Chip braid automatic burning equipment

Abstract

The utility model discloses a chip braid automatic burning device which comprises a machine frame, a carrier tape track, a probe testing device, a heat sealing device, an automatic discharging disc and an automatic receiving disc, a material passing channel for a chip carrier tape to carry materials is arranged between a feeding port and a discharging port of the machine frame, the carrier tape track is obliquely arranged on the machine frame, and the probe testing device is arranged on the carrier tape track. The carrier tape track obliquely extends from one side of the machine frame to the other side of the machine frame, the height of the end, close to the discharging port, of the carrier tape track is smaller than that of the end, away from the discharging port, of the carrier tape track, the probing device is used for burning chips in the containing groove of the chip carrier tape, and the heat sealing device is used for packaging the burned chips. The automatic discharging disc is used for automatically releasing the chip carrier tape to enter the material passing channel through the feeding port and penetrate out of the discharging port, so that the chip carrier tape moves along the carrier tape track to be burnt and packaged in sequence and then is wound by the automatic receiving disc, the yield of chip burning is improved, and the quality of chip products is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip programming equipment, in particular to an automatic chip taping and programming equipment. Background Art

[0002] At present, the production of IC chips has multiple manufacturing processes. Programming is one of the processes in chip manufacturing. Programming means importing a pre-set program into the IC chip. Generally speaking, the data area of the IC chips purchased by manufacturers is blank. In order to enable the IC chips to perform operations according to the functions designed by the manufacturers, programmers will write the program in advance and then write the control program and data into the IC chips using an IC chip programmer. This is a necessary process more important than IC chip testing and is generally performed by the final electronic product manufacturer; the programming of IC chips requires the use of special programming equipment.

[0003] For example, Chinese Patent Application No. CN202210526625.6, titled "An Automatic Taping and Programming Machine and Its Usage Method", specifically, the discharge tray 212 and the receiving tray 213 are driven by the first driving member 214 to rotate synchronously. The chip carrier tape passes from the discharge tray 212 through the feed inlet 11, passes through the material passing channel 12 and exits from the discharge outlet 13, and enters the material receiving groove 223 from the feed end 221 of the carrier tape track 22. The chip carrier tape is programmed through the needle detection device 4, and then the programmed chip carrier tape is encapsulated by the heat sealing device 5. The encapsulated chip carrier tape exits from the discharge end 222 of the carrier tape track 22 and is wound by the rotating receiving tray 213. Among them, when the chip carrier tape exits from the discharge outlet 13 and enters the carrier tape track 22 upward from the feed end 221, under the action of gravity, the chips in the accommodation groove of the chip carrier tape slide against the left side wall of the accommodation groove. When the chip carrier tape moves downward along the carrier tape track 22, since the carrier tape track 22 is inclined, the height of the feed end 221 of the carrier tape track 22 is higher than the height of the discharge end 222 of the carrier tape track 22, so that some of the chips in the accommodation groove of the chip carrier tape slide against the right side wall of the accommodation groove. However, some chips with smaller sizes do not slide against the right side wall of the accommodation groove due to factors such as burrs on the surface. In this way, some of the chips in the accommodation groove of the chip carrier tape entering the carrier tape track 22 slide against the right side wall of the accommodation groove, and some chips still lean against the left side wall of the accommodation groove. Thus, the needles of the needle detection device 4 cannot accurately correspond to all the chips in the accommodation groove of the chip carrier tape for programming, the programming accuracy is low, and the programming defect rate is high, resulting in the quality of the chip products being affected. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an automatic chip taping and programming equipment, aiming to solve the technical problem of high defect rate in chip programming in the prior art.

