Case and electric device

Abstract

The utility model is suitable for the technical field of energy storage, and provides a case and an electric device. The case comprises a case body, a circuit board assembly, a first heat conduction piece and a second heat conduction piece. The circuit board assembly is arranged in the box body; the first heat conduction piece is arranged on the box body, a flow channel is formed in the first heat conduction piece and used for allowing a cooling medium to penetrate through, and the cooling medium is fluid; the second heat conduction piece is arranged in the box body, the second heat conduction piece is detachably or movably connected with the first heat conduction piece, and at least part of the second heat conduction piece is in heat conduction contact with the circuit board assembly; the second heat conduction piece is used for conducting heat emitted by the circuit board assembly to the first heat conduction piece. According to the case and the electric device provided by the embodiment of the invention, the heat dissipation efficiency is relatively high.

Description

Technical Field

[0001] This application belongs to the technical field of energy storage, and particularly relates to a chassis and an electrical device. Background Art

[0002] The secondary control system of a battery generally includes an energy storage inverter, an energy management system, a battery management system, a power control system, a safety monitoring system, etc. At least one cabinet is generally provided among or between the above systems. At least one chassis is provided in the cabinet. A plurality of circuit boards are generally provided in the chassis, and a plurality of electronic components are provided on the circuit boards. And some of the electronic components generate a large amount of heat. Currently, the heat dissipation efficiency of the chassis is low. Summary of the Utility Model

[0003] In view of the above problems, this application provides a chassis and an electrical device, aiming to improve the technical problem of low heat dissipation efficiency of the chassis.

[0004] In a first aspect, an embodiment of this application provides a chassis, including: a box body; a circuit board assembly disposed in the box body; a first heat conducting member disposed on the box body, a flow channel is provided in the first heat conducting member for a cooling medium to pass through, and the cooling medium is a fluid; and a second heat conducting member disposed in the box body, the second heat conducting member is detachably heat-conductively connected and / or movably heat-conductively connected to the first heat conducting member, and at least a part of the second heat conducting member is in heat-conductive contact with the circuit board assembly; the second heat conducting member is used to conduct the heat dissipated by the circuit board assembly to the first heat conducting member.

[0005] For the chassis provided by the embodiment of this application, a first heat conducting member is provided on the box body, and at the same time, a second heat conducting member detachably connected or movably connected to the first heat conducting member is provided in the box body, and the second heat conducting member is in heat-conductive contact with the circuit board assembly. A flow channel is provided in the first heat conducting member for a cooling medium to pass through, so that the circuit board assembly in the chassis can dissipate heat by means of the cooling medium. Since the cooling medium is a fluid, it has a higher thermal conductivity and specific heat capacity than a gas, can transfer and store heat more effectively, can carry more heat per unit volume, and at the same time, the convective heat release coefficient of the cooling medium is much larger than that of a gas. By using the chassis provided by the embodiment of this application, compared with the chassis with an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher, and the volume occupied by the heat dissipation structure can be smaller, which is beneficial to the miniaturization design of the chassis.

[0006] In addition, the first heat conducting member in the chassis provided in the embodiments of the present application is arranged on the box body and is spaced from the circuit board assembly. The circuit board assembly exchanges heat with the first heat conducting member through the second heat conducting member that is detachably heat connected and / or movably heat connected to the first heat conducting member. In this way, compared with the related art solution of directly installing the liquid cooling plate on the circuit board assembly, it can be ensured that only at least part of the second heat conducting member in the first heat conducting member and the second heat conducting member in contact with the circuit board assembly for heat conduction, so that the heat conducting member occupies a smaller space of the circuit board assembly and is not likely to have an adverse impact on the structural stability and vibration stability of the circuit board assembly, achieving multiple benefits at the same time. Among them, the detachable heat connection and / or movable heat connection between the second heat conducting member and the first heat conducting member can also make the heat conduction contact between the circuit board assembly and the second heat conducting member more convenient to implement, and at the same time facilitate the maintenance and replacement of the circuit board assembly and the second heat conducting member.

[0007] In some embodiments, the second heat conducting member is fixedly connected to the circuit board assembly, and the second heat conducting member is slidably connected to the first heat conducting member along a first direction, and the first direction is parallel to the board surface of the circuit board assembly. In this embodiment, the circuit board assembly can be inserted into the box body through the second heat conducting member to fix the position of the circuit board assembly, which is convenient for the disassembly and installation of the circuit board assembly. At the same time, a certain contact area can be provided between the circuit board assembly and the second heat conducting member, and between the second heat conducting member and the first heat conducting member to achieve good heat conduction.

[0008] In some embodiments, a groove extending along the first direction is provided on the first heat conducting member, and the notch of the groove faces the second heat conducting member. The second heat conducting member has a sliding portion, and the sliding portion is slidably engaged with the groove. By adopting the solution provided in this embodiment, the second heat conducting member is slidably connected to the first heat conducting member through the sliding portion and the groove. Compared with the solution in which the second heat conducting member is slidably connected through structures such as a slide rail and a slider, the structure of the second heat conducting member and the first heat conducting member can be made compact, occupying a smaller space, and facilitating the miniaturization design of the chassis.

[0009] In some embodiments, the second heat conducting member includes: a first heat conducting portion located on one side of the circuit board assembly and in thermal contact with the circuit board assembly; and a second heat conducting portion disposed between the circuit board assembly and the first heat conducting member. The second heat conducting portion is thermally connected to the first heat conducting portion and fixedly connected to the circuit board assembly. The second heat conducting portion is slidably connected to the first heat conducting member through a sliding portion; the second heat conducting portion is configured to conduct the heat absorbed by the first heat conducting portion to the first heat conducting member. By adopting the solution provided in this embodiment, the second heat conducting member can be at least divided into two parts (the first heat conducting portion and the second heat conducting portion), so that different regions of the circuit board assembly are in contact or connected with different parts of the second heat conducting member in different ways, so as to achieve the purpose that the circuit board assembly is both in thermal contact with and fixedly connected to the second heat conducting member. In this way, at least part of the first heat conducting member, at least part of the second heat conducting member (the second heat conducting portion), and the circuit board assembly can be located in the same vertical direction, making the structures of the first heat conducting member, the second heat conducting member, and the circuit board assembly compact, occupying less space, and facilitating the miniaturization design of the chassis.

[0010] In some embodiments, a first cavity is provided in the first heat conducting portion, and a second cavity is provided in the second heat conducting portion. The second cavity is communicated with the first cavity to form a receiving cavity, and a phase change medium is provided in the receiving cavity. By adopting the solution provided in this embodiment, the phase change medium is used to cool the circuit board assembly, which has the advantages of high energy storage density, good temperature stability, long cycle life, environmental protection and energy saving, etc., and can provide a good heat dissipation environment for the circuit board assembly running at high speed.

[0011] In some embodiments, the sliding portion is provided on the side of the second heat conducting portion away from the first heat conducting portion, and a third cavity is provided in the sliding portion. The third cavity is communicated with the second cavity. By adopting the solution provided in this embodiment, the phase change medium can flow into the third cavity. In this way, when the phase change medium undergoes a phase change in the third cavity, heat can be conducted to the first heat conducting member through the sliding portion, so as to shorten the distance of the heat transfer path between the second heat conducting member and the first heat conducting member, and can improve the heat conduction rate and the cooling rate of the circuit board assembly to a certain extent.

[0012] In some embodiments, the first cavity includes a plurality of microchannels, the plurality of microchannels are arranged at intervals, and each microchannel is communicated with the second cavity. By adopting the solution provided in this embodiment, the phase change medium can absorb a large amount of latent heat during the phase change process, while the microchannels can provide an efficient heat transfer path. Combining the two can achieve rapid heat transfer and effective heat management, and significantly improve the heat dissipation efficiency. In addition, the structure of the microchannels is compact and occupies little space. In this way, after the microchannels are combined with the phase change medium, efficient heat management functions can be realized in a limited space, which is convenient for the miniaturization design of the chassis.

[0013] In some embodiments, the cross-sectional area of the microchannel is less than or equal to 4 mm2 。

[0014] The microchannel is arranged in the setting manner provided by this embodiment, with small volume, compact structure and small occupied space. After the microchannel is combined with the phase change medium, efficient thermal management functions can be realized within a limited space, which is convenient for the miniaturized design of the chassis.

[0015] In some embodiments, the circuit board assembly includes: a circuit board; a first electronic component; and a second electronic component, the heating power of the second electronic component being greater than that of the first electronic component; a first heat conducting part is in heat conducting contact with the second electronic component. In this embodiment, the first heat conducting part is in heat conducting contact with the electronic component with a higher heating power in the circuit board assembly (i.e., the second electronic component), so that the volume of the first heat conducting part does not need to be set too large, and the electronic component with a higher heating power in the circuit board assembly can dissipate heat in time, so that the overall temperature of the circuit board assembly is not likely to be too high.

[0016] In some embodiments, the first heat conducting part includes: a contact part in heat conducting contact with the second electronic component; and a connecting part connecting the contact part and the second heat conducting part; the first electronic component is located between the contact part and the second heat conducting part, and the thickness of the first electronic component is greater than that of the second electronic component, and the connecting part is arranged to avoid the first electronic component. By adopting the solution provided by this embodiment, the arrangement of the first heat conducting part does not affect the installation of the first electronic component on the circuit board assembly, and at the same time, the thickness of the combined structure of the first heat conducting part and the circuit board assembly is not too large, which is convenient for the miniaturized design of the chassis.

[0017] In some embodiments, the connecting part includes: a vertical part located on one side of the first electronic component and spaced from the contact part; and an inclined part connecting the contact part and the vertical part; the inclined part and the vertical part enclose an installation space for installing at least part of the first electronic component. By adopting the structure provided by this embodiment, the structure of the connecting part is simple and convenient for preparation.

[0018] In some embodiments, at least one of the vertical part, the inclined part and the contact part is a plate-shaped part. By adopting the solution provided by this embodiment, at least part of the thickness of the first heat conducting part can be made smaller, the volume of the first heat conducting part can be made smaller, the occupied space is reduced, and it is convenient for the miniaturized design of the chassis.

[0019] In some embodiments, the first heat conducting part is an integrally formed structure. By adopting the solution provided by this embodiment, the connection between the various parts of the first heat conducting part is stable and convenient for preparation.

