Gluing machine

Abstract

The utility model relates to the technical field of wafer processing, in particular to a gluing machine which comprises a machine shell, the interior of the machine shell is separated through a baffle, a transfer bin is formed in the center of the interior of the machine shell, and processing bins are formed in the machine shell and located on the two sides of the transfer bin. The wafer cleaning device comprises a machine shell, a processing bin is arranged in the machine shell, a rotatable annular cover is arranged in the machine shell, a bottom cleaning liquid spraying unit is fixedly installed in the processing bin and located in the center of the annular cover, and the bottom cleaning liquid spraying unit is not connected with the annular cover. Gluing and cleaning of the wafer are completed in the processing bin, finally, drying and cooling of the wafer are completed in the drying bin and the cooling bin respectively, gluing, cleaning and drying of the wafer are achieved at the same time, higher integration degree and automation degree are achieved, and gluing processing of the wafer can be completed more quickly.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, specifically a glue coater. Background Art

[0002] After being ground, polished and sliced, silicon ingots form silicon wafers, that is, wafers. During the wafer processing, related processes such as glue coating, cleaning, drying and etching are required.

[0003] In the prior art, such as a glue coater proposed in the patent application number "CN202322610356.4", it includes an operating table and longitudinal guide rails fixedly connected to both sides of the operating table. A fixed box is fixedly connected to the top of the operating table, and a cleaning mechanism is arranged on the top of the operating table; the cleaning mechanism includes a second motor fixedly connected to the top of the operating table.

[0004] However, the glue coater proposed in the above patent application can only complete the step of glue coating on the wafer. When cleaning and drying the wafer, it is necessary to transfer the wafer to other equipment for cleaning and drying. The equipment integration degree and automation degree are low, which is not convenient for wafer processing and use. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a glue coater to solve the problems proposed in the above background art.

[0006] The purpose of the utility model can be realized by the following technical solutions:

[0007] The glue coater includes a machine shell. The interior of the machine shell is separated by a baffle, and a transfer chamber is formed at the center of the interior of the machine shell. Processing chambers are formed on both sides of the transfer chamber inside the machine shell;

[0008] A rotatable annular cover is arranged inside the machine shell. A bottom cleaning liquid spraying unit is fixedly installed at the center of the processing chamber and inside the annular cover. The bottom cleaning liquid spraying unit is not connected to the annular cover. A top cleaning liquid spraying unit is fixedly installed at the top of the inner wall of the processing chamber. The top cleaning liquid spraying unit and the bottom cleaning liquid spraying unit are used to spray cleaning liquid to clean the bottom plate and the top of the wafer. A lifting plate is fixedly connected above the annular cover. An arc-shaped notch is formed on the lifting plate. Electric suction cups are fixedly connected around the arc-shaped notch at the top of the lifting plate. The electric suction cups are used to adsorb the wafer.

[0009] Preferably, a wafer carrying platform is fixedly connected to the outside of the machine shell. An electrically operated door that can be opened and closed is arranged above the wafer carrying platform on the machine shell. Windows are arranged on both sides of the machine shell. The windows are used to observe the wafer processing state inside the processing chamber.

[0010] Preferably, a touch panel is provided on the outer surface of the casing, control buttons are provided on the surface of the casing and below the touch panel, and a display screen is installed on the surface of the casing and above the touch panel, and the display screen is inclined.

[0011] Preferably, a glue spraying pipe is provided on one side of the cleaning liquid spraying unit at the top in the processing chamber, and one end of the glue spraying pipe faces above the annular cover for spraying photoresist onto the surface of the wafer.

[0012] Preferably, an equipment chamber is provided on one side of the casing and below the processing chamber. A limiting card rack is fixedly connected inside the equipment chamber, and a waste liquid recovery cylinder body is provided on the limiting card rack.

[0013] Preferably, a waste liquid output pipe is fixedly connected to the bottom of the inner wall of the processing chamber. An adjusting connecting pipe is slidably connected to the waste liquid output pipe, and the bottom of the adjusting connecting pipe extends into the waste liquid recovery cylinder body.

[0014] Preferably, a drying chamber, an alignment chamber, and a cooling chamber communicating with the transfer chamber are provided inside the casing. The drying chamber and the cooling chamber are respectively arranged on both sides of the alignment chamber. A hot plate is installed in the drying chamber, an AI vision detection device and a rotatable alignment table are fixedly installed in the alignment chamber, and a cold plate is installed in the cooling chamber.