[0005] To achieve the above object, the technical solution of the present utility model provides an automatic chip taping and programming device, including:

[0006] A frame, on one side of the frame is provided a feeding port, on the other side of the frame is provided a discharging port, and a material passing channel for the chip carrier tape to pass through is arranged between the feeding port and the discharging port;

[0007] A carrier tape track, the carrier tape track is inclined and arranged on the frame, and the carrier tape track extends obliquely from one side of the frame towards the other side of the frame, and the height of one end of the carrier tape track close to the discharging port is lower than the height of the other end of the carrier tape track far from the discharging port;

[0008] A needle detection device, the needle detection device is slidably arranged above the carrier tape track for programming the chips in the accommodation grooves of the chip carrier tape;

[0009] A heat sealing device, the heat sealing device is arranged above the carrier tape track for encapsulating the programmed chips;

[0010] An automatic feeding tray and an automatic winding tray, the automatic feeding tray is used for automatically releasing the chip carrier tape to enter the material passing channel through the feeding port and pass out through the discharging port, so that the chip carrier tape moves along the carrier tape track to be programmed and encapsulated in sequence and then is wound by the automatic winding tray.

[0011] Furthermore, a first pressing plate is arranged on the carrier tape track, so that the chip carrier tape passes through between the first pressing plate and the carrier tape track. A first through hole is opened on the first pressing plate, and a first threaded hole is correspondingly opened on the carrier tape track. The first pressing plate is installed by passing a first screw through the first through hole and screwing it into the first threaded hole. A first spring is sleeved on the first screw, the first spring is received in the first through hole, and both ends of the first spring respectively abut between the end cap of the first screw and the bottom end of the first through hole. A first limiting step for abutting against the first spring is arranged at the bottom end of the first through hole.

[0012] Further, a second pressing plate is provided on the carrier tape track. The first pressing plate and the second pressing plate are spaced apart along the width direction of the carrier tape track, so as to press on the opposite sides of the chip carrier tape respectively through the first pressing plate and the second pressing plate. A second through hole is formed in the second pressing plate, and a second threaded hole is correspondingly formed in the carrier tape track, so as to install the second pressing plate by passing a second screw through the second through hole and screwing it into the second threaded hole. A second spring is sleeved on the second screw, and the second spring is received in the second through hole. Two ends of the second spring respectively abut between the end cap of the second screw and the bottom end of the second through hole. A second limiting step for abutting the second spring is provided at the bottom end of the second through hole.

[0013] Further, a carrier tape driving assembly is further included. The carrier tape driving assembly includes a driving motor and a driving gear. The driving motor is arranged on the frame, and an output shaft of the driving motor is drivingly connected with the driving gear. The driving gear is located at one end of the carrier tape track away from the discharge port. A plurality of tooth holes are sequentially and spaced apart along the length direction of the chip carrier tape, so that the driving motor drives the chip carrier tape to move on the carrier tape track by the engagement of the teeth of the driving gear with the tooth holes of the chip carrier tape.

[0014] Further, the carrier tape driving assembly further includes a retaining pressing plate. One end of the retaining pressing plate is pivotally connected to the frame, and the retaining pressing plate is located above the driving gear. A buckle is arranged on the frame, and the other end of the retaining pressing plate is clamped with the buckle.

[0015] Further, an avoidance groove is formed in the retaining pressing plate, and the avoidance groove is correspondingly arranged opposite to some teeth at the top of the driving gear.

[0016] Further, a film tearing device arranged on the frame is further included. The film tearing device is used to remove the film material on the surface of the chip carrier tape, so as to facilitate the chip in the accommodating groove of the chip carrier tape to be burned by the needle detection device.

[0017] Further, the film tearing device includes an automatic winding disc. The automatic winding disc is arranged at one end of the carrier tape track close to the discharge port, so as to rotate and wind up and tear off the film material on the surface of the chip carrier tape through the automatic winding disc.

[0018] Further, the film tearing device further includes a film tearing rod. The film tearing rod is arranged at one end of the carrier tape track close to the discharge port, and the film tearing rod is substantially flush with the inclined surface of the carrier tape track, so that the film material on the surface of the chip carrier tape passing out of the discharge port winds around the film tearing rod and is wound up on the automatic winding disc.