[0020] In some embodiments, the first heat conducting part is a heat pipe. The first heat conducting part adopts a heat pipe, which has high heat conduction efficiency and is convenient for obtaining materials.

[0021] In some embodiments, the second heat conducting member is an integrally formed structure. By adopting the solution provided in this embodiment, the connection between various parts in the second heat conducting member can be made stable, and it is also convenient for preparation.

[0022] In some embodiments, the first heat conducting member includes: a third heat conducting portion provided with a first channel for communicating with an external liquid supply pipeline; there are two third heat conducting portions which are arranged at intervals; and a fourth heat conducting portion connecting the two third heat conducting portions, and at least a part of the fourth heat conducting portion protrudes towards the circuit board assembly. A second channel is provided in the fourth heat conducting portion, and the second channel communicates with the two first channels to form a flow channel; the second heat conducting member is connected to the fourth heat conducting portion, and a groove is provided in the fourth heat conducting portion. By adopting the solution provided in this embodiment, the structure of the first heat conducting member is simple and convenient for assembly.

[0023] In some embodiments, in the same fourth heat conducting portion, there are two second channels which are respectively arranged on both sides of the groove. By adopting the solution provided in this embodiment, compared with only one second channel provided in the same fourth heat conducting portion, the area of the heat exchange region between the cooling medium in the second channel and the second heat conducting member can be increased to a certain extent, the heat exchange rate can be improved, and thus the heat dissipation rate of the circuit board assembly can be improved.

[0024] In some embodiments, in the first heat conducting member, the thermal conductivity of the part between the second channel and the groove is greater than or equal to the thermal conductivity of other parts. When the thermal conductivity of the part between the second channel and the groove is greater than that of other parts, the heat exchange rate between the phase change medium and the first heat conducting member, and between the first heat conducting member and the cooling medium can be improved to a certain extent, and thus the heat dissipation efficiency of the circuit board assembly can be improved to a certain extent.

[0025] In some embodiments, both the third heat conducting portion and the fourth heat conducting portion are long strip portions, and the length direction of the third heat conducting portion forms an angle with the length direction of the fourth heat conducting portion. By adopting the solution provided in this embodiment, the structures of the third heat conducting portion and the fourth heat conducting portion can be made simple, and it is convenient for preparation and installation.

[0026] In some embodiments, a heat conducting layer is provided between the first heat conducting member and the second heat conducting member, and the thermal conductivity of the heat conducting layer is greater than the thermal conductivity of the first heat conducting member and greater than the thermal conductivity of the second heat conducting member. By adopting the solution provided in this embodiment, compared with the direct heat conducting contact between the first heat conducting member and the second heat conducting member, the heat exchange rate between the first heat conducting member and the second heat conducting accessory can be improved to a certain extent, and thus the heat dissipation efficiency of the circuit board assembly can be improved to a certain extent.

[0027] In some embodiments, through holes are provided on at least two opposite side walls of the cabinet body, and the through holes are used to connect the internal and external spaces of the cabinet body. By adopting the solution provided in this embodiment, it is convenient for the gas inside and outside the cabinet to convect through the through holes to condition the temperature inside the cabinet. In cooperation with the cooling medium, various heat exchange methods of the chassis can be realized, and the heat dissipation efficiency can be further improved.

[0028] In some embodiments, the cabinet body includes a first side wall and a second side wall arranged opposite to each other. Through holes are provided on both the first side wall and the second side wall. A first heat conducting member is arranged on the first side wall, and a third heat conducting member is provided on the second side wall. A third channel is provided inside the third heat conducting member, and the third channel is used for the cooling medium to pass through. By adopting the solution provided in this embodiment, the gas entering the cabinet body through the through hole can be cooled by the first heat conducting member or the third heat conducting member first and then enter the cabinet body. In this way, the cooling effect of the gas entering the cabinet body through the through hole can be better, which helps to quickly cool the circuit board assembly.

[0029] In some embodiments, there are multiple circuit board assemblies and multiple second heat conducting members respectively. The multiple second heat conducting members are arranged corresponding to the multiple circuit board assemblies, and the multiple second heat conducting members are thermally connected to the same first heat conducting member. By adopting the solution provided in this embodiment, multiple circuit board assemblies can share one first heat conducting member for heat dissipation. In this way, the number of first heat conducting members in the chassis can be reduced, the weight of the chassis and the design difficulty can be decreased.

[0030] In a second aspect, an electrical device provided by an embodiment of the present application includes the chassis according to any of the above solutions. The electrical device provided by the embodiment of the present application includes the above chassis and has a relatively high heat dissipation efficiency.

[0031] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the specific embodiments of the present application are specifically given below. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. And in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0033] Figure 1 It is a schematic structural diagram of a cabinet provided by some embodiments of the present application, and the cabinet door is not shown in the figure;

[0034] Figure 2Schematic diagram of the structure of the chassis provided by some embodiments of the present application. Only one circuit board assembly is shown in the figure;

[0035] Figure 3 For Figure 2 Front view structure schematic diagram of the shown chassis;

[0036] Figure 4 For Figure 3 Cross-sectional structure schematic diagram in the A-A direction in

[0037] Figure 5 Schematic diagram of the assembly structure of the first heat-conducting member, the second heat-conducting member and the circuit board assembly in the chassis provided by some embodiments of the present application;

[0038] Figure 6 For Figure 5 Front view structure schematic diagram of the shown assembly structure;

[0039] Figure 7 For Figure 6 The fourth heat-conducting part, the second heat-conducting part and a part of the first heat-conducting part in Figure 6 Cross-sectional structure schematic diagram in the B-B direction in

[0040] Figure 8 For Figure 6 Cross-sectional structure schematic diagram of the first heat-conducting part in the shown chassis;

[0041] Figure 9 Schematic diagram of the assembly structure of the second heat-conducting member and the circuit board assembly in the chassis provided by some embodiments of the present application.

[0042] The reference numerals in the specific embodiments are as follows:

[0043] 1000, cabinet;

[0044] 100, cabinet body; 200, chassis;

[0045] 10, box body; 20, circuit board assembly; 30, first heat-conducting member; 30a, flow channel; 40, second heat-conducting member; 60, third heat-conducting member;

[0046] 11, through hole; 12, first side wall; 13, second side wall;

[0047] 21, circuit board; 22, first electronic component; 23, second electronic component;

[0048] 31, second channel; 32, groove; 33, third heat-conducting part; 34, first channel; 35, fourth heat-conducting part;

[0049] 41. Sliding part; 42. First heat-conducting part; 421. Contact part; 422. Connecting part; 4221. Vertical part; 4222. Inclined part; 4223. Installation space; 43. Second heat-conducting part; 44. First cavity; 441. Microchannel; 45. Second cavity; 46. Third cavity;

[0050] 61. Third channel;

[0051] X. First direction. Detailed implementation manners

[0052] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, so they are only examples and cannot be used to limit the protection scope of the present application.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0054] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, "a plurality" means more than two unless otherwise specifically defined.

[0055] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0056] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0057] In the description of the embodiments of the present application, the term "plurality" means two or more (including two). Similarly, "multiple groups" means two or more groups (including two groups), and "multiple pieces" means two or more pieces (including two pieces).

[0058] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application.

[0059] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0060] With the development of technology, power batteries are widely used in energy storage power systems such as hydraulic, thermal, wind, and solar power stations, electric transportation tools such as electric bicycles, electric motorcycles, and electric vehicles, as well as multiple fields such as military equipment and aerospace. Since the energy storage capacity of a single battery cell is relatively small, multiple battery cells are generally required in the same electrical device or energy storage system. However, due to factors such as the materials and manufacturing processes of the electrode components, there are often differences in internal resistance, capacity, voltage, etc. between different battery cells. Therefore, in actual applications, heat dissipation unevenness or overcharging and over-discharging are likely to occur in each battery cell. This is likely to lead to a shortened battery life. If the battery is in a severely overcharged state, there is also a risk of explosion.

[0061] To solve the above problems, a secondary control system for the battery is generally provided in the electrical device or energy storage system. The secondary control system for the battery generally includes an energy storage inverter, an energy management system, a battery management system, a power control system, a safety monitoring system, etc. At least one cabinet is generally provided among the above systems or between these systems. At least one chassis is provided in the cabinet, and multiple circuit boards are generally provided in the chassis, and multiple electronic components are provided on the circuit boards. And some of the electronic components generate a large amount of heat.

[0062] In order to ensure the stable performance and long service life of electronic components and circuit boards, a heat dissipation structure is generally provided on or inside the chassis. In related technologies, the above heat dissipation structure adopts an air-cooled structure, that is, in related technologies, the electronic components (such as control chips, etc.) and circuit boards in the chassis are cooled by air cooling. The above air-cooled structure generally includes the following two types: the first is natural convection; the second is forced convection by driving air through a fan. In both of the above solutions, the heat sink is fixed on the surface of the electronic components that need to dissipate heat on the circuit board through a thermal interface material (such as thermal conductive glue, etc.), and the heat on the electronic components is taken away through the convection of the heat sink and air. This technology (i.e., air-cooled heat dissipation) has at least the following problems: low heat transfer efficiency, large volume of the equipment (including the air-cooled structure and the chassis), high noise, small heat flux density of heat dissipation, insufficient heat transfer, etc. Among them, the reason for insufficient heat transfer is that the chassis needs to meet the requirements of electromagnetic compatibility (EMC), the opening rate of the chassis is not high, and the air intake volume is small.

[0063] With the development of society, the requirements for battery control and data processing are getting higher and higher, the functions of circuit boards and the electronic components on them are increasing, and they are gradually moving towards high performance and high heat flux density. This has led to a huge amount of heat generated by some electronic components, such as central processing unit (CPU) chips, field-programmable gate array (FPGA) chips, artificial intelligence (AI) chips, etc. If the temperature cannot be lowered in time during use, these electronic components will have problems such as performance degradation, shortened service life, and shutdown. For the above-mentioned electronic components with a large heat power density, the heat transfer coefficient of the conventional air-cooled structure cannot meet the heat dissipation requirements, and the air-cooled heat sink requires a sufficiently large volume and area to support. After the air-cooled heat sink is installed on the circuit board, it is often difficult for the circuit board to meet both the structural requirements and the vibration requirements at the same time.

