Laminated chip inductor convenient to maintain

Abstract

The utility model discloses a laminated chip inductor convenient to maintain, relates to the technical field of laminated chip inductor structures, and aims to solve the problems that most of laminated chip inductors in the prior art are integrated and do not have a detachable structure, so that the laminated chip inductors are inconvenient to maintain, and the subsequent use of the laminated chip inductors is influenced. Electrode ends are arranged on the two sides of the dielectric body, a dielectric layer is arranged in the dielectric body, and electrode plates are arranged on the upper end face and the lower end face of the dielectric layer; the antenna further comprises plugging blocks which are arranged on the end faces of the two sides of the dielectric body, the plugging blocks are connected with the interiors of the electrode ends in a plugging mode, the upper surfaces of the electrode ends are provided with plugging holes, and the number of the plugging holes is four in total. And the sealing plate is arranged on the end face of one side of the inserting block, fixing screws are installed on the periphery of the surface of the sealing plate, electrode slices are arranged on the upper end face and the lower end face of the dielectric body, and a first electrode layer is arranged in an electrode end.

Description

Technical Field

[0001] The utility model relates to the technical field of the structure of multilayer chip inductors, in particular to a multilayer chip inductor convenient for maintenance. Background Technique

[0002] A chip inductor, also known as a surface mount inductor, like other chip components, is a new generation of leadless or short-lead microelectronic components suitable for surface mount technology. The soldering surface of its lead-out ends is on the same plane. The chip inductor originated from the chip of a leaded multilayer ceramic capacitor directly used for the mounting of hybrid integrated circuits;

[0003] For example, the Chinese authorized patent with the publication number CN215527404U (a multilayer chip inductor): includes a multilayer chip inductor body, electrodes are provided at both ends of the multilayer chip inductor body, and a plurality of heat dissipation frames are fixedly sleeved on the outer surface around the multilayer chip inductor body. All the plurality of heat dissipation frames are located between the two electrodes. When the multilayer chip inductor body works, the plurality of heat dissipation frames continuously dissipate the heat generated by the multilayer chip inductor body to the outside through the heat dissipation holes on the protective shell and the gap between the outer edge of the protective shell and the multilayer chip inductor body to reduce the temperature of the multilayer chip inductor body. And part of the heat is also dissipated to the outside through the connecting column and the protective shell. By arranging a protective shell around the multilayer chip inductor body, the protective shell plays a good protective role for the multilayer chip inductor body, and can effectively avoid damage caused by external force impact.

[0004] However, most of the above-mentioned existing multilayer chip inductors are integral and do not have a disassembly and assembly structure, which is not convenient for maintenance and affects their subsequent use. Therefore, it does not meet the existing requirements, and for this reason, we propose a multilayer chip inductor convenient for maintenance. Content of the Utility Model

[0005] The purpose of the utility model is to provide a multilayer chip inductor convenient for maintenance to solve the problem that most of the existing multilayer chip inductors are integral and do not have a disassembly and assembly structure, which is not convenient for maintenance and affects their subsequent use as mentioned in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A multilayer chip inductor convenient for maintenance, including a dielectric body, electrode ends are provided on both sides of the dielectric body, a dielectric layer is arranged inside the dielectric body, and electrode plates are arranged on the upper and lower end faces of the dielectric layer;

[0007] It further includes:

[0008] The plug-in block is arranged on both end faces of the dielectric body, and the plug-in block is internally plugged and connected to the electrode end. The upper surface of the electrode end is provided with plug-in holes, and a total of four plug-in holes are provided.

[0009] The sealing plate is arranged on one end face of the plug-in block, and fixing screws are installed around the surface of the sealing plate.

[0010] Preferably, electrode plates are arranged on the upper and lower end faces of the dielectric body.

[0011] Preferably, a first electrode layer is arranged inside the electrode end, and a second electrode layer is arranged on one side of the first electrode layer.

[0012] Preferably, a third electrode layer is arranged on one side of the second electrode layer.

[0013] Preferably, plug-in posts are arranged on the upper surface of the plug-in block, and a total of four plug-in posts are provided.

[0014] Preferably, a first telescopic post is arranged on the upper surface of the plug-in post, and a second telescopic post is arranged on one end face of the first telescopic post.

[0015] Preferably, the first telescopic post and the second telescopic post are internally plugged and connected to the plug-in hole. The first telescopic post is elastically connected to the inside of the plug-in post, and the second telescopic post is elastically connected to one end face of the first telescopic post.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0017] 1. By arranging plug-in posts on the upper surface of the plug-in block and plug-in holes on the upper surface of the electrode end, the plug-in blocks on both end faces of the dielectric body are internally plugged and connected to the electrode end, so that the first telescopic post and the second telescopic post above the plug-in posts are plugged and connected to the plug-in holes. The first telescopic post is telescopically connected to the plug-in post, and the second telescopic post is telescopically connected to the first telescopic post. The two telescopic posts can be used for clamping and fixing. When disassembling and assembling, it can be directly removed by pressing the telescopic post. The sealing plates on both end faces of the plug-in block are fixedly connected by fixing screws, which is convenient for disassembling and assembling, and solves the problem that most of the existing stacked chip inductors are integrated and do not have a disassembling and assembling structure, so it is not convenient for maintenance and affects its subsequent use.