[0019] Further, it further includes a film material disk, which is arranged on the frame, and the film material disk is used to release new film material and cover the surface of the chip carrier tape after burning.

[0020] As can be seen from the above technical solution, in the chip carrier tape automatic burning device of the present utility model, the chip carrier tape is automatically released by the rotation of the automatic feeding disk and enters the material passing channel through the feeding port and passes out through the discharging port, and then enters the carrier tape track from one end of the carrier tape track close to the discharging port and moves on the carrier tape track. Immediately afterwards, the chips in the accommodating grooves of the chip carrier tape are burned through the needle detection device. Subsequently, the burned chip carrier tape is encapsulated by the heat sealing device. The encapsulated chip carrier tape passes out from one end of the carrier tape track far from the discharging port and is automatically wound by the rotation of the automatic winding disk. Among them, when the chip carrier tape passes out from the discharging port and enters the carrier tape track upwards, under the action of the gravity of the chips themselves, the chips in the accommodating grooves of the chip carrier tape slide against the left side wall of the accommodating groove. Since the height of one end of the carrier tape track close to the discharging port is lower than the height of the end of the carrier tape track far from the discharging port, when the chip carrier tape moves along the inclined carrier tape track, almost all the chips in the accommodating grooves of the chip carrier tape still abut against the left side wall of the accommodating groove, and part of the chips will not slide against the right side wall of the accommodating groove, so as to make the positions of the chips in each accommodating groove unified. In this way, the needle detection device can accurately correspond to almost all the chips in the accommodating grooves of the chip carrier tape for burning, so as to improve the burning yield of the chips and ensure the quality of the chip products.

[0021] In order to make the technical concept, other purposes, advantages, features and functions of the present utility model clearer and easier to understand, preferred embodiments will be specifically cited in the following specific embodiments, and detailed explanations will be made in conjunction with the drawings. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 is a schematic structural diagram of a chip carrier tape automatic burning device provided by an embodiment of the present application;

[0024] Figure 2 is a perspective view of a chip carrier tape automatic burning device provided by an embodiment of the present application;

[0025] Figure 3 is a perspective view of another angle of a chip carrier tape automatic burning device provided by an embodiment of the present application;

[0026] Figure 4 It is a schematic structural diagram when the first pressing plate and the second pressing plate provided in the embodiment of the present application are combined;

[0027] Figure 5 It is a schematic structural diagram of the tape driving assembly provided in the embodiment of the present application;

[0028] Figure 6 It is a schematic structural diagram of the chip tape provided in the embodiment of the present application.

[0029] Among them, the above-mentioned drawings include the following reference numerals:

[0030] 100, frame; 110, feeding port; 120, discharging port;

[0031] 200, tape track; 210, first pressing plate; 211, first screw; 212, first through hole; 220, second pressing plate; 221, second through hole;

[0032] 300, needle detection device; 400, heat sealing device; 500, automatic material collecting tray; 510, material collecting motor;

[0033] 600, film tearing device; 610, automatic winding disc; 620, film tearing motor; 630, film tearing rod; 700, film material tray;

[0034] 800, tape driving assembly; 810, retaining pressing plate; 811, avoidance groove; 812, pivot; 820, driving motor; 830, driving gear; 831, teeth; 840, buckle;

[0035] 900, chip tape; 910, accommodating groove; 920, tooth holes. Detailed implementation manners

[0036] In order to enable those skilled in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application.

