Ejector pin device

By designing a thimble device with the same force as multiple thimbles, the problem of uneven chip stress in existing thimble devices is solved, and the consistency of stress during the chip erection process is achieved, reducing the risk of cracking or hidden cracking.

CN222980486UActive Publication Date: 2025-06-13VERIZON UNITED SEMICONDUCTOR (BEIJING) CO LTD
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Patent Information

Application Number
CN202422132446.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-30
Publication Date
2025-06-13
Estimated Expiration
2034-08-30

AI Technical Summary

Technical Problem

When the existing thimble device lifts the chip, the left and right sides are inconsistent, resulting in the chip being prone to cracking or hidden cracking.

Method used

A thimble device is designed in which the thimble force is the same during operation. By providing the first thimble assembly and the second thimble assembly, both include a thimble, an elastic member and a support connected in sequence from top to bottom. The thimble is reduced in sequence in the height direction, and the elastic member is compressed at different positions to ensure that the force of the thimble is consistent.

Benefits of technology

By ensuring the consistent force of the thimble, the risk of cracking or hidden cracking caused by uneven force is effectively reduced, and the consistency of the force of the chip during the erection process is ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of wafer processing, and discloses an ejector pin device, which comprises a first ejection assembly and a second ejection assembly which are arranged side by side along the horizontal direction, and each of the first ejection assembly and the second ejection assembly comprises an ejector pin, an elastic piece and a support which are sequentially connected from top to bottom, the ejector pin is provided with a first position, a second position and a third position which are sequentially lowered in the height direction, and in the initial state, when the ejector pin of the first ejecting assembly is located at the first position, the ejector pin of the second ejecting assembly is located at the second position, and the ejector pins of the first ejecting assembly and the second ejecting assembly are located at the third position. And the ejector pins of the first ejection assembly and the second ejection assembly are subjected to the same acting force. In the utility model, the elastic piece of the first jacking assembly can accumulate force earlier relative to the elastic piece of the second jacking assembly, so that when the first jacking assembly and the second jacking assembly jack the product together finally, the stress of the product can be ensured to be consistent.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a thimble device. Background Art

[0002] After the whole wafer is cut into multiple chips, the chips are still adhered to a circular adhesive film with the same size as the wafer. In the subsequent peeling process, the adhesive film carrying the cut chips is fixed on the chuck of the peeling device, and the thimbles at the bottom of the chuck rise to push up the chips, so that the bottom of the chips is separated from the adhesive film, and then the suction head at the top sucks away the chips and places them in the carrier tape to provide chips for the subsequent process.

[0003] In the peeling device, a single thimble or a double thimble is arranged on the lower side of the chuck. For relatively large chips, a double-thimble structure is usually adopted. In the existing design, the double thimbles are fixed on the same mold, and the mold can move up and down, so as to drive the two thimbles to push up the chips together. Since the suction head operates to sequentially suck each chip from the adhesive film until all the chips on the adhesive film are sucked and placed in the carrier tape.

[0004] The arrangement direction of the two thimbles is the same as the direction in which the suction head sucks the chips. It is set that the suction head sucks the chips from left to right in sequence. When the chips are pushed up by the double thimbles, the chips on the left side have been taken away, and the chips on the right side are still adhered to the adhesive film. Affected by this, the force on the two thimbles is different. The thimble near the left side has a smaller force (F1), and the thimble near the right side is affected by the chips on the right side and has a larger force (F2), resulting in inconsistent forces on the left and right sides when the chips are pushed up.

[0005] When the acting forces of the two thimbles on the chip are inconsistent, since the force on the left thimble is smaller and the force on the right thimble is larger, the indentation corresponding to the left thimble on the chip is shallower, and the indentation corresponding to the right thimble is deeper. The chip is unevenly stressed and is prone to cracking or hidden cracking. Hidden cracking is difficult to be found by a high-power microscope, so that the chip can only be found to have a functional failure until it is used, causing irreparable economic losses. Content of the Utility Model

[0006] The purpose of the utility model is to provide a thimble device in which multiple thimbles have the same pushing force during operation.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] A thimble device for pushing a product from the bottom of an adhesive film with the product thereon, comprising a first pushing component and a second pushing component. The first pushing component and the second pushing component are arranged side by side in the horizontal direction, and each includes a thimble, an elastic member and a support seat which are connected in sequence from top to bottom.

[0009] The ejector pin has a first position, a second position, and a third position that decrease successively in the height direction;

[0010] In the initial state, the ejector pin of the first ejecting component is in the first position, and the ejector pin of the second ejecting component is in the second position;

[0011] When the ejector pins of the first ejecting component and the second ejecting component are both in the second position, the elastic member of the first ejecting component is compressed, and the elastic member of the second ejecting component is not compressed;

[0012] When the ejector pins of the first ejecting component and the second ejecting component are both in the third position, the elastic members of the first ejecting component and the second ejecting component are both compressed, and the ejector pins of the first ejecting component and the second ejecting component receive the same acting force from the elastic members.

