Signal line fixing support applied to photoetching equipment

Abstract

The utility model discloses a signal line fixing support applied to photoetching equipment, which comprises a substrate, the substrate comprises a first substrate and a second substrate which are integrally formed, the first substrate and the second substrate are perpendicular to each other, at least two screw holes are formed in the second substrate, and the screw holes are matched with the first substrate and the second substrate; the screw hole is used for mounting the fixed bracket on a frame of photoetching equipment through a screw; wherein a plurality of wire plugging holes are formed in the first substrate, a buffer pad is arranged on each wire plugging hole, the buffer pad is made of an elastic material, the elastic material comprises at least one of rubber, a polymer material and a wood material, the wire plugging holes are used for fixing and connecting signal wires, and the signal wires are signal wires of a wafer transmission unit in the photoetching equipment. According to the utility model, the buffer pad is arranged on the wire plugging hole of the signal wire fixing support used for connecting the signal wire of the wafer transmission unit, so that communication faults caused by loosening of the signal wire are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices and integrated circuit manufacturing, in particular to a signal line fixing bracket applied to a lithography device. Background Art

[0002] In the lithography process of semiconductor integrated circuit manufacturing, before a wafer is transferred to a processing table by a wafer handler for exposure, pre-align is required to ensure that the patterns on the wafer are aligned with the patterns on the mask.

[0003] In the related art, taking the lithography device provided by ASML (Advanced Semiconductor Material Lithography) company in the Netherlands as an example, the signal line fixing bracket in the wafer transfer unit is a middle-transition bracket, and the signal lines at both ends need to be connected respectively. Therefore, inside the wafer transfer unit, due to long-term high-speed movement, the signal lines are likely to become loose, which may further lead to communication failures of the wafer transfer unit, especially reporting errors for the Z-axis signal during the pre-align process, resulting in machine stops and reducing production efficiency. Summary of the Invention

[0004] The utility model provides a signal line fixing bracket applied to a lithography device, which can solve the problem that the signal line fixing bracket in the wafer transfer unit provided in the related art is likely to cause the signal lines to become loose. The signal line fixing bracket includes:

[0005] A substrate, which includes an integrally formed first substrate and a second substrate. The first substrate and the second substrate are perpendicular to each other. At least two screw holes are formed on the second substrate, and the screw holes are used to install the signal line fixing bracket on the frame of the lithography device through screws;

[0006] Wherein, a plurality of wire insertion holes are formed on the first substrate, and a buffer pad is arranged on each wire insertion hole. The buffer pad is made of an elastic material, and the elastic material includes at least one of rubber, polymer material, and wood material. The wire insertion holes are used to fix and connect signal lines, and the signal lines are the signal lines of the wafer transfer unit in the lithography device.

[0007] In some embodiments, the substrate is made of a metal material.

[0008] In some embodiments, the centers of the plurality of wire insertion holes are not on a straight line.

[0009] In some embodiments, the plurality of wire insertion holes include a first wire insertion hole, a second wire insertion hole, a third wire insertion hole, a fourth wire insertion hole, a fifth wire insertion hole, and a sixth wire insertion hole;

[0010] The first wiring hole is used to connect a first signal line and a second signal line. The first signal line is connected to the motor of the eccentricity calibration module of the wafer pre-alignment unit, and the second signal line is connected to the signal control board of the wafer pre-alignment unit;

[0011] The second wiring hole is used to connect a third signal line and a fourth signal line. The third signal line is connected to the decoder of the eccentricity calibration module of the wafer pre-alignment unit, and the fourth signal line is connected to the signal control board of the wafer pre-alignment unit;

[0012] The third wiring hole is used to connect a fifth signal line and a sixth signal line. The fifth signal line is connected to the photoelectric sensor of the wafer pre-alignment unit, and the sixth signal line is connected to the signal control board of the wafer pre-alignment unit;

[0013] The fourth wiring hole is used to connect a seventh signal line and an eighth signal line. The seventh signal line is connected to the motor of the wafer pre-alignment unit, and the eighth signal line is connected to the signal control board of the wafer pre-alignment unit;

[0014] The fifth wiring hole is used to connect a ninth signal line and a tenth signal line. The ninth signal line is connected to the decoder of the wafer pre-alignment unit, and the tenth signal line is connected to the signal control board of the wafer pre-alignment unit;

[0015] The sixth wiring hole is used to connect an eleventh signal line and a twelfth signal line. The eleventh signal line is connected to the lower photoelectric sensor of the wafer pre-alignment unit, and the twelfth signal line is connected to the signal control board of the wafer pre-alignment unit.

