Production system for metal back plate of photovoltaic module

Abstract

The utility model provides a photovoltaic module metal backboard production system. The photovoltaic module metal backboard production system comprises a discharging and cutting unit, a laser cutting unit, a waste removing unit, a hot pressing unit and a separating unit. The emptying and cutting unit comprises an emptying mechanism and a cutting mechanism, and copper foil released by the emptying mechanism is cut by the cutting mechanism; the laser cutting unit comprises a laser device, and the cut copper foil is processed into a required pattern through the laser device; the copper foil processed by the laser comprises an effective metal circuit and a waste copper wire, after the waste copper wire is removed by the waste removing unit, the effective metal circuit and the backboard are subjected to hot-pressing compounding in the hot-pressing unit to obtain a metal backboard, and the metal backboard is separated from a carrier for bearing the metal backboard in the separating unit. According to the application, the copper foil is firstly cut, and then the copper foil is subjected to laser processing, the waste copper wire is removed, and the effective metal circuit and the backboard are subjected to hot pressing in sequence, so that the removal process of the waste copper wire is reliable, the removal success rate of the waste copper wire is improved, and the processing time of the whole metal backboard is saved.

Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic module production. Specifically, it relates to a production system for the metal backplane of photovoltaic modules. Background Art

[0002] In the existing or traditional manufacturing process of the metal backplane of back-contact solar cell modules, metal copper foil and a PET backplane with an adhesive layer are often used for thermal roll lamination. After that, it is cut according to the required length, then laser circuit processing is carried out according to the required pattern. Finally, after the waste copper foil wire is peeled off by relevant equipment or manually, a metal backplane with metal circuits is obtained through a series of subsequent processes.

[0003] Due to process requirements, during the production of the metal backplane, the effective metal circuit part needs to be strongly adhered to the PET backplane to prevent displacement between the copper foil and the PET backplane in subsequent processes. The non-effective metal circuit part (waste copper wire) needs to have as small an adhesive force as possible with the PET backplane so that it can be quickly separated from the PET backplane by relevant equipment or manually. In the prior art, the above two requirements cannot be met simultaneously. And due to the design of the copper foil circuit, the circuit of the waste copper wire is complex and curved. When using the existing equipment or manually separating the waste copper wire from the PET backplane, some waste copper wires are prone to breakage. If it breaks, it needs to start over, thus reducing the separation success rate and increasing the separation time. And due to the great difficulty of starting up the equipment, the efficiency of separating the waste copper wire and the PET backplane using the prior art is low and the difficulty is high. Summary of the Utility Model

[0004] In view of this, this application provides a production system for the metal backplane of photovoltaic modules, which removes waste copper wires before the copper foil and the backplane are hot-pressed and laminated together, ensuring the reliability of removing waste copper wires and increasing the success rate of removing waste copper wires.

[0005] A production system for the metal backplane of photovoltaic modules, characterized in that it includes a feeding and cutting unit, a laser cutting unit, a waste removing unit, a hot pressing unit, and a separating unit;

[0006] The feeding and cutting unit includes a feeding mechanism and a cutting mechanism, and the copper foil released by the feeding mechanism is cut by the cutting mechanism;

[0007] The laser cutting unit includes a laser, and the cut copper foil is processed by the laser to form the required pattern;

[0008] The copper foil processed by the laser includes effective metal circuits and waste copper wires. After the waste copper wires are removed by the waste removal unit, the effective metal circuits are thermocompression bonded with the backplane in the thermocompression unit to obtain a metal backplane, and the metal backplane is separated from the carrier carrying the metal backplane in the separation unit.

[0009] Preferably, the copper foil is cut by the cutting mechanism and placed on the carrier, and the carrier carries the copper foil through the laser cutting unit, the waste removal unit, and the thermocompression unit in sequence.

[0010] Preferably, the carrier has an adsorption unit, and at the laser cutting unit, the waste removal unit, and the thermocompression unit, the adsorption unit adsorbs the effective metal circuits on the carrier.

[0011] Preferably, at least one conveying roller is provided between the unwinding mechanism and the cutting mechanism.

[0012] Preferably, along the conveying direction of the copper foil, a feeding mechanism is provided between the conveying roller close to the cutting mechanism and the cutting mechanism. The copper foil released by the unwinding mechanism is conveyed to the feeding mechanism through the conveying roller, and then conveyed to the cutting mechanism through the feeding mechanism.

[0013] Preferably, the laser cutting unit further includes a head clamp, a tail clamp, and a first driving mechanism, and the first driving mechanism can at least drive the head clamp to move back and forth along the conveying direction of the copper foil;

[0014] After the head end of the copper foil passes through the cutting mechanism, it is clamped by the head clamp, and under the drive of the first driving mechanism, it moves away from the cutting mechanism along the conveying direction of the copper foil until the distance between the head end of the copper foil and the cutting mechanism reaches a preset length, and then the copper foil is cut by the cutting mechanism;

[0015] The tail end of the cut copper foil is clamped by the tail clamp, and the cut copper foil is transported to the carrier under the mutual cooperation of the head clamp and the tail clamp.