[0013] Preferably, a plurality of the first ejecting components are provided, and along the direction close to the second ejecting component, the ejector pins of the plurality of the first ejecting components decrease successively in the height direction.

[0014] Preferably, a base is further included, and the support is vertically adjustably mounted on the base.

[0015] Preferably, the base is provided with a receiving groove, and the support is mounted in the receiving groove.

[0016] Preferably, the support is screwed to the base.

[0017] Preferably, a driver is further included, the support is connected to the output end of the driver, and the driver is configured to drive the support to move vertically.

[0018] Preferably, a carrier table is further included, the top surface of the carrier table is configured to carry the film with the product, and the first ejecting component and the second ejecting component are arranged on the lower side of the carrier table.

[0019] Preferably, a guiding die is further included, the guiding die is provided with a needle-passing hole, and the ejector pin passes through the needle-passing hole.

[0020] Preferably, the spring constant of the elastic member of the first ejecting component is K1, and the spring constant of the elastic member of the second ejecting component is K2, and K1 is less than K2;

[0021] In the initial state, the height difference between the ejector pins of the first ejecting component and the second ejecting component is L0;

[0022] When the ejector pins of the first ejecting component and the second ejecting component are both in the third position, the compression deformation amount of the elastic member of the first ejecting component is L1, and the compression deformation amount of the elastic member of the second ejecting component is L2. L1 is greater than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2.

[0023] Preferably, the position of the support of the first ejecting component in the height direction is higher than that of the support of the second ejecting component; or

[0024] The vertical length of the elastic member of the first ejecting component is greater than the vertical length of the elastic member of the second ejecting component.

[0025] Advantages of the present utility model:

[0026] The initial height of the first ejecting component is higher than that of the second ejecting component, so that when the product is ejected upward, the elastic member of the first ejecting component can store energy earlier than the elastic member of the second ejecting component. When the first ejecting component and the second ejecting component jointly eject the product finally, it can ensure that the forces on the product are consistent, effectively reducing the risk of cracking or hidden cracking of the product caused by inconsistent forces. Description of the drawings

[0027] Figure 1 is a front view of the ejector pin device according to the embodiment of the present utility model when the ejector pin of the first ejecting component is in the first position and the ejector pin of the second ejecting component is in the second position;

[0028] Figure 2 is a schematic structural diagram of the ejector pin device according to the embodiment of the present utility model when the ejector pin of the first ejecting component is in the first position and the ejector pin of the second ejecting component is in the second position;

[0029] Figure 3 is a front view of the ejector pin device according to the embodiment of the present utility model when the ejector pins of the first ejecting component and the second ejecting component are both in the third position;

[0030] Figure 4 is a schematic structural diagram of the ejector pin device according to the embodiment of the present utility model when the ejector pins of the first ejecting component and the second ejecting component are both in the third position.

[0031] In the figure:

[0032] 100, product; 200, adhesive film;

[0033] 1, ejector pin;

[0034] 2, elastic member;

[0035] 3, support;

[0036] 4. Base; 41. Receiving groove;

[0037] 5. Carrying platform;

[0038] 6. Guide die. Specific implementation manner

[0039] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar components or components with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present utility model and should not be construed as a limitation to the present utility model.

[0040] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium. It can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] In the description of the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below", and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0042] The technical solution of the present utility model will be further described below with reference to the drawings and through specific implementation manners.

[0043] As Figures 1 - 4As shown in the figure, the present utility model provides a thimble device for pushing a product 100 from the bottom of a film 200 with the product 100 thereon. The thimble device includes a first pushing assembly and a second pushing assembly. The first pushing assembly and the second pushing assembly are arranged side by side in the horizontal direction, and each includes a thimble 1, an elastic member 2, and a support 3 connected in sequence from top to bottom. The thimble 1 has a first position, a second position, and a third position that decrease in sequence along the height direction. In the initial state, the thimble 1 of the first pushing assembly is in the first position, and the thimble 1 of the second pushing assembly is in the second position. When the thimbles 1 of both the first pushing assembly and the second pushing assembly are in the second position, the elastic member 2 of the first pushing assembly is compressed, and the elastic member 2 of the second pushing assembly is not compressed. When the thimbles 1 of both the first pushing assembly and the second pushing assembly are in the third position, the elastic members 2 of both the first pushing assembly and the second pushing assembly are compressed, and the thimbles 1 of the first pushing assembly and the second pushing assembly receive the same acting force from the elastic member 2.

