Carrying device and wafer reversing mechanism

Abstract

The utility model discloses a carrying device and a wafer reversing mechanism, the carrying device comprises a main body part, the main body part is provided with an upper side and a lower side which are opposite to each other, the upper side surface of the main body part defines a first supporting surface and a second supporting surface, and the first supporting surface is sunken towards the lower side relative to the second supporting surface; the pushing part is connected to the main body part, and at least one part of the pushing part is arranged on the second supporting surface; the pushing piece can move in a reciprocating mode in the first direction and the second direction relative to the main body part. The carrying device provided by the utility model can improve the wafer replacement efficiency and reduce the risk of wafer fragmentation, and the wafer reversing mechanism with the carrying device also has the same advantages.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a handling device and an inverting mechanism. Background Art

[0002] In the related art, after wafers are produced, they need to be inspected. However, the specifications of the cassettes for storing wafers and the test cassettes are often inconsistent. Therefore, it is necessary to manually transfer the wafers from the storage cassette to the test cassette, resulting in low efficiency of wafer replacement and a high risk of wafer fragmentation. Summary of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a handling device, which can improve the efficiency of wafer replacement and reduce the risk of wafer fragmentation.

[0004] The present application also provides an inverting mechanism with a handling device.

[0005] The handling device according to the first aspect embodiment of the utility model is used for transferring wafers and includes:

[0006] A main body part having opposite upper and lower sides. The upper side surface of the main body part defines a first support surface and a second support surface, and the first support surface is recessed downward relative to the second support surface towards the lower side;

[0007] A pushing member connected to the main body part, and at least a part of the pushing member is disposed on the second support surface;

[0008] Wherein, the pushing member can reciprocate relative to the main body part in a first direction and a second direction.

[0009] The handling device according to the embodiment of the utility model has at least the following beneficial effects: Compared with manual operation, in this solution, the cassette and the wafers to be transferred are fixed by the first support surface and the second support surface, and the pushing member is used to push the wafers to realize the transfer of the wafers between the cassettes, greatly improving the transfer efficiency of the wafers and reducing the risk of fragmentation caused by human errors in manual transfer. At the same time, the first support surface is recessed relative to the second support surface, so that when the wafer transitions from the second support surface to the first support surface, it has an inclination angle, which is convenient for pushing the wafer.

[0010] According to some embodiments of the utility model, a chute is further provided on one side of the main body part. The chute extends along the first direction, and the pushing member is movably connected to the chute;

[0011] The chute is disposed on the lower side surface of the main body part; and / or the chute is disposed on the second support surface.

[0012] According to some embodiments of the present utility model, the pushing member includes a resisting portion and a sliding portion. The resisting portion is connected to one end of the sliding portion, and the resisting portion is used to abut against the wafer. The other end of the sliding portion is connected to the sliding groove.

[0013] According to some embodiments of the present utility model, it further includes a limiting block. The limiting block is connected to the main body portion and is disposed at both ends of the sliding groove. The limiting block and the sliding groove jointly define the moving path of the pushing member.

[0014] According to some embodiments of the present utility model, the main body portion includes a base and a support member. The base and the support member are detachably connected. The support member defines the first support surface and the second support surface. The support member can rotate relative to the base to change the positions of the first support surface and the second support surface relative to the pushing member.

[0015] According to some embodiments of the present utility model, it further includes fixing members. At least two fixing members are provided on the first support surface, and at least two fixing members are arranged at intervals along a third direction; at least two fixing members are provided on the second support surface, and at least two fixing members are arranged at intervals along the third direction; the third direction is perpendicular to the first direction and the second direction.

[0016] According to some embodiments of the present utility model, at least two of the fixing members on the first support surface include limiting portions. The limiting portions are formed by the fixing members extending along the third direction, and the limiting portions of at least two fixing members are oppositely arranged.

[0017] According to some embodiments of the present utility model, the support member further defines an abutting surface. The abutting surface is connected between the first support surface and the second support surface; the abutting surface is perpendicular to the first support surface and the second support surface.

[0018] According to some embodiments of the present utility model, the abutting surface is oppositely arranged with at least two of the fixing members on the first support surface. When the cassette is disposed on the first support surface, the abutting surface and the fixing members jointly position the cassette.

