Heat dissipation installation structure of photovoltaic diode module
By setting up glue filling grooves on the plastic seal body of the photovoltaic diode module and using heat dissipation glue with high thermal conductivity, the problem of insufficient heat dissipation under traditional packaging methods is solved, and a more efficient heat dissipation effect is achieved, and the service life of the module is extended.
Patent Information
- Application Number
- CN202421842625.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-31
AI Technical Summary
Under traditional packaging mode, the thermal dissipation effect of the photovoltaic diode module is insufficient, resulting in an increase in junction temperature and affecting performance and life.
A heat dissipation installation structure of a photovoltaic diode module is designed, including setting up a glue filling groove on the plastic seal body, using high thermal conductivity to replace part of the plastic seal body, increasing the heat dissipation path, and adjusting the module layout when necessary to optimize the heat dissipation effect.
Through the improved heat dissipation structure, the heat dissipation efficiency of the photovoltaic diode module is significantly improved, which extends the service life and stabilizes the performance.
Smart Images
Figure CN222981923U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a heat dissipation and installation structure of a photovoltaic diode module. Background Art
[0002] With the development of power electronics technology, the output power and power density of power devices have been continuously improved, posing higher requirements for heat dissipation. Especially in photovoltaic systems, as a key component, the junction temperature control of Schottky diodes is directly related to the rectification performance, reliability, and system life. In the traditional packaging method, epoxy molding compound is usually used to completely cover the chip, jumper, and the frame area connected thereto. Although it can provide good mechanical protection, it limits the effective heat dissipation path of the chip, resulting in an increase in junction temperature and affecting performance and life. Summary of the Utility Model
[0003] The technical problem to be solved by the utility model is: to provide a heat dissipation and installation structure of a photovoltaic diode module in order to overcome the deficiencies existing in the prior art.
[0004] The technical solution adopted by the utility model to solve its technical problem is: a heat dissipation and installation structure of a photovoltaic diode module, including a main body. The main body includes a first copper wire frame, a second copper wire frame, a wafer, and a jumper. The bottom surface of the first copper wire frame is connected to one end of the jumper. The bottom surface of the second copper wire frame is connected to the wafer through soldering. The wafer is also connected to the other end of the jumper.
[0005] A plastic package body is arranged outside the wafer and the jumper. A glue injection groove is opened on the plastic package body on the top surface of the second copper wire frame where the wafer is located.
[0006] The main body is arranged in a junction box, and a heat dissipation glue is encapsulated in the junction box. The heat dissipation glue is poured into the glue injection groove, and the heat of the wafer is dissipated to the junction box through the heat dissipation glue for heat dissipation.
[0007] Further, the glue injection groove runs horizontally through the plastic package body.
[0008] Further, the cross-section of the glue injection groove is a trapezoid with a wider top and a narrower bottom.
[0009] Further, the junction box is connected to a photovoltaic module.
[0010] Further, the bottom of the junction box is connected to the photovoltaic module.
[0011] The beneficial effects of the utility model are: the utility model has the characteristics of simple structure, reasonable design, good heat dissipation effect, long service life of the photovoltaic diode module, and stable performance.
[0012] 1). Glue filling groove design: A glue filling groove is set in the encapsulant above the frame. Usually, both ends of the glue filling groove are through, and there are gentle slopes at the edges, which can directly expose part of the frame, or the encapsulant at the bottom of the glue filling groove can be appropriately thinned. This design reduces the barrier of the encapsulant to heat conduction, and part of the encapsulant is replaced by a thermally conductive potting adhesive with a higher thermal conductivity than the encapsulant, thereby improving the thermal conductivity efficiency.
[0013] 2). Further preferred solution: Main body flipping layout: That is, flip the diode module so that the glue filling groove of the encapsulant faces upward to form a top heat dissipation structure. After this layout change, the heat dissipation path is adjusted to two paths, directly through the potting adhesive to the cover of the junction box, reducing the number of layers of heat-resistant materials (the original heat dissipation path is encapsulant - potting adhesive - box body (including part of the adhesive) - photovoltaic module), reducing two heat-resistant material conduction paths, and greatly accelerating the heat conduction rate. It should be noted that when using the top of the flipped module for heat dissipation, the wire bonding terminal design on both sides needs to be adjusted simultaneously to be well adapted to the installation of the junction box.
