Jig for soldering paste printing of high-power triode base

Abstract

A jig for soldering paste printing of a high-power triode base is provided with a fixing plate and a cover plate, and the cover plate is detachably buckled over the fixing plate. The fixing plate is provided with at least one fixing area used for fixing a high-power triode base, and the cover plate is provided with at least one printing area matched with the fixing area. An accommodating space for accommodating a high-power triode base is arranged between the fixing area and the printing area; the cover plate is provided with a fixing area, the fixing area is provided with a printing hole used for printing soldering paste, and when the cover plate is buckled above the fixing plate, the printing hole is located over the containing space, and the printing hole is located over a mounting area of a high-power triode base. According to the jig for solder paste printing of the high-power triode base, the high-power triode base can be flatly fixed through the fixing plate, solder paste can be accurately printed on the surface mounting area of the high-power triode base through the cover plate, and the thickness of the solder paste can be accurately controlled.

Description

Technical Field

[0001] The utility model relates to the technical field of high-power triode tube printing, and particularly relates to a jig for solder paste printing on the base of a high-power triode. Background Art

[0002] At present, a high-power triode is composed of a chip and a metal base. For example, a high-power triode for preventing high-temperature accumulation disclosed in Chinese Patent Publication No. CN217641296U has solder paste applied in the mounting area of the metal base, and then the chip is fixed on the metal base. The metal base is diamond-shaped, and the back of the metal base is provided with multiple pins, such as 2 or 3 pins. The metal base also has two assembly holes and is fixed to the chip on the front of the metal base, as Figures 1 to 3 shown in Figure 2 where the shaded area is the mounting area. Due to the complex structure of the metal base, the metal base cannot be laid flat when applying solder paste. Currently, when applying solder paste to the metal base, a jig with a groove is mainly used, and then multiple pins are extended into the groove to make the plane of the metal base in the same plane, as Figure 4 and Figure 5 shown. Then, through a handheld syringe, the solder paste is injected drop by drop onto the mounting area of the metal base. This method requires drop-by-drop injection, which is inefficient, and it is impossible to stably control the injection area of the solder paste when using the handheld syringe, nor can the thickness of the applied solder paste be accurately controlled.

[0003] Therefore, in view of the deficiencies of the prior art, it is very necessary to provide a jig for solder paste printing on the base of a high-power triode to solve the deficiencies of the prior art. Content of the Utility Model

[0004] The purpose of the utility model is to avoid the deficiencies of the prior art and provide a jig for solder paste printing on the base of a high-power triode. The jig for solder paste printing on the base of a high-power triode can accurately control the position and thickness of the applied solder paste.

[0005] The above object of the utility model is achieved by the following technical measures:

[0006] Provide a jig for solder paste printing on the base of a high-power triode, which is provided with a fixing plate and a cover plate, and the cover plate is detachably buckled above the fixing plate.

[0007] The fixing plate is provided with at least one fixing area for fixing the base of the high-power triode, and the cover plate is provided with at least one printing area matching the fixing area.

[0008] A receiving space for receiving the base of the high-power triode is arranged between the fixing area and the printing area..

[0009] The fixed area is provided with printing holes for printing solder paste. When the cover plate is buckled above the fixed plate, the printing holes are directly above the accommodation space and directly above the mounting area of the high-power triode base.

[0010] Preferably, the number of the above-mentioned fixed areas corresponds one-to-one with the number of the printing areas.

[0011] Preferably, the above-mentioned fixed plate is provided with a plate body and fixing bolts for fixing the high-power triode base, and the fixing bolts are detachably assembled to the plate body.

[0012] Preferably, the above-mentioned plate body is provided with pin holes and fixing holes for accommodating the pins of the high-power triode base. The positions of the pin holes correspond to the positions of the pins of the high-power triode base, the positions of the fixing holes correspond to the positions of the assembly holes of the high-power triode base, and the fixing bolts are detachably assembled to the fixing holes.

[0013] Each fixed area is provided with a pair of the fixing bolts, a pair of the fixing holes and a plurality of the pin holes.

[0014] Preferably, the above-mentioned cover plate is further provided with accommodation holes matching the fixing bolts, and the accommodation holes are detachably assembled with the fixing bolts.

[0015] Each printing area is provided with one of the printing holes and a pair of the accommodation holes.

[0016] When the jig is working, the pins of the high-power triode base are respectively inserted into the pin holes, the fixing bolts are inserted into the assembly holes of the high-power triode base and assembled with the fixing holes, the high-power triode base is fixed to the fixed plate, the cover plate is buckled on the upper surface of the fixed plate, the fixing bolts extend into the accommodation holes, and the mounting area of the high-power triode base is directly below the printing holes.

