Chip heat dissipation structure

Abstract

The utility model discloses a chip heat dissipation structure which comprises a heat collection metal plate, the lower side of the heat collection metal plate is coated with heat conduction silicone grease, the side walls of the left side and the right side of the heat collection metal plate are evenly and fixedly connected with a plurality of heat conduction pieces through locking screws, and the heat conduction piece located on the left side is fixedly connected with an air outlet thin pipe. An air inlet thin pipe is fixedly connected to the heat-conducting fin on the right side, an air inlet thick pipe is fixedly connected to the heat-conducting fin on the right side, the inner diameter of the air outlet thin pipe is smaller than that of the air inlet thick pipe, the same conical acceleration flow guide pipe is fixedly connected between the air outlet thin pipe and the air inlet thick pipe, and the inner diameter of the left end of the conical acceleration flow guide pipe is smaller than that of the right end of the conical acceleration flow guide pipe. According to the chip heat dissipation structure, the throughput of heat dissipation airflow in unit time can be improved, so that the heat dissipation mechanism can continuously absorb heat on the chip, rapid and effective auxiliary heat dissipation can be carried out on the chip, and compared with an existing heat dissipation structure, the chip heat dissipation structure is more efficient, and the service life of the chip is prolonged. And the operation stability of the chip is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, and specifically relates to a chip heat dissipation structure. Background Art

[0002] The CPU chip is an important component of the host computer. When the CPU chip is in use, a large amount of heat will be generated, which will cause the temperature of the CPU to rise sharply, thus affecting the stability of the CPU performance. Therefore, a heat dissipation structure needs to be installed to assist in dissipating heat from the CPU.

[0003] The existing chip heat dissipation structure uses a heat sink or a heat pipe to absorb and transfer the heat on the CPU, and then uses a cooling fan to assist in dissipating heat from the heat dissipation structure. The air flow blown by the cooling fan in the above chip heat dissipation structure passes through the heat dissipation structure at a uniform speed, resulting in a lower amount of heat discharged per unit time, thus leading to a lower heat dissipation efficiency. Content of the Utility Model

[0004] The purpose of the utility model is to provide a chip heat dissipation structure to solve the problems put forward in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a chip heat dissipation structure, which includes a heat collecting metal plate. A heat conductive silicone grease is coated on the lower side of the heat collecting metal plate. A plurality of heat conductive sheets are uniformly fixedly connected to the side walls on the left and right sides of the heat collecting metal plate through locking screws. An air outlet thin pipe is fixedly connected to the heat conductive sheet on the left side, and an air inlet thick pipe is fixedly connected to the heat conductive sheet on the right side. The inner diameter of the air outlet thin pipe is smaller than that of the air inlet thick pipe. The same tapered acceleration guide pipe is fixedly connected between the air outlet thin pipe and the air inlet thick pipe. The inner diameter of the left end of the tapered acceleration guide pipe is smaller than that of the right end. A heat conductive component is connected between the tapered acceleration guide pipe and the heat collecting metal plate. Two elastic mounting components are symmetrically and fixedly connected to the vertical side walls of the heat collecting metal plate.

[0007] Further, the elastic mounting component includes a mounting plate fixedly connected to the vertical side wall of the heat collecting metal plate. A threaded hole is opened on the mounting plate. A locking bolt is threadedly inserted into the threaded hole. A compression spring is movably sleeved outside the locking bolt. The compression spring is located above the mounting plate.

[0008] Further, the heat conductive component includes a plurality of heat conductive plates fixedly connected to the upper side of the heat collecting metal plate. The same metal connecting plate is fixedly connected to the upper sides of the plurality of heat conductive plates. Metal connecting blocks are fixedly connected between the upper side of the metal connecting plate and the plurality of tapered acceleration guide pipes.

[0009] Furthermore, a gasket is fixedly connected to the side wall on the lower side of the mounting plate.

[0010] Furthermore, a plurality of air holes are formed in the vertical side wall of the heat conducting fin, and the plurality of air holes are evenly distributed on the heat conducting fin.

[0011] Furthermore, the materials of the heat collecting metal plate, the heat conducting fin, the air outlet fine pipe, the air inlet thick pipe and the conical acceleration guide pipe are all copper.

[0012] Furthermore, a conical hopper is fixedly connected to one end of the air inlet thick pipe far away from the conical acceleration guide pipe.

