3DVC vapor chamber with U-shaped grooves on heat dissipation surface
By setting a U-shaped groove-shaped heat dissipation groove on the heat dissipation surface of the 3DVC heat dissipation plate, the problem of insufficient space between the heat pipe and the heat dissipation plate and the steam chamber in the prior art is solved, and a better heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422028613.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-20
AI Technical Summary
The heat dissipation surface of the existing VC heat dissipation plate is flat, resulting in insufficient space between the contact surfaces and steam chambers between the heat pipe and the heat dissipation plate, which cannot meet the needs of efficient heat dissipation.
A 3DVC heat-smoothing plate with a U-shaped groove on the heat dissipation surface is designed, and several heat-smoothing grooves that are suitable for the shape of the heat pipe are arranged on the heat dissipation surface, which increases the contact area between the heat pipe and the heat-smoothing plate and the steam chamber space.
The contact area between the heat equalization plate and the heat pipe and the steam chamber space are improved, which significantly improves the heat dissipation effect and meets the high requirements of high-performance computing hardware for heat dissipation.
Smart Images
Figure CN222981887U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a 3DVC vapor chamber with a U-shaped groove on the heat dissipation surface. Background Art
[0002] Due to its highly integrated and tiny structure, electronic devices generate a large amount of heat during operation and have relatively high requirements for the operating temperature. The vapor chamber can transfer heat through phase change over a larger area, so it has become the best heat dissipation solution for electronic devices.
[0003] The working fluid in a common vapor chamber flows not fast enough on the vapor chamber, resulting in uneven temperature distribution on the vapor chamber. Thermal stress is easily generated on the vapor chamber. After long-term use, the area where the thermal stress accumulates on the vapor chamber is prone to cracking, and ultimately the vapor chamber is scrapped.
[0004] 3DVC vapor chamber is a special vapor chamber technology and has been increasingly valued in high-performance computing hardware due to its high-efficiency heat dissipation performance. With the continuous improvement of the heat dissipation requirements of electronic devices, this technology may be more widely applied in the future.
[0005] In the prior art, the heat dissipation surface of a conventional VC vapor chamber is flat. When welding the heat dissipation module, the parts need to be flattened in the early stage so that the flat surface of the heat pipe contacts the flat surface of the vapor chamber to achieve a good heat dissipation effect. However, this design reduces the contact surface between the two and the chamber space of the vapor chamber and the heat pipe, reducing the heat dissipation effect and unable to meet the increasing requirements for 3DVC vapor chambers.
[0006] Therefore, the prior art needs to be improved and enhanced. Summary of the Utility Model
[0007] The purpose of the utility model is to provide a 3DVC vapor chamber with a U-shaped groove on the heat dissipation surface. By setting heat pipe grooves on the heat dissipation surface, it can not only effectively solve the problem of the contact surface between the vapor chamber and the heat pipe, but also increase the steam chamber space between the two, enabling the heat dissipation module to have a better heat dissipation effect.
[0008] To achieve the above purpose, the technical solution adopted by the utility model is:
[0009] A 3DVC vapor chamber with a U-shaped groove on the heat dissipation surface includes a vapor chamber body having a heat dissipation surface and a heat source contact surface opposite to the heat dissipation surface, and a plurality of heat dissipation grooves are arranged along the length direction on the heat dissipation surface.
[0010] As a further scheme of the utility model, the vapor chamber body includes a first cover plate and a second cover plate, and a sealed cavity is formed between the first cover plate and the second cover plate.
[0011] As a further solution of the present utility model, the four corners of the first cover plate and the second cover plate are fixed together by nut posts.
[0012] As a further solution of the present utility model, both the first cover plate and the second cover plate are made of copper.
[0013] As a further solution of the present utility model, a first profiling groove is provided on one side of the first cover plate facing the second cover plate, a first liquid absorption core adapted to the shape of the first profiling groove is provided in the first profiling groove, a second profiling groove is provided on one side of the second cover plate facing the first cover plate, a second liquid absorption core adapted to the shape of the second profiling groove is provided in the second profiling groove, and a plurality of support columns are provided between the first liquid absorption core and the second liquid absorption core.
[0014] As a further solution of the present utility model, a first protrusion, a second protrusion, a third protrusion and a fourth protrusion are provided on the heat dissipation surface, and a groove is formed between the first protrusion, the second protrusion, the third protrusion and the fourth protrusion.