[0017] Preferably, the above-mentioned plate body is further provided with an accommodation groove matching the contour of the high-power triode base. The pin holes are located inside the accommodation groove, and the space between the accommodation groove and the lower surface of the cover plate serves as the accommodation space.

[0018] The jig for printing solder paste on the high-power triode base of the present utility model is further provided with a stripping plate for separating the high-power triode base after printing, and the stripping plate is detachably inserted directly below the fixed plate.

[0019] Preferably, the above-mentioned stripping plate is integrally connected with insertion posts.

[0020] Preferably, the above-mentioned plate body is further provided with stripping holes, the stripping holes are located inside the accommodation groove, and the insertion posts and the stripping holes are detachably assembled.

[0021] In the fixing plate, the fixing areas are distributed in a matrix.

[0022] In the cover plate, the printing areas are distributed in a matrix.

[0023] Preferably, the thickness of the above cover plate is less than or equal to the solder paste coating thickness. Defining the thickness of the cover plate as A, there is 0.5mm ≤ A ≤ 5mm.

[0024] A fixture for solder paste printing of a high-power triode base of the present utility model is provided with a fixing plate and a cover plate. The cover plate is detachably buckled directly above the fixing plate; the fixing plate is provided with at least one fixing area for fixing the high-power triode base, and the cover plate is provided with at least one printing area matching the fixing area; a receiving space for receiving the high-power triode base is provided between the fixing area and the printing area; the fixing area is provided with printing holes for printing solder paste. When the cover plate is buckled above the fixing plate, the printing holes are directly above the receiving space and directly above the mounting area of the high-power triode base. The fixture for solder paste printing of the high-power triode base can fix the high-power triode base flat through the fixing plate, can accurately print solder paste on the mounting area of the high-power triode base through the cover plate, and the thickness of the solder paste can be accurately controlled. Description of the Drawings

[0025] The present utility model is further described with reference to the accompanying drawings, but the content in the drawings does not constitute any limitation to the present utility model.

[0026] Figure 1 It is a three-dimensional structure diagram of a high-power triode base.

[0027] Figure 2 It is a front view of a high-power triode base.

[0028] Figure 3 It is a left view of a high-power triode base.

[0029] Figure 4 It is a schematic diagram of a high-power triode base placed in a fixture in the prior art.

[0030] Figure 5 It is for Figure 4 the left view of.

[0031] Figure 6 It is a top view of the fixture in Example 1 during operation.

[0032] Figure 7 It is a perspective view of the fixture in Example 1 during operation.

[0033] Figure 8Top view of the fixing plate in the fixture of Embodiment 1.

[0034] Figure 9 Perspective view of the fixing plate.

[0035] Figure 10 Top view of the fixing plate of Embodiment 1.

[0036] Figure 11 Stereogram of the fixing plate of Embodiment 1.

[0037] Figure 12 Top view of the fixing plate of Embodiment 2.

[0038] Figure 13 Stereogram of the fixing plate of Embodiment 2.

[0039] Figure 14 Perspective view of the fixture of Embodiment 2 during operation.

[0040] Figure 15 Stereogram of the stripping plate of Embodiment 2.

[0041] Figure 16 Stereogram of the stripping plate and the fixing plate of Embodiment 2 during assembly.

[0042] At Figures 1 to 16 , including:

[0043] Fixing plate 100, plate body 110, fixing bolt 120, pin hole 130, fixing hole 140, receiving groove 150, stripping hole 160, fixing area 170,

[0044] Cover plate 200, printing hole 210, receiving hole 220, printing area 230,

[0045] Stripping plate 300, insertion post 310,

[0046] High-power triode base 400, pin 410, mounting area 420, assembly hole 430. Detailed implementation mode

[0047] The technical solution of the present utility model will be further described in conjunction with the following embodiments.

[0048] Embodiment 1

[0049] A fixture for solder paste printing of a high-power triode base, as Figure 6 and Figure 7As shown, a fixing plate 100 and a cover plate 200 are provided. The cover plate 200 is detachably fastened above the fixing plate 100. The fixing plate 100 is provided with at least one fixing area 170 for fixing the base 400 of a high-power triode, and the cover plate 200 is provided with at least one printing area 230 that matches the fixing area 170.

[0050] It should be noted that in the present utility model, the side for solder paste printing is defined as the upper side of the jig.

[0051] A receiving space for receiving the base 400 of the high-power triode is provided between the fixing area 170 and the printing area 230.

