form electrodes.

[0003] In the traditional electrode sintering infiltration method, although the thermistors are loaded in the stainless-steel mesh frame in a flat and non-overlapping manner, due to the relatively simple design of the mesh frame, it is impossible to effectively position the thermistors. At the same time, it is very difficult to design the mesh frame with an integral turning function for use in the subsequent processes. Generally, after electrode sintering infiltration, before the thermistors are subjected to full-voltage withstand screening or resistance value measurement in the subsequent processes, the thermistors must be poured out of the mesh frame and then sorted by mechanical vibration screening.

[0004] In the traditional electrode sintering infiltration method, when the thermistors are loaded in the mesh frame, the surface electrodes of the resistor chips need to be in direct contact with the stainless-steel mesh frame. Due to process adaptability reasons, discoloration marks in a certain state will occur at the contact parts due to the influence of chemical reactions and heat absorption effects. This phenomenon will lead to a reduction in the qualified rate of the product appearance and pose a safety hazard to the electrical performance of the product.

[0005] In addition, in the traditional electrode sintering infiltration method, due to the relatively large external dimensions of the mesh frame, generally only single-layer or at most two-layer mesh frame electrode sintering infiltration can be achieved in a sintering infiltration furnace with a general structure, and the ventilation effect during the sintering infiltration process is poor, and the overall production efficiency is low.

[0006] In the traditional stainless-steel sintering infiltration mesh frame sintering infiltration, the thermistors are usually loaded in a simple and scattered manner. After electrode sintering infiltration, before the thermistors are subjected to full-voltage withstand screening or resistance value measurement in the subsequent processes, the thermistors must be poured out of the mesh frame and then sorted by mechanical vibration. The mechanical vibration during the sorting process will inevitably cause appearance damage to the matrix and electrodes of the resistor chips, and also pose a safety hazard to the electrical performance of the chips. Summary of the Utility Model

[0007] The purpose of the present utility model is to provide a pallet for electrode baking and infiltration of a thermistor chip. By providing a chip groove with a hollow structure on the body of the pallet and arranging a supporting flange in the chip groove, it can ensure that the bottom of the thermistor chip does not contact the body of the pallet during the baking and infiltration process, thereby improving the yield rate.

[0008] The present utility model is realized through the following technical solutions:

[0009] A pallet for electrode baking and infiltration of a thermistor chip, including a body, wherein a plurality of chip grooves are provided on the body, and the chip grooves are arranged at intervals in an array form on the body, and the distance between adjacent chip grooves is 3-4 mm; the bottom of the chip groove is of a hollow structure, and a supporting flange is arranged in the chip groove, and the supporting flange abuts against the edge of the thermistor chip for supporting the thermistor chip.

[0010] Further, the length of the chip groove is 29-30 mm, the width is 10-11 mm, and the depth is 1.5 mm.

[0011] Further, the supporting flange is arranged at the edge position of the bottom of the chip groove.

[0012] Further, the width of the supporting flange is 1-2 mm.

[0013] Further, relief openings are symmetrically arranged on the supporting flanges on the left and right sides in the chip groove, the relief openings are of an arc structure, and the relief openings are used for making way for the lower electrode probe.

[0014] Further, a plurality of grooves are respectively arranged at the edges of the upper and lower ends and the middle position of the body, and supporting feet are correspondingly arranged below the grooves.

[0015] Further, the length of the body is 200-210 mm, the width is 150-160 mm, and the thickness is 2-3 mm.

[0016] Compared with the prior art, the present utility model has the following advantages and beneficial effects:

[0017] 1) In the present utility model, by providing a chip groove with a hollow structure on the body of the pallet and arranging a supporting flange in the chip groove, it can ensure that the bottom of the thermistor chip does not contact the body of the pallet during the baking and infiltration process, thereby improving the yield rate.

[0018] 2) In the present utility model, a plurality of grooves are provided on the pallet, and support feet are correspondingly arranged below the positions where the grooves are provided. During the sintering process, the support feet of the upper body can be correspondingly inserted into the grooves of the lower body to keep the bodies stable. Moreover, the bodies are arranged at intervals, enabling the multi-layer stacking sintering process. At the same time, it is ensured that the upper pallet will not press the lower thermistor chips during multi-layer stacking sintering, reserving sufficient ventilation and exhaust space, and ensuring the uniformity of the electrode sintering temperature and atmosphere. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a top view structural schematic diagram of the pallet for electrode sintering of the thermistor chip of the present utility model.

[0021] Figure 2 It is a partial cross-sectional view of the side of the pallet for electrode sintering of the thermistor chip of the present utility model.

[0022] Figure 3 For Figure 2 the structural schematic diagram at position A in

[0023] Figure 4 For Figure 2 the structural schematic diagram at position B in

[0024] Wherein: 1 - body, 2 - chip slot, 3 - support flange, 31 - relief opening, 4 - groove, 5 - support foot. SPECIFIC EMBODIMENTS

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model.