[0037] Please refer to Figures 1 to 6, this embodiment provides an automatic chip taping and burning device, including a frame 100, a carrier tape track 200, a pin detection device 300, a heat sealing device 400, an automatic loading tray, and an automatic unloading tray 500. A control unit for controlling the operation of the burning device is provided inside the frame 100. An inlet 110 is provided on one side of the frame 100, and an outlet 120 is provided on the other side of the frame 100. A material passing channel for the chip carrier tape 900 to pass through is provided between the inlet 110 and the outlet 120. The carrier tape track 200 is inclined on the frame 100 and extends obliquely from one side of the frame 100 towards the other side of the frame 100. The height of the end of the carrier tape track 200 close to the outlet 120 is lower than the height of the end of the carrier tape track 200 far from the outlet 120. The pin detection device 300 is slidably arranged above the carrier tape track 200 for burning the chips in the accommodation grooves 910 of the chip carrier tape 900. The heat sealing device 400 is arranged above the carrier tape track 200 for encapsulating the burned chips. The automatic loading tray is used to automatically release the chip carrier tape 900 to enter the material passing channel through the inlet 110 and pass through the outlet 120, so that the chip carrier tape 900 moves along the carrier tape track 200 to be burned and encapsulated in sequence and then wound by the automatic unloading tray 500. The automatic unloading tray 500 is driven by a winding motor 510 to rotate, and the automatic loading tray is driven by a feeding motor to rotate. Among them, the pin detection device 300 is a prior art.

[0038] It can be seen that as Figure 1 and Figure 6As shown, the chip tape automatic burning equipment of this embodiment automatically releases the chip carrier 900 by rotating the automatic discharge plate, enters the material passage through the feed port 110 and passes through the discharge port 120, and then enters the carrier track 200 from the end of the carrier track 200 close to the discharge port 120 to move, and then the chip in the receiving groove 910 of the chip carrier 900 is burned through the needle detection device 300, and then the burned chip carrier 900 is packaged by the heat sealing device 400, and the packaged chip carrier 900 passes through the end of the carrier track 200 away from the discharge port 120, and is automatically reeled by the rotation of the automatic receiving plate 500, wherein, when the chip carrier 900 passes through the discharge port 120 and enters the carrier track 200 upward, the chip itself is affected. Under the action of gravity, the chips in the receiving grooves 910 of the chip carrier 900 slide against the left side wall of the receiving grooves 910. Since the height of the end of the carrier track 200 close to the discharge port 120 is lower than the height of the end of the carrier track 200 away from the discharge port 120, when the chip carrier 900 moves along the inclined carrier track 200, almost all the chips in the receiving grooves 910 of the chip carrier 900 still rest against the left side wall of the receiving grooves 910, and no part of the chips slide against the right side wall of the receiving grooves 910, so as to achieve the uniform position of the chips in each receiving groove 910. In this way, the probe test device 300 and almost all the chips in the receiving grooves 910 of the chip carrier 900 can be accurately correspondingly burned, so as to improve the yield of chip burning and ensure the quality of chip products.

[0039] Specifically, if Figure 1 and Figure 4 As shown, a first pressing plate 210 is provided on the carrier rail 200 to allow the chip carrier 900 to pass between the first pressing plate 210 and the carrier rail 200, a first through hole 212 is provided on the first pressing plate 210, and a first threaded hole is correspondingly provided on the carrier rail 200, so that a first screw 211 passes through the first through hole 212 and is screwed into the first threaded hole to install the first pressing plate 210, and a first spring is sleeved on the first screw 211, and the first spring is accommodated in the first through hole 212, and the two ends of the first spring are respectively blocked between the end cap of the first screw 211 and the bottom end of the first through hole 212, and a first limiting step for blocking the first spring is provided at the bottom end of the first through hole 212, and the first pressing plate 210 is located below the needle testing device 300, so that the chip carrier 900 can move more smoothly on the carrier rail 200 under the limiting action of the first pressing plate 210, thereby further improving the yield and accuracy of chip burning.

