Heat dissipation mechanism of silicon carbide power device

Abstract

The utility model discloses a heat dissipation mechanism of a silicon carbide power device, which relates to the technical field of silicon carbide devices and comprises a silicon carbide power device body, a heat conduction connecting piece and a bottom plate. The bottom plate is provided with a heat dissipation assembly capable of conducting heat dissipation on the silicon carbide power device body and an adjusting assembly used for adjusting the distance between the heat dissipation fins, the effect of adjusting the distance between the heat dissipation fins is achieved through mutual cooperation of the heat dissipation assembly and the adjusting assembly, and according to the specific requirements of the silicon carbide power device body during working, the heat dissipation assembly can conduct heat dissipation on the silicon carbide power device body. The distance between the cooling fins is adjusted through the adjusting assembly, so that the heat dissipation efficiency of the heat dissipation mechanism is optimal, the heat dissipation effect of the mechanism is improved, the application range of the mechanism is expanded, and meanwhile the convenience and flexibility of the mechanism are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide devices, and particularly relates to a heat dissipation mechanism for a silicon carbide power device. Background Art

[0002] Power semiconductor devices refer to electronic devices directly used for power conversion or control in power circuits. Silicon carbide, as a material of the third-generation wide bandgap semiconductor, has high critical breakdown electric field, excellent thermal conductivity, high load current density, and good performance for working at high temperatures.

[0003] When the power device is in a working state, a large amount of heat will be generated by the device itself. However, the working temperature of the power device is usually limited. If the temperature exceeds the limit, its working performance or efficiency will be greatly reduced. Therefore, a heat dissipation mechanism is needed to dissipate heat from the power device during operation. However, most of the existing heat dissipation mechanisms cannot adjust the spacing between the heat sinks. The spacing between the heat sinks is one of the key factors affecting the heat dissipation efficiency of the heat dissipation mechanism. For example, in a high-power or high-temperature environment, a smaller spacing may help improve the heat dissipation efficiency. However, as the spacing between the heat sinks decreases, the thermal boundary layer may merge faster, resulting in a decrease in the heat transfer rate. Therefore, if the spacing between the heat sinks cannot be adjusted according to specific requirements, it may lead to the heat dissipation efficiency of the heat dissipation mechanism not reaching the optimum under certain working conditions, affecting the heat dissipation effect, poor device compatibility, limiting the application scenarios, and reducing the convenience and flexibility of the mechanism. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a heat dissipation mechanism for a silicon carbide power device, so as to solve the problems that the existing heat dissipation mechanism cannot adjust the spacing between the heat sinks according to specific requirements, resulting in the heat dissipation efficiency not reaching the optimum, affecting the heat dissipation effect, poor device compatibility, limiting the application scenarios, and reducing the convenience and flexibility of the mechanism.

[0005] A heat dissipation mechanism for a silicon carbide power device includes a silicon carbide power device body, a heat conduction connecting piece, and a bottom plate. The silicon carbide power device body is connected to the bottom plate through the heat conduction connecting piece. The bottom plate is provided with a heat dissipation component for dissipating heat from the silicon carbide power device body and an adjusting component for adjusting the spacing between the heat sinks.

[0006] Preferably, the heat dissipation component includes two symmetrically arranged mounting plates mounted on the bottom plate. A fan is provided on the mounting plate. A slide rail is provided on the bottom plate near the air blowing direction of the fan. A plurality of moving blocks are slidably arranged on the slide rail. Heat sinks are provided on the moving blocks.

[0007] Preferably, a plurality of raised points are provided on the heat sink.

[0008] Preferably, the adjusting assembly includes two symmetrically-structured grooves formed in the bottom plate. A telescopic rod is provided in each groove. A connecting block is fixedly provided at the working end of the telescopic rod. A moving plate is fixedly provided on the side wall of the connecting block. A plurality of moving grooves are provided on the moving plate. Slide rods corresponding to the moving blocks one by one are slidably provided in the moving grooves. The end of the slide rod is fixedly connected to the side wall of the moving block. A plurality of guide rails are provided on the bottom plate. The moving plate is slidably engaged with the guide rails.

[0009] Preferably, a plurality of heat dissipation holes are formed in the bottom plate.