[0064] To improve the above problems, or at least partially improve the above problems, an embodiment of the present application provides a chassis. A first heat conducting member is provided on the box body of the chassis. At the same time, a second heat conducting member detachably connected or movably connected to the first heat conducting member is provided inside the box body, and the second heat conducting member is in heat conducting contact with the circuit board assembly. A flow channel is provided inside the first heat conducting member for a cooling medium to pass through, so that the circuit board assembly in the chassis can dissipate heat by means of the cooling medium. Since the cooling medium has a higher thermal conductivity and specific heat capacity than gas, it can transfer and store heat more effectively, and can carry more heat per unit volume. At the same time, the convective heat release coefficient of the cooling medium is much larger than that of gas. By using the chassis provided by the embodiment of the present application, compared with the chassis with an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher, and the volume occupied by the heat dissipation structure can be smaller, which is beneficial to the miniaturization design of the chassis.

[0065] The chassis provided by the embodiment of the present application can be used in an electrical device with a chassis or various energy storage systems. The electrical device can be, but is not limited to, a cabinet, a computer system, a server, a power tool, a battery car, an electric vehicle, a ship, a spacecraft, etc. Among them, the spacecraft can include an airplane, a rocket, a space shuttle, a spaceship, etc. The energy storage system can include an energy storage cabinet, an energy storage valve tower, etc.

[0066] For the convenience of description in the following embodiments, a cabinet, which is an electrical device provided by an embodiment of the present application, is taken as an example for description.

[0067] Figure 1 It is a schematic structural diagram of a cabinet provided by some embodiments of the present application. The cabinet door is not shown in the figure. As Figure 1 shown, the cabinet 1000 includes a cabinet body 100 and a chassis 200 disposed inside the cabinet body 100. Among them, the cabinet body 100 is used to accommodate the chassis 200 and other electrical or electronic devices, and generally has a plurality of side plates, at least one side is open, or at least one side plate can be disassembled or opened and closed. The above-mentioned openable or detachable side plate is generally used as the cabinet door of the cabinet body, which is not shown in the figure. The above-mentioned side plate is usually made of cold-rolled steel plate or alloy, and can also be made of other materials (such as plastic, composite material, etc.).

[0068] Figure 2 It is a schematic structural diagram of a chassis provided by some embodiments of the present application. As Figure 2 shown, the chassis 200 generally includes a box body 10 and a circuit board assembly 20 disposed inside the box body 10. In addition, the chassis 200 may further include other structures according to the usage requirements, such as a heat dissipation structure, an electric control structure, etc., which can be determined specifically according to the usage requirements.

[0069] Among them, the box body 10 is generally also surrounded by multiple side plates and has at least one opening. Each side plate is usually made of a metal plate and has good protection performance, and can also be made of other materials (such as plastics, composite materials, etc.). In addition, in order to ensure the structural stability and vibration requirements of the chassis 200, in addition to the side plates, a support structure is generally provided inside the box body 10. For example, support columns such as square tubes are provided at the connection of two adjacent side plates, and two adjacent support columns are connected by welding, plugging, etc.

[0070] Generally, there are multiple circuit board assemblies 20. Each circuit board assembly 20 includes a circuit board and electronic components arranged on the circuit board. The number and functions of the electronic components on each circuit board assembly 20 can be determined according to the usage needs. The circuit board assembly 20 can be inserted into the box body 10 or fixedly connected to the box body 10 by bolts, etc., which can be specifically determined according to the usage needs.

[0071] It can be understood that Figure 2 only one circuit board assembly 20 is shown in. According to the usage needs, other circuit board assemblies 20 can also be provided inside the box body 10. The other circuit board assemblies 20 can be arranged parallel to the shown circuit board assembly 20, perpendicular to the shown circuit board assembly 20, or at other included angles.

[0072] Figure 3 For Figure 2 the front view structural schematic diagram of the shown chassis; Figure 4 For Figure 3 the sectional structural schematic diagram along the A-A direction in. Please refer to Figures 2 to 4 together. An embodiment of the present application provides a chassis 200. The chassis 200 includes a box body 10, a circuit board assembly 20, a first heat conducting member 30, and a second heat conducting member 40. Among them, the circuit board assembly 20 is arranged inside the box body 10. The first heat conducting member 30 is arranged on the box body 10. A flow channel 30a is arranged inside the first heat conducting member 30. The flow channel 30a is used for a cooling medium to pass through. The second heat conducting member 40 is arranged inside the box body 10, and the second heat conducting member 40 is detachably heat-conductively connected and / or movably heat-conductively connected to the first heat conducting member 30. At least a part of the second heat conducting member 40 is in heat-conductive contact with the circuit board assembly 20. The second heat conducting member 40 is used for conducting the heat dissipated by the circuit board assembly 20 to the first heat conducting member 30.

[0073] The cooling medium is a liquid substance used in the cooling process. It reduces the temperature of the equipment by absorbing heat and carrying it away from the heat source. The above cooling medium can be water, brine, liquid nitrogen, etc., depending on the specific needs of use. Compared with gas, the cooling medium usually has higher thermal conductivity and specific heat capacity, and can transfer and store heat more effectively; secondly, the cooling medium has a higher density, so it can carry more heat per unit volume; thirdly, the convective heat release coefficient of the cooling medium is much larger than that of the gas, which is conducive to the rapid dissipation of heat.

[0074] The first heat-conducting member 30 is a device or component for transferring heat through a cooling medium, and can be composed of one component or multiple components, depending on the specific use needs. In order to ensure that the first heat-conducting member 30 has a high thermal conductivity, the solid part of the first heat-conducting member 30 (i.e., the part other than the flow channel 30a) can be made of a material with a high thermal conductivity, such as metal (silver, copper, aluminum, etc.) and non-metal with high thermal conductivity (such as graphite, carbon fiber, ceramic, etc.). The above-mentioned thermal conductivity, also known as thermal conductivity, or thermal conductivity, refers to the ability of a material to directly conduct heat. Thermal conductivity is defined as the amount of heat directly conducted by a material of unit cross-section and length under a unit temperature difference and per unit time.

[0075] The first heat-conducting member 30 can be integrally formed on the box body 10, or fixed to the box body 10 by welding, bonding, plugging, etc., can be completely arranged on the inner wall of the box body 10, or can be partially located on the inner wall of the box body 10 and the other part on the outer wall of the box body 10, or outside the box body 10, depending on the specific usage requirements.

[0076] The cooling medium being a fluid means that the cooling medium is a medium that can be used for cooling and can flow, and can be a liquid, a gas-liquid mixture, a liquid-solid mixture, and the like.

[0077] The flow channel 30a is a cavity or channel provided in the first heat conducting member 30 for the cooling medium to pass through. The flow channel 30a is a structure with both ends open, and both ends of the flow channel 30a can be connected to an external cooling medium supply system, so that the cooling medium can flow and take away the heat absorbed by the first heat conducting member 30 in the process of passing through the flow channel 30a, thereby achieving cooling.

[0078] The second heat-conducting member 40 is a device or component for transferring heat, and can be composed of one component or multiple components, depending on the use requirements. In order to ensure that the heat-conducting efficiency of the second heat-conducting member 40 is high, the second heat-conducting member 40 can be made of a material with a high thermal conductivity, such as metal (silver, copper, aluminum, etc.), non-metal with high thermal conductivity (such as graphite, carbon fiber, ceramic with high thermal conductivity, etc.).

[0079] The second heat conducting member 40 can be detachably mounted on the first heat conducting member 30 by means of bolt connection, plug connection, sliding connection, etc., or can be movably connected to the first heat conducting member 30 by means of sliding connection, rotational connection, etc., which can be specifically determined according to the usage requirements. Among them, detachable means that the second heat conducting member 40 can be mounted on the first heat conducting member 30 without damaging its own structure, and can also be removed from the first heat conducting member 30 without damaging its own structure. Movable heat conduction connection means that the position of the second heat conducting member 40 on the first heat conducting member 30 or the included angle between the two can be changed, and heat transfer can be achieved between the two. It can be understood that in some cases, such as when the second heat conducting member 40 is slidably arranged on the first heat conducting member 30, the second heat conducting member 40 can also be detached from the first heat conducting member 30. At this time, the second heat conducting member 40 can be detachably connected to the first heat conducting member 30 and can also be movably connected to the first heat conducting member 30.

[0080] Both heat conduction connection and heat conduction contact refer to the process in which heat is transferred through direct contact between two or more objects. This process involves the transfer of heat from a higher temperature region of one object to a lower temperature region of another object until thermal equilibrium or a steady state is reached. At least part of the second heat conducting member 40 being in heat conduction contact with the circuit board assembly 20 can be that at least part of the second heat conducting member 40 is in heat conduction contact with the electronic components with heat generation power on the circuit board assembly 20, or at least part of the second heat conducting member 40 is in heat conduction contact with the circuit board 21 of the circuit board assembly 20, or a part of the second heat conducting member 40 is in heat conduction contact with the electronic components with heat generation power on the circuit board assembly 20 and a part is in heat conduction contact with the circuit board 21 of the circuit board assembly 20, which can be specifically determined according to the usage requirements.

[0081] The heat dissipation principle of the chassis 200 provided by the embodiments of the present application is as follows:

[0082] During use, at least part of the heat dissipated by the circuit board assembly 20 is conducted to the second heat conducting member 40 by means of heat conduction contact, and then the heat is conducted to the first heat conducting member 30 through the second heat conducting member 40, and then conducted to the outside of the box body 10 through the cooling medium in the first heat conducting member 30 to achieve heat dissipation of the circuit board assembly 20.

[0083] Since there are various installation methods for the second heat conducting member 40 and the first heat conducting member 30, the assembly method of the chassis 200 provided by the embodiments of the present application will be described by way of example:

[0084] When the second heat conducting member 40 is detachably mounted on the first heat conducting member 30, the second heat conducting member 40 can be first mounted on the circuit board 21 assembly 20, and then the combined structure of the second heat conducting member 40 and the circuit board 21 assembly 20 can be mounted on the first heat conducting member 30 so that the second heat conducting member 40 is in heat conduction connection with the first heat conducting member 30.