[0040] Furthermore, if Figure 1 , Figure 4 and Figure 6As shown in the figure, a second pressing plate 220 is provided on the carrier tape track 200. The first pressing plate 210 and the second pressing plate 220 are arranged at intervals along the width direction of the carrier tape track 200. Both the first pressing plate 210 and the second pressing plate 220 are located below the needle detection device 300, so as to press on the opposite sides of the chip carrier tape 900 through the first pressing plate 210 and the second pressing plate 220 respectively. A second through hole 221 is opened on the second pressing plate 220, and a second threaded hole is correspondingly opened on the carrier tape track 200, so as to install the second pressing plate 220 by passing a second screw through the second through hole 221 and screwing it into the second threaded hole. A second spring is sleeved on the second screw, and the second spring is received in the second through hole 221. The two ends of the second spring respectively abut between the end cap of the second screw and the bottom end of the second through hole 221. A second limiting step for abutting the second spring is provided at the bottom end of the second through hole 221. Among them, both the first pressing plate 210 and the second pressing plate 220 are located below the needle detection device 300, and the chip in the accommodation groove 910 of the chip carrier tape 900 is exposed between the first pressing plate 210 and the second pressing plate 220, so as to facilitate the needle detection device 300 to perform programming on the chip in the accommodation groove 910 of the chip carrier tape 900.

[0041] In this embodiment, as Figure 1 、 Figure 5 and Figure 6 shown, the programming device further includes a carrier tape driving assembly 800. The carrier tape driving assembly 800 includes a driving motor 820 and a driving gear 830. The driving motor 820 is arranged on the frame 100, and the output shaft of the driving motor 820 is drivingly connected to the driving gear 830. The driving gear 830 is located at one end of the carrier tape track 200 away from the discharge port 120. A plurality of tooth holes 920 are arranged at intervals along the length direction of the chip carrier tape 900, so that the driving motor 820 drives the chip carrier tape 900 to move on the carrier tape track 200 by the engagement of the teeth 831 of the driving gear 830 with the tooth holes 920 of the chip carrier tape 900. In this way, the carrier tape driving assembly 800 drives the chip carrier tape 900 to move on the carrier tape track 200, thereby preventing the chip carrier tape 900 from getting stuck at the heat sealing device 400 or the needle detection device 300, making the chip carrier tape 900 move more smoothly on the carrier tape track 200, so as to improve the stability and reliability of programming.

[0042] Specifically, as Figure 1 、 Figure 5 and Figure 6As shown, the carrier tape driving assembly 800 further includes a retaining plate 810. One end of the retaining plate 810 is pivotally connected to the frame 100 through a pivot 812, and the retaining plate 810 is located above the driving gear 830. A buckle 840 is provided on the frame 100, and the other end of the retaining plate 810 is snap-connected to the buckle 840. In this way, under the pressing and limiting action of the retaining plate 810, the tooth holes 920 of the chip carrier tape 900 are more reliably engaged with the teeth 831 of the driving gear 830, avoiding the tooth holes 920 of the chip carrier tape 900 disengaging from the teeth 831 of the driving gear 830 and causing failures.

[0043] Further, as Figure 1 and Figure 5 shown, the retaining plate 810 is provided with an avoidance groove 811, and the avoidance groove 811 is correspondingly arranged opposite to some of the teeth 831 at the top of the driving gear 830, avoiding the retaining plate 810 interfering with the rotation of the driving gear 830 to improve the stability and reliability of the structure.

[0044] In this embodiment, as Figures 1 to 3 shown, the programming device further includes a film tearing device 600 provided on the frame 100. The film tearing device 600 is used to remove the film material on the surface of the chip carrier tape 900, so that the needle detection device 300 can program the chips in the accommodation grooves 910 of the chip carrier tape 900.

[0045] Specifically, as Figures 1 to 3 shown, the film tearing device 600 includes an automatic winding reel 610, and the automatic winding reel 610 is driven by a film tearing motor 620 to rotate. The automatic winding reel 610 is arranged at one end of the carrier tape track 200 close to the discharge port 120 to wind and tear off the film material on the surface of the chip carrier tape 900 by the rotation of the automatic winding reel 610. The film tearing device 600 further includes a film tearing rod 630. The film tearing rod 630 is arranged at one end of the carrier tape track 200 close to the discharge port 120, and the film tearing rod 630 is substantially flush with the inclined surface of the carrier tape track 200, so that the film material on the surface of the chip carrier tape 900 passing through the discharge port 120 winds around the film tearing rod 630 and is wound and collected on the automatic winding reel 610.