[0010] The advantages of the present utility model are as follows: In the heat dissipation mechanism of a silicon carbide power device of the present utility model, through the mutual cooperation of the heat dissipation assembly and the adjusting assembly, the effect of adjustable heat sink spacing is achieved. According to the specific requirements during the operation of the silicon carbide power device body, the distance between the heat sinks is adjusted through the adjusting assembly, so as to optimize the heat dissipation efficiency of the heat dissipation mechanism, improve the heat dissipation effect of the mechanism, expand the applicable range of the mechanism, and at the same time enhance the convenience and flexibility of the mechanism. Description of the Drawings

[0011] Figure 1 、 2 are schematic structural diagrams of different perspectives of the present utility model.

[0012] Figure 3 is a schematic structural diagram of the adjusting mechanism in the present utility model.

[0013] Figure 4 is a cross-sectional view of the present utility model.

[0014] Among them, 100, silicon carbide power device body; 101, heat conduction connecting piece; 102, bottom plate; 103, heat dissipation hole; 200, heat dissipation assembly; 201, mounting plate; 202, fan; 203, heat sink; 204, raised point; 300, adjusting assembly; 301, moving plate; 302, moving groove; 303, slide rod; 304, moving block; 305, slide rail; 306, connecting block; 307, telescopic rod; 308, groove; 309, guide rail. Detailed Embodiments

[0015] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0016] As Figures 1 to 4As shown in the figure, a heat dissipation mechanism for a silicon carbide power device includes a silicon carbide power device body 100, a heat conduction connecting piece 101, and a bottom plate 102. The silicon carbide power device body 100 is connected to the bottom plate 102 through the heat conduction connecting piece 101. A heat dissipation component 200 capable of dissipating heat from the silicon carbide power device body 100 and an adjustment component 300 for adjusting the distance between the heat sinks 203 are provided on the bottom plate 102.

[0017] By providing the heat dissipation component 200 and the adjustment component 300, the heat conducted out through the heat conduction connecting piece 101 when the silicon carbide power device body 100 is working is dissipated by the heat dissipation component 200, ensuring the stable operation of the silicon carbide power device body 100. At the same time, according to the specific requirements when the silicon carbide power device body 100 is working, the distance between the heat sinks 203 can be adjusted through the adjustment component 300, so that the heat dissipation efficiency of the heat dissipation mechanism reaches the optimal value, maximizing the heat dissipation performance and effect of the entire heat dissipation mechanism, and ensuring the reliability and durability of the silicon carbide power device body 100 during use.

[0018] In this embodiment, the heat dissipation component 200 includes two symmetrically structured mounting plates 201 mounted on the bottom plate 102. A fan 202 is provided on the mounting plate 201. A slide rail 305 is provided on the bottom plate 102 near the air blowing direction of the fan 202. A plurality of moving blocks 304 are slidably provided on the slide rail 305, and heat sinks 203 are provided on the moving blocks 304.

[0019] The fan 202 generates an air flow, blows air over the surface of the heat sink 203, accelerates the transfer and dissipation of heat, so as to be able to more effectively take away the heat, reduce the temperature of the silicon carbide power device body 100, protect the silicon carbide power device body 100 from high-temperature damage, and avoid the performance decline or failure caused by overheating, significantly improving the heat dissipation efficiency of the mechanism.

[0020] In this embodiment, a plurality of raised points 204 are provided on the heat sink 203.

[0021] The raised points 204 are evenly distributed on the surface of the heat sink 203, increasing the heat dissipation area of the heat sink 203, which helps to improve the heat dissipation performance of the mechanism.

[0022] In this embodiment, the adjusting component 300 includes two symmetrically structured grooves 308 formed in the bottom plate 102. An expansion link 307 is disposed in each groove 308. A connecting block 306 is fixedly provided at the working end of the expansion link 307. A moving plate 301 is fixedly provided on the side wall of the connecting block 306. A plurality of moving grooves 302 are formed in the moving plate 301. Slide bars 303 corresponding to the moving blocks 304 are slidably disposed in the moving grooves 302. The end of each slide bar 303 is fixedly connected to the side wall of the corresponding moving block 304. A plurality of guide rails 309 are provided on the bottom plate 102. The moving plate 301 is slidably engaged with the guide rails 309.