[0026] Embodiment 1:

[0027] The main structure of this embodiment is a pallet for electrode sintering of a thermistor chip, as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown in the figure, it includes a body 1. The body 1 has a length of 210 mm, a width of 150 mm, and a thickness of 2 mm. It is a rectangular structure as a whole and is made of 310S stainless steel material. The highest heat-resistant temperature of the 310S stainless steel material can reach 1100 °C, which can meet the firing and infiltration temperature range of 500 - 900 °C for different silver electrodes and aluminum electrodes of the thermistor chip. Its excellent oxidation resistance, creep resistance, and lasting strength can ensure the long service life of the pallet. A number of chip slots 2 are provided on the body 1. The chip slots 2 are arranged at intervals in an array form on the body 1. The distance between adjacent chip slots 2 is 3 mm. A total of 52 chip slots 2 are provided on the body 1, with 13 chip slots 2 arranged in the X-axis direction and 4 chip slots 2 arranged in the Y-axis direction. The chip slots 2 are arranged at intervals. The length of the chip slot 2 is 29.5 mm, the width is 10.5 mm, and the depth is 1.5 mm. The bottom of the chip slot 2 is a hollow structure. On the upper edge of the hollow bottom inside the chip slot 2, there is a support flange 3. The support flange 3 protrudes from the inner edge of the chip slot 2 and is parallel to the surface of the body 1. The support flange 3 abuts against the edge of the thermistor chip. The support flange 3 is used to support the thermistor chip. The thermistor chip is arranged in the chip slot 2 of the body 1. Its upper surface protrudes from the body 1, its lower surface is at the position of the hollow hole, and its edge part abuts against the support flange 3. After the surface electrodes of the thermistor chip are printed and dried, it can be directly flipped onto the body 1 of the firing and infiltration pallet by manual or robotic arm. After flipping, the thermistor chip together with the body 1 of the pallet enters the firing and infiltration furnace for firing and infiltration. After firing and infiltration, the thermistor chip is cooled according to the process conditions and then directly transferred to the next process for full-voltage withstand screening or resistance value measurement by using the pallet body 1, avoiding the previous operations of pouring the thermistor chip and sorting by mechanical vibration sieving, and effectively reducing the damage to the matrix and electrode appearance of the thermistor chip.

[0028] The overall size of the body 1 is relatively small; at the same time, two spaced grooves 4 are provided at the edges of both the upper and lower ends of the body 1, and four spaced grooves 4 are respectively provided at the middle position of the body 1. Support feet 5 are correspondingly provided below the grooves 4. During the sintering process, the support feet 5 of the upper body 1 can be correspondingly inserted into the grooves 4 of the lower body 1 to keep the bodies 1 stable, and moreover, the bodies 1 are kept spaced apart. The design of the support feet 5 of the body 1 can realize the process of multi-layer stacking and sintering, and at the same time ensure that the upper pallet will not press on the lower resistance chips during multi-layer stacking and sintering, and also reserve enough ventilation and exhaust space to ensure the uniformity of the electrode firing and infiltration temperature and atmosphere. Combining with the safety size space of the firing and infiltration furnace hearth and the firing and infiltration process of the thermistor chip, the production efficiency can be more than doubled by using the pallet stacking method compared with the traditional mesh firing.

[0029] Embodiment 2:

[0030] Based on the above embodiments, this embodiment further defines the supporting flange 3. The supporting flange 3 is arranged at the bottom edge position of the chip groove 2, that is, at a position 1.5 mm deep below the chip groove 2; the width of the supporting flange 3 is 1 mm; relief openings 31 are symmetrically arranged on the supporting flanges 3 on the left and right sides inside the chip groove 2. The relief openings 31 are arc-shaped structures and are used to make way for the lower electrode probes. The relief openings 31 can ensure that when the withstand voltage screening or resistance value measurement is carried out in the next process, the lower electrode probes can smoothly pass through the body 1 to lift the thermistor chip and thus separate it from the body 1; thereby increasing the safety and accuracy of the test. Other parts of this embodiment are the same as those of the above embodiments and will not be described in detail here.

[0031] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0032] In addition, when the terms "horizontal" and "vertical" appear in the description of the present invention, it does not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0033] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, if the terms "set", "installed", "connected", "connected" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0034] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Any simple modification or equivalent change made to the above embodiments based on the technical essence of the present invention falls within the protection scope of the present invention.

Claims

1. A support plate for thermistor chip electrode burning infiltration, characterized in that: It comprises a main body, on which a plurality of chip slots are arranged, the chip slots are arranged in an array on the main body at intervals, and the spacing between adjacent chip slots is 3-4mm; the bottom of the chip slot is a hollow structure, and a supporting flange is arranged in the chip slot, and the supporting flange abuts against the edge of the thermistor chip to support the thermistor chip.

2. The support plate for thermistor chip electrode burning-infiltration according to claim 1, characterized in that: The chip slot has a length of 29-30 mm, a width of 10-11 mm, and a depth of 1.5 mm.

3. The support plate for thermistor chip electrode burning-infiltration according to claim 2, characterized in that: The supporting flange is arranged at the bottom edge of the chip slot.

4. The support plate for thermistor chip electrode burning-infiltration according to claim 3, characterized in that: The width of the supporting flange is 1-2 mm.

5. The support plate for thermistor chip electrode burning-infiltration according to claim 1, characterized in that: The support flanges on the left and right sides of the chip slot are symmetrically provided with clearance openings, the clearance openings are arc-shaped structures, and the clearance openings are used to make way for the lower electrode probe.

6. The support plate for thermistor chip electrode burning-infiltration according to claim 1, characterized in that: A plurality of grooves are respectively arranged at the edges of the upper and lower ends of the main body and at the middle position thereof, and supporting feet are correspondingly arranged below the grooves.

7. The support plate for thermistor chip electrode burning-infiltration according to claim 1, characterized in that: The body has a length of 200-210 mm, a width of 150-160 mm, and a thickness of 2-3 mm.

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