[0016] Preferably, the laser cutting unit further includes a linear motion module, and the linear motion module drives the carrier carrying the copper foil to move step by step to directly below the laser.

[0017] Preferably, the waste removal unit includes a flipping frame, a waste cleaning module, a rotation driving mechanism, and a positioning and clamping mechanism. The power output end of the rotation driving mechanism is connected to the flipping frame, the positioning and clamping mechanism is arranged on the flipping frame, and the positioning and clamping mechanism fixes the carrier carrying the laser-processed copper foil on the flipping frame;

[0018] The rotation driving mechanism drives the flipping frame to drive the carrier to rotate 180°, so that the front side of the copper foil faces downward. The waste removal module can at least move from one end of the flipping frame to the other end, and the waste removal module removes the waste copper wires during the movement.

[0019] After the waste copper wires are removed, the rotation driving mechanism drives the flipping frame to drive the carrier to rotate 180° again, so that the front side of the copper foil faces upward.

[0020] Preferably, the waste removal module does not contact the effective metal circuit during the movement.

[0021] Preferably, the photovoltaic module metal backplane production system further includes a backplane bearing platform and a backplane handling module. After the waste copper wires are removed and the front side of the copper foil faces upward, the backplane handling module transports the backplane placed on the backplane bearing platform to the carrier, so that the adhesive layer of the backplane contacts the effective metal circuit.

[0022] Preferably, the photovoltaic module metal backplane production system further includes a moving mechanism. The moving mechanism drives the backplane bearing platform to move above the carrier or away from above the carrier, and the backplane handling module is located above the carrier.

[0023] After the waste copper wires are removed and the front side of the copper foil faces upward, the moving mechanism drives the backplane bearing platform to move above the carrier and below the backplane handling module. The backplane handling module removes the backplane on the carrier from the backplane bearing platform. Subsequently, the moving mechanism drives the backplane bearing platform to leave above the carrier, and the backplane handling module then places the backplane on the copper foil.

[0024] Preferably, the hot pressing unit includes a hot pressing platform and a hot pressing plate arranged above the hot pressing platform. At least one of the hot pressing platform, the hot pressing plate, and the carrier has a heating unit.

[0025] After the carrier carrying the copper foil and the backplane is transported to the hot pressing platform, the hot pressing plate presses down on the backplane, wherein the adhesive layer of the backplane contacts the effective metal circuit, or after the carrier carrying the copper foil is transported to the hot pressing platform, the backplane is transported to the carrier so that the adhesive layer of the backplane contacts the effective metal circuit, and then the hot pressing plate presses down on the backplane.

[0026] Preferably, the separation unit includes a jaw assembly and a moving separation assembly. The jaw assembly clamps one end of the metal backplane and lifts it upward to a preset height, creating a gap between the metal backplane and the carrier. The moving separation assembly moves from the gap to the other end of the metal backplane, separating the metal backplane from the carrier.

[0027] Preferably, it further includes a conveying module. Through the conveying module, the carrier carrying the laser-processed copper foil is sequentially conveyed to the laser cutting unit, the waste removing unit, and the hot pressing unit, and the carrier carrying the metal backplane is conveyed from the hot pressing unit to the separation unit.

[0028] The beneficial effects of this application are as follows:

[0029] 1. Cut the copper foil to the required length, laser process the required pattern on the copper foil and then remove the waste copper wires, and then hot press the effective metal circuit together with the backplane, thereby ensuring the reliability of the waste copper wire removal process, improving the success rate of waste copper wire removal, and saving the processing time of the entire metal backplane.

[0030] 2. During the process from laser processing to hot pressing and compounding, the copper foil is placed on the carrier for processing. This is convenient for operation and can ensure the flatness and precision of laser circuit processing and hot pressing and compounding on the copper foil, guaranteeing the production stability of the metal backplane. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0032] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which this application can be implemented. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope that can be covered by the technical content disclosed in this application without affecting the effects that this application can produce and the purposes that can be achieved.

[0033] Figure 1 It is a schematic structural diagram of a metal backplane production system for photovoltaic modules;

[0034] Figure 2 It is a schematic structural diagram of a feeding and cutting unit;

[0035] Figure 3 It is a schematic structural diagram of a laser cutting unit;

[0036] Figure 4 It is a top view of a waste removing unit;

[0037] Figure 5 It is a schematic structural diagram of a hot pressing unit;

[0038] Figure 6 It is a schematic structural diagram of a separating unit.

