Semiconductor part cleaning device

Abstract

The utility model discloses a semiconductor part cleaning device, and relates to the technical field of semiconductor part cleaning. The ultrasonic cleaning machine mainly comprises an ultrasonic cleaning machine body, a box cover is hinged to the top of the ultrasonic cleaning machine body, the box cover is fixed to the ultrasonic cleaning machine body through a fixing buckle, and a bearing plate is movably arranged in the ultrasonic cleaning machine body; a plurality of evenly-distributed first springs are connected between the bottom of the bearing plate and the bottom wall in the ultrasonic cleaning machine body. The cleaning basket is movably arranged in the ultrasonic cleaning machine body and carried on the top of the bearing plate, and the interior of the cleaning basket is used for containing semiconductor parts; and the beating assembly is installed on the ultrasonic cleaning machine body and used for intermittently beating the bottom of the bearing plate. According to the semiconductor part cleaning device, the bearing plate is intermittently beaten through the beating assembly, semiconductor parts are promoted to roll in the cleaning basket, the contact area of cleaning liquid and the parts is increased, and therefore the cleaning uniformity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor part cleaning, and particularly relates to a semiconductor part cleaning device. Background Art

[0002] Semiconductor part cleaning is a key step in the semiconductor manufacturing process, and its purpose is to remove impurities such as particulate matter, organic matter, metal contaminants, and oxides on semiconductor parts such as silicon wafers. With the continuous progress of integrated circuit (IC) manufacturing technology, the requirements for cleaning technology are also getting higher and higher.

[0003] The ultrasonic semiconductor part cleaning device is a device for cleaning semiconductor parts. When the existing ultrasonic semiconductor part cleaning device cleans semiconductor parts, the semiconductor parts are stacked together in the device, resulting in the overlapping surface not being cleaned, which affects the cleaning effect of semiconductor parts.

[0004] Therefore, this application document provides a semiconductor part cleaning device. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a semiconductor part cleaning device to solve the problems raised in the above background art.

[0006] The utility model specifically adopts the following technical solutions to achieve the above purpose:

[0007] A semiconductor part cleaning device includes:

[0008] An ultrasonic cleaning machine body, the top of the ultrasonic cleaning machine body is hinged with a box cover, the box cover is fixed to the ultrasonic cleaning machine body through a fixed buckle, a water inlet pipe and a water outlet pipe are arranged on the ultrasonic cleaning machine body, a bearing plate is movably arranged inside the ultrasonic cleaning machine body, and a plurality of uniformly distributed first springs are connected between the bottom of the bearing plate and the bottom wall inside the ultrasonic cleaning machine body;

[0009] A cleaning basket, which is movably arranged inside the ultrasonic cleaning machine body and is carried on the top of the bearing plate, and the inside of the cleaning basket is used for holding semiconductor parts;

[0010] A striking component, which is installed on the ultrasonic cleaning machine body and is used for intermittently striking the bottom of the bearing plate.

[0011] Preferably, the striking component includes a reduction motor installed on the outer side wall of the ultrasonic cleaning machine body, the output end of the reduction motor is fixed with a rotating rod movably inserted inside the ultrasonic cleaning machine body, a cam is fixedly sleeved on the rotating rod, and one end of the cam intermittently abuts against the bottom of the bearing plate.

[0012] Preferably, a plurality of water permeable holes are formed through the bearing plate, a vertically oriented guiding groove is formed on the inner wall of the ultrasonic cleaning machine body, and a guiding block sliding inside the guiding groove is fixed on the bearing plate.

[0013] Preferably, a plurality of uniformly distributed baffles are fixed to the top of the cleaning basket, and a plurality of buffer members are installed on one side of the box cover, and the plurality of buffer members correspond to the plurality of baffles one by one.

[0014] Preferably, the buffer member includes a buffer plate, a second spring and a shock absorber. The second spring is connected between one side of the box cover and the buffer plate, and the shock absorber is connected between one side of the box cover and the buffer plate and is located inside the second spring.

[0015] Preferably, a pulling plate is provided at the top of the cleaning basket. Beneficial effects

[0016] In the present utility model, the striking component intermittently strikes the bearing plate, causing the semiconductor parts to roll over in the cleaning basket, increasing the contact area between the cleaning liquid and the parts, thereby improving the uniformity of cleaning. The box cover is fixed to the ultrasonic cleaning machine body through the fixing buckle, ensuring the safety during the cleaning process and preventing the overflow of the cleaning liquid and the loss of parts. Description of the drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the present utility model;

[0019] Figure 2 For the present utility model Figure 1 Three-dimensional sectional view;

[0020] Figure 3 It is a three-dimensional structural schematic diagram of another state of the present utility model;

[0021] Figure 4 For the present utility model Figure 3 Three-dimensional sectional view;

[0022] Figure 5 For the present utility model Figure 3 Three-dimensional sectional view in another direction.