[0018] 2. By arranging a dielectric layer and electrode plates inside the dielectric body, the heat dissipation performance is better. Moreover, heat dissipation holes are arranged on the upper and lower end faces of the dielectric body, which is convenient for heat dissipation. At the same time, dust-proof nets are installed inside the heat dissipation holes, which can also prevent dust from entering while dissipating heat. Description of the Drawings

[0019] Figure 1Schematic diagram of the overall structure of the laminated chip inductor of the present utility model;

[0020] Figure 2 Enlarged schematic diagram of the dielectric structure of the present utility model;

[0021] Figure 3 Enlarged partial schematic diagram of the interior of the dielectric of the present utility model;

[0022] Figure 4 Enlarged schematic diagram of the structure at position A of the dielectric of the present utility model;

[0023] In the figure: 1. Dielectric; 2. Electrode end; 3. Heat dissipation hole; 4. Dust-proof net; 5. Insertion hole; 6. Insertion block; 7. Sealing plate; 8. Fixing screw; 9. Dielectric layer; 10. Electrode sheet; 11. First electrode layer; 12. Second electrode layer; 13. Third electrode layer; 14. Insertion post; 15. First telescopic post; 16. Second telescopic post. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0025] Please refer to Figures 1-4 , an embodiment provided by the present utility model: a laminated chip inductor convenient for maintenance, including a dielectric body 1, electrode ends 2 are arranged on both sides of the dielectric body 1, a dielectric layer 9 is arranged inside the dielectric body 1, and electrode sheets 10 are arranged on the upper and lower end faces of the dielectric layer 9;

[0026] It further includes:

[0027] Insertion blocks 6 are arranged on both side end faces of the dielectric body 1, and the insertion blocks 6 are inserted and connected to the inside of the electrode ends 2. Insertion holes 5 are arranged on the upper surface of the electrode ends 2, and there are four insertion holes 5 in total;

[0028] A sealing plate 7 is arranged on one end face of the plug-in block 6. Fixing screws 8 are installed around the surface of the sealing plate 7. During use, since a plug-in post 14 is arranged on the upper surface of the plug-in block 6 and a plug-in hole 5 is arranged on the upper surface of the electrode end 2, the plug-in blocks 6 on both end faces of the dielectric body 1 are inserted and connected to the inside of the electrode end 2, so that the first telescopic column 15 and the second telescopic column 16 above the plug-in post 14 are inserted and connected to the plug-in hole 5. The first telescopic column 15 is telescopically connected to the plug-in post 14, and the second telescopic column 16 is telescopically connected to the first telescopic column 15. The two telescopic columns can be used for clamping and fixing. During disassembly and assembly, it can be directly removed by pressing the telescopic column. The sealing plates 7 on both end faces of the plug-in block 6 are fixedly connected by fixing screws 8, which is convenient for disassembly and assembly, solving the problem that most of the existing multilayer chip inductors are integrated and do not have a dismountable structure, thus being inconvenient for maintenance and affecting their subsequent use. And by arranging a dielectric layer 9 and electrode plates 10 inside the dielectric body 1, the heat dissipation performance is better. Heat dissipation holes 3 are arranged on the upper and lower end faces of the dielectric body 1, which is convenient for heat dissipation. At the same time, a dust-proof net 4 is installed inside the heat dissipation holes 3, which can also prevent dust from entering while dissipating heat.

[0029] Please refer to Figures 1-4 Electrode plates 10 are arranged on both the upper and lower end faces of the dielectric body 1.

[0030] Please refer to Figures 1-4 Please refer to

[0031] Please refer to Figures 1-4 A first electrode layer 11 is arranged inside the electrode end 2, and a second electrode layer 12 is arranged on one side of the first electrode layer 11. By arranging a dielectric layer 9 and electrode plates 10 inside the dielectric body 1, the heat dissipation performance is better. Heat dissipation holes 3 are arranged on the upper and lower end faces of the dielectric body 1, which is convenient for heat dissipation. At the same time, a dust-proof net 4 is installed inside the heat dissipation holes 3, which can also prevent dust from entering while dissipating heat.

[0032] Please refer to Figures 1-4 A plug-in post 14 is arranged on the upper surface of the plug-in block 6, and a total of four plug-in posts 14 are arranged.

