Wafer box storage device

Abstract

The utility model discloses a wafer box storage device which comprises a plurality of stand columns arranged in an array mode. The plurality of shelf units are detachably connected with the stand column, the plurality of shelf units are sequentially arranged at intervals in the height direction of the stand column, a containing space for containing a wafer box is arranged above each shelf unit, the wafer box storage device further comprises a plurality of connecting units detachably arranged on the shelf units, and each connecting unit is provided with a detection unit; wherein the plurality of connection units are configured to be capable of adjusting connection positions on the shelf unit, and the detection unit is configured to detect one or more wafer cassettes placed above or below the shelf unit. According to the wafer box storage device, the position of the detection unit can be flexibly adjusted on the shelf unit through the connection unit, the wafer boxes with different sizes or detection labels located at different positions of the wafer boxes can be detected, and the problem that an existing wafer box storage device can only detect and store wafer boxes of a single type is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cassette storage, and particularly relates to a wafer cassette storage device. Background Art

[0002] In a semiconductor wafer fab, the storage and transportation of wafer cassettes are very important links. In order to enable the wafer production equipment and the inspection equipment to have a high utilization rate, buffer storage devices are usually placed beside the wafer production equipment and the inspection equipment.

[0003] Most of the existing buffer storage devices are multi-layer frame structures formed by integral metal welding. A metal plate is laid on each layer of the frame structure, and sensors are installed at specified positions on the metal plate or the frame structure to detect the detection labels on the wafer cassettes. Due to the planar structure of the metal plate and the position limitation of the sensors installed on the frame structure, when the sensors are installed on the frame structure, their positions are fixed. Therefore, after the sensors are installed, if the detection labels on different models or types of wafer cassettes are located at different positions, it is difficult for the sensors to detect different types or models of wafer cassettes.

[0004] Based on this, a new technical solution is needed. Summary of the Utility Model

[0005] In view of this, the embodiments of the utility model provide a wafer cassette storage device to at least solve the problem that it is difficult for the existing buffer wafer cassette storage device to cope with the detection of different models or types of wafer cassettes after installation.

[0006] The embodiments of the utility model provide the following technical solutions:

[0007] The embodiments of the utility model provide a wafer cassette storage device, which includes a plurality of upright columns arranged in an array; a plurality of shelf units detachably connected to the upright columns, the plurality of shelf units are sequentially and spaced apart along the height direction of the upright columns, and each shelf unit has a receiving space for receiving a wafer cassette above it. The wafer cassette storage device further includes a plurality of connection units detachably arranged on the shelf units, and each connection unit is respectively provided with a detection unit;

[0008] Wherein, the plurality of connection units are configured to be adjustable in connection positions on the shelf units, and the detection unit is configured to detect one or more wafer cassettes placed above or below the shelf unit.

[0009] Further, the plurality of connection units include first connection elements and / or second connection elements;

[0010] The plurality of connection units are detachably arranged on the upper side and / or the lower side of the shelf unit;

[0011] The shelf unit is a grid-like frame structure.

[0012] Further, each of the detection units is configured to be installed below a shelf unit through a corresponding first connection element to detect a first wafer cassette below the shelf unit or a second wafer cassette above the shelf unit; wherein, the first wafer cassette is a wafer cassette having a detection label at the upper end of the cassette body, and the second wafer cassette is a wafer cassette having a detection label at the side and / or bottom of the cassette body; or,

[0013] Each of the detection units is configured to be installed above a shelf unit through a corresponding second connection element to detect a second wafer cassette above the shelf unit; wherein, the second wafer cassette is a wafer cassette having a detection label at the side and / or bottom of the cassette body; or,

[0014] Some of the detection units are configured to be connected below adjacent shelf units through corresponding first connection elements, and another part of the detection units are configured to be connected above adjacent shelf units through corresponding second connection elements, and the detection units opposite to each other on adjacent shelf units are arranged vertically corresponding to each other to detect a third wafer cassette located between the two vertically corresponding detection units; wherein, the third wafer cassette is a wafer cassette having detection labels at both the bottom and the upper end of the cassette body, or a wafer cassette having detection labels at both the side and the upper end of the cassette body.