[0052] The fixing area 170 is provided with printing holes 210 for printing solder paste. When the cover plate 200 is fastened above the fixing plate 100, the printing holes 210 are located directly above the receiving space and directly above the mounting area 420 of the base 400 of the high-power triode. The thickness of the cover plate 200 is less than or equal to the solder paste application thickness. Defining the thickness of the cover plate 200 as A, there is 0.5mm ≤ A ≤ 5mm.

[0053] The number of fixing areas 170 corresponds one-to-one with the number of printing areas 230. The number of fixing areas 170 and the number of printing areas 230 of the present utility model can be specifically determined according to actual situations, such as 1, 2, 5, 10, 20, 50, etc. In this embodiment, 10 is taken as an example for illustration. The scope of the fixing area 170 and the scope of the printing area 230 described in the present utility model refer to the scope where the base 400 of the high-power triode is located as the corresponding scope of the fixing area 170 and the printing area 230 when the jig is working. The printing holes 210 of the present utility model correspond to the mounting area 420 of the base 400 of the high-power triode, so that the solder paste can be accurately printed on the mounting area 420, and the thickness of the solder paste can be controlled by the thickness of the cover plate 200 or the depth of the printing holes 210.

[0054] The fixing plate 100 is provided with a plate body 110 and fixing bolts 120 for fixing the base 400 of the high-power triode. The fixing bolts 120 are detachably assembled to the plate body 110. The plate body 110 is provided with pin holes 130 for receiving the pins 410 of the base 400 of the high-power triode and fixing holes 140. The positions of the pin holes 130 correspond to the positions of the pins 410 of the base 400 of the high-power triode, and the positions of the fixing holes 140 correspond to the positions of the assembly holes 430 of the base 400 of the high-power triode. The fixing bolts 120 are detachably assembled to the fixing holes 140, such as Figure 8 and Figure 9 , where Figure 8 the dotted area in is the fixing area 170.

[0055] It should be noted that the fixing bolt 120 of the present utility model can clamp and fix the high-power triode base 400 through the fixing hole 140, or directly insert the fixing bolt 120 into the assembly hole 430 of the high-power triode base 400, and the high-power triode base 400 is integrally fixed through the two fixing bolts 120 and the pin holes 130, which is determined according to the actual situation.

[0056] Each fixing area 170 is provided with a pair of fixing bolts 120, a pair of fixing holes 140 and a plurality of pin holes 130.

[0057] The cover plate 200 is further provided with a receiving hole 220 matching the fixing bolt 120, and the receiving hole 220 is detachably assembled with the fixing bolt 120; each printing area 230 is provided with a printing hole 210 and a pair of receiving holes 220, such as Figure 10 and Figure 11 where Figure 10 the dotted area in is the printing area 230.

[0058] When the jig is working, the pins 410 of the high-power triode base 400 are respectively inserted into the pin holes 130, the fixing bolts 120 are inserted into the assembly holes 430 of the high-power triode base 400 and assembled with the fixing holes 140, the high-power triode base 400 is fixed to the fixing plate 100, the cover plate 200 is buckled on the upper surface of the fixing plate 100, the fixing bolts 120 extend into the receiving holes 220, and the mounting area 420 of the high-power triode base 400 is located directly below the printing hole 210.

[0059] The using method of the jig for solder paste printing of the high-power triode base of the present utility model is as follows: clamp the high-power triode base 400 with the fixing bolt 120 through the fixing hole 140 or insert the assembly hole 430 of the high-power triode base 400 into the fixing bolt 120 to fix the high-power triode base 400 on the fixing plate 100, then buckle the cover plate 200, insert the fixing bolt 120 into the receiving hole 220 to position and fix the cover plate 200, then apply the solder paste into the printing hole 210, and then scrape off the excess solder paste with a squeegee, so as to realize the solder paste printing of the mounting area 420 of the high-power triode base 400.

[0060] It should be noted that when the fixing plate 100 and the cover plate 200 of the present utility model are correspondingly provided with a plurality of fixing areas 170 and printing areas 230, each time only need to quickly apply the solder paste into the printing hole 210, then the printing can be quickly completed. Compared with the prior art's point-by-point injection method, the working efficiency can be greatly improved. The position of the pin holes 130 of the present utility model corresponding to the positions of the pins 410 of the high-power triode base 400 means that the position where the high-power triode base 400 can be directly inserted into the pin holes 130 is the position corresponding to the positions of the pins 410 of the high-power triode base 400.

[0061] The fixture for solder paste printing on the base of a high-power triode can flatly fix the base 400 of the high-power triode through the fixing plate 100, accurately print solder paste on the mounting area 420 of the base 400 of the high-power triode through the cover plate 200, and the thickness of the solder paste can be accurately controlled, and the working efficiency can also be improved.

