Wafer cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses a wafer cleaning device which comprises a cleaning box, a plurality of sets of supporting rods are fixedly connected to the inner bottom face of the cleaning box, two semicircular plates are fixedly connected between every two sets of supporting rods, receding openings are formed in the two corners and the lowest end of each semicircular plate, and three rotating rods are installed on the side wall of the cleaning box in a penetrating mode. A plurality of rubber damping rollers are fixedly connected to the outer walls of the rotating rods and located in the receding opening, and a motor is installed on the outer wall of the cleaning box. According to the utility model, the wafer is placed between the two semicircular plates, the wafer is supported by the plurality of rubber damping rollers, and the motor is utilized to drive one of the rotating rods to rotate, so that the rubber damping roller at the lowermost part of the wafer drives the wafer to rotate between the two semicircular plates, and the water spraying unit sprays water to clean the two sides of the wafer. The two sides of each wafer can be cleaned at the same time, multiple wafers can be cleaned at a time, the cleaning efficiency is high, and the wafers can be cleaned conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, and specifically relates to a wafer cleaning device. Background Art

[0002] In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In order to achieve the purpose of no contaminants on the wafer surface, it is necessary to remove the contaminants on the wafer surface to avoid the re - residue of contaminants on the wafer surface before the process. Therefore, during the wafer manufacturing process, the surface of the wafer needs to be cleaned multiple times to remove contaminants such as metal ions, atoms, organic substances, and particles attached to the wafer surface.

[0003] The prior art such as the patent with the publication number CN218282848U discloses a wafer cleaning device. The wafer cleaning device includes a base, a driving component, and a nozzle component. The base is provided with a receiving groove; the driving component rotatably penetrates through the bottom of the receiving groove, and an adsorbing member is provided at the end of the driving component. The adsorbing member is located in the receiving groove, the adsorbing member is in transmission connection with the driving component, and the adsorbing member can adsorb the wafer; the nozzle component includes a support rod and a nozzle provided at the end of the support rod. The support rod is rotatably connected to the bottom of the receiving groove. The nozzle includes a first nozzle and a second nozzle. The first nozzle can spray cleaning liquid onto the upper surface of the wafer, the second nozzle can spray gas onto the upper surface of the wafer, and the output port of the second nozzle is arranged opposite to the center of the wafer. This utility model improves the cleanliness of the wafer surface and improves the drying effect of the wafer.

[0004] The prior art still has deficiencies:

[0005] When cleaning the wafer in the above - mentioned prior art, since only one side of the wafer can be cleaned at a time, it is necessary to turn the wafer over after cleaning one side of the wafer and then clean the other side of the wafer. The operation is relatively cumbersome, the cleaning efficiency of the wafer is low, and it is not convenient to use. For this reason, a wafer cleaning device is proposed. Content of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the utility model provides a wafer cleaning device, which can clean both sides of the wafer at one time, with high cleaning efficiency and convenient to use.

[0007] To achieve the above object, the present utility model provides the following technical solution: A wafer cleaning device, including a cleaning box, wherein a plurality of support rods are fixedly connected to the inner bottom surface of the cleaning box, two semi-circular plates are fixedly connected between each group of support rods, and relief openings are provided at two corners and the lowermost end of each semi-circular plate. Three rotating rods are installed through the side wall of the cleaning box, and a plurality of rubber damping rollers are fixedly connected to the outer walls of the multiple rotating rods. The rubber damping rollers are located within the relief openings. A motor is installed on the outer wall of the cleaning box, and the motor is drivingly connected to one of the lowermost rotating rods through a transmission belt. A drain pipe communicating with the inside of the cleaning box is installed on the bottom surface of the cleaning box, and a water spraying unit for cleaning both sides of the wafer is installed on the side wall of the cleaning box.

[0008] Preferably, the water spraying unit includes a water distribution pipe installed on the side wall of the cleaning box. A water inlet pipe and a plurality of spray pipes are fixedly communicated with the outer wall of the water distribution pipe. The other ends of the plurality of spray pipes penetrate into the cleaning box and are fixedly connected to the inner wall of the cleaning box. The number of each group of spray pipes is two, and a plurality of communicating nozzles are installed on the adjacent sides of the two spray pipes. The two spray pipes clean both sides of the wafer through the nozzles.