[0014] 3). Flexible glue filling groove shape: Under the module flipping layout, the design of the glue filling groove is no longer limited to the through design at both ends (because there is no need to consider providing a flow path for the thermally conductive potting adhesive of the junction box), and it can be designed as a locally open square or rectangular opening according to requirements. The center of the opening is concentrated at the chip welding position, which can not only ensure the heat dissipation efficiency but also optimize the mechanical strength and stability of the encapsulant. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in this application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0016] Figure 1 It is a schematic diagram of the installation structure of the present invention.
[0017] Figure 2 It is a schematic diagram of the structure of the main body of the present invention Figure 1 .
[0018] Figure 3 It is a schematic diagram of the structure of the main body of the present invention Figure 2 .
[0019] In the figure: 1. First copper wire frame, 2. Second copper wire frame, 3. Wafer, 4. Jumper wire, 5. Solder, 6. Encapsulant, 7. Glue filling groove, 8. Upper heat dissipation glue layer, 9. Cover, 10. Lower heat dissipation glue layer, 11. Box bottom. Detailed Embodiments
[0020] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0021] Figures 1 to 3 A heat dissipation and installation structure of a photovoltaic diode module shown includes a main body. The main body includes a first copper wire frame 1, a second copper wire frame 2, a wafer 3 and a jumper 4. The bottom surface of the second copper wire frame 2 is connected to the wafer 3 through soldering tin 5. The bottom surface of the first copper wire frame 1 is connected to the jumper 4. The first copper wire frame 1 and the second copper wire frame 2 are conducted through the wafer 3 and the jumper 4. A plastic package 6 is arranged outside the wafer 3 and the jumper 4. A potting groove 7 is opened on the plastic package 6 on the top surface of the second copper wire frame 2 where the wafer 3 is located.
[0022] The main body is installed in a junction box. A heat dissipation glue is encapsulated in the junction box. After encapsulation, the heat dissipation glue is poured into the potting groove 7. Generally, an upper heat dissipation glue layer 8 is above the plastic package 6, a lid 9 of the junction box is above the upper heat dissipation glue layer 8, a lower heat dissipation glue layer 10 is below the plastic package 6, and a bottom 11 of the junction box is below the second potting glue layer 10. The heat of the wafer 3 is dissipated to the junction box through the heat dissipation glue for heat dissipation.
[0023] The junction box is connected to a photovoltaic module.
[0024] To improve the heat dissipation effect, the potting groove 7 penetrates the plastic package 6 horizontally, and the cross-section of the potting groove 7 is a trapezoid with a wider upper part and a narrower lower part.
[0025] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present utility model.
Claims
1. A heat dissipation installation structure of a photovoltaic diode module, comprising a main body, the main body comprising a first copper wire frame, a second copper wire frame, a wafer and a jumper, characterized in that: The bottom surface of the second copper wire frame is connected to the wafer through solder, the bottom surface of the first copper wire frame is connected to the jumper, and the first copper wire frame and the second copper wire frame are connected through the wafer and the jumper. A plastic package is provided outside the wafer and the jumper, and a glue pouring groove is provided on the plastic package on the top surface of the second copper wire frame where the wafer is located; The main body is arranged in a junction box, heat dissipation glue is encapsulated in the junction box, and the heat dissipation glue is poured into the glue filling groove. The heat of the wafer is dissipated to the junction box through the heat dissipation glue for heat dissipation.
2. A heat dissipation installation structure for a photovoltaic diode module according to claim 1, characterized in that: The glue pouring groove runs through the plastic packaging body transversely.
3. A heat dissipation installation structure of a photovoltaic diode module according to claim 1 or 2, characterized in that: The cross section of the glue pouring groove is a trapezoid that is wide at the top and narrow at the bottom.
4. The heat dissipation installation structure of a photovoltaic diode module according to claim 1, characterized in that: The junction box is connected to the photovoltaic module.