[0085] When the second heat conducting member 40 is movably disposed on the first heat conducting member 30, the position of the second heat conducting member 40 can be adjusted to a position convenient for installing the circuit board 21 assembly 20 first, and then the circuit board 21 assembly 20 can be fixed to the second heat conducting member 40. After that, the position of the second heat conducting member 40 is adjusted again to drive the circuit board 21 assembly 20 to move to a preset installation position. During this period, the second heat conducting member 40 can always be in heat conducting connection with the first heat conducting member 30, or after the circuit board 21 assembly 20 moves to the preset installation position, the second heat conducting member 40 moves to a position in heat conducting connection with the first heat conducting member 30.

[0086] When the second heat conducting member 40 is both detachably connected and movably connected to the first heat conducting member 30, the second heat conducting member 40 can be installed on the circuit board 21 assembly 20 first, and then the combined structure of the second heat conducting member 40 and the circuit board 21 assembly 20 can be installed on the first heat conducting member 30. After that, by adjusting the position of the second heat conducting member 40 on the first heat conducting member 30 or the included angle with the first heat conducting member 30, the circuit board 21 assembly 20 is finally moved to a preset installation position. During this period, the second heat conducting member 40 can always be in heat conducting connection with the first heat conducting member 30, or after the circuit board 21 assembly 20 moves to the preset installation position, the second heat conducting member 40 moves to a position in heat conducting connection with the first heat conducting member 30.

[0087] In the chassis 200 provided by the embodiment of the present application, a first heat conducting member 30 is provided on the box body 10, and at the same time, a second heat conducting member 40 detachably connected or movably connected to the first heat conducting member 30 is provided in the box body 10, and the second heat conducting member 40 is in heat conducting contact with the circuit board assembly 20. A flow channel 30a is provided in the first heat conducting member 30 through which a cooling medium can pass, so that the circuit board assembly 20 in the chassis 200 can dissipate heat by means of the cooling medium. Since the cooling medium is a fluid, it has a higher thermal conductivity and specific heat capacity than gas, can transfer and store heat more effectively, can carry more heat per unit volume, and at the same time, the convective heat transfer coefficient of the cooling medium is much larger than that of gas. By using the chassis 200 provided by the embodiment of the present application, compared with the chassis 200 with an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher, the volume occupied by the heat dissipation structure can be smaller, which is beneficial to the miniaturization design of the chassis 200.

[0088] In addition, the first heat conducting member 30 in the chassis 200 provided in the embodiments of the present application is arranged on the box body 10 and is spaced from the circuit board assembly 20. Heat exchange is achieved between the circuit board assembly 20 and the first heat conducting member 30 through the second heat conducting member 40 that is detachably heat connected and / or movably heat connected to the first heat conducting member 30. In this way, compared with the related art solution of directly installing the liquid cooling plate on the circuit board assembly 20, only at least part of the second heat conducting member 40 in the first heat conducting member 30 and the second heat conducting member 40 for heat dissipation needs to be in heat contact with the circuit board assembly 20, which can make the heat conducting member occupy a smaller space on the circuit board assembly 20 and is not likely to have an adverse impact on the structural stability and vibration stability of the circuit board assembly 20, achieving multiple benefits. Among them, the detachable heat connection and / or movable heat connection between the second heat conducting member 40 and the first heat conducting member 30 can also make the heat contact between the circuit board assembly 20 and the second heat conducting member 40 more convenient to implement, and at the same time facilitate the maintenance and replacement of the circuit board assembly 20 and the second heat conducting member 40. As Figure 4 shown, in some embodiments, the second heat conducting member 40 is fixedly connected to the circuit board assembly 20, and the second heat conducting member 40 is slidably connected to the first heat conducting member 30 along the first direction X. The first direction X is parallel to the board surface of the circuit board assembly 20.

[0089] The fixed connection means that the second heat conducting member 40 and the circuit board assembly 20 are connected to each other, and their relative positions will not change after connection. The above fixed connection can be achieved by means such as gluing, welding, bolt connection, etc., and can be determined according to actual use needs.

[0090] The box body 10 is generally in a cuboid structure. The first direction X can be the length direction of the box body 10, or the width direction of the box body 10, or other directions that form an angle with the length direction or width direction of the box body 10, and can be determined according to actual use needs.

[0091] Sliding means that the second heat conducting member 40 can move relative to the first heat conducting member 30, and the contact surface between the two remains unchanged during the movement. The second heat conducting member 40 is slidably connected to the first heat conducting member 30 along the first direction means that a sliding structure is provided between the second heat conducting member 40 and the first heat conducting member 30 along the first direction. This sliding structure generally includes two parts, one part is arranged on the first heat conducting member 30, and the other part is arranged on the second heat conducting member 40, and these two parts are slidably connected. The specific structures of the above two parts can be determined according to actual use needs. For example, one part can be a slide rail and the other part can be a slider; it can also be that one part is a slideway and the other part is a slider embedded in the slideway, etc.

[0092] In this embodiment, the circuit board assembly 20 can be inserted into the box body 10 through the second heat conducting member 40 to fix the position of the circuit board assembly 20, which facilitates the disassembly and installation of the circuit board assembly 20. At the same time, a certain contact area can be provided between the circuit board assembly 20 and the second heat conducting member 40, and between the second heat conducting member 40 and the first heat conducting member 30 to achieve good heat conduction.

[0093] Figure 5 FIG. 4 is a schematic structural diagram of an assembly structure of a first heat conducting member, a second heat conducting member and a circuit board assembly in a chassis provided in some embodiments of the present application; Figure 6 is Figure 5 a front view structural diagram of the shown assembly structure;

[0094] Figure 7 is along Figure 6 a sectional structural diagram taken along the B-B direction in FIG. 4. Please also refer to Figures 5 to 7 In some embodiments, a groove 32 extending along the first direction X is provided on the first heat conducting member 30. The notch of the groove 32 faces the second heat conducting member 40. The second heat conducting member 40 has a sliding portion 41, and the sliding portion 41 is slidably engaged with the groove 32. That is, the second heat conducting member 40 is slidably connected to the first heat conducting member 30 through the sliding portion 41 and the groove 32.

[0095] The groove 32 in this embodiment can be formed by removing a part of the material of the first heat conducting member 30 when the first heat conducting member 30 is prepared, or can be formed together with the first heat conducting member 30 by an integral molding process when the first heat conducting member 30 is prepared. It can also be formed by adding a solid groove on the surface of the first heat conducting member 30 facing the second heat conducting member 40 after the first heat conducting member 30 is prepared, so that the solid groove forms the above-mentioned groove 32.

[0096] The sliding portion 41 can be integrally formed on the second heat conducting member 40, or can be provided independently of the second heat conducting member 40. That is, after the sliding portion 41 and the second heat conducting member 40 are respectively prepared, they are assembled together.

[0097] The shape of the cross section of the sliding portion 41 can be the same as or similar to the shape of the cross section of the groove 32. For example, when the cross section of the groove 32 is rectangular, the shape of the sliding portion 41 can be rectangular or T-shaped, etc., as long as it can be slidably engaged with the groove 32.

[0098] Adopting the solution provided in this embodiment, the second heat conducting member 40 is slidably connected to the first heat conducting member 30 through the sliding portion 41 and the groove 32. Compared with the second heat conducting member 40 being slidably connected through structures such as a slide rail and a slider, the structure of the second heat conducting member 40 and the first heat conducting member 30 can be made more compact, occupying less space, which is convenient for the miniaturization design of the chassis 200.

[0099] Such as Figure 6 andFigure 7 As shown, in some embodiments, the second heat conducting member 40 includes a first heat conducting portion 42 and a second heat conducting portion 43. The first heat conducting portion 42 is located on one side of the circuit board assembly 20 and is in heat conducting contact with the circuit board assembly 20. The second heat conducting portion 43 is located between the circuit board assembly 20 and the first heat conducting member 30. The second heat conducting portion 43 is in heat conducting connection with the first heat conducting portion 42. And the second heat conducting portion 43 is fixedly connected to the circuit board assembly 20. The sliding portion 41 is provided on the second heat conducting portion 43. The second heat conducting portion 43 is slidably connected to the first heat conducting member 30 through the sliding portion 41. The second heat conducting portion 43 is configured to conduct the heat absorbed by the first heat conducting portion 30 to the first heat conducting member 30.

[0100] The first heat conducting portion 42 is a component for surface contact with the heat dissipating parts (such as the circuit board 21 and the electronic components with high heat generation power) in the circuit board assembly 20, and can be composed of one or more parts.

[0101] The second heat conducting portion 43 is a component for conducting the heat absorbed by the first heat conducting portion 42 to the first heat conducting member 30, and can be composed of one or more parts. The material, structure, etc. of the second heat conducting portion 43 can be the same as or different from those of the first heat conducting portion 42, and can be determined according to actual use needs.

[0102] The sliding portion 41 can be integrally formed on the second heat conducting portion 43, or can be separately prepared and then installed on the second heat conducting portion 43.

[0103] Heat conducting connection means that the second heat conducting portion 43 is connected to the first heat conducting portion 42, and there is a heat conducting path between the two. The heat on the first heat conducting portion 42 can be conducted to the second heat conducting portion 43 through this heat conducting path.

[0104] By adopting the solution provided in this embodiment, the second heat conducting member 40 can be at least divided into two parts (the first heat conducting portion 42 and the second heat conducting portion 43), so that different regions of the circuit board assembly 20 are in contact or connected with different parts of the second heat conducting member 40 in different ways, so as to achieve the purpose that the circuit board assembly 20 is both in heat conducting contact with and fixedly connected to the second heat conducting member 40. In this way, at least part of the first heat conducting member 30, at least part of the second heat conducting member 40 (the second heat conducting portion 43), and the circuit board assembly 20 can be located in the same vertical direction, making the structures of the first heat conducting member 30, the second heat conducting member 40 and the circuit board assembly 20 compact, occupying less space, and facilitating the miniaturization design of the chassis 200.

[0105] As Figure 7 As shown, in some embodiments, a first cavity 44 is provided inside the first heat conducting portion 42. A second cavity 45 is provided inside the second heat conducting portion 43. The second cavity 45 communicates with the first cavity 44 to form a receiving cavity. A phase change medium is provided in the receiving cavity.