[0039] Among them, 1 is a feeding and cutting unit; 11 is a feeding mechanism; 12 is a cutting mechanism; 13 is a conveying roller; 14 is a feeding mechanism; 2 is a laser cutting unit; 21 is a laser; 22 is a first clamp; 23 is a tail clamp; 24 is a linear motion module; 3 is a waste removing unit; 31 is a flipping frame; 32 is a waste cleaning module; 33 is a rotary driving mechanism; 4 is a hot pressing unit; 41 is a hot pressing platform; 42 is a hot pressing plate; 5 is a separating unit; 51 is a jaw assembly; 6 is a carrier. Specific embodiments

[0040] Next, the embodiments in the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0041] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0042] The present application provides a production system for a metal backplane of a photovoltaic module. Referring to Figure 1-6 , it includes a feeding and cutting unit 1, a laser cutting unit 2, a waste removing unit 3, a hot pressing unit 4, and a separating unit 5;

[0043] The feeding and cutting unit 1 includes a feeding mechanism 11 and a cutting mechanism 12, and the copper foil released by the feeding mechanism 11 is cut by the cutting mechanism 12;

[0044] The laser cutting unit 2 includes a laser 21, and the cut copper foil is processed by the laser 21 to form the required pattern;

[0045] The copper foil processed by the laser 21 includes effective metal lines and waste copper wires. After the waste copper wires are removed by the waste removing unit 3, the effective metal lines are thermally pressed and compounded with the backplane in the hot pressing unit 4 to obtain a metal backplane, and the metal backplane is separated from the carrier 6 carrying the metal backplane in the separating unit 5.

[0046] At the beginning, the coiled copper foil is manually loaded onto the unwinding mechanism 11. The copper foil released from the coiled copper foil passes through the cutting mechanism 11, and then after being pulled out by a preset length, it is cut by the cutting mechanism 12 to obtain copper foil of the required size. The cut copper foil is conveyed below the laser 21, and the required pattern is processed on the copper foil by the laser 21. Then it is moved to the waste removal unit 3, and the waste copper wires generated by laser processing are removed by the waste removal unit 3, so that only the effective metal circuit part remains on the copper foil. Then at the hot pressing unit 4, the effective metal circuit of the copper foil is hot pressed and compounded with the backplane by the hot pressing unit 4. Specifically, the adhesive layer of the backplane is heated by the hot pressing unit 4 to make it adhesive, so that the effective metal circuit is adhered to the backplane through the adhesive layer.

[0047] During the hot pressing process, due to the fact that the size of the backplane is larger than that of the copper foil and the pattern formed by laser processing of the copper foil, part of the adhesive layer of the backplane will overflow between the copper foil and the carrier 6 after heating, resulting in a certain adhesiveness between the metal backplane formed after hot pressing and the carrier 6. For this reason, it is necessary to separate the metal backplane and the carrier 6 through the separation unit 5.

[0048] By using the photovoltaic module metal backplane production system provided by the present application to prepare the metal backplane, it can ensure the reliability of the waste copper wire removal process, improve the success rate of waste copper wire removal, and save the processing time of the entire processing process.

[0049] In order to better convey the copper foil between each processing unit, the copper foil is placed on the carrier 6 after being cut by the cutting mechanism 12, and the carrier 6 carries the copper foil through the laser cutting unit 2, the waste removal unit 3 and the hot pressing unit 4 in sequence.

[0050] Since the copper foil is very thin and cannot be well moved to the subsequent processing stations after the corresponding pattern is processed by the laser 21, in this embodiment, the copper foil is placed on the carrier 6 after being cut, and the copper foil is conveyed to the laser cutting unit 2, the waste removal unit 3 and the hot pressing unit 4 in sequence by moving the carrier 6. This method can well move the copper foil, improve the processing efficiency of the metal backplane, and effectively prevent the copper foil from being damaged during the moving process.

[0051] Furthermore, the carrier 6 has an adsorption unit, and at the laser cutting unit 2, the waste removal unit 3 and the hot pressing unit 4, the adsorption unit adsorbs the effective metal circuit on the carrier 6.

[0052] It can be understood that after the copper foil is cut to the required size, the copper foil is placed on the carrier 6, adsorbed on the carrier 6 by the adsorption unit, and then transferred to the laser cutting unit 2, the waste removal unit 3 and the hot pressing unit 4. Specifically, the adsorption unit is arranged corresponding to the pattern processed by the laser, so that after being processed by the laser 21, only the effective metal circuit is adsorbed by the adsorption unit, while the waste copper wire is not adsorbed, which is convenient for removing the waste copper wire through the waste removal device 3 and preventing the effective metal circuit from being damaged during the processing of each subsequent process.

[0053] The adsorption unit includes a vacuum pumping device, an adsorption chamber and a plurality of adsorption holes. The adsorption holes are arranged on the surface of the carrier 6 in contact with the copper foil, and the adsorption chamber is arranged inside the carrier 6. Each adsorption hole is communicated with the adsorption chamber. After the copper foil is placed on the carrier 6, the adsorption chamber is evacuated by the vacuum pumping device, so that the adsorption holes adsorb the effective metal circuit part of the copper foil on the carrier 6.

[0054] As Figure 2 shown, at least one conveying roller 13 is arranged between the feeding mechanism 11 and the cutting mechanism 12. The conveying direction of the copper foil is changed by the conveying roller 13, so that the copper foil released by the feeding mechanism 11 is conveyed to the cutting mechanism 12.