[0013] Furthermore, a plurality of clamping blocks are fixedly connected to the vertical side wall of the heat collecting metal plate, clamping grooves matching with the clamping blocks are formed on the heat conducting fin, and the clamping blocks are inserted into the clamping grooves.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] By providing the heat collecting metal plate, the locking screw, the heat conducting fin, the air outlet fine pipe, the air inlet thick pipe, the conical acceleration guide pipe and the heat conducting silicone grease, in use, the heat conducting silicone grease is applied on the heat collecting metal plate, the side of the heat collecting metal plate with the heat conducting silicone grease is tightly attached to the chip, the heat collecting metal plate is installed on the main board through the elastic mounting component, the heat on the chip is transmitted to the air outlet fine pipe, the air inlet thick pipe and the conical acceleration guide pipe through the heat conducting fin. When the air flow blown by the radiator fan in the host enters the air inlet thick pipe, the heat dissipation air flow enters the conical acceleration guide pipe through the air inlet thick pipe. When the air flow passes through the conical acceleration guide pipe, due to the principle of the venturi effect, the heat dissipation air flow will pass through quickly, so that the heat on the air outlet fine pipe, the air inlet thick pipe and the conical acceleration guide pipe can be taken away quickly, the passing amount of the heat dissipation air flow per unit time can be increased, so that it can be ensured that the heat dissipation mechanism can continuously absorb the heat on the chip, and thus the chip can be assisted in heat dissipation quickly and effectively. Compared with the existing heat dissipation structure, the heat dissipation structure of this chip is more efficient and effectively improves the stability of the chip operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is a schematic diagram of the structure of the present utility model in another direction;

[0018] Figure 3 is Figure 1 the schematic diagram of the structure of the elastic mounting component in

[0019] In the figure: 1, heat collection metal plate; 2, locking screw; 3, heat conduction fin; 4, fine air outlet pipe; 5, thick air inlet pipe; 6, conical acceleration guide pipe; 7, mounting plate; 8, locking bolt; 9, compression spring; 10, heat conduction plate; 11, metal connecting plate; 12, metal connecting block; 13, gasket; 14, air hole; 15, conical hopper; 16, clamping block; 17, clamping groove; 18, heat conduction silicone grease. Detailed implementation manner

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1 - 3 , the present invention provides a chip heat dissipation structure, including a heat collection metal plate 1, a heat conduction silicone grease 18 is coated on the lower side of the heat collection metal plate 1, a plurality of heat conduction fins 3 are uniformly fixedly connected to the side walls on the left and right sides of the heat collection metal plate 1 through locking screws 2, a fine air outlet pipe 4 is fixedly connected to the heat conduction fin 3 on the left side, a thick air inlet pipe 5 is fixedly connected to the heat conduction fin 3 on the right side, the inner diameter of the fine air outlet pipe 4 is smaller than the inner diameter of the thick air inlet pipe 5, the fine air outlet pipe 4 and the thick air inlet pipe 5 are fixedly connected to the same conical acceleration guide pipe 6, the inner diameter of the left end of the conical acceleration guide pipe 6 is smaller than the inner diameter of the right end, a heat conduction component is connected between the conical acceleration guide pipe 6 and the heat collection metal plate 1, and two elastic mounting components are symmetrically and fixedly connected to the vertical side walls of the heat collection metal plate 1.

[0022] In the above embodiment, the passing amount of the heat dissipation air flow per unit time can be increased, so that it can be ensured that the heat dissipation mechanism can continuously absorb the heat on the chip, and thus the chip can be quickly and effectively assisted in heat dissipation. Compared with the existing heat dissipation structure, the heat dissipation structure of this chip is more efficient and effectively improves the stability of the chip operation.

[0023] The elastic mounting component includes a mounting plate 7 fixedly connected to the vertical side wall of the heat collection metal plate 1, a threaded hole is opened on the mounting plate 7, a locking bolt 8 is threadedly inserted into the threaded hole, and a compression spring 9 is movably sleeved outside the locking bolt 8, and the compression spring 9 is located above the mounting plate 7.

[0024] In the above embodiment, turning the locking bolt 8 can fix and install the heat collection metal plate 1, and the provided compression spring 9 can continuously apply pressure to the mounting plate 7, so that the heat collection metal plate 1 can be closely attached to the chip, improving the heat dissipation effect of the heat dissipation structure.

[0025] The heat-conducting component includes a plurality of heat-conducting plates 10 fixedly connected to the upper side of the heat-collecting metal plate 1. The upper sides of the plurality of heat-conducting plates 10 are fixedly connected to the same metal connecting plate 11. Metal connecting blocks 12 are fixedly connected between the upper side of the metal connecting plate 11 and the plurality of conical acceleration guide tubes 6. Through the mutual cooperation of the heat-conducting plates 10, the metal connecting plate 11 and the metal connecting blocks 12, the heat on the heat-collecting metal plate 1 can be transferred to the conical acceleration guide tubes 6 more efficiently.

[0026] A gasket 13 is fixedly connected to the side wall of the lower side of the mounting plate 7, which improves the stability of the installation of the elastic mounting component.

[0027] A plurality of air holes 14 are formed in the vertical side wall of the heat-conducting fin 3, and the plurality of air holes 14 are evenly distributed on the heat-conducting fin 3, which can improve the smoothness of the airflow blown by the cooling fan flowing in the heat dissipation structure.

[0028] The materials of the heat-collecting metal plate 1, the heat-conducting fin 3, the air outlet fine tube 4, the air inlet thick tube 5 and the conical acceleration guide tube 6 are all copper, which can improve the heat conduction efficiency of the heat-collecting metal plate 1, the heat-conducting fin 3, the air outlet fine tube 4, the air inlet thick tube 5 and the conical acceleration guide tube 6, and thus can improve the heat dissipation efficiency.