[0016] In some embodiments, the lithography apparatus is a lithography apparatus produced by ASML.

[0017] The technical solution of the present utility model has at least the following advantages:

[0018] By providing a buffer pad on the wiring hole of the signal line fixing bracket for connecting the signal lines of the wafer transfer unit, the connection part of the signal lines is comprehensively protected by the softness and elasticity of the buffer pad, increasing the movable range of the connection part, thereby increasing the movable space of the signal lines during the high-speed movement of the wafer transfer unit, and further reducing the communication failure caused by the loosening of the signal lines, reducing the probability of downtime due to failures, and improving the production efficiency to a certain extent. Description of the Drawings

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 is a front view schematic diagram of a signal line fixing bracket provided by an exemplary embodiment of the present invention;

[0021] Figure 2 is a top view schematic diagram of a signal line fixing bracket provided by an exemplary embodiment of the present invention;

[0022] Figure 3 is an installation schematic diagram of a signal line fixing bracket provided by an exemplary embodiment of the present invention. Specific Embodiments

[0023] The following will clearly and completely describe the technical solutions in the present invention in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can also be the communication inside two elements. It can be a wireless connection or a wired connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0027] Reference Figure 1 , which shows a front view schematic diagram of a signal line fixing bracket provided by an exemplary embodiment of the present utility model; reference Figure 2 , which shows a top view schematic diagram of a signal line fixing bracket provided by an exemplary embodiment of the present utility model, as Figure 1 and Figure 2 shown, the signal line fixing bracket 100 is applied to a lithography apparatus, and the lithography apparatus can be a lithography apparatus produced by ASML Corporation. The signal line fixing bracket 100 includes:

[0028] A substrate, which is made of a metal material. The substrate includes a first substrate 110 and a second substrate 120 formed integrally. The first substrate 110 and the second substrate 120 are perpendicular to each other. At least two screw holes are formed on the second substrate 120 ( Figure 1 , Figure 2 exemplified by a first screw hole 121 and a second screw hole 122 in, and can be set according to requirements in actual applications). The screw holes are used to install the signal line fixing bracket 100 on the frame of the lithography apparatus through screws.

[0029] Among them, a plurality of wire insertion holes are formed on the first substrate 110 ( Figure 1 , Figure 2 exemplified by a first wire insertion hole 111, a second wire insertion hole 112, a third wire insertion hole 113, a fourth wire insertion hole 114, a fifth wire insertion hole 115 and a sixth wire insertion hole 116 in, and can be set according to requirements in actual applications). A buffer pad 130 is provided on each wire insertion hole. The buffer pad 130 is made of an elastic material, and the elastic material includes at least one of rubber, polymer material and wood material. The wire insertion holes are used to fix and connect signal lines. The signal lines are signal lines of a wafer transfer unit in the lithography apparatus. The centers of the plurality of wire insertion holes are not located on a straight line (that is, the plurality of wire insertion holes are arranged in a staggered manner, and this arrangement method can save the use space and at the same time reduce and eliminate interference problems).

[0030] Exemplarily, as Figure 3As shown in the figure, the signal line fixing bracket 100 can be installed on the frame 200 of the lithography equipment. The first wiring hole 111 is used to connect the first signal line 311 and the second signal line 312. The first signal line 311 is connected to the eccentric calibration module motor of the wafer pre-alignment unit, and the second signal line 312 is connected to the signal control board of the wafer pre-alignment unit. The second wiring hole 112 is used to connect the third signal line 321 and the fourth signal line 322. The third signal line 321 is connected to the decoder of the eccentric calibration module of the wafer pre-alignment unit, and the fourth signal line 322 is connected to the signal control board of the wafer pre-alignment unit. The third wiring hole 113 is used to connect the fifth signal line 331 and the sixth signal line 332. The fifth signal line 331 is connected to the photoelectric sensor of the wafer pre-alignment unit, and the sixth signal line 332 is connected to the signal control board of the wafer pre-alignment unit. The fourth wiring hole 114 is used to connect the seventh signal line 341 and the eighth signal line 342. The seventh signal line 341 is connected to the motor of the wafer pre-alignment unit, and the eighth signal line 342 is connected to the signal control board of the wafer pre-alignment unit. The fifth wiring hole 115 is used to connect the ninth signal line 351 and the tenth signal line 352. The ninth signal line 351 is connected to the decoder of the wafer pre-alignment unit, and the tenth signal line 352 is connected to the signal control board of the wafer pre-alignment unit. The sixth wiring hole 116 is used to connect the eleventh signal line 361 and the twelfth signal line 362. The eleventh signal line 361 is connected to the lower photoelectric sensor of the wafer pre-alignment unit, and the twelfth signal line 362 is connected to the signal control board of the wafer pre-alignment unit. Wherein, when every two signal lines are fixed in the corresponding wiring holes, they can be connected through their respective corresponding plugs 371 and 372.