[0055] In addition, along the conveying direction of the copper foil, a feeding mechanism 14 is arranged between the conveying roller 13 close to the cutting mechanism 12 and the cutting mechanism 12. The copper foil released by the feeding mechanism 11 is conveyed to the feeding mechanism 14 through the conveying roller 13 and then conveyed to the cutting mechanism 12 through the feeding mechanism 14.

[0056] The specific structure of the feeding mechanism 14 is the prior art and will not be described in detail here. In this application, the copper foil is conveyed to the cutting mechanism 12 through the feeding mechanism 14, which can make the cutting alignment accuracy better and facilitate the cutting mechanism 12 to cut the copper foil to the required size.

[0057] Referring to Figure 1 and Figure 3 , the laser cutting unit 2 further includes a head clamp 22, a tail clamp 23 and a first driving mechanism. The first driving mechanism can at least drive the head clamp 22 to move back and forth along the conveying direction of the copper foil;

[0058] After the head end of the copper foil passes through the cutting mechanism 12, it is clamped by the head clamp 22 and driven by the first driving mechanism to move away from the cutting mechanism 12 along the conveying direction of the copper foil until the distance between the head end of the copper foil and the cutting mechanism reaches a preset length, and then the cutting mechanism 12 cuts off the copper foil;

[0059] The tail end of the copper foil after being cut is clamped by the tail clip 23, and under the mutual cooperation of the head clip 22 and the tail clip 23, the cut copper foil is transported onto the carrier 6.

[0060] Initially, as Figure 3 shown, the head clip 22 is located at one end close to the cutting mechanism 12, and the carrier 6 is placed in advance at the laser cutting unit 2. The coiled copper foil is manually loaded onto the feeding mechanism 11, and the copper foil at the feeding mechanism 11 is sequentially pulled and wound around each conveying roller 13 manually, and then the head end of the copper foil is pulled to the feeding mechanism 14. The feeding mechanism 14 passes the head end of the copper foil through the cutting mechanism 12 and conveys it to the head clip 22. The head clip 22 clamps the head end of the copper foil. Under the action of the first driving mechanism, the head clip 22 moves away from the cutting mechanism 12 along the conveying direction of the copper foil until the length from the head end of the copper foil to the cutting mechanism 12 reaches the required length. Then the cutting mechanism 12 cuts the copper foil to form the tail end of the copper foil, and the tail clip 23 clamps the tail end of the copper foil. Together with the cooperation of the head clip 22, the copper foil is transported onto the carrier 6.

[0061] The specific structures of the first driving mechanism and the cutting mechanism 12 are prior arts. As long as the head clip 22 can move back and forth along the conveying direction of the copper foil and the copper foil can be cut off, the length from the head end of the copper foil to the cutting mechanism 12 can be measured by existing distance measuring instruments.

[0062] In this embodiment, a second driving mechanism is further provided on the laser cutting unit 2. After the tail clip 23 clamps the tail end of the copper foil, the second driving mechanism can drive the head clip 22 and the tail clip 23 to move synchronously above the carrier 6. Then the head clip 22 and the tail clip 23 release the copper foil so that the copper foil is placed on the carrier 6. This process can determine the position between the copper foil and the carrier 6 through an existing positioning mechanism to ensure that the copper foil can be placed on the carrier 6. Further, a third driving mechanism can be set up. When the copper foil moves above the carrier 6, the third driving mechanism drives the head clip 22 and the tail clip 23 to move synchronously downward until the copper foil contacts the upper surface of the carrier 6, and then the head clip 22 and the tail clip 23 release the copper foil again, which can further prevent the position of the copper foil placed on the carrier 6 from shifting. The specific structures of the second driving mechanism and the third driving mechanism are prior arts and will not be described in detail here. For example, they can both be air cylinders, etc.

[0063] In addition, the present application also has a head clip driving mechanism and a tail clip driving mechanism. The head clip driving mechanism can drive the head clip 22 to clamp the head end of the copper foil, and the tail clip driving mechanism can drive the tail clip 23 to clamp the tail end of the copper foil.

[0064] It can be understood that the front clamp 22 and the rear clamp 23 can both be jaw structures that grip both ends of the copper foil, or they can both be suction claws that suck both ends of the copper foil through vacuum suction, or one of the front clamp 22 and the rear clamp 23 can be a jaw structure and the other can be a suction claw structure. The present application does not limit the specific structures of the front clamp 22 and the rear clamp 23, as long as the front end of the copper foil can be gripped by the front clamp 22 and the rear end of the copper foil can be gripped by the rear clamp 23.

[0065] In a preferred embodiment, the rear clamp 23 is a suction claw and the front clamp 22 is a jaw. When the copper foil is conveyed to the front clamp 22, under the action of the front clamp driving mechanism, the front clamp 22 grips the front end of the copper foil, and after the copper foil is pulled to the required length under the action of the first driving mechanism, the rear clamp 23 moves downward under the action of the rear clamp driving mechanism to adsorb the rear end of the copper foil, and then the cutting mechanism 12 cuts off the copper foil. In this way, in cooperation with the feeding mechanism 14, the positions of the copper foil in front of and behind the cutting mechanism 12 are both pressed during cutting, which can make the cutting effect better.