[0106] The first cavity 44 can be integrally formed within the first heat conducting portion 42 or can be obtained by reprocessing after the first heat conducting portion 42 is prepared, which can be determined according to actual usage needs.

[0107] The second cavity 45 can be integrally formed within the second heat conducting portion 43 or can be obtained by reprocessing after the second heat conducting portion 43 is prepared, which can be determined according to actual usage needs.

[0108] A phase change medium refers to a substance that can undergo a phase change (such as solid-liquid, liquid-gas, or solid-gas transformation) at a specific temperature and absorb or release a large amount of latent heat during this process. According to the type of phase change, phase change media can be classified into solid-liquid phase change materials, liquid-gas phase change materials, solid-gas phase change materials, etc.

[0109] The heat dissipation principle of the chassis 200 provided in this embodiment is as follows:

[0110] During use, the circuit board assembly 20 dissipates heat outward, and this heat is conducted to the first heat conducting portion 42 through thermal contact, causing the temperature of the first heat conducting portion 42 to rise. When this temperature is higher than the phase change temperature of the phase change medium, the form of the medium changes, such as the medium changing from a solid state to a liquid state or from a liquid state to a gaseous state, and heat is absorbed and stored during this period. After the form of the medium changes, the volume and flow pattern of the medium generally also change. For example, after changing from a liquid state to a gaseous state, the gaseous medium will flow from a place with a higher temperature to a place with a lower temperature, that is, from the first heat conducting portion 42 to the second heat conducting portion 43. After reaching the second heat conducting portion 43, since the second heat conducting portion 43 is in contact with the first heat conducting member 30 and the temperature is lower than that of the first heat conducting portion 42, and the temperature of the part closer to the first heat conducting member 30 is lower. When the medium flows to an area where the temperature is lower than the phase change temperature, the medium changes from a liquid state to a solid state or from a gaseous state to a liquid state, releasing the stored heat. The second heat conducting portion 43 receives this heat and exchanges heat with the first heat conducting member 30. After the medium undergoes a phase change again, its volume shrinks and it flows back to the first heat conducting portion 42, repeating the above operations to achieve heat conduction between the second heat conducting member 40 and the first heat conducting member 30 and cooling of the circuit board assembly 20.

[0111] Adopting the solution provided in this embodiment to cool the circuit board assembly 20 using a phase change medium has the advantages of high energy storage density, good temperature stability, long cycle life, environmental protection and energy saving, etc., and can provide a good heat dissipation environment for the circuit board assembly 20 operating at high speed.

[0112] As Figure 7 shown, in some embodiments, the sliding portion 41 is provided on the side of the second heat conducting portion 43 away from the first heat conducting portion 42, and a third cavity 46 is provided inside the sliding portion 41. The third cavity 46 is in communication with the second cavity 45.

[0113] The third cavity 46 can be integrally formed within the sliding portion 41 or can be obtained by reprocessing after the sliding portion 41 is fabricated, which can be determined according to actual usage requirements.

[0114] Adopting the solution provided by this embodiment enables the phase change medium to flow into the third cavity 46. In this way, when the phase change of the phase change medium occurs within the third cavity 46, heat can be conducted to the first heat conducting member 30 through the sliding portion 41, so as to shorten the distance of the heat transfer path between the second heat conducting member 40 and the first heat conducting member 30, and to a certain extent improve the heat conduction rate and the cooling rate of the circuit board assembly 20.

[0115] Figure 8 For Figure 6 the schematic cross-sectional structure view of the first heat conducting portion in the chassis shown. As Figure 8 shown, in some embodiments, the first cavity 44 includes a plurality of micro-channels 441. The plurality of micro-channels 441 are spaced apart, and each micro-channel 441 communicates with the second cavity 45.

[0116] The plurality of micro-channels 441 can be connected or spaced apart, which can be determined according to actual usage requirements. The cross-section of the micro-channel 441 refers to the section obtained by cutting the micro-channel 441 through a section perpendicular to the extending direction of the micro-channel 441. This section can be circular, square or other shapes.

[0117] In the initial state, a phase change medium can be filled in each micro-channel 441. Since the cross-sectional area of the micro-channel 441 is small, this enables the phase change medium to generate a strong convective heat transfer effect when flowing in the micro-channel 441, thereby improving the heat transfer efficiency.

[0118] Adopting the solution provided by this embodiment, the phase change medium can absorb a large amount of latent heat during the phase change process, while the micro-channels 441 can provide an efficient heat transfer path. Combining the two can achieve rapid heat transfer and effective heat management, significantly improving the heat dissipation efficiency. In addition, the structure of the micro-channels 441 is compact and occupies little space. In this way, after the micro-channels 441 are combined with the phase change medium, an efficient heat management function can be realized within a limited space, facilitating the miniaturized design of the chassis 200.

[0119] In some embodiments, the cross-sectional area of the micro-channel 441 is less than or equal to 4 mm 2 .

[0120] It can be understood that when the cross-section of the micro-channel 441 is circular, the diameter of the cross-section of the micro-channel 441 can be less than or equal to 2 mm; when the cross-section of the micro-channel 441 is square, the width of the cross-section of the micro-channel 441 can be less than or equal to 2 mm.

[0121] The microchannel 441 is arranged by using the arrangement method provided in this embodiment, which has a small volume, a compact structure and occupies a small space. In this way, after the microchannel 441 is combined with the phase change medium, an efficient thermal management function can be realized in a limited space, which is convenient for the miniaturized design of the chassis 200.

[0122] Figure 9 It is a schematic structural diagram of the assembly structure of the second heat conducting member and the circuit board assembly in the chassis provided in some embodiments of the present application. As Figure 9 shown, in some embodiments, the circuit board assembly 20 includes a circuit board 21, a first electronic component 22 and a second electronic component 23. The heat generation power of the second electronic component 23 is greater than that of the first electronic component 22. The first heat conducting portion 42 is in thermal contact with the second electronic component 23.

[0123] The heat generation power refers to the heat released by an object per unit time, usually expressed in watts (W), and is an important parameter to measure the heat generation ability of an object.

[0124] In this embodiment, the first heat conducting portion 42 is in thermal contact with the electronic component with a higher heat generation power (i.e., the second electronic component 23) in the circuit board assembly 20. In this way, the volume of the first heat conducting portion 42 does not need to be set too large, so that the electronic component with a higher heat generation power in the circuit board assembly 20 can be cooled in time, so that the overall temperature of the circuit board assembly 20 is not likely to be too high.

[0125] In some embodiments, the first heat conducting portion 42 includes a contact portion 421 and a connecting portion 422. The contact portion 421 is in thermal contact with the second electronic component 23. The connecting portion 422 connects the contact portion 421 and the second heat conducting portion 43.

[0126] The first electronic component 22 is located between the contact portion 421 and the second heat conducting portion 43, and the thickness of the first electronic component 22 is greater than that of the second electronic component 23. And the connecting portion 422 is arranged to avoid the first electronic component 22.

[0127] The contact portion 421 is a component for thermally contacting the circuit board assembly 20, and can be composed of one part or multiple parts. The connecting portion 422 is a component for connecting the contact portion 421 and the second heat conducting portion 43 and enabling heat conduction between the two, and can be composed of one part or multiple parts. The materials of the contact portion 421 and the connecting portion 422 can be the same or different, which can be determined according to actual use needs.

[0128] The first cavity 44 on the first heat conducting portion 42 can be arranged on the connecting portion 422, or a part of it can be arranged on the connecting portion 422 and the other part can be arranged on the contact portion 421, which can be determined according to actual use needs.

[0129] The fact that the connecting portion 422 is arranged to avoid the first electronic component 22 means that the distance between the connecting portion 422 and the circuit board 21 can be less than the thickness of the first electronic component 22. The connecting portion 422 can pass through from one side of the first electronic component 22, or a through hole through which the first electronic component 22 can pass can be formed in the connecting portion 422, as long as the arrangement of the connecting portion 422 does not affect the installation of the first electronic component 22.

[0130] By adopting the solution provided in this embodiment, the arrangement of the first heat conducting portion 42 can be made not to affect the installation of the first electronic component 22 on the circuit board assembly 20, and at the same time, the thickness of the combined structure of the first heat conducting portion 42 and the circuit board assembly 20 will not be too large, which is convenient for the miniaturization design of the chassis 200.

[0131] In some embodiments, the connecting portion 422 includes a vertical portion 4221 and an inclined portion 4222. The vertical portion 4221 is in the same extending direction as the contact portion 421 and is arranged in a staggered manner with the contact portion 421. The inclined portion 4222 connects the contact portion 421 and the vertical portion 4221. The inclined portion 4222 and the vertical portion 4221 enclose an installation space 4223. The installation space 4223 is used for installing at least part of the first electronic component 22.

[0132] The contact portion 421 is generally a flat plate structure and extends in a direction parallel to the plate surface of the circuit board 21. The vertical portion 4221 can also be a flat plate structure or a strip structure, and its extending direction can be the same as that of the contact portion 421. The extending direction of the contact portion 421 refers to the connection direction between one end of the contact portion 421 connected to the connecting portion 422 and the other end of the contact portion 421 far from the connecting portion 422.

[0133] The staggered arrangement means that at least part of the vertical portion 4221 is located outside the extending area of the contact portion 421.

[0134] The inclined portion 4222 is a component whose extending direction forms an angle with the extending direction of the contact portion 421 and is used to connect the contact portion 421 and the vertical portion 4221.

[0135] The inclined portion 4222 and the contact portion 421 can be integrally formed or separately arranged. For example, they can be plugged or glued together, etc., which can be determined according to actual use needs.

[0136] The installation space 4223 is an open space enclosed by the inclined portion 4222 and the vertical portion 4221.

[0137] By adopting the structure provided in this embodiment, the structure of the connecting portion 422 is simple and convenient for preparation.

[0138] In some embodiments, at least one of the vertical portion 4221, the inclined portion 4222 and the contact portion 421 is a plate-shaped portion.

[0139] The plate-shaped part is a component with a plate shape. At least one of the vertical part 4221, the inclined part 4222, and the contact part 421 being a plate-shaped part means that at least one of the three parts has a plate shape.