[0019] According to a second aspect embodiment of the present utility model, a wafer flipping mechanism includes:

[0020] The handling device according to any one of the above embodiments;

[0021] A first cassette, connected to the first support surface; and

[0022] A second cassette, connected to the second support surface and accommodating wafers;

[0023] Wherein, the pushing member is configured to slide along the first direction to push the wafer from the second cassette to the first cassette.

[0024] The wafer inversion mechanism according to the embodiment of the present invention has at least the following beneficial effects: By using the above-mentioned handling device, the transfer speed of the wafer between two cassettes with different specifications can be increased, and the risk of wafer fragmentation during the transfer can be reduced.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the drawings and embodiments, wherein:

[0027] Figure 1 is a schematic diagram of the handling device in the embodiment of the present invention;

[0028] Figure 2 is a top view schematic diagram of the handling device in the embodiment of the present invention;

[0029] Figure 3 In the embodiment of the present invention Figure 2 is a cross-sectional schematic diagram taken along line A-A;

[0030] Figure 4 is a bottom view schematic diagram of the handling device in the embodiment of the present invention;

[0031] Figure 5 is a schematic diagram of the wafer inversion mechanism in the embodiment of the present invention;

[0032] Figure 6 is a schematic diagram of the wafer inversion mechanism in the embodiment of the present invention.

[0033] Reference numerals:

[0034] Handling device 10; main body part 100; base 110; support member 120; first support surface 121; second support surface 122; abutting surface 123; fixing member 124; positioning hole 1241; limiting part 1242; sliding groove 130; pushing member 140; abutting part 141; sliding part 142; limiting block 150;

[0035] Wafer inversion mechanism 200; first cassette 210; second cassette 220; wafer 230. DETAILED DESCRIPTION

[0036] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model, and should not be construed as a limitation of the present utility model.

[0037] In the description of the present utility model, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present utility model.

[0038] In the description of the present utility model, the meaning of "several" is more than one, the meaning of "multiple" is more than two, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0039] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0040] In the description of the present utility model, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0041] Next, referring to the accompanying drawings of the specification, a handling device according to an embodiment of the first aspect of the present utility model will be described. Among them, the direction from the second support surface to the first support surface is defined as the first direction, and the direction from the first support surface to the second support surface is defined as the second direction.

[0042] Refer to Figure 1 and Figure 2As shown, an embodiment of the present utility model provides a handling device 10 for transferring a wafer 230. The handling device 10 includes a main body portion 100 and a pushing member 140. Among them, the main body portion 100 has opposite upper and lower sides. The upper side surface of the main body portion 100 defines a first support surface 121 and a second support surface 122. The first support surface 121 and the second support surface 122 are used to support a cassette loaded with the wafer 230. The first support surface 121 is recessed toward the lower side of the main body portion 100 relative to the second support surface 122, so that the first support surface 121 and the second support surface 122 form a stepped structure. Through this stepped structure, the cassette located on the first support surface 121 can be positioned. At the same time, when transferring the wafer 230, there is a height difference between the first support surface 121 and the second support surface 122, so that the wafer 230 has an inclined angle when transitioning from the second support surface 122 to the first support surface 121 to facilitate the transfer of the wafer 230.

[0043] The pushing member 140 is connected to the main body portion 100, and at least a part of the pushing member 140 is disposed on the second support surface 122. It should be noted that at least a part of the pushing member 140 being disposed on the second support surface 122 does not mean that the pushing member 140 is connected to the second support surface 122. Among them, one end of the main body portion 100 defines the first support surface 121, and the other end defines the second support surface 122. At least a part of the pushing member 140 being disposed on the second support surface 122 means that at least a part of the pushing member 140 is provided at the end defining the second support surface 122. The pushing member 140 can reciprocate relative to the main body portion 100 in a first direction and a second direction, so that the pushing member 140 can push the wafer 230 located on the second support surface 122 onto the first support surface 121. In this embodiment, referring to Figure 3 As shown, there is no connection relationship between the pushing member 140 and the second support surface 122. At least a part of the pushing member 140 can move above the second support surface 122, thereby achieving the effect of pushing the wafer 230. In other embodiments (not shown in the figure), there is a connection relationship between the pushing member 140 and the second support surface 122. At least a part of the pushing member 140 can be directly connected to the second support surface 122 and move along the surface of the second support surface 122 to push the wafer 230.