[0066] Continue to refer to Figure 3 , the laser cutting unit 2 further includes a linear motion module 24, and the linear motion module 24 drives the carrier 6 carrying the copper foil to move step by step directly below the laser 21.

[0067] After the copper foil is placed on the carrier 6, the linear motion module 24 moves the carrier 6 carrying the copper foil step by step below the laser 21, so as to laser process the required pattern on the entire copper foil through the laser 21. It can be understood that in the pattern obtained after laser processing, the effective metal circuit part is adsorbed on the carrier 6, and the waste copper wire part is not adsorbed on the carrier 6. Therefore, the position between the laser 21 and the copper foil needs to be positioned before laser processing to ensure that the laser processing path does not shift. The device for positioning the position between the laser 21 and the copper foil is a prior art and will not be specifically introduced here.

[0068] As Figure 4 shown, the waste removing unit 3 includes a turning frame 31, a waste cleaning module 32, a rotary driving mechanism 33 and a positioning and clamping mechanism. The power output end of the rotary driving mechanism 33 is connected to the turning frame 31, and the positioning and clamping mechanism is arranged on the turning frame 31. The positioning and clamping mechanism fixes the carrier 6 carrying the copper foil after laser processing on the turning frame 31;

[0069] The rotation drive mechanism drives the flipping frame 31 to drive the carrier 6 to rotate 180°, so that the front side of the copper foil faces downward. The waste removal module 32 can move at least from one end of the flipping frame 31 to the other end of the flipping frame 31, and the waste removal module 32 removes the waste copper wires during the movement.

[0070] After the waste copper wires are removed, the rotation drive mechanism drives the flipping frame 31 to drive the carrier 6 to rotate 180° again, so that the front side of the copper foil faces upward.

[0071] Specifically, after the required pattern is laser processed on the copper foil, the carrier 6 carrying the copper foil is transferred to the flipping frame 31, and the carrier 6 is fixed on the flipping frame 31 through a positioning and clamping mechanism. The structure of the positioning and clamping mechanism is prior art. As long as the carrier 6 can be fixed on the flipping frame 31 during the flipping and waste removal process, and after the waste removal is completed and the carrier 6 is flipped so that the front side of the copper foil faces upward, the positioning and clamping mechanism can release the carrier 6, enabling the carrier 6 to be removed from the flipping frame 31. For example, the positioning and clamping mechanism can be a buckle. By arranging multiple buckles on the flipping frame 31, the carrier 6 is fixed on the flipping frame 31 through the buckles after the carrier 6 is placed on the flipping frame 31. When the carrier 6 needs to be removed from the flipping frame 31, the buckles are released.

[0072] After the carrier 6 is fixed on the flipping frame 31 through the positioning and clamping mechanism, the rotation drive mechanism 33 drives the flipping frame 31 to rotate 180°, so that the copper foil on the carrier 6 faces downward. It can be understood that during the entire waste removal process, the effective metal circuit of the copper foil has been adsorbed on the carrier 6 all the time, while the waste copper wires have not been adsorbed on the carrier 6. When the flipping frame 31 rotates 180° to make the front side of the copper foil face downward, some waste copper wires will separate from the carrier 6. Subsequently, the waste removal module 32 moves from one end of the flipping frame 31 to the other end of the flipping frame 31. During the movement, the waste removal module 32 causes the waste copper wires that have not separated from the carrier 6 to separate from the carrier 6.

[0073] In order to make all the waste copper wires separate from the carrier 6, the waste removal module 32 can move back and forth between the two ends of the flipping frame 31 for multiple times, and the specific number of times can be determined according to the actual effect.

[0074] In this embodiment, the waste removal module 32 can be a waste removal roller driven by a waste removal drive mechanism, that is, the waste removal roller moves back and forth between the two ends of the flipping frame 31 under the action of the waste removal drive mechanism. During the movement, the waste removal roller contacts the waste copper wires, and under the action of the waste removal roller, the waste copper wires are completely separated from the carrier 6. In this way, the waste removal module 32 (i.e., the waste removal roller) does not contact the effective metal circuit during the movement, so as to avoid the waste removal module 32 damaging the effective metal circuit.

[0075] Alternatively, the waste removal module 32 can also be a blowing mechanism driven by a waste removal drive mechanism. Under the action of the waste removal drive mechanism, the blowing mechanism moves back and forth between the two ends of the flipping frame 31. During the movement, the blowing mechanism blows off the waste copper wires that are still in contact with the carrier 6, so that all the waste copper wires are completely separated from the carrier 6. In this embodiment, it is preferably to use this method to remove the waste copper wires, and the removal effect of the waste copper wires by the blowing mechanism is better.

