Pressing die

Abstract

The utility model discloses a pressing die, which is used for pressing a ring-frame-shaped groove on a colloid layer in a bowl cup of an LED (light-emitting diode) packaging structure, and comprises a main body, a plurality of hollow convex columns are arranged on the bottom surface of the main body, and the central area of the bottom surface of each hollow convex column is communicated with the hollow area of the hollow convex column. The pressing die is simple in structure and low in manufacturing cost, can synchronously press the annular frame-shaped grooves on the colloid layers in a plurality of LED packaging structures at the same time, and is beneficial to improving the production efficiency of the LED packaging structures and reducing the manufacturing cost of the LED packaging structures; the pressing die further has the advantage of being easy to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and particularly relates to a pressing mold. Background Art

[0002] As a new type of solid semiconductor device, LED has the advantages of small volume, light weight, high luminous efficiency, energy conservation and environmental protection, and has now been widely applied to all walks of life. With the increasingly wide and diversified application levels of LEDs, and in order to better meet the requirements of different application scenarios, the requirements for the light extraction efficiency and light extraction uniformity of LEDs are also getting higher and higher.

[0003] In order to improve the light extraction efficiency of white LEDs and improve the light extraction uniformity, the common current practice is to adopt a multi-layer colloid packaging structure. However, when using multi-layer colloid packaging, since each layer of colloid is cured separately in sequence, it results in incomplete fusion and curing between each layer of colloid, and the bonding force between the colloids is poor. After long-term use of the LED, the colloid will age and the colloid will peel off, affecting the reliability and service life of the LED.

[0004] The inventor has developed a new type of LED packaging structure. In this new type of LED packaging structure, as Figure 1 shown, an annular groove 30 is provided on the top surface of the lower colloid layer 20 in the bowl cup 10, and a partial area of the upper colloid layer 40 fills the annular groove 30, thereby increasing the bonding area between the upper and lower adjacent colloid layers, and further reducing the risk of peeling between the adjacent colloid layers. However, setting the annular groove for each single new type of LED packaging structure is very time-consuming, so that the production efficiency of the new type of LED packaging structure is very low. Therefore, it is necessary to develop a pressing mold that can improve the manufacturing efficiency of the annular groove on the top surface of the colloid layer.

[0005] The disclosure of the above background art content is only used to assist in understanding the inventive concept and technical solution of the present invention, and it does not necessarily belong to the prior art of this patent application. Without clear evidence that the above content was publicly available on the filing date of this patent application, the above background art should not be used to evaluate the novelty and inventiveness of this application. Summary of the Utility Model

[0006] The technical problem solved by the utility model is to provide a pressing mold that can improve the manufacturing efficiency of the annular groove on the top surface of the colloid layer.

[0007] To solve the above technical problem, the technical solution adopted by the utility model is: a pressing mold for pressing an annular groove on a colloid layer in a bowl cup of an LED packaging structure, including a main body, and a plurality of hollow convex columns are provided on the bottom surface of the main body, and the central region of the bottom surface of the hollow convex column communicates with the hollow region of the hollow convex column.

[0008] In one embodiment, a plurality of the protruding posts are arranged in a rectangular array on the bottom surface of the main body.

[0009] In one embodiment, the longitudinal section of the bottom region of the protruding post is U-shaped, triangular or rectangular.

[0010] In one embodiment, the cross-section of the hollow protruding post is annular, elliptical annular or polygonal frame-shaped.

[0011] In one embodiment, the main body is in a flat plate shape.

[0012] In one embodiment, positioning posts are provided on the bottom surface of the main body.

[0013] In one embodiment, the main body is in a rectangular plate shape, and the positioning posts are respectively provided at the respective corner portions of the main body.

[0014] The beneficial effects of the present utility model are as follows: The pressing die has a simple structure and low manufacturing cost. It can simultaneously perform the work of pressing ring-shaped grooves on the colloid layers in a plurality of LED packaging structures, which is beneficial to improving the production efficiency of the LED packaging structure and reducing the manufacturing cost of the LED packaging structure; the pressing die also has the advantage of being easy to operate. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0016] Figure 1 It is a cross-sectional view of the LED packaging structure;

[0017] Figure 2 It is a schematic structural diagram of the pressing die according to the first embodiment of the present utility model;

[0018] Figure 3 It is a schematic diagram of the working state of the pressing die according to the first embodiment of the present utility model.

[0019] Explanation of the reference numerals in the drawings:

[0020] 1. Main body; 2. Hollow protruding post; 3. Positioning post;

[0021] 10. Bowl cup; 20. Lower colloid layer; 30. Ring-shaped groove; 40. Upper colloid layer. Detailed Embodiments

[0022] The realization of the purpose, functional features, and advantages of the present utility model will be further described in conjunction with embodiments with reference to the accompanying drawings.