[0015] Advantages of the present utility model:

[0016] When the wafer is transferred into the casing of the present utility model, the position alignment of the wafer can be first completed in the alignment chamber, the wafer can be coated with glue, cleaned, and finally dried and cooled in the drying chamber and the cooling chamber respectively. The glue coating, cleaning, and drying of the wafer are realized simultaneously, with higher integration and automation degrees, and the glue coating process of the wafer can be completed more quickly. It is not necessary to transfer the wafer to multiple devices for separate processing, and the processing of the wafer is more simple and fast. Description of the drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts;

[0018] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 It is the present utility model Figure 1 The schematic diagram of the internal structure of the casing;

[0020] Figure 3 It is the present utility model Figure 1Cross-sectional view of the side view of the middle casing;

[0021] Figure 4 is the present utility model Figure 1 Schematic structural diagram of the middle annular cover part;

[0022] Figure 5 is the present utility model Figure 1 Cross-sectional view of the top view of the middle casing.

[0023] The reference numerals in the figure are as follows:

[0024] 1. Casing, 101. Transfer bin, 102. Processing bin, 103. Equipment bin, 104. Drying bin, 105. Alignment bin, 106. Cooling bin, 3. Annular cover, 4. Heating unit, 5. Liquid outlet groove, 6. Lifting plate, 7. Arc-shaped groove, 8. Electric suction cup, 9. Wafer carrier, 10. Electric bin door, 11. Window, 12. Touch panel, 13. Control button, 131. Display screen, 14. Glue spraying pipe, 15. Cleaning liquid spraying pipe, 16. Limit holder, 17. Waste liquid recovery cylinder, 18. Waste liquid output pipe, 19. Adjusting connecting pipe, 20. Hot plate, 21. AI vision detection device, 22. Alignment table, 23. Cold plate. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] The glue applicator includes a casing 1. The interior of the casing 1 is separated by a baffle, and a transfer bin 101 is formed at the center of the interior of the casing 1. Processing bins 102 are formed on both sides of the transfer bin 101 inside the casing 1;

[0027] A rotatable annular cover 3 is provided inside the casing 1. A bottom cleaning liquid spraying unit 4 is fixedly installed at the center of the processing bin 102 and inside the annular cover 3. The bottom cleaning liquid spraying unit 4 and the annular cover 3 are not connected. A top cleaning liquid spraying unit 15 is fixedly installed at the top of the inner wall of the processing bin 102. The top cleaning liquid spraying unit 15 and the bottom cleaning liquid spraying unit 4 are used to spray cleaning liquid to clean the bottom plate and the top of the wafer. A lifting plate 6 is fixedly connected above the annular cover 3. An arc-shaped groove 7 is formed on the lifting plate 6. Electric suction cups 8 are fixedly connected to the top of the lifting plate 6 and around the arc-shaped groove 7. The electric suction cups 8 are used to adsorb the wafer.

[0028] AsFigure 1 and Figure 2 Inside the processing chamber 102, there is also a motor that drives the annular cover 3 to rotate, so as to realize the rotation of the annular cover 3. This motor is a waterproof motor and can operate safely, efficiently and stably inside the processing chamber 102. Both the first electric hatch 2 and the electric hatch 10 can be automatically opened and closed. Inside the transfer chamber 101, there is an XYZ-axis synchronous belt manipulator (not shown in the figure) in the prior art. After the electric hatch 10 is opened, the manipulator can transfer the wafer on the wafer carrier 9 to above the lifting plate 6 inside the processing chamber 102. After the wafer processing is completed, the wafer is transferred from inside the processing chamber 102 to above the lifting plate 6 again.

[0029] The outer side of the casing 1 is fixedly connected with a wafer carrier 9. An openable and closable electric hatch 10 is arranged above the wafer carrier 9 on the casing 1. Windows 11 are arranged on both sides of the casing 1. The windows 11 are used to observe the wafer processing state inside the processing chamber 102.

[0030] The window 11 is located outside the processing chamber 102 and can observe the wafer processing state inside the processing chamber 102. The window 11 adopts an openable and closable design, and the wafer can also be directly placed into the processing chamber 102 by opening the window.

[0031] A touch panel 12 is arranged on the outer surface of the casing 1. Control buttons 13 are arranged on the surface of the casing 1 and below the touch panel 12. A display screen 131 is installed on the surface of the casing 1 and above the touch panel 12. The display screen 131 is inclined.