[0076] In this embodiment, the photovoltaic module metal backplane production system further includes a backplane carrying platform and a backplane handling module. After the waste copper wires are removed and the copper foil faces upward, the backplane handling module transports the backplane placed on the backplane carrying platform to the carrier 6, so that the adhesive layer of the backplane contacts the effective metal circuit.

[0077] Furthermore, the photovoltaic module metal backplane production system further includes a moving mechanism. The moving mechanism drives the backplane carrying platform to move above the carrier 6 or away from above the carrier 6. The backplane handling module is located above the carrier 6;

[0078] After the waste copper wires are removed and the copper foil faces upward, the moving mechanism drives the backplane carrying platform to move above the carrier 6 and below the backplane handling module. The backplane handling module removes the backplane on the carrier 6 from the backplane carrying platform. Subsequently, the moving mechanism drives the backplane carrying platform to leave above the carrier 6, and the backplane handling module then places the backplane on the copper foil.

[0079] The backplane handling module in this embodiment can be a structure including a lifting drive mechanism and a plurality of suction cups. After the backplane carrying platform moves above the carrier 6, the lifting drive mechanism drives all the suction cups to move downward until the suction cups suck the backplane on the backplane carrying platform and move the backplane upward to separate it from the backplane carrying platform. Subsequently, the moving mechanism drives the backplane carrying platform to leave above the carrier 6 and return to the initial position to receive the next backplane. Finally, under the action of the lifting drive mechanism, the backplane sucked by the suction cups moves downward to contact the copper foil, and then the suction cups release the backplane so that the backplane is placed on the copper foil. Subsequently, the lifting drive mechanism drives the suction cups to move upward to the initial position to prepare for handling the next backplane.

[0080] In this embodiment, the backplane carrying platform and the backplane handling module can be arranged at the waste removal unit 3, or can be arranged on the conveying path between the waste removal unit 3 and the hot pressing unit 4, or can also be arranged at the hot pressing unit 4. Preferably, the backplane carrying platform is arranged beside the waste removal unit 3, and the backplane handling module is arranged above the flipping frame 31 and does not affect the flipping of the flipping frame 31.

[0081] The structure of the moving mechanism is prior art, and any structure capable of moving the backplane carrying platform is acceptable. Taking the backplane carrying platform and the backplane handling module arranged at the waste removing unit 3 as an example, for instance, sliders can be arranged at the bottom of the backplane carrying platform, and slide rails are arranged at positions corresponding to the sliders. The slide rails extend above the turning frame 31 all the way and will not affect the turning of the turning frame 31. Under the action of the moving driving mechanism, the sliders slide on the slide rails, so that the backplane carrying platform moves above the turning frame 31 or away from above the turning frame 31. The moving driving mechanism is a conventional existing driving mechanism, such as a cylinder or an oil cylinder, etc. Of course, the backplane handling module and the moving mechanism can also not be arranged, but instead, the backplane can be directly carried to the carrier manually, so that the backplane is placed on the effective metal circuit.

[0082] As Figure 5 shown, the hot pressing unit 4 includes a hot pressing platform 41 and a hot pressing plate 42 located above the hot pressing platform 41. At least one of the hot pressing platform 41, the hot pressing plate 42, and the carrier 6 has a heating unit;

[0083] After the carrier 6 carrying the copper foil and the backplane is conveyed to the hot pressing platform 41, the hot pressing plate 42 presses down onto the backplane, wherein the adhesive layer of the backplane contacts the effective metal circuit, or after the carrier 6 carrying the copper foil is conveyed to the hot pressing platform 41, the backplane is carried onto the carrier 6, so that the adhesive layer of the backplane contacts the effective metal circuit, and then the hot pressing plate 42 presses down onto the backplane.

[0084] During the hot pressing process, the copper foil and the backplane can be heated to a preset temperature through the heating unit arranged in the hot pressing platform 41 and / or the carrier 6, so that the adhesive layer of the backplane contacting the copper foil has adhesiveness, and then the hot pressing plate 42 presses down onto the backplane. After pressing for a certain time, the backplane and the copper foil are adhered together through the adhesive layer. It can also be that the hot pressing plate 42 presses down onto the backplane, and then the copper foil and the backplane are heated to a preset temperature through the heating unit arranged in the hot pressing platform 41 and / or the hot pressing plate 42 and / or the carrier 6, and are pressed for a certain time, so that the backplane and the copper foil are adhered together.

[0085] As Figure 6 shown, the separating unit 5 includes a jaw assembly 51 and a moving separating assembly. The jaw assembly 51 grabs one end of the metal backplane and lifts it to a preset height, so that a gap is formed between the metal backplane and the carrier 6. The moving separating assembly moves from the gap to the other end of the metal backplane, so that the metal backplane is separated from the carrier 6.

[0086] For the gripper assembly 51, any structure that can clamp one end of the metal backplane and lift it upward by a certain height to create a gap between the metal backplane and the carrier 6 is acceptable. For example, the upper gripper and the lower gripper can cooperate to grip one end of the metal backplane, and then the gripper driving mechanism drives the upper gripper and the lower gripper to move upward together, causing the end of the metal backplane clamped by the upper gripper and the lower gripper to move upward.