[0015] Further, the shelf unit has rod elements;

[0016] Each of the first connection elements includes a connecting plate portion and at least two suspension portions connected to both ends of the connecting plate portion, wherein the suspension portion has a hook portion, and the hook portion has an inner surface surrounding an open area; at least a part of the inner surface of the hook portion contacts and supports the outer surface of the rod element of the shelf unit.

[0017] Each of the second connection elements includes at least two connection pieces connected to both ends of the detection unit, wherein the connection piece has a first limiting portion for connecting the detection unit and a locking portion connected to the first limiting portion, and the locking portion has a blocking wall protruding to one side relative to the first limiting portion; in each of the second connection elements, the first limiting portions of the two connection pieces are used to limit the relative movement in the horizontal direction between the rod element of the shelf unit and the second connection element, and the blocking walls of the two locking portions limit the relative movement in the height direction between the rod element of the shelf unit and the second connection element.

[0018] Further, the detection unit is connected to the upper surface or the lower surface of the connecting plate portion;

[0019] The detection unit has a first panel and a second panel facing away from the first panel. A through hole for the detection light to pass through is provided on the first panel, and the detection unit is connected to the connection plate portion through the second panel;

[0020] When the detection unit is configured to be connected to the upper surface of the connection plate portion, the detection light of the detection unit can pass through the through hole to detect the in-position state of the second wafer cassette or the third wafer cassette above the shelf unit;

[0021] When the detection unit is configured to be connected to the lower surface of the connection plate portion, the detection light of the detection unit can detect the in-position state of the first wafer cassette or the third wafer cassette below the shelf unit.

[0022] Further, the second panel of the detection unit is configured to form a shielding body with a material that shields electromagnetic waves, suppressing the propagation of the electromagnetic waves of the detection unit outside the specified area, where the specified area is the area where the electromagnetic waves propagate in the direction from the second panel towards the first panel.

[0023] Further, the connection manner between the connection unit and the shelf unit includes one of hanging connection, snap connection, magnetic attraction connection, adhesive connection, tethering connection, and buckle connection.

[0024] Further, the shelf unit includes a plurality of first rod elements arranged at intervals along the length direction of the shelf unit and a plurality of second rod elements arranged at intervals along the width direction of the shelf unit;

[0025] Among them, the plurality of first rod elements and / or the plurality of second rod elements are arranged at equal intervals.

[0026] Further, each of the upright columns includes:

[0027] A plurality of second limiting portions, and the plurality of second limiting portions are arranged on the upright column at intervals along the height direction of the upright column;

[0028] Further, the wafer cassette storage device further includes:

[0029] A plurality of fixing units, each of the fixing units is arranged around a corresponding upright column. The fixing unit includes two relatively arranged fixing portions, the two fixing portions are relatively arranged on both sides of the corresponding upright column, and a third limiting portion is arranged on the side surface of each fixing portion facing the upright column, and the third limiting portion cooperates with the second limiting portion;

[0030] Further, the shelf unit is configured to be adjustable in the installation position along the height direction of the upright column, and each of the shelf units further includes:

[0031] A plurality of fixing sleeves are arranged along the circumferential direction of the shelf unit at the edge of the shelf unit, and correspondingly sleeved on a plurality of the upright columns, and the inner diameters of the fixing sleeves increase sequentially from top to bottom;

[0032] Wherein, when the two fixing parts are attached to both sides of the corresponding upright column and the second limiting part and the third limiting part are cooperatively connected, the fixing sleeve slides along the upright column and is sleeved outside the two fixing parts, so that the shelf unit is located between a plurality of the upright columns at the height of the second limiting part.

[0033] Further, when the inner surface of the fixing part is attached to the upright column, the distance from the outer surface of the fixing part to the central axis of the upright column gradually increases from top to bottom, and the outer surface of the fixing part matches the inner surface of the fixing sleeve.

[0034] Further, the wafer cassette storage device further includes:

[0035] A wire groove unit, and part of the wire groove units are arranged at the edge of the shelf unit along the length direction and / or the width direction of the shelf unit and are located above the shelf unit, and are used for arranging wires and blocking the wafer cassettes on the shelf unit.