[0023] Figures 1 - 5 In:

[0024] 1. Ultrasonic cleaning machine body; 11. Box cover; 12. Fixed buckle; 13. Water inlet pipe; 14. Water outlet pipe; 15. Bearing plate; 151. Water permeable hole; 152. Guide block; 16. First spring; 17. Guide groove; 18. Buffer member; 181. Buffer plate; 182. Second spring; 183. Shock absorber; 2. Cleaning basket; 21. Baffle; 22. Pulling plate; 3. Striking component; 31. Reducing motor; 32. Rotating rod; 33. Cam. Specific embodiments

[0025] For the purpose, technical solutions and advantages of the embodiments of the present utility model to be clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

[0026] This application provides a semiconductor part cleaning device, which is mainly used to solve the problem that when the existing ultrasonic semiconductor part cleaning device cleans semiconductor parts, the semiconductor parts are stacked together in the device, resulting in the overlapping surface not being cleaned, affecting the cleaning effect of the semiconductor parts, and provides the following technical solutions. The following will be combined with Figures 1 - 5 make a detailed description:

[0027] A semiconductor part cleaning device mainly includes: an ultrasonic cleaning machine body 1, a box cover 11 is hinged to the top of the ultrasonic cleaning machine body 1, the box cover 11 is fixed to the ultrasonic cleaning machine body 1 through a fixed buckle 12, a water inlet pipe 13 and a water outlet pipe 14 are arranged on the ultrasonic cleaning machine body 1, a carrier plate 15 is movably arranged inside the ultrasonic cleaning machine body 1, and a plurality of evenly distributed first springs 16 are connected between the bottom of the carrier plate 15 and the bottom wall inside the ultrasonic cleaning machine body 1; a cleaning basket 2, which is movably arranged inside the ultrasonic cleaning machine body 1 and is mounted on the top of the carrier plate 15, and the inside of the cleaning basket 2 is used for holding semiconductor parts; a striking component 3, which is installed on the ultrasonic cleaning machine body 1, and the striking component 3 is used for intermittently striking the bottom of the carrier plate 15. The specific cleaning operation is as follows: First, put the semiconductor parts to be cleaned into the inside of the cleaning basket 2, then add an appropriate amount of cleaning liquid and water into the ultrasonic cleaning machine body 1 through the water inlet pipe 13, and then start the ultrasonic cleaning machine body 1 to start the ultrasonic cleaning process. Secondly, the striking component 3 starts to work, intermittently striking the bottom of the carrier plate 15, prompting the semiconductor parts to roll in the cleaning basket 2 to improve the cleaning effect. After the cleaning is completed, drain the cleaning liquid through the water outlet pipe 14, then add clean water for rinsing. After the rinsing is completed, turn off the ultrasonic cleaning machine body 1 to stop the cleaning process. Finally, open the box cover 11, take out the cleaning basket 2, and perform subsequent drying treatment on the cleaned semiconductor parts. This device ensures that each surface of the semiconductor parts can be fully cleaned through the synergistic effect of intermittent striking and ultrasonic waves. Especially for parts with complex structures, the cleaning quality can be improved.

[0028] In this embodiment, please refer to Figure 2 、 Figure 3 and Figure 4 As shown in, the striking component 3 includes a reduction motor 31 installed on the outer side wall of the ultrasonic cleaning machine body 1. The output end of the reduction motor 31 is fixed with a rotating rod 32 that is movably inserted into the inside of the ultrasonic cleaning machine body 1. A cam 33 is fixedly sleeved on the rotating rod 32. One end of the cam 33 intermittently abuts against the bottom of the carrier plate 15. When the reduction motor 31 is started, the rotating rod 32 is driven to rotate through its output end. When the rotating rod 32 rotates, the cam 33 is driven to rotate. The intermittent design of the cam 33 enables it to make periodic contact with the bottom of the carrier plate 15. Whenever the cam 33 contacts the bottom of the carrier plate 15, a striking effect is generated, prompting the carrier plate 15 and the cleaning basket 2 and semiconductor parts thereon to move relatively. Under the connection of a plurality of first springs 16, the carrier plate 15 drives the cleaning basket 2 to vibrate continuously, so that the semiconductor parts inside the cleaning basket 2 are turned over, effectively performing cleaning. And under the buffering of the cleaning liquid and water, the semiconductor parts will not have a heavy collision, ensuring the integrity of the semiconductor parts.