[0015] As a further solution of the present utility model, the first protrusion and the third protrusion are oppositely arranged, the second protrusion and the fourth protrusion are oppositely arranged, a plurality of first heat dissipation grooves are provided on both the first protrusion and the third protrusion, and a second heat dissipation groove is provided on both the second protrusion and the fourth protrusion.
[0016] As a further solution of the present utility model, a third heat dissipation groove is provided at the connection of the second protrusion with the first protrusion and the fourth protrusion, and a fourth heat dissipation groove is provided at the connection of the fourth protrusion with the first protrusion and the third protrusion.
[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0018] Due to the above structural design, that is, the heat pipe heat spreader body has a heat dissipation surface and a heat source contact surface, and a plurality of heat dissipation grooves adapted to the shape of the heat pipe are provided along the length direction on the heat dissipation surface, so that a part of the heat pipe can be placed in the heat dissipation grooves, which improves the contact area between the heat pipe heat spreader and the heat pipe, and at the same time increases the steam chamber space between the two, thereby enabling the heat dissipation module to have a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Att Figure 1 is a schematic structural diagram of an embodiment of the present utility model;
[0020] Att Figure 2 is an exploded structural diagram of an embodiment of the present utility model;
[0021] Att Figure 3Schematic diagram of the structure of the first cover plate according to an embodiment of the present utility model;
[0022] Appendix Figure 4 Another schematic diagram of the structure of the first cover plate according to an embodiment of the present utility model;
[0023] Appendix Figure 5 Schematic diagram of the structure of the second cover plate according to an embodiment of the present utility model;
[0024] Appendix Figure 6 Another schematic diagram of the structure of the second cover plate according to an embodiment of the present utility model.
[0025] Each reference numeral in the figure is respectively:
[0026] 100 - heat pipe body;
[0027] 101 - first cover body, 102 - second cover body, 104 - first wick, 105 - second wick, 106 - support column;
[0028] 1011 - heat dissipation surface, 1012 - first profiling groove;
[0029] 1021 - heat source contact surface, 1022 - second profiling groove;
[0030] 1011a - first protrusion, 1011b - second protrusion, 1011c - third protrusion, 1011d - fourth protrusion, 1011e - first heat dissipation groove, 1011f - second heat dissipation groove, 1011g - third heat dissipation groove, 1011h - fourth heat dissipation groove, 1011k - groove. Detailed implementation manners
[0031] To make the above - mentioned objects, features and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.
[0033] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. In the present application, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0034] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0035] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.
[0036] Embodiment:
[0037] Please refer to Figure 1-6 , a 3DVC vapor chamber with a U-shaped groove on the heat dissipation surface of the present application, includes a vapor chamber body 100. The vapor chamber body 100 has a heat dissipation surface 1011 and a heat source contact surface 1021 opposite to the heat dissipation surface 1011. The heat dissipation surface is in contact with the heat pipe, and the heat source contact surface is in contact with the CPU, GPU or other high-performance processors. A plurality of heat dissipation grooves adapted to the shape of the heat pipe are arranged along the length direction on the heat dissipation surface 1011. The cross-section of the heat dissipation groove is U-shaped, so that a part of the heat pipe can be placed in the heat dissipation groove, which improves the contact area between the vapor chamber and the heat pipe, and at the same time increases the steam chamber space of the two, thereby enabling the heat dissipation module to have a better heat dissipation effect.
[0038] Specifically, the vapor chamber body 100 includes a first cover plate 101 and a second cover plate 102. The surface of the first cover plate relative to the second cover plate is the heat dissipation surface, and the surface of the second cover plate relative to the first cover plate is the heat source contact surface. The four corners of the first cover plate 101 and the second cover plate 102 are fixed together by nut posts, and a sealed cavity is formed between the first cover plate 101 and the second cover plate 102. Both the first cover plate 101 and the second cover plate 102 are made of copper.
[0039] Specifically, a first profiling groove 1012 is provided on one side of the first cover plate 101 facing the second cover plate 102. A first wick 104 adapted to the shape of the first profiling groove 1012 is arranged in the first profiling groove 1012. A second profiling groove 1022 is provided on one side of the second cover plate 102 facing the first cover plate 101. A second wick 105 adapted to the shape of the second profiling groove 1022 is arranged in the second profiling groove 1022. A plurality of support columns 106 are arranged between the first wick 104 and the second wick 105. The first wick is adapted to the shape of the first profiling groove, so that the first wick is in close contact with the first cover plate, which is beneficial to improving the performance of the vapor chamber. The second wick is adapted to the shape of the second profiling groove, so that the second wick is in close contact with the second cover plate, which is beneficial to improving the performance of the vapor chamber.