[0033] Please refer to Figures 1-4, a first telescopic column 15 is provided on the upper surface of the plug column 14, and a second telescopic column 16 is provided on one end face of the first telescopic column 15. The plug blocks 6 on both end faces of the dielectric body 1 are inserted and connected to the inside of the electrode end 2, so that the first telescopic column 15 and the second telescopic column 16 above the plug column 14 are inserted and connected to the plug holes 5. The first telescopic column 15 is telescopically connected to the plug column 14, and the second telescopic column 16 is telescopically connected to the first telescopic column 15. The two telescopic columns can be used for snap fixation. During disassembly and assembly, it can be directly removed by pressing the telescopic column. The sealing plates 7 on both end faces of the plug block 6 are fixedly connected by fixing screws 8, which is convenient for disassembly and assembly. This solves the problem that most of the existing multilayer chip inductors are integrated and do not have a dismountable structure, thus making it inconvenient to repair and affecting their subsequent use. Moreover, a dielectric layer 9 and electrode plates 10 are provided inside the dielectric body 1, which has better heat dissipation. Heat dissipation holes 3 are provided on the upper and lower end faces of the dielectric body 1 for convenient heat dissipation. At the same time, a dust-proof net 4 is installed inside the heat dissipation holes 3 to prevent dust from entering while dissipating heat.

[0034] Please refer to Figures 1-4 , the first telescopic column 15 and the second telescopic column 16 are inserted and connected to the inside of the plug hole 5. The first telescopic column 15 is elastically connected to the inside of the plug column 14, and the second telescopic column 16 is elastically connected to one end face of the first telescopic column 15.

[0035] Working principle: During use, since a plug column 14 is provided on the upper surface of the plug block 6 and a plug hole 5 is provided on the upper surface of the electrode end 2, the plug blocks 6 on both end faces of the dielectric body 1 are inserted and connected to the inside of the electrode end 2, so that the first telescopic column 15 and the second telescopic column 16 above the plug column 14 are inserted and connected to the plug holes 5. The first telescopic column 15 is telescopically connected to the plug column 14, and the second telescopic column 16 is telescopically connected to the first telescopic column 15. The two telescopic columns can be used for snap fixation. During disassembly and assembly, it can be directly removed by pressing the telescopic column. The sealing plates 7 on both end faces of the plug block 6 are fixedly connected by fixing screws 8, which is convenient for disassembly and assembly. This solves the problem that most of the existing multilayer chip inductors are integrated and do not have a dismountable structure, thus making it inconvenient to repair and affecting their subsequent use. Moreover, a dielectric layer 9 and electrode plates 10 are provided inside the dielectric body 1, which has better heat dissipation. Heat dissipation holes 3 are provided on the upper and lower end faces of the dielectric body 1 for convenient heat dissipation. At the same time, a dust-proof net 4 is installed inside the heat dissipation holes 3 to prevent dust from entering while dissipating heat.

[0036] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A laminated chip inductor that is easy to maintain, comprising a dielectric body (1), electrode terminals (2) are arranged on both sides of the dielectric body (1), a dielectric layer (9) is arranged inside the dielectric body (1), and electrode sheets (10) are arranged on the upper and lower end surfaces of the dielectric layer (9); Features: Also includes: A plug-in block (6) is arranged on both side end surfaces of the dielectric body (1), and the plug-in block (6) is plug-connected with the inside of the electrode end (2); the upper surface of the electrode end (2) is provided with a plug-in hole (5), and a total of four plug-in holes (5) are provided; A sealing plate (7) is arranged on one end surface of the plug-in block (6), and fixing screws (8) are installed around the surface of the sealing plate (7).

2. The multilayer chip inductor easy to maintain according to claim 1, characterized in that: The upper and lower end surfaces of the dielectric body (1) are both provided with electrode sheets (10).

3. The multilayer chip inductor easy to maintain according to claim 2, characterized in that: A first electrode layer (11) is arranged inside the electrode end (2), and a second electrode layer (12) is arranged on one side of the first electrode layer (11).

4. The multilayer chip inductor easy to maintain according to claim 3, characterized in that: A third electrode layer (13) is arranged on one side of the second electrode layer (12).

5. The multilayer chip inductor easy to maintain according to claim 4, characterized in that: The upper surface of the plug-in block (6) is provided with a plug-in column (14), and a total of four plug-in columns (14) are provided.

6. The multilayer chip inductor easy to maintain according to claim 5, characterized in that: A first telescopic column (15) is arranged on the upper surface of the plug-in column (14), and a second telescopic column (16) is arranged on one side end surface of the first telescopic column (15).

7. The multilayer chip inductor easy to repair according to claim 6, characterized in that: The first telescopic column (15) and the second telescopic column (16) are plug-connected to the inside of the plug-in hole (5); the first telescopic column (15) is elastically connected to the inside of the plug-in column (14); and the second telescopic column (16) is elastically connected to one side end surface of the first telescopic column (15).

Images