[0087] In this embodiment, the moving and separating assembly includes a round roller and a separating driving mechanism. Under the action of the separating driving mechanism, the round roller moves from the gap to the other end of the metal backplane, thereby gradually separating the metal backplane from the carrier 6. Using the round roller to separate the metal backplane and the carrier 6 can avoid damaging the metal backplane during the separation process. The structure of the separating driving mechanism is not specifically limited in this application, as long as it can drive the round roller to move.

[0088] To prevent the metal backplane and the carrier 6 from adhering to each other again after separation, this application drives multiple round rollers to move simultaneously through the separating driving mechanism to separate the metal backplane and the carrier 6. The separated metal backplane is placed on multiple round rollers to prevent the separated metal backplane from adhering to the carrier 6 again.

[0089] To facilitate the movement of the carrier 6 between various devices, the photovoltaic module metal backplane production system of this application further includes a conveying module. Through the conveying module, the carrier 6 carrying the laser-processed copper foil is sequentially conveyed to the waste removing unit 3 and the hot pressing unit 4, and the carrier 6 carrying the metal backplane is conveyed from the hot pressing unit 5 to the separating unit 5.

[0090] When the entire copper foil on the carrier 6 has completed laser processing, the carrier 6 at the laser cutting unit 2 is conveyed to the turning frame 31 at the waste removing unit 3 through the conveying module to remove the waste copper wires; after the waste copper wires are removed, the backplane can be first transported onto the carrier 6 so that the adhesive layer of the backplane contacts the effective metal circuit, and then the carrier 6 on the turning frame 31 is conveyed to the hot pressing platform 41 at the hot pressing unit 4 through the conveying module, or the backplane can also be transported onto the carrier 6 on the conveying module between the waste removing unit 3 and the hot pressing unit 4, and then the carrier 6 is conveyed to the hot pressing platform 41 through the conveying module, or after removing the waste copper wires, the carrier 6 carrying the effective metal circuit is conveyed to the hot pressing platform 41 through the conveying module, and then the backplane is transported onto the carrier 6 and then hot pressing is performed; when the hot pressing is completed, a metal backplane with the copper foil and the backplane compounded together is obtained. At this time, the metal backplane is still placed on the carrier 6 and adhered to the carrier 6, and the carrier 6 carrying the metal backplane needs to be conveyed from the hot pressing unit 4 to the separating unit 5 through the conveying module, and the separating unit 5 separates the metal backplane from the carrier 6.

[0091] The specific structure of the conveying module is a prior art, as long as it can achieve the functions described above, and no detailed description will be given here.

[0092] In this specification, each embodiment is described in a progressive, or parallel, or a combination of progressive and parallel manners. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and reference can be made to the description of the method part for related parts.

[0093] It should be noted that in the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present.

[0094] It also should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that an article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the existence of additional identical elements in the article or device including the above elements.

[0095] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A photovoltaic module metal backplane production system, characterized in that: It comprises a material discharging and cutting unit (1), a laser cutting unit (2), a waste removal unit (3), a hot pressing unit (4) and a separation unit (5); The material discharging and cutting unit (1) comprises a material discharging mechanism (11) and a cutting mechanism (12), and the copper foil discharged by the material discharging mechanism (11) is cut by the cutting mechanism (12); The laser cutting unit (2) comprises a laser (21), and the cut copper foil is processed by the laser (21) to form a desired pattern; The copper foil processed by the laser (21) comprises an effective metal circuit and waste copper wires. After the waste copper wires are removed by the waste removal unit (3), the effective metal circuit is hot-pressed and combined with a backplane in the hot pressing unit (4) to obtain a metal backplane. The metal backplane is separated from a carrier (6) carrying the metal backplane in the separation unit (5).

2. A photovoltaic module metal backplane production system according to claim 1, characterized in that: After being cut by the cutting mechanism (12), the copper foil is placed on the carrier (6), and the carrier (6) carries the copper foil through the laser cutting unit (2), the waste removal unit (3) and the hot pressing unit (4) in sequence.

3. A photovoltaic module metal backplane production system according to claim 2, characterized in that: The carrier (6) has an adsorption unit, and at the laser cutting unit (2), the waste removal unit (3) and the hot pressing unit (4), the adsorption unit adsorbs the effective metal circuit onto the carrier (6).

4. A photovoltaic module metal backplane production system according to any one of claims 1 to 3, characterized in that: At least one conveying roller (13) is provided between the material unloading mechanism (11) and the cutting mechanism (12).

5. A photovoltaic module metal backplane production system according to claim 4, characterized in that: Along the conveying direction of the copper foil, a feeding mechanism (14) is provided between the conveying roller (13) close to the cutting mechanism (12) and the cutting mechanism (12); the copper foil released by the discharge mechanism (11) is conveyed to the feeding mechanism (14) via the conveying roller (13), and then conveyed to the cutting mechanism (12) via the feeding mechanism (14).