[0046] In this embodiment, as Figures 1 to 3 shown, the programming device further includes a film material reel 700. The film material reel 700 is arranged on the frame 100 and is driven by a film material motor to rotate. The film material reel 700 is used to release new film material, which is guided by a roller shaft and covers the surface of the programmed chip carrier tape 900, so that the heat sealing device 400 presses the new film material and the programmed chip carrier tape 900 for lamination and packaging. Among them, the heat sealing device 400 is an existing heat sealer.

[0047] From the above description, it can be seen that the above embodiments of the present utility model achieve the following technical effects:

[0048] The chip taping automatic programming device of the present utility model has an automatic feeding tray that rotates to automatically release the chip carrier tape 900, which enters the material passing channel through the feeding port 110 and exits through the discharging port 120. After the film material on the surface of the chip carrier tape 900 is removed by the film tearing device 600, it enters the carrier tape track 200 from one end of the carrier tape track 200 close to the discharging port 120 and moves on the carrier tape track 200. Subsequently, the chips in the accommodation grooves 910 of the chip carrier tape 900 are programmed through the needle detection device 300. Then, the programmed chip carrier tape 900 is encapsulated by the heat sealing device 400. After encapsulation, the chip carrier tape 900 exits from the end of the carrier tape track 200 far from the discharging port 120 and is automatically wound by the rotation of the automatic take-up tray 500. Among them, when the chip carrier tape 900 exits from the discharging port 120 and enters the carrier tape track 200 upward, under the action of the gravity of the chips themselves, the chips in the accommodation grooves 910 of the chip carrier tape 900 slide against the left side wall of the accommodation groove 910. Since the height of one end of the carrier tape track 200 close to the discharging port 120 is lower than the height of the end of the carrier tape track 200 far from the discharging port 120, when the chip carrier tape 900 moves along the inclined carrier tape track 200, almost all the chips in the accommodation grooves 910 of the chip carrier tape 900 still abut against the left side wall of the accommodation groove 910, and no part of the chips will slide against the right side wall of the accommodation groove 910, so as to make the positions of the chips in each accommodation groove 910 unified. In this way, the needle detection device 300 can accurately correspond to almost all the chips in the accommodation grooves 910 of the chip carrier tape 900 for programming, so as to improve the programming yield of the chips and ensure the quality of the chip products.

[0049] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0050] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof in subsequent drawings is not required.

[0051] It should be noted that in the description of the present application, unless otherwise clearly specified and defined, the terms "set, connect, couple, install" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, a contact connection, or an integral connection; for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "the other side", "both ends", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0053] In addition, if the description in the embodiments of the present application involves "first", "second", etc., such descriptions of "first", "second", etc. are only for descriptive purposes and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features.

[0054] The above is the preferred embodiment of the present utility model. It should be pointed out that for those of ordinary skill in the technical field, without departing from the principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications are also regarded as the protection scope of the present utility model.

Claims

1. A chip taping automatic burning device, characterized in that: include: A frame, wherein a feed port is disposed on one side of the frame, a discharge port is disposed on the other side of the frame, and a material transfer channel for carrying and feeding chips is disposed between the feed port and the discharge port; A carrier track, wherein the carrier track is obliquely arranged on the frame, and the carrier track is obliquely extended from one side of the frame toward the other side of the frame, and the height of one end of the carrier track close to the discharge port is lower than the height of one end of the carrier track away from the discharge port; A probe device, which is slidably disposed above the carrier track to burn the chip in the receiving slot of the chip carrier; A heat sealing device, which is arranged above the carrier track and is used to package the burned chips; An automatic unloading tray and an automatic receiving tray, wherein the automatic unloading tray is used to automatically release the chip carrier tape through the feed port into the material transfer channel and out through the discharge port, so that the chip carrier tape moves along the carrier tape track for sequential burning and packaging and then is reeled up by the automatic receiving tray.