[0140] By adopting the solution provided in this embodiment, at least part of the first heat-conducting part 42 can have a smaller thickness, the volume of the first heat-conducting part 42 can be smaller, the occupied space is reduced, which is convenient for the miniaturized design of the chassis 200.

[0141] In some embodiments, the first heat-conducting part 42 is an integrally formed structure.

[0142] The integrally formed structure refers to that in the manufacturing process, through specific process methods (such as injection molding, die casting, hot pressing, 3D printing, etc.), a product that originally needed to be assembled from multiple parts is directly manufactured into a whole structure in one processing. That is, the connecting part 422, the contact part 421, etc. in the first heat-conducting part 42 are obtained through the integrally formed process.

[0143] By adopting the solution provided in this embodiment, the connection between the various parts in the first heat-conducting part 42 can be stable and it is convenient for preparation.

[0144] In some embodiments, the first heat-conducting part 42 is a heat pipe.

[0145] A heat pipe is a vacuum cavity with a fine structure on the inner wall, usually made of metals such as copper. Its structure is usually in a flat plate type or a flat-shaped special shape, filled with a working fluid (such as pure water) inside, and the circulation of the fluid is driven through the fine structure (such as powder sintering, multi-layer copper mesh, etc.).

[0146] The first heat-conducting part 42 adopts a heat pipe, which has high heat conduction efficiency and is convenient for obtaining materials.

[0147] In some embodiments, the second heat-conducting part 40 is an integrally formed structure.

[0148] In this embodiment, each part in the second heat-conducting part 40 (including the first heat-conducting part 42 and the second heat-conducting part 43) is obtained through the integrally formed process.

[0149] By adopting the solution provided in this embodiment, the connection between the various parts in the second heat-conducting part 40 can be stable and it is convenient for preparation.

[0150] Such as Figure 5 and Figure 6As shown, in some embodiments, the first heat conducting member 30 includes a third heat conducting portion 33 and a fourth heat conducting portion 35. A first channel 34 for communicating with an external liquid supply pipeline is provided in the third heat conducting portion 33. There are two third heat conducting portions 33, and the two third heat conducting portions 33 are spaced apart. The fourth heat conducting portion 35 connects the two third heat conducting portions 33, and at least a part of the fourth heat conducting portion 35 protrudes towards the circuit board assembly 20. A second channel 31 is provided in the fourth heat conducting portion 35. The second channel 31 communicates with the two first channels 34 to form the above-mentioned flow channel 30a. The second heat conducting member 40 is connected to the fourth heat conducting portion 35. A groove is provided in the fourth heat conducting portion 35.

[0151] The third heat conducting portion 33 is a component with a first channel 34 provided therein for communicating with an external liquid supply pipeline, and can be composed of one or more parts. The first channel 34 generally has two ends, one of which communicates with the second channel 31 and the other communicates with the external liquid supply pipeline. The external liquid supply pipeline is a system located outside the chassis 200 for supplying the above-mentioned cooling medium into the first heat conducting member 30.

[0152] Spaced apart means that there is a certain gap between the two third heat conducting portions 33 and they do not contact each other. For example, the two can be respectively arranged on both sides of the box body 10, or respectively arranged at both ends of the box body 10, or although they are located on the same side of the box body 10, there is a certain interval between them.

[0153] The fourth heat conducting portion 35 is a component for conducting the heat absorbed by the second heat conducting member 40 to the third heat conducting portion 33, and can be composed of one or more parts. The material, structure, etc. of the fourth heat conducting portion 35 can be the same as or different from those of the third heat conducting portion 33, which can be specifically determined according to the usage requirements. The fourth heat conducting portion 35 can be perpendicularly arranged with respect to the third heat conducting portion 33, or arranged at other angles, or located on the same straight line, which can be specifically determined according to the usage requirements.

[0154] At least a part of the fourth heat conducting portion 35 protruding towards the side where the circuit board assembly 20 is located includes at least the following situations: First, the fourth heat conducting portion 35 is entirely located on the side of the third heat conducting portion 33 close to the circuit board assembly 20; Second, a part of the fourth heat conducting portion 35 is located between the two third heat conducting portions 33, and the other part is located on the side of the third heat conducting portion 33 close to the circuit board assembly 20. It can be understood that when the first heat conducting member 30 has a groove, the groove is provided on the fourth heat conducting portion 35. At least a part of the fourth heat conducting portion 35 protruding towards the side where the circuit board assembly 20 is located facilitates the connection between the fourth heat conducting portion 35 and the second heat conducting member 40.

[0155] When the solution provided in this embodiment is adopted, one of the first channels 34 on the third heat-conducting part 33 can be used as the water inlet channel, which is connected to the water outlet of the external liquid supply pipeline, and the first channel 34 on the other third heat-conducting part 33 can be used as the drainage channel, which is connected to the water return port of the external liquid supply pipeline. When it is necessary to dissipate heat from the circuit board assembly 20, start the external liquid supply pipeline. The external liquid supply pipeline supplies the cooling medium into the third heat-conducting part 33. Then, the cooling medium reaches the second channel 31 of the fourth heat-conducting part 35 through the third heat-conducting part 33. When flowing through the second channel 31, it exchanges heat with the second heat-conducting part 40, and then flows into another third heat-conducting part 33, and finally is discharged through the outlet of this third heat-conducting part 33, or enters the external liquid supply pipeline again. The flow direction of the cooling medium can be referred to Figure 5 the one-way solid arrows in Figure 5 . The heat generated by the circuit board assembly 20 can be propagated in the direction indicated by the one-way dashed arrows in

[0156] , and is propagated from bottom to top through the second heat-conducting part 40 to the first heat-conducting part 31 to complete the above heat exchange.

[0157] In some embodiments, in the same fourth heat-conducting part 35, there are two second channels 31, and the two second channels 31 are respectively arranged on both sides of the groove 32.

[0158] Adopting the solution provided in this embodiment can, to a certain extent, increase the area of the heat exchange region between the cooling medium in the second channel 31 and the second heat-conducting part 40 compared with only setting one second channel 31 in the same fourth heat-conducting part 35, improve the heat exchange rate, and thus improve the heat dissipation rate of the circuit board assembly 20.

[0159] In some embodiments, in the first heat-conducting part 30, the thermal conductivity of the part between the second channel 31 and the groove 32 is greater than or equal to that of other parts.

[0160] Thermal conductivity, also known as heat conductivity, is a measure of the heat-conducting ability of a substance. It describes the ability of a material to transfer heat under stable heat transfer conditions. The definition of thermal conductivity is the amount of heat transferred per unit time under the condition that the temperature gradient is 1 K / m and the heat-conducting area is 1 m 2 . Its unit is watt per meter degree (W / (m·K), where K can be replaced by °C). Specifically, thermal conductivity refers to the amount of heat transferred through an area of 1 square meter in 1 second under stable heat transfer conditions, with a temperature difference of 1 degree (K, °C) between the two surfaces of a 1-meter-thick material.

[0161] In this embodiment, the thermal conductivity of the portion between the second channel 31 and the groove 32 may be equal to that of other portions, or may be greater than that of other portions. When the thermal conductivity of the portion between the second channel 31 and the groove 32 is greater than that of other portions, the heat transfer rate between the phase change medium and the first heat conducting member 30, and between the first heat conducting member 30 and the cooling medium can be improved to a certain extent, thereby improving the heat dissipation efficiency of the circuit board assembly 20 to a certain extent.

[0162] In some embodiments, both the third heat conducting portion 33 and the fourth heat conducting portion 35 are long strip portions, and the length direction of the third heat conducting portion 33 forms an angle with the length direction of the fourth heat conducting portion 35.

[0163] A long strip portion refers to a component whose dimension in the length direction is much larger than the dimensions in other directions such as the width direction and the height direction. Forming an angle means that the length direction of the third heat conducting portion 33 and the length direction of the fourth heat conducting portion 35 form a non-zero angle.

[0164] Adopting the solution provided in this embodiment can make the structures of the third heat conducting portion 33 and the fourth heat conducting portion 35 simple, facilitating preparation and installation.

[0165] In some embodiments, a heat conducting layer is provided between the first heat conducting member 30 and the second heat conducting member 40. The thermal conductivity of the heat conducting layer is greater than that of the first heat conducting member 30 and greater than that of the second heat conducting member 40.

[0166] A heat conducting layer refers to a material layer used to enhance heat conduction. Through its high thermal conductivity, the heat conducting layer helps heat transfer rapidly from the high-temperature region to the low-temperature region, thereby optimizing the thermal management of the entire system. The heat conducting layer includes but is not limited to the following: nano heat conducting layer, thin film heat conducting layer, heat conducting coating, heat conducting silicone grease layer, heat conducting gel layer, heat conducting double-sided tape, heat conducting gasket, etc.

[0167] Adopting the solution provided in this embodiment can, to a certain extent, improve the heat transfer rate between the first heat conducting member 30 and the second heat conducting accessory compared with the direct heat conduction contact between the first heat conducting member 30 and the second heat conducting member 40, thereby improving the heat dissipation efficiency of the circuit board assembly 20 to a certain extent.

[0168] As Figure 2 shown, in some embodiments, through holes 11 are provided on at least two opposite side walls of the box body 10. The through holes 11 are used to connect the internal and external spaces of the box body 10, that is, for air to pass through to enter or flow out of the box body 10.

[0169] The through holes 11 are through holes that penetrate along the thickness direction of the side walls.

[0170] The housing 10 generally includes a plurality of side walls, and at least two side walls are arranged opposite to each other. The through holes 11 are provided on at least two opposite side walls of the housing 10 above, which means that the through holes 11 are provided on at least two opposite side walls among all the side walls of the housing 10. For example, if the housing 10 includes a side wall 1, a side wall 2, a side wall 3, and a side wall 4, where the side wall 1 and the side wall 2 are arranged opposite to each other, and the side wall 3 and the side wall 4 are arranged opposite to each other. At this time, the through holes 11 can be opened on the side wall 1 and the side wall 2, or the through holes 11 can be opened on the side wall 3 and the side wall 4, or the through holes 11 can be opened on the side wall 1, the side wall 2, and the side wall 3, and so on.