[0032] Such as Figure 1 , through the touch panel 12 and the control buttons 13, the glue coater can be controlled. The display screen 131 can display the operating parameters of the glue coater. Through the inclined setting of the display screen 131, the display screen 131 is easier to observe.

[0033] A glue spraying pipe 14 is arranged inside the processing chamber 102 on one side of the top cleaning liquid spraying unit 15. One end of the glue spraying pipe 14 faces above the annular cover 3 and is used to spray photoresist onto the surface of the wafer.

[0034] Such as Figure 3 and Figure 4 , the glue spraying pipe 14 is connected to the photoresist storage bin inside the glue coater, so that the stored photoresist can be sprayed onto the wafer above the lifting plate 6 through the glue spraying pipe 14. Both the top cleaning liquid spraying unit 15 and the bottom cleaning liquid spraying unit 4 are connected to the cleaning liquid storage bin inside the glue coater, and there are submersible pumps and openings for spraying cleaning liquid inside both the top cleaning liquid spraying unit 15 and the bottom cleaning liquid spraying unit 4, and the cleaning liquid can be sprayed onto the wafer above the lifting plate 6.

[0035] An equipment compartment 103 is disposed on one side of the housing 1 and below the processing compartment 102 . A limit bracket 16 is fixedly connected to the equipment compartment 103 , and a waste liquid recovery cylinder 17 is disposed on the limit bracket 16 .

[0036] like Figure 1 and Figure 3 The bottom of the waste liquid recovery cylinder 17 is clamped in the limiting bracket 16, and there is a door that can be opened and closed on the outside of the equipment compartment 103, so that the equipment compartment 103 can be opened and the waste liquid recovery cylinder 17 located inside the equipment compartment 103 can be installed and removed.

[0037] A waste liquid output pipe 18 is fixedly connected to the bottom of the inner wall of the processing chamber 102 , and an adjustment connecting pipe 19 is slidably connected to the waste liquid output pipe 18 . The bottom of the adjustment connecting pipe 19 extends to the waste liquid recovery cylinder 17 .

[0038] like Figure 3 The adjusting connecting tube 19 can slide up and down, so that when the adjusting connecting tube 19 is slid up, the adjusting connecting tube 19 and the waste liquid recovery cylinder 17 can be separated. At this time, the waste liquid recovery cylinder 17 can be taken out, and the waste liquid in the waste liquid recovery cylinder 17 can be processed. After installing the waste liquid processing cylinder 17, the adjusting connecting tube 19 is lowered so that the bottom of the adjusting connecting tube 19 extends into the waste liquid recovery cylinder 17, so that when waste liquid is generated by cleaning and coating, the waste liquid will enter the waste liquid output pipe 18, and the waste liquid flowing down the waste liquid output pipe 18 directly enters the waste liquid processing cylinder 17 through the adjusting connecting tube 19, and no leakage will occur.

[0039] The housing 1 is provided with a drying chamber 104, an alignment chamber 105 and a cooling chamber 106 which are connected to the transfer chamber 101. The drying chamber 104 and the cooling chamber 106 are respectively arranged on both sides of the alignment chamber 105. A hot plate 20 is installed in the drying chamber 104, an AI visual inspection device 21 and a rotatable alignment table 22 are fixedly installed in the alignment chamber 105, and a cold plate 23 is installed in the cooling chamber 106.

[0040] The drying chamber 104 , the alignment chamber 105 , the cooling chamber 106 and the processing chamber 102 are all connected to the transfer chamber 101 , so that the XYZ-axis synchronous belt robot inside the transfer chamber 101 can drive the wafer to be transferred to the drying chamber 104 , the alignment chamber 105 , the cooling chamber 106 and the processing chamber 102 .

[0041] There is a heating wire in the hot plate 20, which can heat the wafer. There is a cavity in the cold plate 23 and it is connected to the coolant circulation pipeline. The circulation of the coolant is used to take away the heat of the cold plate 23 and the wafer thereon, thereby cooling the wafer. There is a motor under the alignment table 22. The AI ​​visual inspection device 21 is used to detect the chamfer position of the wafer. The alignment table 22 drives the wafer to rotate, so that the wafer rotates accordingly and rotates to the corresponding position through the chamfer to achieve wafer alignment.