[0009] Preferably, two rubber blocking rings are fixedly connected to the outer wall of the rubber damping roller, and the two rubber blocking rings are located between the two semi-circular plates.

[0010] Preferably, the water spraying direction of the nozzle is inclined downward.

[0011] Preferably, one of the rotating rods drivingly connected to the motor through a transmission belt is drivingly connected to the other two rotating rods respectively through a transmission belt.

[0012] Preferably, a water passing opening is provided on the side wall of the support rod, and two adjacent support rods are in mutual contact.

[0013] Preferably, a cover plate is installed on the upper end surface of the cleaning box through bolts. A plurality of positioning holes are provided through the upper surface of the cover plate, and the distance between the positioning holes is equal to the distance between the two rubber blocking rings on the outer wall of the rubber damping roller.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] 1. In the present utility model, the wafer is placed between two semi-circular plates, and the wafer is supported by multiple rubber damping rollers. The motor is used to drive one of the rotating rods to rotate, so that the rubber damping roller at the lowermost position of the wafer drives the wafer to rotate between the two semi-circular plates, and the water spraying unit sprays water on both sides of the wafer for cleaning, realizing the simultaneous cleaning of both sides of the wafer. Multiple wafers can be cleaned at one time, with high cleaning efficiency and convenient wafer cleaning.

[0016] 2. The utility model installs two rubber blocking rings on the outer wall of the rubber damping roller, and then blocks the wafer through the two rubber blocking rings, so that the side wall of the wafer will not be worn, thus avoiding damage to the wafer and improving practicality.

[0017] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures indicated in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the cleaning box of the utility model;

[0020] Figure 3 This is a schematic diagram of the cross-sectional structure of the cleaning box of the utility model;

[0021] Figure 4 This is a schematic diagram of the position structure of the semicircular plate and the rubber damping roller of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the water spray unit of the utility model.

[0023] In the figure: 1. cleaning box; 2. support rod; 3. semicircular plate; 4. yielding port; 5. rotating rod; 6. rubber damping roller; 7. rubber blocking ring; 8. motor; 9. water spray unit; 91. water inlet pipe; 92. water distribution pipe; 93. water spray pipe; 94. nozzle; 10. drain pipe; 11. cover plate; 12. positioning hole; 13. water yielding port. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this technical field without creative work are within the scope of protection of the utility model.

[0025] See also Figures 1-5The wafer cleaning device of this embodiment includes a cleaning box 1, and a plurality of groups of support rods 2 are fixedly connected to the inner bottom surface of the cleaning box 1, and two semicircular plates 3 are fixedly connected between each group of support rods 2. The semicircular plates 3 are provided with clearance openings 4 at both corners and the lower end. Three rotating rods 5 are installed through the side wall of the cleaning box 1, and a plurality of rubber damping rollers 6 are fixedly connected to the outer walls of the plurality of rotating rods 5. The rubber damping rollers 6 are located in the clearance openings 4. A motor 8 is installed on the outer wall of the cleaning box 1, and the motor 8 is connected to one of the lowest rotating rods 5 through a transmission belt. A drainage pipe 10 connected to the interior of the cleaning box 1 is installed on the bottom surface of the cleaning box 1, and a water spray unit 9 for cleaning both sides of the wafer is installed on the side wall of the cleaning box 1.

[0026] like Figures 1-4 As shown, the structure of the wafer cleaning device in the utility model is similar to the structure of the existing wafer cleaning device, such as the prior art CN218282848U. The main improvement of the utility model is that both sides of the wafer can be cleaned at one time, with high cleaning efficiency and convenient use. When the wafer needs to be cleaned, the utility model places multiple wafers between multiple groups of semicircular plates 3, and the rubber damping rollers 6 on the outer walls of multiple support rods 2 support the wafers. At this time, the motor 8 can be started to work, and the motor 8 drives the rotating rod 5 at the lowest position to rotate The rotating rod 5 drives the rubber damping roller 6 on its outer wall to rotate, and the rubber damping roller 6 rotates in the yielding port 4. The rubber damping roller 6 drives the wafer to rotate between the two semicircular plates 3. The other two rubber damping rollers 6 support the wafer. At this time, water is sprayed to both sides of the semicircular plate 3 through the water spray unit 9. As the wafer rotates, the outer walls on both sides of the wafer can be cleaned. The cleaned water can be discharged from the drain pipe 10. Multiple wafers can be cleaned at one time, and both sides of multiple wafers can be cleaned at the same time. The cleaning efficiency is high and the wafer cleaning is convenient.