[0171] Adopting the solution provided by this embodiment facilitates the convection of the gas inside and outside the housing 10 through the through holes 11 to achieve the temperature condition inside the housing 10. Cooperating with the cooling medium, various heat exchange methods of the chassis 200 can be realized, and the heat dissipation efficiency can be further improved.

[0172] As Figures 2 to 4 As shown, in some embodiments, the housing 10 includes a first side wall 12 and a second side wall 13 arranged opposite to each other. The through holes 11 are provided on both the first side wall 12 and the second side wall 13. The first heat conducting member 30 is arranged on the first side wall 12. A third heat conducting member 60 is provided on the second side wall 13. A third channel 61 is provided inside the third heat conducting member 60. The third channel 61 is used for the cooling medium to pass through.

[0173] The structure of the third heat conducting member 60 can be the same as or different from that of the first heat conducting member 30, which can be determined according to actual use needs.

[0174] Adopting the solution provided by this embodiment can enable the gas entering the housing 10 through the through holes 11 to be cooled by the first heat conducting member 30 or the third heat conducting member 60 first and then enter the housing 10. In this way, the cooling effect of the gas entering the housing 10 through the through holes 11 can be better, which helps to quickly cool down the circuit board assembly 20.

[0175] In some embodiments, there are a plurality of circuit board assemblies 20 and a plurality of second heat conducting members 40 respectively. The plurality of second heat conducting members 40 are arranged corresponding to the plurality of circuit board assemblies 20, and the plurality of second heat conducting members 40 are thermally connected to the same first heat conducting member 30.

[0176] Two adjacent circuit board assemblies 20 among the plurality of circuit board assemblies 20 can be arranged in parallel, or vertically, or at other included angles.

[0177] A plurality of second heat conducting members 40 are correspondingly arranged with a plurality of circuit board assemblies 20. The number of the second heat conducting members 40 can be the same as that of the circuit board assemblies 20, and they are arranged in one-to-one correspondence. Or the number of the second heat conducting members 40 can be greater than that of the circuit board assemblies 20, and one circuit board assembly 20 is correspondingly arranged with a plurality of second heat conducting members 40. Specifically, it can be determined according to the usage requirements.

[0178] By adopting the solution provided in this embodiment, a plurality of circuit board assemblies 20 can share one first heat conducting member 30 for heat dissipation. In this way, the number of the first heat conducting members 30 in the chassis can be reduced, and the weight and design difficulty of the chassis can be reduced.

[0179] According to some embodiments of the present application, the present application also provides an electrical device including the chassis of any of the above solutions.

[0180] The electrical device can be any of the foregoing devices or systems using the chassis.

[0181] The electrical device provided by the embodiment of the present application includes the above-mentioned chassis and has a relatively high heat dissipation efficiency.

[0182] According to some embodiments of the present application, a cabinet is provided. The cabinet can be a screen cabinet or other cabinets. Please refer to Figures 1 to 9 , the cabinet 1000 includes a cabinet body 100 and a chassis 200 arranged in the cabinet body 100. The chassis 200 includes a box body 10, a circuit board assembly 20, a first heat conducting member 30, and a second heat conducting member 40. Among them, the circuit board assembly 20 is inserted into the box body 10. The first heat conducting member 30 is arranged on the box body 10. A flow channel 30a is arranged in the first heat conducting member 30. The flow channel 30a is used for the cooling medium to pass through. The second heat conducting member 40 is arranged in the box body 10. The second heat conducting member 40 is fixedly connected to the circuit board assembly 20, and the second heat conducting member 40 is slidably connected to the first heat conducting member 30 along a first direction X. The first direction X is parallel to the board surface of the circuit board assembly 20 and is also the insertion direction of the circuit board assembly 20. At least a part of the second heat conducting member 40 is in heat conduction contact with the circuit board assembly 20. The second heat conducting member 40 is used to conduct the heat dissipated by the circuit board assembly 20 to the first heat conducting member 30.

[0183] A groove 32 extending along the first direction X is arranged on the first heat conducting member 30. The notch of the groove 32 faces the side where the second heat conducting member 40 is located. The second heat conducting member 40 has a sliding part 41 that slidably cooperates with the groove 32, and the second heat conducting member 40 is slidably connected to the first heat conducting member 30 through the sliding part 41 and the groove 32.

[0184] The second heat conducting member 40 includes a first heat conducting portion 42 and a second heat conducting portion 43. The first heat conducting portion 42 is located on one side of the circuit board assembly 20 and is respectively connected to the first heat conducting portion 42 and the first heat conducting member 30. The second heat conducting portion 43 is fixedly connected to the circuit board assembly 20, is slidably connected to the first heat conducting member 30 through a sliding portion 41, and is also thermally connected to the first heat conducting portion 42. The sliding portion 41 is provided on the second heat conducting portion 43.

[0185] The first heat conducting portion 42 is a heat pipe, and a first cavity 44 is provided therein. A second cavity 45 is provided in the second heat conducting portion 43. The second cavity 45 communicates with the first cavity 44 to form a receiving cavity. A phase change medium is provided in the receiving cavity. The sliding portion 41 is provided on a side of the second heat conducting portion 43 away from the first heat conducting portion 42, and a third cavity 46 is provided in the sliding portion 41. The third cavity 46 communicates with the second cavity 45.

[0186] The first cavity 44 includes a plurality of microchannels 441. The plurality of microchannels 441 are spaced apart, and each microchannel 441 communicates with the second cavity 45. The cross-sectional area of the microchannel 441 is less than or equal to 4 mm 2 of the microchannel 441.

[0187] The circuit board assembly 20 includes a circuit board 21, a first electronic component 22, and a second electronic component 23. The heat generation power of the second electronic component 23 is greater than that of the first electronic component 22. The first heat conducting portion 42 is in thermal contact with the second electronic component 23.

[0188] The first electronic component 22 is located between the contact portion 421 and the second heat conducting portion 43, and the thickness of the first electronic component 22 is greater than that of the second electronic component 23. The first heat conducting portion 42 includes a contact portion 421 and a connecting portion 422. The contact portion 421 is in thermal contact with the second electronic component 23. The connecting portion 422 connects the contact portion 421 and the second heat conducting portion 43, and the connecting portion 422 is arranged to avoid the first electronic component 22.

[0189] The connecting portion 422 includes a vertical portion 4221 and an inclined portion 4222. The vertical portion 4221 is in the same extending direction as the contact portion 421 and is arranged in a staggered manner with the contact portion 421. The inclined portion 4222 connects the contact portion 421 and the vertical portion 4221. The inclined portion 4222 and the vertical portion 4221 enclose an installation space 4223. The installation space 4223 is used for installing at least part of the first electronic component 22.

[0190] The second heat conducting member 40 is an integrally formed structure. The first heat conducting member 30 includes a third heat conducting portion 33 and a fourth heat conducting portion 35. A first channel 34 for communicating with an external liquid supply pipeline is provided in the third heat conducting portion 33. There are two third heat conducting portions 33, and the two third heat conducting portions 33 are arranged at intervals. The fourth heat conducting portion 35 connects the two third heat conducting portions 33, and at least a part of the fourth heat conducting portion 35 protrudes toward the side where the circuit board assembly 20 is located. A groove 32 is provided on the fourth heat conducting portion 35, and a second channel 31 is provided inside the fourth heat conducting portion 35. The second channel 31 communicates with the two first channels 34 to form the above-mentioned flow channel 30a.

[0191] In the same fourth heat conducting portion 35, there are two second channels 31, and the two second channels 31 are respectively arranged on both sides of the groove 32. In the first heat conducting member 30, the thermal conductivity of the part between the second channel 31 and the groove 32 is greater than or equal to the thermal conductivity of other parts.

[0192] Both the third heat conducting portion 33 and the fourth heat conducting portion 35 are long strips, and the length direction of the third heat conducting portion 33 is perpendicular to the length direction of the fourth heat conducting portion 35.

[0193] A heat conducting layer is provided between the first heat conducting member 30 and the second heat conducting member 40. The thermal conductivity of the heat conducting layer is greater than the thermal conductivity of the first heat conducting member 30 and greater than the thermal conductivity of the second heat conducting member 40.

[0194] The box body 10 includes a first side wall 12 and a second side wall 13 which are oppositely arranged. Through holes 11 are provided on both the first side wall 12 and the second side wall 13. The through holes 11 are used for air to pass through to enter the box body 10 or flow out of the box body 10. The first heat conducting member 30 is arranged on the first side wall 12. A third heat conducting member 60 is provided on the second side wall 13. A third channel 61 is provided inside the third heat conducting member 60. The third channel 61 is used for cooling medium to pass through.

[0195] In this embodiment, the third heat conducting portion 33 in the first heat conducting member 30 is a guide rail originally used to support the side plate in the box body 10. This guide rail is a metal guide rail, and a liquid channel for fluid to pass through is designed inside the metal guide rail, which saves the pipeline space between the board liquid cooling plate and the water cooling interface and solves the problem of fluid leakage reliability.

[0196] The second heat conducting member 40 in this embodiment is a super heat conducting and temperature equalizing structure. Through this structure, the heat of the heating chips on the circuit board 21 can be collected uniformly, and then the heat is conducted to the top metal guide rail through the super heat conducting performance of internal phase change. Liquid cooling heat dissipation is carried out by passing water or other heat transfer media in the water channel inside the metal guide rail.

[0197] The first side wall 1212 can be the top plate of the box body 10, and the second side wall 1313 can be the bottom plate of the box body 10. The design of the guide rail liquid cooling channel is applied to the bottom guide rail of the chassis 200, which has a dual effect of heat exchange and cooling on the inlet air in the chassis 200.

[0198] In this embodiment, multiple chips on a single circuit board 21 can be temperature-equalized and heat-conducted through the same superconducting heat equalization structure, so that the heat dissipated by the multiple chips can be synchronously transmitted into the top metal guide rail liquid cooling channel and the flow channel.

[0199] When multiple circuit board assemblies 20 are used, each circuit board assembly 20 can correspond to one or more second heat conducting members 40, and the multiple second heat conducting members 40 can be in heat conducting contact with the same first heat conducting member 30, so that the same first heat conducting member 30 can dissipate heat from multiple circuit board assemblies 20.