6. A photovoltaic module metal backplane production system according to claim 3, characterized in that: The laser cutting unit (2) further comprises a first clamp (22), a tail clamp (23) and a first driving mechanism, wherein the first driving mechanism can at least drive the first clamp (22) to move back and forth along the conveying direction of the copper foil; After the leading end of the copper foil passes through the cutting mechanism (12), it is clamped by the leading clamp (22) and driven by the first driving mechanism to move away from the cutting mechanism (12) along the conveying direction of the copper foil until the distance between the leading end of the copper foil and the cutting mechanism reaches a preset length, and then the copper foil is cut by the cutting mechanism (12); The tail end of the cut copper foil is clamped by the tail clamp (23), and the cut copper foil is transported to the carrier (6) under the cooperation of the head clamp (22) and the tail clamp (23).

7. A photovoltaic module metal backplane production system according to claim 6, characterized in that: The laser cutting unit (2) further comprises a linear motion module (24), wherein the linear motion module (24) drives the carrier (6) carrying the copper foil to move step by step to directly below the laser (21).

8. A photovoltaic module metal backplane production system according to claim 3, characterized in that: The waste removal unit (3) comprises a turning frame (31), a waste removal module (32), a rotation drive mechanism (33) and a positioning clamping mechanism, wherein a power output end of the rotation drive mechanism (33) is connected to the turning frame (31), and the positioning clamping mechanism is arranged on the turning frame (31), and the positioning clamping mechanism fixes the carrier (6) carrying the laser-processed copper foil on the turning frame (31); The rotary drive mechanism (33) drives the flip frame (31) to drive the carrier (6) to rotate 180 degrees, so that the copper foil faces downward, and the waste removal module (32) can at least move from one end of the flip frame (31) to the other end of the flip frame (31), and the waste removal module (32) removes the waste copper wire during the movement; After the waste copper wire is removed, the rotary drive mechanism (33) drives the flip frame (31) to drive the carrier (6) to rotate 180 degrees again, so that the front side of the copper foil faces upward.

9. A photovoltaic module metal backplane production system according to claim 8, characterized in that: The waste removal module (32) does not contact the effective metal circuit during the movement.

10. A photovoltaic module metal backplane production system according to claim 8 or 9, characterized in that: The photovoltaic module metal backplane production system also includes a backplane carrying platform and a backplane transport module. When the waste copper wire is removed and the copper foil faces upward, the backplane transport module transports the backplane placed on the backplane carrying platform to the carrier (6) so that the adhesive layer of the backplane contacts the effective metal circuit.

11. A photovoltaic module metal backplane production system according to claim 10, characterized in that: The photovoltaic module metal backplane production system further comprises a moving mechanism, wherein the moving mechanism drives the backplane carrying platform to move to the top of the carrier (6), or to leave the top of the carrier (6), and the backplane handling module is located above the carrier (6); When the waste copper wire is removed and the front side of the copper foil faces upward, the moving mechanism drives the backplane carrying platform to move to the top of the carrier (6) and the bottom of the backplane transport module, and the backplane transport module moves the backplane on the carrier (6) away from the backplane carrying platform. Then, the moving mechanism drives the backplane carrying platform to leave the top of the carrier (6), and the backplane transport module places the backplane on the copper foil.

12. A photovoltaic module metal backplane production system according to claim 3, characterized in that: The hot pressing unit (4) comprises a hot pressing platform (41) and a hot pressing plate (42) arranged above the hot pressing platform (41), and at least one of the hot pressing platform (41), the hot pressing plate (42) and the carrier (6) has a heating unit; After the carrier (6) carrying the copper foil and the backplane is transferred to the hot pressing platform (41), the hot pressing plate (42) is pressed down onto the backplane, wherein the adhesive layer of the backplane is in contact with the effective metal circuit, or after the carrier (6) carrying the copper foil is transferred to the hot pressing platform (41), the backplane is moved onto the carrier (6) so that the adhesive layer of the backplane is in contact with the effective metal circuit, and then the hot pressing plate (42) is pressed down onto the backplane.

13. A photovoltaic module metal backplane production system according to any one of claims 1 to 3, characterized in that: The separation unit (5) comprises a clamping jaw assembly (51) and a movable separation assembly, wherein the clamping jaw assembly (51) clamps one end of the metal back plate and lifts it upward to a preset height, so that a gap is formed between the metal back plate and the carrier (6), and the movable separation assembly moves from the gap to the other end of the metal back plate, so that the metal back plate is separated from the carrier (6).

14. A photovoltaic module metal backplane production system according to any one of claims 2 or 3, characterized in that: The invention also comprises a conveying module, through which the carrier (6) carrying the copper foil processed by laser is sequentially conveyed to the waste removal unit (3) and the hot pressing unit (4), and the carrier (6) carrying the metal back plate is conveyed from the hot pressing unit (4) to the separation unit (5).

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