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0024] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture as shown in the accompanying drawings. If this specific posture changes, then the directional indications will also change accordingly.

[0025] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0026] In addition, the meaning of "and / or" that appears throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution, or the solution, or the solution that satisfies both simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0027] In this application, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] Embodiment 1

[0029] Please refer to Figure 2 and Figure 3 In this regard, Embodiment 1 of the present utility model is as follows: As Figure 2As shown in the figure, a pressing mold is used to press a ring-shaped groove on the colloid layer in the bowl cup of the LED packaging structure. The pressing mold includes a main body 1, and a plurality of hollow convex columns 2 are provided on the bottom surface of the main body 1. The central area of the bottom surface of the hollow convex column 2 communicates with the hollow area of the hollow convex column 2.

[0030] The convex columns in a plurality of numbers are arranged in a rectangular array on the bottom surface of the main body 1. Therefore, the pressing mold can simultaneously press the colloid layers of a plurality of LED packaging structures arranged in a rectangular array.

[0031] The longitudinal section of the bottom area of the convex column is in a U shape, a triangle, a rectangle or other shapes. It is easy to understand that the shape of the longitudinal section of the bottom area of the convex column determines the shape of the longitudinal section of the ring-shaped groove 30 on the colloid layer of the LED packaging structure.

[0032] The cross section of the hollow convex column 2 is in a circular ring shape, an elliptical ring shape, a polygonal frame shape or other shapes. Similarly, the shape of the cross section of the hollow convex column 2 determines the overall shape of the ring-shaped groove 30 on the colloid layer of the LED packaging structure.

[0033] Preferably, the main body 1 is in a flat plate shape; positioning columns 3 are provided on the bottom surface of the main body 1. In this embodiment, the main body 1 is in a rectangular plate shape, and the positioning columns 3 are respectively provided at the respective corner portions of the main body 1.

[0034] The hollow convex column 2 is connected to the bottom surface of the main body 1. The height of the hollow convex column 2 is A, the depth of the inner area of the bowl cup of the LED packaging structure is B, and the thickness of the LED chip in the bowl cup is C. A - 0.5C ≤ A ≤ B. In this way, when the bottom surface of the main body 1 contacts the top end of the bowl cup, the bottom end of the hollow convex column 2 can effectively press a ring-shaped groove on the colloid layer in the bowl cup.

[0035] The pressing mold can be made of stainless steel material, and the hollow convex column 2 can be processed and formed by an optional etching or machining method.

[0036] The use process of this pressing mold is briefly described as follows:

[0037] As Figure 3As shown, after the lower colloidal layer 20 is encapsulated in the bowl 10 of the LED packaging structure, low-temperature preliminary curing is adopted, and then the hollow convex column 2 of the pressing mold is buckled downward with the surface facing down on the LED packaging structure. The pressing mold will press the lower colloidal layer 20 downward due to gravity. Among them, the positioning column 3 cooperates with the positioning hole on the bracket substrate connecting the LED packaging structure. After high-temperature curing and demolding, the hollow convex column 2 will form an annular groove 30 on the surface of the lower colloidal layer 20. After multi-layer colloidal layer packaging, the bonding area between adjacent colloidal layers can be effectively increased, ensuring the tightness of the bonding between adjacent colloidal layers and improving the reliability and service life of the LED.

[0038] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A pressing mold for pressing a ring-shaped groove on a colloid layer in a bowl of an LED packaging structure, characterized in that: It comprises a main body, the bottom surface of which is provided with a plurality of hollow bosses, and the central area of ​​the bottom surface of the hollow bosses is connected to the hollow area of ​​the hollow bosses.

2. The pressing die according to claim 1, characterized in that: A plurality of the protrusions are arranged in a rectangular array on the bottom surface of the main body.

3. The pressing die according to claim 1, characterized in that: The longitudinal cross section of the bottom area of ​​the protruding column is U-shaped, triangular or rectangular.

4. The pressing die according to claim 1, characterized in that: The cross section of the hollow protruding column is in the shape of a circular ring, an elliptical ring or a polygonal frame.

5. The pressing die according to claim 1, characterized in that: The main body is in a flat plate shape.

6. The pressing die according to claim 5, characterized in that: The bottom surface of the main body is provided with a positioning column.

7. The pressing die according to claim 6, characterized in that: The main body is in the shape of a rectangular plate, and each corner of the main body is correspondingly provided with the positioning column.

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