[0200] The solution provided in this embodiment combines the superconducting heat equalization structure with the liquid cooling guide rail to perform superconducting post-water cooling on different board and chip in the chassis 200. The superconducting heat equalization structure is used to transfer heat upward to the liquid cooling channel formed by the metal guide rail in the chassis 200 for efficient heat dissipation, without affecting the quick plug-and-play system of the board.

[0201] In the related art, the position where the first heat conducting member 30 is located is the guide rail, and the guide rail is made of aluminum alloy combined with polypropylene (PP for short). The material of the first heat conducting member 30 in this embodiment can also be PP, but the guide rail surface in contact with the board plugging and unplugging needs to be composed of high thermal conductivity metals, such as aluminum alloy, copper metal, high thermal conductivity coefficient ceramics, etc.

[0202] In this embodiment, the first heat conducting member 30 is a water cooling structure formed by processing an internal flow channel in the metal guide rail structure of the chassis 200. The second heat conducting member 40 is a superconducting heat equalization structure or can be called a heat equalization plate. The internal structure of the heat equalization plate is flexibly designed and consists of several micro-channels 441 with a size less than 2*2 mm. The inside is a phase change medium (media such as R134a, R22, Freon, etc.). The two heat conducting members are relatively independent, but there is mechanical contact. When designing, try to ensure the maximum contact area to improve the effect of the heat conducting contact area, and a heat conducting interface material can be added to the contact surface to reduce the contact thermal resistance and the surface abrasion caused by long-term quick plugging and unplugging to improve the service life.

[0203] Among them, the interior of the second heat conducting member 40 is a phase change medium. The preparation materials of the second heat conducting member 40 can be high heat conductivity materials such as aluminum alloy, copper, and ceramics. When the phase change medium inside it absorbs the heat of the heat source (chip), it reaches its volatilization temperature and undergoes phase change evaporation in the evaporation area (i.e., the area where the contact part in the first heat conducting part is located). It volatilizes upward through the adiabatic section (i.e., the inclined part and the vertical part in the first heat conducting part) to the condensation end (i.e., the second heat conducting part). Since the condensation end channel is in full contact with the liquid cooling guide rail of the top chassis 200, it will transfer the heat of the gaseous medium to the liquid cooling chassis 200 guide rail for condensation, and the condensed liquid phase medium will return to the evaporation end (i.e., the contact part in the first heat conducting part) along the original path. In this way, a closed superconducting cycle is formed. During this cycle process, the internal medium absorbs a large amount of phase change heat transfer. Therefore, the heat conductivity coefficient of this structure can reach the effect of 00K / W longitudinally and 140K / W transversely, so it is called a super heat conducting and temperature equalizing structure.

[0204] The first heat conducting member 30 and the second heat conducting member 40 in this embodiment are two independent mechanisms. The second heat conducting member 40 is fixed on the circuit board assembly 20 through a slot structure, solving the problem of fixing the liquid cooling plate to the circuit board assembly 20. When the circuit board assembly 20 is inserted and removed through the guide rail in the chassis 200, the second heat conducting member 40 is stuck on the liquid cooling guide rail (i.e., the first heat conducting member 30) together with the circuit board assembly 20 and is in full contact to form sufficient heat conduction.

[0205] This cabinet 1000 solves the problems in the related technology that the forced air cooling efficiency of the chassis 200 in the cabinet 1000 is low, the equipment space is large, and the noise is high, as well as the problems that the natural air cooling efficiency in the cabinet 1000 is low and the inlet temperature is relatively high after the temperature iteration of multiple chassis 200; it also solves the problems in the related technology that when the chassis 200 in the cabinet 1000 is designed for liquid cooling, the design of the chassis 200 is complex, the liquid cooling interfaces are too many, the leakage risk is large, and the maintainability is low; it solves the design limitations of the liquid cooling plate of the liquid cooling chassis 200 (the liquid cooling plate is relatively heavy and difficult to fix), and the problem that directly contacting the liquid cooling plate in the design of the board card chip alone hinders the reliability of quick plugging and unplugging.

[0206] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present application, and they should all be covered within the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A chassis, characterized in that: include: Box; A circuit board assembly is disposed in the box; A first heat-conducting member is arranged on the box body, wherein a flow channel is arranged inside the first heat-conducting member, wherein the flow channel is used for a cooling medium to pass through, and the cooling medium is a fluid; as well as A second heat-conducting member is disposed in the box, the second heat-conducting member is detachably and / or movably connected to the first heat-conducting member, and at least a portion of the second heat-conducting member is in thermal contact with the circuit board assembly; The second heat conducting member is used to conduct the heat dissipated by the circuit board assembly to the first heat conducting member.

2. The chassis according to claim 1, characterized in that The second heat-conducting member is fixedly connected to the circuit board assembly, and the second heat-conducting member is slidably connected to the first heat-conducting member along a first direction, and the first direction is parallel to the board surface of the circuit board assembly.

3. The chassis according to claim 2, characterized in that The first heat conducting member is provided with a groove extending along the first direction, the notch of the groove faces the second heat conducting member, and the second heat conducting member has a sliding portion, and the sliding portion is slidably matched with the groove.

4. The chassis according to claim 3, characterized in that The second heat conducting member comprises: A first heat conducting portion, located at one side of the circuit board assembly and in thermal contact with the circuit board assembly; and The second heat-conducting part is arranged between the circuit board assembly and the first heat-conducting part. The second heat-conducting part is thermally connected to the first heat-conducting part and is fixedly connected to the circuit board assembly. The second heat-conducting part is slidably connected to the first heat-conducting part through the sliding part. The second heat-conducting part is used to conduct the heat absorbed by the first heat-conducting part to the first heat-conducting part.

5. The chassis according to claim 4, characterized in that: A first cavity is disposed in the first heat conducting part, a second cavity is disposed in the second heat conducting part, the second cavity is connected with the first cavity to form a containing cavity, and a phase change medium is disposed in the containing cavity.

6. The chassis according to claim 5, characterized in that The sliding part is arranged on a side of the second heat conducting part away from the first heat conducting part, and a third cavity is arranged inside the sliding part, and the third cavity is communicated with the second cavity.

7. The chassis according to claim 5 or 6, characterized in that: The first cavity includes a plurality of microchannels, the plurality of microchannels are arranged at intervals, and each of the microchannels is communicated with the second cavity.

8. The chassis according to claim 7, characterized in that: The cross-sectional area of ​​the microchannel is less than or equal to 4 mm 2 .

9. The chassis according to any one of claims 4 to 8, characterized in that: The circuit board assembly comprises: Circuit boards; a first electronic component; and a second electronic component, wherein the heat generation power of the second electronic component is greater than the heat generation power of the first electronic component; The first heat conducting portion is in thermal contact with the second electronic component.

10. The chassis according to claim 9, characterized in that: The first heat conducting part comprises: a contact portion in thermal contact with the second electronic component; and a connecting portion, connecting the contact portion and the second heat conducting portion; The first electronic component is located between the contact portion and the second heat conducting portion, and the thickness of the first electronic component is greater than the thickness of the second electronic component. The connecting portion is arranged to avoid the first electronic component.

11. The chassis according to claim 10, characterized in that The connecting portion comprises: a vertical portion, located at one side of the first electronic component and spaced apart from the contact portion; and an oblique portion connecting the contact portion and the vertical portion; The oblique portion and the vertical portion enclose an installation space, and the installation space is used to install at least part of the first electronic component.

12. The chassis according to claim 11, characterized in that At least one of the vertical portion, the inclined portion, and the contact portion is a plate-shaped portion.

13. The chassis according to any one of claims 4 to 11, characterized in that: The first heat conducting part is an integrally formed structure.

14. The chassis according to any one of claims 4 to 12, characterized in that: The first heat conducting part is a temperature equalizing plate.

15. The chassis according to any one of claims 1 to 14, characterized in that: The second heat conducting member is an integrally formed structure.

16. The chassis according to any one of claims 3 to 14, characterized in that: The first heat conducting member comprises: A third heat-conducting part, having a first channel therein for communicating with an external liquid supply pipeline; two third heat-conducting parts are provided, and the two third heat-conducting parts are spaced apart; and a fourth heat-conducting portion, connecting the two third heat-conducting portions, and at least a portion of the fourth heat-conducting portion protruding toward the circuit board assembly, wherein a second channel is disposed inside the fourth heat-conducting portion, and the second channel is connected to the two first channels to form the flow channel; The second heat conducting member is connected to the fourth heat conducting portion, and the groove is disposed on the fourth heat conducting portion.

17. The chassis according to claim 16, characterized in that In the same fourth heat conducting part, two second channels are provided, and the two second channels are respectively provided on two sides of the groove.

18. The chassis according to claim 16 or 17, characterized in that: In the first heat conducting member, a thermal conductivity of a portion between the second channel and the groove is greater than or equal to a thermal conductivity of other portions.

19. The chassis according to any one of claims 16 to 18, characterized in that: The third heat conducting portion and the fourth heat conducting portion are both long strip portions, and a length direction of the third heat conducting portion forms an angle with a length direction of the fourth heat conducting portion.

20. The chassis according to any one of claims 1 to 19, characterized in that: A heat-conducting layer is provided between the first heat-conducting member and the second heat-conducting member, and a thermal conductivity of the heat-conducting layer is greater than a thermal conductivity of the first heat-conducting member and greater than a thermal conductivity of the second heat-conducting member.

21. The chassis according to any one of claims 1 to 20, characterized in that: At least two oppositely disposed side walls of the box body are provided with through holes, and the through holes are used to connect the inner and outer spaces of the box body.

22. The chassis according to claim 21, characterized in that The box body includes a first side wall and a second side wall arranged opposite to each other, the first side wall and the second side wall are both provided with the through hole, the first heat conducting member is arranged on the first side wall, the second side wall is provided with a third heat conducting member, the third heat conducting member is provided with a third channel therein, and the third channel is used for the cooling medium to pass through.

23. The chassis according to any one of claims 1 to 22, characterized in that: The circuit board assembly and the second heat-conducting member are provided in plurality, respectively, and the plurality of the second heat-conducting members are arranged correspondingly to the plurality of the circuit board assemblies, and the plurality of the second heat-conducting members are thermally connected to the same first heat-conducting member.

24. An electrical device, characterized in that: A chassis comprising any one of claims 1-23.

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