[0044] Specifically, the pusher 140 can push the wafer 230 from the second support surface 122 to the first support surface 121 along the first direction. After the handling of the wafer 230 is completed, the pusher 140 can reset to its original position along the second direction. At this time, replace the cassette loaded with the new wafer 230, and then move the pusher 140 again to move the new wafer 230 from the second support surface 122 to the first support surface 121. By repeating this cycle, the wafers 230 to be tested can be transferred from the loaded cassette to the detection cassette. Compared with the traditional manual operation, through this handling device 10, when the wafer 230 needs to replace the cassette for different process operations, the replacement efficiency of the wafer 230 can be improved, which not only greatly improves the operation efficiency, but also greatly reduces the risk of wafer 230 fragmentation caused by human errors.

[0045] In some embodiments, referring to Figure 3 and Figure 4 as shown, a chute 130 is further provided on one side of the main body 100. The chute 130 extends along the first direction. The pusher 140 is movably connected to the chute 130 and reciprocates through the chute 130. In this embodiment, the chute 130 is provided on the lower surface of the main body 100. A part of the pusher 140 is disposed on the second support surface 122, and the other part is disposed in the chute 130. The pusher 140 moves on the chute 130 to push the wafer 230 to achieve the transfer of the wafer 230. In another embodiment (not shown in the figure), the chute 130 can also be provided on the second support surface 122. The pusher 140 is connected to the chute 130, and the pusher 140 moves along the surface of the second support surface 122 to push the wafer 230. In other embodiments (not shown in the figure), the chute 130 can be provided on the lower surface of the main body 100 and the second support surface 122 at the same time, that is, a part of the pusher 140 is connected to the lower side of the main body 100, and the part connected to the second support surface 122 is driven to move by this part located on the lower side of the main body 100.

[0046] In some embodiments, referring to Figure 1 and Figure 3 as shown, the pusher 140 includes a holding portion 141 and a sliding portion 142. One end of the sliding portion 142 is connected to the holding portion 141, and the other end is connected to the chute 130. Specifically, the holding portion 141 is used to abut against the wafer 230 to push the wafer 230. The holding portion 141 is disposed on the second support surface 122. The other end of the sliding portion 142 is engaged with the chute 130. When the sliding portion 142 slides along the first direction on the chute 130, the sliding portion 142 will drive the holding portion 141 to move. At this time, the holding portion 141 will push the wafer 230 to move from the second support surface 122 to the first support surface 121, thereby completing the handling and transfer of the wafer 230.

[0047] In some embodiments, referring to Figure 3 and Figure 4 As shown, the handling device 10 further includes a limiting block 150. The limiting block 150 is connected to the main body portion 100 and is disposed at both ends of the sliding groove 130. The limiting block 150 and the sliding groove 130 jointly define the moving path of the pushing member 140. Specifically, in this embodiment, limiting blocks 150 are provided at both ends of the sliding groove 130. When the pushing member 140 moves to the end of the sliding groove 130, the limiting block 150 will block the pushing member 140 to prevent the pushing member 140 from detaching from the end of the sliding groove 130. The limiting block 150 and the sliding groove 130 jointly limit the moving path of the pushing member 140 within a certain range. In other embodiments (not shown in the figure), the sliding groove 130 may also be provided with a limiting block 150 only at one end. Among them, one end of the sliding groove 130 extends to the edge of the main body portion 100, and there is no obstruction at the end extending to the edge, while the other end is blocked by the main body portion 100. Thus, a limiting block 150 can be provided only at the end where the sliding groove 130 is connected to the edge of the main body portion 100. When the pushing member 140 slides to the edge of the main body portion 100, the limiting block 150 blocks the pushing member 140 at the edge of the main body portion 100, so that the pushing member 140 will not separate from the edge of the main body portion 100 and the sliding groove 130.

[0048] In some embodiments, referring to Figure 1 and Figure 3 As shown, the main body portion 100 includes a base 110 and a support member 120. The support member 120 is detachably connected above the base 110, and the support member 120 can rotate relative to the base 110 to change the positions of the first support surface 121 and the second support surface 122 relative to the pushing member 140. The support member 120 defines the first support surface 121 and the second support surface 122. Specifically, after the support member 120 is detached from the base 110, the support member 120 can rotate relative to the base 110 to change the positions of the first support surface 121 and the second support surface 122. Specifically, when the handling device 10 is in a normal state, part of the pushing member 140 is located above the second support surface 122. After the support member 120 rotates relative to the base 110, part of the pushing member 140 changes to be located above the first support surface 121. At this time, moving the pushing member 140 can reset the wafer 230 on the first support surface 121 to the second support surface 122. In this embodiment, there is a height difference between the cassettes on the first support surface 121 and the second support surface 122. This height difference makes up for the height difference between the first support surface 121 and the second support surface 122, so that the bottom surfaces of the two cassettes supporting the wafer 230 are in the same plane. Thus, the situation where the height difference between the first support surface 121 and the second support surface 122 blocks the transfer of some wafers 230 can be avoided.