[0023] When it is necessary to adjust the spacing between the heat sinks 203 according to the specific requirements during the operation of the silicon carbide power device body 100, the expansion link 307 drives the moving plate 301 to move along the guide rail 309, and then drives the slide bar 303 to move along the moving groove 302. The slide bar 303 drives the moving block 304 to move along the slide rail 305, thereby adjusting the distance between the heat sinks 203, realizing the equidistant adjustment of the heat sinks 203, improving the heat dissipation efficiency of the heat dissipation mechanism, enhancing the device compatibility of the mechanism, and at the same time improving the convenience and flexibility of the mechanism.

[0024] In this embodiment, a plurality of heat dissipation holes 103 are formed in the bottom plate 102.

[0025] Forming the heat dissipation holes 103 is beneficial to enhancing the heat dissipation effect of the mechanism.

[0026] Working process and principle: When the device is in use, the silicon carbide power device body 100 conducts the heat generated during operation to the heat sinks 203 through the heat conduction connecting piece 101. The fan 202 generates an air flow to blow air over the surface of the heat sinks 203, accelerating the transfer and dissipation of heat, so as to more effectively remove the heat, reduce the temperature of the silicon carbide power device body 100, protect the silicon carbide power device body 100 from high-temperature damage, and avoid the performance degradation or failure caused by overheating. Moreover, according to the specific requirements during the operation of the silicon carbide power device body 100, the spacing between the heat sinks 203 can be adjusted. The expansion link 307 drives the moving plate 301 to move along the guide rail 309, and then drives the slide bar 303 to move along the moving groove 302. The slide bar 303 drives the moving block 304 to move along the slide rail 305, thereby adjusting the distance between the heat sinks 203, realizing the equidistant adjustment of the heat sinks 203, significantly improving the heat dissipation efficiency of the mechanism, enhancing the device compatibility of the mechanism, and at the same time improving the convenience and flexibility of the mechanism.

[0027] As is known by common technical knowledge, the present utility model can be implemented by other embodiments that do not depart from its spiritual essence or essential features. Therefore, the above-disclosed embodiments are illustrative in all aspects and not exclusive. All changes within the scope of the present utility model or within the scope equivalent to the present utility model are encompassed by the present utility model.

Claims

1. A heat dissipation mechanism for a silicon carbide power device, characterized in that: The invention comprises a silicon carbide power device body (100), a heat-conducting connector (101) and a base plate (102); the silicon carbide power device body (100) is connected to the base plate (102) via the heat-conducting connector (101); and the base plate (102) is provided with a heat dissipation component (200) capable of dissipating heat from the silicon carbide power device body (100) and an adjustment component (300) for adjusting the spacing between heat sinks (203).

2. The heat dissipation mechanism of a silicon carbide power device according to claim 1, characterized in that: The heat dissipation assembly (200) comprises two mounting plates (201) symmetrically mounted on a base plate (102); a fan (202) is disposed on the mounting plates (201); a slide rail (305) is disposed on the base plate (102) at a position close to the blowing direction of the fan (202); a plurality of moving blocks (304) are slidably mounted on the slide rail (305); and a heat sink (203) is disposed on the moving blocks (304).

3. The heat dissipation mechanism of a silicon carbide power device according to claim 2, characterized in that: The heat sink (203) is provided with a plurality of protruding points (204).

4. The heat dissipation mechanism of a silicon carbide power device according to claim 2, characterized in that: The adjustment component (300) comprises two symmetrical grooves (308) opened on the bottom plate (102), a telescopic rod (307) is arranged in the groove (308), a connecting block (306) is fixedly arranged on the working end of the telescopic rod (307), a movable plate (301) is fixedly arranged on the side wall of the connecting block (306), a plurality of movable grooves (302) are arranged on the movable plate (301), a sliding rod (303) corresponding to the movable block (304) is slidably arranged in the movable groove (302), an end of the sliding rod (303) is fixedly connected to the side wall of the movable block (304), a plurality of guide rails (309) are arranged on the bottom plate (102), and the movable plate (301) is slidably matched with the guide rails (309).

5. The heat dissipation mechanism of a silicon carbide power device according to claim 1, characterized in that: The bottom plate (102) is provided with a plurality of heat dissipation holes (103).

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