[0042] The working principle of the glue applicator provided by the present utility model is as follows:

[0043] The wafer is first transferred into the alignment chamber 105 for alignment. After the alignment is completed, when the wafer is transferred above the lifting plate 6 in the processing chamber 102, the electric suction cup 8 adsorbs the wafer, and the annular cover 3 drives the lifting plate 6 to rotate, and the wafer rotates accordingly. Then, photoresist is sprayed onto the surface of the wafer at the glue spraying pipe 14. After the photoresist spraying is completed, the top cleaning liquid spraying unit 15 and the bottom cleaning liquid spraying unit 4 spray cleaning liquid to clean the bottom plate and the top of the wafer. After the cleaning of the wafer is completed, it is transferred to the drying chamber 104, heated and dried on the hot plate 20, and finally transferred to the cooling chamber 106 for cooling on the cold plate 23.

[0044] Compared with the related art, the glue applicator provided by the present utility model has the following beneficial effects:

[0045] When the wafer is transferred into the machine housing 1, the present utility model can first complete the position alignment of the wafer in the alignment chamber 105, complete the glue application, cleaning of the wafer in the processing chamber 102, and finally complete the drying and cooling of the wafer in the drying chamber 104 and the cooling chamber 106 respectively. At the same time, the glue application, cleaning and drying of the wafer are realized, with higher integration and automation degree, and can complete the glue application processing of the wafer more quickly. There is no need to transfer the wafer to multiple devices for separate processing, and the processing of the wafer is more simple and fast.

[0046] The above shows and describes the basic principle, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the description in the specification only illustrate the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A glue coating machine, comprising a housing (1), characterized in that: The interior of the housing (1) is divided by a baffle, a transfer chamber (101) is formed at the center of the interior of the housing (1), and processing chambers (102) are formed inside the housing (1) and on both sides of the transfer chamber (101); A rotatable annular cover (3) is arranged inside the casing (1), a bottom cleaning liquid spraying unit (4) is fixedly installed in the processing chamber (102) and at the center of the annular cover (3), the bottom cleaning liquid spraying unit (4) and the annular cover (3) are not connected, a top cleaning liquid spraying unit (15) is fixedly installed on the top of the inner wall of the processing chamber (102), the top cleaning liquid spraying unit (15) and the bottom cleaning liquid spraying unit (4) are used to spray cleaning liquid to clean the bottom plate and the top of the wafer, a lifting plate (6) is fixedly connected above the annular cover (3), an arc-shaped notch (7) is opened on the lifting plate (6), an electric suction cup (8) is fixedly connected to the top of the lifting plate (6) and around the arc-shaped notch (7), and the electric suction cup (8) is used to adsorb the wafer.

2. The glue coating machine according to claim 1, characterized in that: A wafer carrier platform (9) is fixedly connected to the outer side of the casing (1), an openable and closable electric door (10) is arranged on the casing (1) and above the wafer carrier platform (9), and windows (11) are arranged on both sides of the casing (1), and the windows (11) are used to observe the wafer processing status inside the processing chamber (102).

3. The glue coating machine according to claim 1, characterized in that: A touch panel (12) is arranged on the outer surface of the casing (1), a control button (13) is arranged on the surface of the casing (1) and below the touch panel (12), and a display screen (131) is installed on the surface of the casing (1) and above the touch panel (12), and the display screen (131) is arranged in an inclined manner.

4. The glue coating machine according to claim 1, characterized in that: A glue spraying tube (14) is arranged on one side of the top cleaning liquid spraying unit (15) in the processing chamber (102), and one end of the glue spraying tube (14) faces the top of the annular cover (3) and is used for spraying photoresist onto the surface of the wafer.

5. The glue coating machine according to claim 1, characterized in that: An equipment bin (103) is provided on one side of the housing (1) and below the processing bin (102), a limit bracket (16) is fixedly connected inside the equipment bin (103), and a waste liquid recovery cylinder (17) is provided on the limit bracket (16).

6. The glue coating machine according to claim 5, characterized in that: A waste liquid output pipe (18) is fixedly connected to the bottom of the inner wall of the processing chamber (102), an adjustment connecting pipe (19) is slidably connected to the waste liquid output pipe (18), and the bottom of the adjustment connecting pipe (19) extends to the waste liquid recovery cylinder (17).

7. The glue coating machine according to claim 1, characterized in that: The housing (1) is provided with a drying chamber (104), an alignment chamber (105) and a cooling chamber (106) which are connected to the transfer chamber (101); the drying chamber (104) and the cooling chamber (106) are respectively arranged on both sides of the alignment chamber (105); a hot plate (20) is installed in the drying chamber (104); an AI visual inspection device (21) and a rotatable alignment table (22) are fixedly installed in the alignment chamber (105); and a cold plate (23) is installed in the cooling chamber (106).

Images