[0062] Embodiment 2

[0063] A fixture for solder paste printing on the base of a high-power triode, having the same other features as in Embodiment 1, further having the following technical features: The plate body 110 is further provided with a receiving groove 150 that matches the contour of the base 400 of the high-power triode. The pin holes 130 are located inside the receiving groove 150. The space between the receiving groove 150 and the lower surface of the cover plate 200 serves as a receiving space, as Figures 12 to 14 .

[0064] In this embodiment, the receiving groove 150 can further fix the base 400 of the high-power triode, and the base 400 of the high-power triode is located inside the receiving groove 150, so that the fixing plate 100 and the cover plate 200 are closely attached to each other, further preventing the cover plate 200 from moving and improving the printing accuracy.

[0065] The utility model is further provided with a stripping plate 300 for separating the base 400 of the high-power triode after printing. The stripping plate 300 is detachably inserted directly below the fixing plate 100.

[0066] The stripping plate 300 is integrally connected with a plug post 310, as Figure 15 ; the plate body 110 is further provided with a stripping hole 160, the stripping hole 160 is located inside the receiving groove 150, and the plug post 310 and the stripping hole 160 are detachably assembled. In the fixing plate 100, the fixing areas 170 are distributed in a matrix; in the cover plate 200, the printing areas 230 are distributed in a matrix.

[0067] It should be noted that after printing in this embodiment, the stripping plate 300 is installed directly below the fixing plate 100, so that the plug post 310 is inserted into the inside of the receiving groove 150, thereby ejecting the base 400 of the high-power triode after printing, as Figure 16 , improving the disassembly speed of the base 400 of the high-power triode.

[0068] Compared with Embodiment 1, this embodiment further improves the printing accuracy and working efficiency.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. A jig for printing solder paste on the base of a high-power transistor, characterized in that: A fixing plate and a cover plate are provided, and the cover plate is detachably buckled on the top of the fixing plate; The fixing plate is provided with at least one fixing area for fixing the base of the high-power triode, and the cover plate is provided with at least one printing area matching the fixing area; An accommodation space for accommodating a high-power triode base is provided between the fixing area and the printing area; The fixing area is provided with a printing hole for printing solder paste. When the cover plate is buckled on top of the fixing plate, the printing hole is located directly above the accommodating space, and the printing hole is located directly above the mounting area of ​​the high-power transistor base.

2. The jig for printing solder paste on the base of a high-power transistor according to claim 1, characterized in that: The number of the fixed areas corresponds to the number of the printing areas.

3. The jig for printing solder paste on the base of a high-power transistor according to claim 2, characterized in that: The fixing plate is provided with a plate body and a fixing bolt for fixing the base of the high-power triode, and the fixing bolt is detachably assembled on the plate body; The plate body is provided with a pin hole and a fixing hole for accommodating the pin of the high-power transistor base. The position of the pin hole corresponds to the pin position of the high-power transistor base, the position of the fixing hole corresponds to the assembly hole position of the high-power transistor base, and the fixing bolt can be detachably assembled in the fixing hole.

4. The jig for printing solder paste on the base of a high-power transistor according to claim 3 is characterized in that: Each fixing area is provided with a pair of fixing bolts, a pair of fixing holes and a plurality of pin holes.

5. The jig for printing solder paste on the base of a high-power transistor according to claim 4, characterized in that: The cover plate is also provided with a receiving hole matching the fixing bolt, and the receiving hole and the fixing bolt are detachably assembled; Each printing area is provided with one printing hole and a pair of receiving holes.

6. The jig for printing solder paste on the base of a high-power transistor according to claim 5, characterized in that: The plate body is also provided with a receiving groove matching the contour of the high-power triode base, the pin hole is located inside the receiving groove, and the receiving space is provided between the receiving groove and the lower surface of the cover plate.

7. The jig for printing solder paste on the base of a high-power transistor according to claim 6, characterized in that: A stripping plate for separating the printed high-power triode base is also provided, and the stripping plate is detachably inserted just below the fixing plate.

8. The jig for printing solder paste on the base of a high-power transistor according to claim 7, characterized in that: The stripping plate is integrally connected with a plug post; The plate body is also provided with a stripping hole, and the stripping hole is located inside the accommodating groove, and the plug column and the stripping hole are detachable and assembled.

9. The jig for printing solder paste on the base of a high-power transistor according to claim 8, characterized in that: In the fixing plate, the fixing areas are distributed in a matrix; In the cover plate, the printing areas are distributed in a matrix.

10. The jig for printing solder paste on the base of a high-power transistor according to claim 1, characterized in that: The thickness of the cover plate is less than or equal to the thickness of the solder paste. The thickness of the cover plate is defined as A, and 0.5 mm ≤ A ≤ 5 mm.

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