[0031] Among them, the eccentric calibration module motor of the wafer pre-alignment unit is used to drive the eccentric calibration module to finely adjust the wafer position when the wafer pre-alignment unit detects that the wafer position deviates from the center (when the eccentricity is too large and greater than the threshold value) so that the wafer eccentricity meets the standard. The motor of the wafer pre-alignment unit is used to control the movement of the wafer in the Z direction of the wafer pre-alignment unit. The photoelectric sensor of the wafer pre-alignment unit is used to detect the missing corner position of the wafer edge, and then unify the orientation of the wafer when it enters the machine. The lower photoelectric sensor of the wafer pre-alignment unit is used to detect whether the wafer pre-alignment unit reaches the specified position when it descends in the Z direction.

[0032] In summary, in the embodiment of the present utility model, by arranging buffer pads on the wiring holes of the signal line fixing bracket for the signal lines connecting the wafer transfer unit, the connection points of the signal lines are comprehensively protected by the softness and elasticity of the buffer pads, increasing the movable range of the connection points. Thus, the movable space of the signal lines during the high-speed movement of the wafer transfer unit is increased, thereby reducing the communication failures caused by the loosening of the signal lines and reducing the probability of downtime due to failures, and improving the production efficiency to a certain extent.

[0033] Obviously, the above embodiments are merely examples for clear illustration and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation manners here. And the obvious changes or modifications derived therefrom still fall within the protection scope of this utility model creation.

Claims

1. A signal line fixing bracket used in a lithography device, characterized in that: include: A substrate, the substrate comprising an integrally formed first substrate and a second substrate, the first substrate and the second substrate being perpendicular to each other, the second substrate being formed with at least two screw holes, the screw holes being used to mount the fixing bracket on a frame of the lithography device by screws; Among them, a plurality of wire insertion holes are formed on the first substrate, and a buffer pad is arranged on each wire insertion hole. The buffer pad is made of elastic material, and the elastic material includes at least one of rubber, polymer material and wood material. The wire insertion hole is used to fix and connect the signal line, and the signal line is the signal line of the wafer transfer unit in the lithography equipment.

2. The signal line fixing bracket according to claim 1, characterized in that: The substrate is made of metal material.

3. The signal line fixing bracket according to claim 2, characterized in that: The centers of the plurality of wire insertion holes are not located on a straight line.

4. The signal line fixing bracket according to any one of claims 1 to 3, characterized in that: The plurality of wire insertion holes include a first wire insertion hole, a second wire insertion hole, a third wire insertion hole, a fourth wire insertion hole, a fifth wire insertion hole and a sixth wire insertion hole; The first plug hole is used to connect a first signal line and a second signal line, the first signal line is connected to the eccentricity calibration module motor of the wafer pre-alignment unit, and the second signal line is connected to the signal control board of the wafer pre-alignment unit; The second plug hole is used to connect a third signal line and a fourth signal line, the third signal line is connected to the decoder of the eccentricity calibration module of the wafer pre-alignment unit, and the fourth signal line is connected to the control board of the wafer pre-alignment unit signal; The third plug hole is used to connect a fifth signal line and a sixth signal line, the fifth signal line is connected to the photoelectric sensor of the wafer pre-alignment unit, and the sixth signal line is connected to the signal control board of the wafer pre-alignment unit; The fourth plug hole is used to connect a seventh signal line and an eighth signal line, the seventh signal line is connected to a motor of a wafer pre-alignment unit, and the eighth signal line is connected to a signal control board of the wafer pre-alignment unit; The fifth plug hole is used to connect a ninth signal line and a tenth signal line, the ninth signal line is connected to a decoder of the wafer pre-alignment unit, and the tenth signal line is connected to a signal control board of the wafer pre-alignment unit; The sixth plug hole is used to connect an eleventh signal line and a twelfth signal line, the eleventh signal line is connected to the lower photoelectric sensor of the wafer pre-alignment unit, and the twelfth signal line is connected to the signal control board of the wafer pre-alignment unit.

5. The signal line fixing bracket according to claim 4, characterized in that: The lithography equipment is produced by ASML.

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