[0049] In some embodiments, referring to Figure 2As shown, the handling device 10 further includes fixing members 124. Among them, at least two fixing members 124 are provided on the first support surface 121, and the at least two fixing members 124 are spaced apart along the third direction. Similarly, at least two fixing members 124 are also provided on the second support surface 122, and the at least two fixing members 124 are spaced apart along the third direction. Specifically, in this embodiment, two fixing members 124 are provided on the first support surface 121, and the two fixing members 124 are spaced apart along the third direction. When the cartridge is placed on the first support surface 121, the cartridge will be clamped between the two fixing members 124, and the two fixing members 124 will position the cartridge. Similarly, two fixing members 124 are also provided on the second support surface 122, and the two fixing members 124 are spaced apart along the third direction. When the cartridge is placed on the second support surface 122, the cartridge will be clamped between the two fixing members 124, and the two fixing members 124 will position the cartridge. In other embodiments (not shown in the figure), the number of fixing members 124 provided on the first support surface 121 and the second support surface 122 can also be other numerical features, such as: one. When the cartridges are respectively fixed on the first support surface 121 and the second support surface 122, one end of the two cartridges abuts against each other, and the other end is provided with a fixing member 124. The fixing of the cartridge is achieved by the mutual abutment of the fixing member 124 and the cartridge.

[0050] Further, the third direction is perpendicular to the first direction and the second direction. Specifically, when the cartridge is arranged on the first support surface 121 and the second support surface 122, the arrangement direction of the cartridge is parallel to the first direction and the second direction. This setting can enable the wafer 230 to be transferred from the second support surface 122 to the first support surface 121 along the shortest path, and making the third direction perpendicular to the first direction and the second direction can enable the fixing members 124 to clamp and position the cartridge to the greatest extent. In other embodiments (not shown in the figure), the third direction may not be perpendicular to the first direction and the second direction, that is, at least two fixing members 124 are arranged obliquely, and the cartridge is still arranged between the at least two fixing members 124. In this setting, part of the fixing member 124 can still clamp and fix the cartridge.

[0051] In some embodiments, refer to Figure 2As shown, the fixing member 124 on the first supporting surface 121 includes a limiting portion 1242. The fixing members 124 are arranged at intervals on the first supporting surface 121. After two fixing members 124 are fixed on the first supporting surface 121, they have opposite side surfaces. The limiting portion 1242 is formed by extending along the third direction from the opposite sides of at least two fixing members 124, and the limiting portions 1242 of at least two fixing members 124 are arranged oppositely. When the cartridge is fixed on the first supporting surface 121, the limiting portion 1242 will abut against the cartridge to prevent the cartridge from moving along the first direction and disengaging from the fixing member 124. When the wafer 230 is moved to the cartridge on the first supporting surface 121, a frictional force will be generated between the bottom of the wafer 230 and the cartridge. By abutting the limiting portion 1242 against the cartridge, it is possible to prevent the cartridge from moving under the drive of the frictional force and disengaging from the fixing member 124.

[0052] Further, referring to Figure 2 As shown, a plurality of groups of positioning holes 1241 are provided on the upper side surface of the main body portion 100. The plurality of groups of positioning holes 1241 are arranged at intervals, and the spacing of each group of positioning holes 1241 is inconsistent. The fixing member 124 is detachably fixed in the positioning hole 1241. The fixing member 124 can change the spacing distance from other fixing members 124 by being assembled in different positioning holes 1241, so that the distance between the fixing member 124 and the fixing member 124 can be changed according to cartridges of different specifications and sizes, thereby completing the clamping and positioning of cartridges of different specifications and sizes.