[0027] Among them, the above-mentioned motor 8 can be purchased on the market. It belongs to mature technology and has been fully disclosed, so it is not repeated in the specification. The motor 8 is equipped with a power connection line, and it is electrically connected to the external main controller and 220V phase voltage (or 380V line voltage) through the power line, and the main controller can be a conventional known device such as a computer that plays a control role.

[0028] like Figures 2-5As shown, the water spray unit 9 includes a water distribution pipe 92 installed on the side wall of the cleaning box 1, and the outer wall of the water distribution pipe 92 is fixedly connected with a water inlet pipe 91 and a plurality of water spray pipes 93, the other ends of the plurality of water spray pipes 93 are all passed through the cleaning box 1 and fixedly connected to the inner wall of the cleaning box 1, and the number of each group of water spray pipes 93 is two, and a plurality of connected nozzles 94 are installed on the adjacent sides of the two water spray pipes 93, and the two water spray pipes 93 clean both sides of the wafer through the nozzles 94; when cleaning the wafer, water is transported to the water distribution pipe 92 through the water inlet pipe 91, and the water is dispersed from the water distribution pipe 92 to the plurality of water spray pipes 93, and the water spray pipes 93 located on the adjacent sides of the wafer respectively spray water to both sides of the wafer through the plurality of nozzles 94 connected thereto, and the wafer is cleaned as the wafer rotates, so as to achieve complete cleaning of the wafer.

[0029] like Figure 4 As shown, two rubber blocking rings 7 are fixedly connected to the outer wall of the rubber damping roller 6, and the two rubber blocking rings 7 are located between the two semicircular plates 3; when the wafer is placed on the rubber damping roller 6, the wafer is located between the two rubber blocking rings 7, and the two rubber blocking rings 7 restrict the wafer, so that when the rubber damping roller 6 rotates and drives the wafer to rotate, the wafer will not generate friction with the side walls of the semicircular plates 3, thereby avoiding damage to the wafer and improving practicality.

[0030] like Figure 4 and Figure 5 As shown, the water spraying direction of the nozzle 94 is inclined downward; the nozzle 94 sprays water obliquely downward, so that the water cleans the outer wall of the wafer in a tangential surface, and the cleaning effect is good and the cleaning efficiency is high.

[0031] like Figure 1 , Figure 3 and Figure 4 As shown, one of the rotating rods 5 connected to the motor 8 through a transmission belt is respectively connected to the other two rotating rods 5 through the transmission belt; the motor 8 drives one of the rotating rods 5 to rotate through the transmission belt, and the rotating rod 5 drives the other two rotating rods 5 to rotate synchronously through the transmission belt, so that the rubber damping rollers 6 on the outer walls of the multiple rotating rods 5 all rotate, and then the multiple rubber damping rollers 6 rotate synchronously to drive the wafer to rotate stably.

[0032] like Figure 3 As shown, a water outlet 13 is opened on the side wall of the support rod 2, and two adjacent support rods 2 fit together; multiple fitting support rods 2 can be installed in the cleaning box 1, and the water falling into the cleaning box 1 can be conveniently discharged from the drain pipe 10 through the water outlet 13. More support rods 2 can be installed in the cleaning box 1 to increase the number of wafers that can be cleaned at one time.

[0033] like Figure 1As shown, a cover plate 11 is installed on the upper end surface of the cleaning box 1 by bolts, and a plurality of positioning holes 12 are formed through the upper surface of the cover plate 11, and the spacing between the positioning holes 12 is equal to the spacing between the two rubber blocking rings 7 on the outer wall of the rubber damping roller 6; the wafer is inserted between the two semicircular plates 3 through the positioning holes 12 on the cover plate 11, and part of the wafer is located on the cover plate 11, which is convenient for positioning and placing the wafer. At the same time, the cover plate 11 also prevents water splashing from the cleaning box 1 for cleaning the wafer, thereby improving practicality.