2. The chip taping automatic burning device according to claim 1, characterized in that: A first pressure plate is provided on the carrier rail, so that the chip carrier passes between the first pressure plate and the carrier rail, a first through hole is provided on the first pressure plate, and a first threaded hole is correspondingly provided on the carrier rail, so that the first pressure plate can be installed by passing a first screw through the first through hole and screwing into the first threaded hole, and a first spring is sleeved on the first screw, and the first spring is accommodated in the first through hole, and the two ends of the first spring are respectively abutted between the end cap of the first screw and the bottom end of the first through hole, and the bottom end of the first through hole is provided with a first limiting step for abutting the first spring.

3. The chip taping automatic burning device according to claim 2 is characterized in that: The carrier track is provided with a second pressing plate, and the first pressing plate and the second pressing plate are spaced apart in the width direction of the carrier track so that the first pressing plate and the second pressing plate are respectively pressed on opposite sides of the chip carrier, and a second through hole is provided on the second pressing plate, and a second threaded hole is correspondingly provided on the carrier track so that a second screw passes through the second through hole and is screwed into the second threaded hole to install the second pressing plate, and a second spring is sleeved on the second screw, and the second spring is accommodated in the second through hole, and the two ends of the second spring are respectively abutted between the end cap of the second screw and the bottom end of the second through hole, and the bottom end of the second through hole is provided with a second limiting step for abutting the second spring.

4. The chip taping automatic burning device according to any one of claims 1 to 3, characterized in that: It also includes a carrier drive assembly, which includes a drive motor and a drive gear. The drive motor is arranged on the frame, and the output shaft of the drive motor is drivingly connected to the drive gear. The drive gear is located at an end of the carrier track away from the discharge port. The chip carrier is provided with a plurality of tooth holes spaced in sequence along its length direction, so that the drive motor can drive the chip carrier to move on the carrier track by matching the teeth of the drive gear with the tooth holes of the chip carrier.

5. The chip taping automatic burning device according to claim 4 is characterized in that: The carrier belt driving assembly also includes a pressure plate, one end of which is pivotally connected to the frame and located above the driving gear. A buckle is provided on the frame, and the other end of the pressure plate is buckled with the buckle.

6. The chip taping automatic burning device according to claim 5, characterized in that: The pressure baffle plate is provided with an avoidance groove, and the avoidance groove is arranged corresponding to a part of the teeth at the top of the driving gear.

7. The chip taping automatic burning device according to any one of claims 1 to 3, characterized in that: It also includes a film-tearing device arranged on the frame, and the film-tearing device is used to remove the film material on the surface of the chip carrier, so that the needle testing device can burn the chip in the receiving groove of the chip carrier.

8. The chip taping automatic burning device according to claim 7, characterized in that: The film tearing device comprises an automatic winding disk, which is arranged at one end of the carrier track close to the discharge port, so that the film material on the surface of the chip carrier can be rolled up and torn off by rotating the automatic winding disk.

9. The chip taping automatic burning device according to claim 8, characterized in that: The film tearing device also includes a film tearing rod, which is arranged at one end of the carrier track close to the discharge port, and the film tearing rod is roughly flush with the inclined surface of the carrier track, so that the film material on the surface of the chip carrier that passes through the discharge port can pass through the film tearing rod and be wound and rolled up on the automatic winding disk.

10. The chip taping automatic burning device according to any one of claims 1 to 3, characterized in that: It also includes a film material tray, which is arranged on the frame and is used to release new film material and cover the surface of the chip carrier after burning.

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