[0029] One end of the air inlet thick tube 5 far from the conical acceleration guide tube 6 is fixedly connected to a conical hopper 15. The provided conical hopper 15 can facilitate more air flow to enter the air inlet thick tube 5.

[0030] A plurality of clamping blocks 16 are fixedly connected to the vertical side wall of the heat-collecting metal plate 1. A clamping groove 17 matching the clamping blocks 16 is formed on the heat-conducting fin 3. The clamping blocks 16 are inserted into the clamping grooves 17. Through the mutual cooperation of the clamping blocks 16 and the clamping grooves 17, the installation stability of the heat-conducting fin 3 can be improved.

[0031] Working principle: When in use, heat-conducting silicone grease 18 is applied on the heat-collecting metal plate 1, and the side of the heat-collecting metal plate 1 with the heat-conducting silicone grease 18 is tightly attached to the chip. The heat-collecting metal plate 1 is installed on the main board through the elastic mounting component. The heat on the chip is transferred to the air outlet fine tube 4, the air inlet thick tube 5 and the conical acceleration guide tube 6 through the heat-conducting fin 3. When the airflow blown by the cooling fan in the host enters the air inlet thick tube 5, the heat dissipation airflow enters the conical acceleration guide tube 6 through the air inlet thick tube 5. When the airflow passes through the conical acceleration guide tube 6, due to the principle of the narrow tube effect, the heat dissipation airflow will accelerate through, so that the heat on the air outlet fine tube 4, the air inlet thick tube 5 and the conical acceleration guide tube 6 can be taken away quickly, and the passing amount of the heat dissipation airflow per unit time can be increased, so that it can be ensured that the heat dissipation mechanism can continuously absorb the heat on the chip, and thus the chip can be quickly and effectively assisted in heat dissipation. Compared with the existing heat dissipation structure, this chip heat dissipation structure is more efficient and effectively improves the stability of the chip operation.

[0032] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip heat dissipation structure, comprising a heat collecting metal plate (1), characterized in that: The lower side of the heat collecting metal plate (1) is coated with thermal conductive silicone grease (18); the side walls on the left and right sides of the heat collecting metal plate (1) are evenly fixedly connected with a plurality of heat conducting plates (3) by means of locking screws (2); the heat conducting plate (3) on the left side is fixedly connected with a thin air outlet tube (4); the heat conducting plate (3) on the right side is fixedly connected with a thick air inlet tube (5); the inner diameter of the thin air outlet tube (4) is smaller than the inner diameter of the thick air inlet tube (5); the same conical accelerating flow guide tube (6) is fixedly connected between the thin air outlet tube (4) and the thick air inlet tube (5); the inner diameter of the left end of the conical accelerating flow guide tube (6) is smaller than the inner diameter of the right end; a heat conducting component is connected between the conical accelerating flow guide tube (6) and the heat collecting metal plate (1); and two elastic mounting components are symmetrically fixedly connected to the vertical side walls of the heat collecting metal plate (1).

2. A chip heat dissipation structure according to claim 1, characterized in that: The elastic mounting assembly comprises a mounting plate (7) fixedly connected to the vertical side wall of the heat collecting metal plate (1), the mounting plate (7) being provided with a threaded hole, a locking bolt (8) being threadedly inserted into the threaded hole, a compression spring (9) being provided on the outer sleeve of the locking bolt (8), and the compression spring (9) being located on the upper side of the mounting plate (7).

3. A chip heat dissipation structure according to claim 1, characterized in that: The heat conduction assembly comprises a plurality of heat conduction plates (10) fixedly connected to the upper side of a heat collecting metal plate (1), the upper sides of the plurality of heat conduction plates (10) being fixedly connected to a same metal connecting plate (11), and a metal connecting block (12) being fixedly connected between the upper side of the metal connecting plate (11) and a plurality of conical accelerating flow guide tubes (6).

4. A chip heat dissipation structure according to claim 2, characterized in that: A gasket (13) is fixedly connected to the side wall at the lower side of the mounting plate (7).

5. The chip heat dissipation structure according to claim 1, characterized in that: The vertical side wall of the heat conducting plate (3) is provided with a plurality of air holes (14), and the plurality of air holes (14) are evenly distributed on the heat conducting plate (3).

6. The chip heat dissipation structure according to claim 1, characterized in that: The heat collecting metal plate (1), the heat conducting sheet (3), the thin air outlet tube (4), the thick air inlet tube (5) and the conical accelerating flow guide tube (6) are all made of copper.

7. A chip heat dissipation structure according to claim 6, characterized in that: One end of the thick air inlet pipe (5) away from the conical accelerating flow guide pipe (6) is fixedly connected to a conical bucket (15).

8. The chip heat dissipation structure according to claim 6, characterized in that: A plurality of clamping blocks (16) are fixedly connected to the vertical side walls of the heat collecting metal plate (1), a clamping slot (17) matching the clamping block (16) is provided on the heat conducting plate (3), and the clamping block (16) is inserted into the clamping slot (17).

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