[0040] Specifically, a first protruding portion 1011a, a second protruding portion 1011b, a third protruding portion 1011c and a fourth protruding portion 1011d are provided on the heat dissipation surface 1011. The first protruding portion 1011a and the third protruding portion 1011c are oppositely arranged. The second protruding portion 1011b and the fourth protruding portion 1011d are oppositely arranged. Two first heat dissipation grooves 1011e are provided on both the first protruding portion 1011a and the third protruding portion 1011c. A second heat dissipation groove 1011f is provided on both the second protruding portion 1011b and the fourth protruding portion 1011d. A third heat dissipation groove 1011g is provided at the connection of the second protruding portion 1011b with the first protruding portion 1011a and the third protruding portion 1011c. A fourth heat dissipation groove 1011h is provided at the connection of the fourth protruding portion 1011d with the first protruding portion 1011a and the third protruding portion 1011c. A groove 1011k is formed between the first protruding portion 1011a, the second protruding portion 1011b, the third protruding portion 1011c and the fourth protruding portion 1011d. The above-mentioned first heat dissipation groove, second heat dissipation groove, third heat dissipation groove and fourth heat dissipation groove are adapted to the shape of the heat pipe, so that a part of the heat pipe is placed in these heat dissipation grooves, which increases the contact area between the first cover plate and the heat pipe, and also enlarges the steam chamber space of the heat pipe and the heat spreader, and the heat dissipation effect is better.
[0041] In summary, through the above structural design, the utility model solves the deficiencies existing in the prior art and has the characteristics of reasonable structure, good heat dissipation effect and strong practicability.
[0042] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0043] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A 3DVC heat spreader with a U-shaped groove on the heat dissipation surface, comprising a heat spreader body (100), characterized in that: The heat spreader body (100) has a heat dissipation surface (1011) and a heat source contact surface (1021) opposite to the heat dissipation surface (1011), and a plurality of heat dissipation grooves are arranged on the heat dissipation surface (1011) along the length direction.
2. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 1, characterized in that: The heat spreader body (100) comprises a first cover plate (101) and a second cover plate (102), and a sealed cavity is formed between the first cover plate (101) and the second cover plate (102).
3. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 2, characterized in that: The four corners of the first cover plate (101) and the second cover plate (102) are fixed together by means of nut columns.
4. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 3, characterized in that: The first cover plate (101) and the second cover plate (102) are both made of copper.
5. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 4, characterized in that: The first cover plate (101) is provided with a first profiling groove (1012) on one side facing the second cover plate (102), a first liquid absorbent core (104) whose shape matches that of the first profiling groove (1012) is provided in the first profiling groove (1012), the second cover plate (102) is provided with a second profiling groove (1022) on one side facing the first cover plate (101), a second liquid absorbent core (105) whose shape matches that of the second profiling groove (1022) is provided in the second profiling groove (1022), and a plurality of support columns (106) are provided between the first liquid absorbent core (104) and the second liquid absorbent core (105).
6. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 5, characterized in that: A first protrusion (1011a), a second protrusion (1011b), a third protrusion (1011c) and a fourth protrusion (1011d) are provided on the heat dissipation surface (1011), and a groove (1011k) is formed between the first protrusion (1011a), the second protrusion (1011b), the third protrusion (1011c) and the fourth protrusion (1011d).
7. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 6, characterized in that: The first protrusion (1011a) and the third protrusion (1011c) are arranged opposite to each other, and the second protrusion (1011b) and the fourth protrusion (1011d) are arranged opposite to each other. The first protrusion (1011a) and the third protrusion (1011c) are both provided with a plurality of first heat dissipation grooves (1011e), and the second protrusion (1011b) and the fourth protrusion (1011d) are both provided with a second heat dissipation groove (1011f).
8. The 3DVC heat spreader with U-shaped grooves on the heat dissipation surface according to claim 7, characterized in that: A third heat dissipation groove (1011g) is provided at the connection between the second protrusion (1011b) and the first protrusion (1011a) and the third protrusion (1011c), and a fourth heat dissipation groove (1011h) is provided at the connection between the fourth protrusion (1011d) and the first protrusion (1011a) and the third protrusion (1011c).