[0029] Furthermore, please refer to Figure 2 andFigure 4 On the bearing plate 15, a number of water-permeable holes 151 are formed through. The water-permeable holes 151 allow the cleaning liquid to directly act on the semiconductor parts, improving the cleaning efficiency. On the inner wall of the ultrasonic cleaning machine body 1, a vertically oriented guiding groove 17 is constructed. A guiding block 152 that slides inside the guiding groove 17 is fixed on the bearing plate 15. The design of the guiding groove 17 and the guiding block 152 provides the stability of the bearing plate 15 and prevents it from shifting under the action of ultrasonic waves.

[0030] Furthermore, please refer to Figure 2 、 Figure 4 and Figure 5 . On the top of the cleaning basket 2, a number of evenly distributed baffles 21 are fixed. On one side of the box cover 11, a number of buffer members 18 are installed. The number of buffer members 18 corresponds to the number of baffles 21 one by one. During the cleaning process, the cleaning basket 2 will vibrate up and down. At this time, the baffles 21 collide with the buffer members 18, which can reduce the damage to the box cover 11 and the cleaning basket 2.

[0031] Specifically, the buffer member 18 includes a buffer plate 181, a second spring 182 and a shock absorber 183. The shock absorber 183 is a prior art and will not be elaborated here. The second spring 182 is connected between one side of the box cover 11 and the buffer plate 181. The shock absorber 183 is connected between one side of the box cover 11 and the buffer plate 181 and is located inside the second spring 182. The baffle 21 collides with the buffer plate 181. Under the action of the second spring 182 and the shock absorber 183, the impact on the cleaning basket 2 is buffered, and at the same time, the box cover 11 is buffered, reducing the damage to the cleaning basket 2 and the box cover 11.

[0032] It should be noted that, please refer to Figure 2 . A pulling plate 22 is provided on the top of the cleaning basket 2. The design of the pulling plate 22 enables the operator to conveniently take out or put in the cleaning basket 2, improving the convenience of operation.

[0033] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor parts cleaning device, characterized in that: include: An ultrasonic cleaning machine body (1), wherein a box cover (11) is hingedly connected to the top of the ultrasonic cleaning machine body (1), the box cover (11) is fixed to the ultrasonic cleaning machine body (1) via a fixing buckle (12), a water inlet pipe (13) and a water outlet pipe (14) are arranged on the ultrasonic cleaning machine body (1), a bearing plate (15) is movably arranged inside the ultrasonic cleaning machine body (1), and a plurality of evenly distributed springs (16) are connected between the bottom of the bearing plate (15) and the bottom wall inside the ultrasonic cleaning machine body (1); A cleaning basket (2) movably arranged inside the ultrasonic cleaning machine body (1) and mounted on the top of the carrier plate (15), the interior of the cleaning basket (2) being used to hold semiconductor parts; A striking component (3) is mounted on the ultrasonic cleaning machine body (1), and the striking component (3) is used to intermittently strike the bottom of the supporting plate (15).

2. A semiconductor parts cleaning device according to claim 1, characterized in that: The striking assembly (3) comprises a reduction motor (31) mounted on the outer wall of the ultrasonic cleaning machine body (1); a rotating rod (32) movably inserted into the ultrasonic cleaning machine body (1) is fixed to the output end of the reduction motor (31); a cam (33) is fixedly sleeved on the rotating rod (32); one end of the cam (33) intermittently contacts the bottom of the supporting plate (15).

3. A semiconductor parts cleaning device according to claim 1, characterized in that: The bearing plate (15) is provided with a plurality of water-permeable holes (151), the inner wall of the ultrasonic cleaning machine body (1) is provided with a vertical guide groove (17), and a guide block (152) is fixed on the bearing plate (15) and slides inside the guide groove (17).

4. A semiconductor parts cleaning device according to claim 1, characterized in that: A plurality of evenly distributed baffles (21) are fixed to the top of the cleaning basket (2), and a plurality of buffer members (18) are installed on one side of the box cover (11), wherein the plurality of buffer members (18) correspond one to one with the plurality of baffles (21).

5. A semiconductor parts cleaning device according to claim 4, characterized in that: The buffer component (18) comprises a buffer plate (181), a second spring (182) and a shock absorber (183); the second spring (182) is connected between one side of the box cover (11) and the buffer plate (181); the shock absorber (183) is connected between one side of the box cover (11) and the buffer plate (181) and is located inside the second spring (182).

6. A semiconductor parts cleaning device according to claim 1, characterized in that: A buckle plate (22) is provided on the top of the cleaning basket (2).

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