[0044] In the present utility model, the initial height of the first pushing assembly is higher than that of the second pushing assembly, so that when pushing the product 100 upward, the elastic member 2 of the first pushing assembly can store energy earlier relative to the elastic member 2 of the second pushing assembly, ensuring that when the first pushing assembly and the second pushing assembly jointly push the product 100 finally, the force applied to the product 100 is consistent, effectively reducing the risk of cracking or hidden cracking of the product 100 caused by inconsistent force.

[0045] In this embodiment, the product 100 is a chip, and the elastic member 2 is a spring that extends vertically, with the bottom end connected to the top surface of the support 3 and the top end connected to the bottom end of the thimble 1. When the product 100 is pushed up by the thimbles 1 of the first pushing assembly and the second pushing assembly, it is sucked by a suction head above the product 100, thereby realizing peeling from the film 200.

[0046] In other embodiments, the product 100 can also be components such as a power amplifier module fixed on the film 200 after encapsulation, and the elastic member 2 can also be other elastic supports such as a rubber rod column.

[0047] In one embodiment, a plurality of first pushing assemblies are provided. Along the direction close to the second pushing assembly, the thimbles 1 of the plurality of first pushing assemblies decrease in sequence along the height direction. Taking the second pushing assembly as a reference, the pushing acting forces finally applied to the chip by the plurality of first pushing assemblies are the same, enabling the chip to be stressed at multiple points, which is safer and more reliable. Specifically, the first pushing assembly can be provided with two or three according to the shape and size of the product 100.

[0048] In another embodiment, one first pushing assembly is provided. One first pushing assembly and one second pushing assembly cooperate with each other, with a simpler structure and more reliable cooperation.

[0049] Specifically, the thimble device further includes a base 4, and the support 3 is vertically adjustably mounted on the base 4. By providing the base 4, it is possible to more reliably drive the first jacking assembly and the second jacking assembly to lift synchronously, and the vertical position of the support 3 on the base 4 is adjustable, so that the position of the support 3 relative to the base 4 can be adjusted according to the specific usage situation, ensuring that when the thimbles 1 of the first jacking assembly and the second jacking assembly are both in the third position, the forces received by the thimbles 1 of the first jacking assembly and the second jacking assembly are the same.

[0050] More specifically, the base 4 is provided with a receiving groove 41, and the support 3 is installed in the receiving groove 41. By providing the receiving groove 41, it is possible to more reliably protect the support 3, the thimble 1 and the elastic member 2 on the support 3, and to provide an avoidance space for the floating of the thimble 1 and the elastic member 2.

[0051] In one embodiment, the support 3 is screwed to the base 4. With the above arrangement, it is possible to adjust the vertical position of the support 3 relative to the base 4 by rotating the support 3. The matching structure is simple, the adjustment operation is convenient, and the independent adjustment of the height of the thimbles 1 of the first jacking assembly and the second jacking assembly can be realized.

[0052] Specifically, the support 3 can be screwed to the bottom of the receiving groove 41, and the vertical height is adjusted based on the bottom of the receiving groove 41.

[0053] In another embodiment, the thimble device further includes a driver. The support 3 is connected to the output end of the driver, and the driver is configured to drive the support 3 to move vertically. Each support 3 is provided with a driver, and the supports 3 of the first jacking assembly and the second jacking assembly are independently adjusted. With the above arrangement, manual operation is omitted, the vertical position adjustment of the support 3 is more efficient, and the independent adjustment of the height of the thimbles 1 of the first jacking assembly and the second jacking assembly can be realized.

[0054] Specifically, the driver can be an electric push rod, an electric cylinder, etc., installed at the bottom of the receiving groove 41, with the output end facing upward and connected to the bottom of the support 3.

[0055] Specifically, the thimble device further includes a carrier 5. The top surface of the carrier 5 is configured to carry the film 200 with the product 100, and the first jacking assembly and the second jacking assembly are arranged on the lower side of the carrier 5. By providing the carrier 5, it is possible to more stably support the film 200 with the product 100, facilitating the first jacking assembly and the second jacking assembly to perform jacking.

[0056] More specifically, the thimble device further includes a guiding die 6. The guiding die 6 is provided with a needle-passing hole, and the thimble 1 passes through the needle-passing hole. The guiding die 6 guides and positions the thimble 1 through the needle-passing hole, ensuring that the thimble 1 can be lifted and lowered safely and reliably.

[0057] In this embodiment, the first jacking component and the second jacking component share a guiding die 6, and the guiding die 6 is adhesively connected to the bottom surface of the loading platform 5.

[0058] Specifically, the stiffness coefficient of the elastic member 2 of the first jacking component is K1, and the stiffness coefficient of the elastic member 2 of the second jacking component is K2, where K1 is less than K2; in the initial state, the height difference between the ejector pins 1 of the first jacking component and the second jacking component is L0; when the ejector pins 1 of both the first jacking component and the second jacking component are in the third position, the compression deformation of the elastic member 2 of the first jacking component is L1, and the compression deformation of the elastic member 2 of the second jacking component is L2, where L1 is greater than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2. With the above settings, by configuring elastic members 2 with different stiffness coefficients, when the first jacking component and the second jacking component jack the product 100, the force on the product 100 can be ensured to be consistent.