[0053] In some embodiments, referring to Figure 1 As shown, the support member 120 further defines an abutting surface 123. The abutting surface 123 is connected between the first supporting surface 121 and the second supporting surface 122, and the abutting surface 123 is perpendicular to the first supporting surface 121 and the second supporting surface 122. Further, the abutting surface 123 is disposed opposite to at least two fixing members 124 on the first supporting surface 121. When the cartridge is disposed on the first supporting surface 121, both ends of the cartridge along the first direction will be clamped between the abutting surface 123 and the limiting portion 1242. The abutting surface 123 and the limiting portion 1242 jointly position the cartridge to prevent the cartridge from moving relative to the first supporting surface 121.

[0054] Next, with reference to the accompanying drawings of the specification, the wafer inverting mechanism 200 according to the second aspect embodiment of the present invention will be described. Referring to Figure 5 and Figure 6 As shown, the wafer inverting mechanism 200 includes the handling device 10, the first cartridge 210, and the second cartridge 220 described in any of the above embodiments. Among them, the first cartridge 210 is disposed on the first supporting surface 121, the second cartridge 220 is disposed on the second supporting surface 122, and the second cartridge 220 contains wafers 230. The pushing member 140 is configured to slide along the first direction to push the wafer 230 from the second cartridge 220 to the first cartridge 210.

[0055] Specifically, when it is necessary to replace the cassette of the device wafer 230, the first cassette 210 is respectively placed on the first support surface 121, and the second cassette 220 is placed on the second support surface 122. Subsequently, the pusher 140 is moved so that the wafer 230 in the second cassette 220 is moved into the first cassette 210. Then, the pusher 140 is moved in the second direction to reset the pusher 140, and the first cassette 210 and the second cassette 220 are removed to complete the transfer work of the wafer 230.

[0056] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the relevant art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A handling device for transferring wafers, characterized in that: include: A main body portion having an upper side and a lower side opposite to each other, wherein the upper side surface of the main body portion defines a first supporting surface and a second supporting surface, wherein the first supporting surface is recessed toward the lower side relative to the second supporting surface; A pushing member connected to the main body, at least a portion of the pushing member is disposed on the second supporting surface; The pushing member can reciprocate along a first direction and a second direction relative to the main body.

2. The transport device according to claim 1, characterized in that: A slide groove is further provided on one side of the main body, the slide groove extends along the first direction, and the pusher is movably connected to the slide groove; The slide groove is arranged on the lower surface of the main body; and / or the slide groove is arranged on the second supporting surface.

3. The transport device according to claim 2, characterized in that: The pushing member includes a supporting portion and a sliding portion, wherein the supporting portion is connected to one end of the sliding portion and is used to abut against the wafer, and the other end of the sliding portion is connected to the slide groove.

4. The transport device according to claim 2, characterized in that: It also includes a limit block, which is connected to the main body and arranged at both ends of the slide slot. The limit block and the slide slot together define a moving path of the pusher.

5. The transport device according to claim 1, characterized in that: The main body includes a base and a support member, the base is detachably connected to the support member, the support member defines the first support surface and the second support surface, and the support member can rotate relative to the base to change the positions of the first support surface and the second support surface relative to the pushing member.

6. The transport device according to claim 5, characterized in that: It also includes fixing parts, the first supporting surface is provided with at least two fixing parts, and at least two fixing parts are arranged at intervals along a third direction; the second supporting surface is provided with at least two fixing parts, and at least two fixing parts are arranged at intervals along the third direction; the third direction is perpendicular to the first direction and the second direction.

7. The transport device according to claim 6, characterized in that: At least two of the fixing members of the first supporting surface include a limiting portion, and the limiting portion is formed by extending the fixing member along the third direction. The limiting portions of at least two of the fixing members are arranged opposite to each other.

8. The transport device according to claim 7, characterized in that: The support member further defines an abutment surface, which is connected between the first support surface and the second support surface; the abutment surface is perpendicular to the first support surface and the second support surface.

9. The transport device according to claim 8, characterized in that: The abutting surface is arranged opposite to at least two fixing members of the first supporting surface. When the material box is arranged on the first supporting surface, the abutting surface and the limiting portion jointly position the material box.

10. The film rewinding mechanism is characterized in that: include: The transport device according to any one of claims 1 to 9; A first material box connected to the first supporting surface; as well as A second material box, connected to the second supporting surface and containing wafers; Wherein, the pushing member is configured to slide along the first direction to push the wafer from the second material box to the first material box.

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