[0034] The implementation steps in this embodiment are as follows: when the wafer needs to be cleaned, multiple wafers are placed between multiple groups of semicircular plates 3 through the positioning holes 12 on the cover plate 11, and the rubber damping rollers 6 on the outer walls of multiple support rods 2 support the wafers. The wafers are located between two rubber blocking rings 7, and the two rubber blocking rings 7 restrict the wafers. At this time, the motor 8 can be started to work, and the motor 8 drives the rotating rod 5 located at the lowest position to rotate. The rotating rod 5 drives the other two rotating rods 5 to rotate synchronously through the transmission belt, and the rotating rod 5 drives the rubber damping roller 6 to rotate, and the rubber damping roller 6 rotates in the yielding port 4. The rubber damping roller 6 drives the wafer to rotate between the two semicircular plates 3. At this time, water is transported to the water distribution pipe 92 through the water inlet pipe 91. The water is dispersed from the water distribution pipe 92 to multiple water spray pipes 93. The water spray pipes 93 located on the adjacent two sides of the wafer spray water to both sides of the wafer through multiple nozzles 94 connected thereto. With the rotation of the wafer, the outer walls of both sides of the wafer can be cleaned, and the cleaned water can be discharged from the drain pipe 10. Multiple wafers can be cleaned at one time, and both sides of multiple wafers can be cleaned at the same time. The cleaning efficiency is high, and the wafer cleaning is convenient.

[0035] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A wafer cleaning device, comprising a cleaning box (1), characterized in that: The inner bottom surface of the cleaning box (1) is fixedly connected to a plurality of groups of support rods (2), and two semicircular plates (3) are fixedly connected between each group of support rods (2). The semicircular plates (3) are provided with clearance openings (4) at both corners and the lowest end. Three rotating rods (5) are installed through the side wall of the cleaning box (1), and the outer walls of the plurality of rotating rods (5) are fixedly connected to a plurality of rubber damping rollers (6), and the rubber damping rollers (6) are located in the clearance openings (4). The outer wall of the cleaning box (1) is installed with a motor (8), and the motor (8) is connected to one of the rotating rods (5) at the lowest position through a transmission belt. The bottom surface of the cleaning box (1) is installed with a drainage pipe (10) connected to the interior thereof, and the side wall of the cleaning box (1) is installed with a water spray unit (9) for cleaning both sides of a wafer.

2. A wafer cleaning device according to claim 1, characterized in that: The water spray unit (9) comprises a water distribution pipe (92) installed on the side wall of the cleaning box (1); the outer wall of the water distribution pipe (92) is fixedly connected with a water inlet pipe (91) and a plurality of groups of water spray pipes (93); the other ends of the plurality of groups of water spray pipes (93) are all inserted into the cleaning box (1) and fixedly connected to the inner wall of the cleaning box (1); each group of water spray pipes (93) has two pipes; adjacent sides of the two water spray pipes (93) are installed with a plurality of connected nozzles (94); the two water spray pipes (93) clean both sides of the wafer through the nozzles (94).

3. A wafer cleaning device according to claim 1, characterized in that: Two rubber blocking rings (7) are fixedly connected to the outer wall of the rubber damping roller (6), and the two rubber blocking rings (7) are located between the two semicircular plates (3).

4. A wafer cleaning device according to claim 2, characterized in that: The water spraying direction of the spray head (94) is inclined downward.

5. The wafer cleaning device according to claim 1, characterized in that: One of the rotating rods (5) which is connected to the motor (8) via a transmission belt is connected to the other two rotating rods (5) via the transmission belt.

6. The wafer cleaning device according to claim 1, characterized in that: A water outlet (13) is provided on the side wall of the support rod (2), and two adjacent support rods (2) are fitted to each other.

7. The wafer cleaning device according to claim 3, characterized in that: A cover plate (11) is installed on the upper end surface of the cleaning box (1) by means of bolts. A plurality of positioning holes (12) are formed through the upper surface of the cover plate (11). The spacing between the positioning holes (12) is equal to the spacing between two rubber blocking rings (7) on the outer wall of the rubber damping roller (6).

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