[0059] More specifically, the position of the support 3 of the first jacking component in the height direction is higher than that of the support 3 of the second jacking component; or the vertical length of the elastic member 2 of the first jacking component is greater than the vertical length of the elastic member 2 of the second jacking component. In the above settings, for products 100 with different shapes and sizes, the height difference between the ejector pins 1 of the first jacking component and the second jacking component can be achieved as needed by adjusting the height of the support 3 or the length of the elastic member 2, so as to achieve the effect of consistent force on the product 100 and further reduce the risk of cracking or hidden cracking of the product 100 caused by uneven force.

[0060] Taking one first jacking component and one second jacking component as an example, the debugging process of the ejector pin device is described as follows:

[0061] During debugging, measure the diameters of the indentations corresponding to the two ejector pins 1 on the test product 100.

[0062] If the left indentation is smaller, for the first jacking component on the left, increase the height of the support 3 and / or replace the elastic member 2 with a longer one and / or replace the elastic member 2 with a greater stiffness coefficient.

[0063] If the left indentation is larger, for the first jacking component on the left, decrease the height of the support 3 and / or replace the elastic member 2 with a shorter one and / or replace the elastic member 2 with a smaller stiffness coefficient.

[0064] The debugging is completed until the diameters of the two indentations are the same.

[0065] At this time, the forces on the left and right sides of the product 100 are consistent when it is jacked up.

[0066] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. Ejector device, characterized in that: Used to push the product (100) from the bottom of a film (200) carrying the product (100), comprising a first pushing assembly and a second pushing assembly, wherein the first pushing assembly and the second pushing assembly are arranged side by side in a horizontal direction, and both comprise a push pin (1), an elastic member (2) and a support (3) connected in sequence from top to bottom; The ejector pin (1) has a first position, a second position and a third position which are successively lowered in height direction; In an initial state, the ejector pin (1) of the first ejector assembly is in a first position, and the ejector pin (1) of the second ejector assembly is in a second position; When the ejector pins (1) of the first ejector assembly and the second ejector assembly are both in the second position, the elastic member (2) of the first ejector assembly is compressed, and the elastic member (2) of the second ejector assembly is not compressed; When the ejector pins (1) of the first ejector assembly and the second ejector assembly are both in the third position, the elastic members (2) of the first ejector assembly and the second ejector assembly are both compressed, and the ejector pins (1) of the first ejector assembly and the second ejector assembly are subjected to the same force from the elastic member (2).

2. The ejector device according to claim 1, characterized in that: A plurality of the first ejection assemblies are provided, and along a direction approaching the second ejection assembly, the ejector pins (1) of the plurality of the first ejection assemblies are sequentially lowered along a height direction.

3. The ejector device according to claim 1, characterized in that: It also comprises a base (4), and the support (3) is mounted on the base (4) in an adjustable vertical position.

4. The ejector device according to claim 3, characterized in that: The base (4) is provided with a receiving groove (41), and the support (3) is installed in the receiving groove (41).

5. The ejector device according to claim 3, characterized in that: The support (3) is screwed to the base (4).

6. The ejector device according to claim 3, characterized in that: It also comprises a driver, the support (3) is connected to the output end of the driver, and the driver is configured to drive the support (3) to move vertically.

7. The ejector device according to claim 1, characterized in that: It also includes a loading platform (5), the top surface of which is configured to carry the adhesive film (200) with the product (100), and the first pushing assembly and the second pushing assembly are arranged on the lower side of the loading platform (5).

8. The ejector device according to claim 1, characterized in that: It also comprises a guide die (6), wherein the guide die (6) is provided with a needle threading hole, and the ejector pin (1) is inserted into the needle threading hole.

9. The ejector device according to any one of claims 1 to 8, characterized in that: The stiffness coefficient of the elastic member (2) of the first push-moving assembly is K1, and the stiffness coefficient of the elastic member (2) of the second push-moving assembly is K2, and K1 is smaller than K2; In an initial state, the height difference between the ejector pins (1) of the first ejector assembly and the second ejector assembly is L0; When the ejector pins (1) of the first ejector assembly and the second ejector assembly are both in the third position, the compression deformation of the elastic member (2) of the first ejector assembly is L1, and the compression deformation of the elastic member (2) of the second ejector assembly is L2, L1 is greater than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2.

10. The ejector device according to claim 9, characterized in that: The support (3) of the first jacking assembly is located higher in height than the support (3) of the second jacking assembly; or The vertical length of the elastic member (2) of the first pushing assembly is greater than the vertical length of the elastic member (2) of the second pushing assembly.