[0036] Further, the shelf unit further includes:

[0037] A blocking part, which is arranged at at least one edge of the shelf unit and is used for blocking the wafer cassette.

[0038] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of the present invention at least include:

[0039] A wafer cassette storage device of the present invention can detachably install a detection unit above and / or below a shelf unit through a connection unit, and can also adjust the position of the detection unit in the horizontal direction of the shelf unit through the connection unit, so that the position of the detection unit on the shelf unit can be flexibly adjusted through the connection unit, so as to realize the detection of one or more wafer cassettes placed above or below the shelf unit by the detection unit;

[0040] Further, since the shelf unit is a mesh structure, when the detection unit is located below the shelf unit, the detection signal of the detection unit can penetrate through the grid of the shelf unit to detect the wafer cassette located above the shelf unit and with the detection label on the side and / or bottom of the wafer cassette, solving the problem that the existing buffer wafer cassette storage device cannot store and detect wafer cassettes of different models or types after installation. Description of the Drawings

[0041] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0042] Figure 1 Schematic structural diagram of a wafer cassette storage device according to an embodiment of the present utility model;

[0043] Figure 2 Front view of a wafer cassette storage device according to an embodiment of the present utility model;

[0044] Figure 3 Side view of a wafer cassette storage device according to an embodiment of the present utility model;

[0045] Figure 4 Schematic structural diagram of a shelf unit in a wafer cassette storage device according to an embodiment of the present utility model;

[0046] Figure 5 For Figure 4 Schematic structural diagram of part A in

[0047] Figure 6 Schematic structural diagram of the first connection element of the connection unit and the detection unit according to an embodiment of the present utility model;

[0048] Figure 7 Assembly side view of the first connection element of the connection unit and the detection unit according to an embodiment of the present utility model;

[0049] Figure 8 Assembly schematic diagram of the second connection element of the connection unit and the detection unit according to an embodiment of the present utility model;

[0050] Figure 8a For Figure 8 Schematic structural diagram of part C in , that is, partial structural diagram of the second connection element in the embodiment of the present utility model;

[0051] Figure 9 Schematic structural diagram of multiple first wafer cassettes according to an embodiment of the present utility model;

[0052] Figure 10 And 11 Schematic structural diagram of multiple second wafer cassettes according to an embodiment of the present utility model;

[0053] Figure 12 Schematic diagram of multiple third wafer cassettes according to an embodiment of the present utility model.

[0054] Figure 13This is a schematic diagram of the assembly of the column and the shelf unit in the embodiment of the utility model;

[0055] Figure 14 for Figure 13 The structural diagram of the middle B part;

[0056] Figure 15 It is a partial exploded view of the pillar and the wafer box storage device of the embodiment of the utility model;

[0057] Figure 16 It is an exploded view of the column, the fixing part and the fixing sleeve of the embodiment of the utility model.

[0058] The accompanying drawings of the present utility model are as follows:

[0059] 10. upright column; 11. second limiting part;

[0060] 20. Shelf unit; 21. First rod element; 22. Second rod element; 23. Fixing sleeve; 24. Blocking part;

[0061] 30. Accommodation space;

[0062] 40. Connecting unit; 41. First connecting element; 411. Connecting plate portion; 412. Suspension portion; 4121. First straight plate portion; 4122. Hook portion; 42. Second connecting element; 421. Connecting piece; 4211. First limiting portion; 4212. Locking portion;

[0063] 50. Detection unit; 51. First panel; 52. Second panel; 53. Through hole;

[0064] 60. fixing unit; 61. fixing portion; 62. third limiting portion; 63. protrusion; 64. inner concave portion;

[0065] 70. Wire trough unit;

[0066] 80. Wafer box; 81. Detection label; 82. First wafer box; 83. Second wafer box; 84. Third wafer box. DETAILED DESCRIPTION

[0067] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0068] The following describes the implementation manners of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope protected by the present application.

[0069] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present application, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects described herein can be used to implement the device and / or practice the method. Additionally, this device and / or this method can be implemented using other structures and / or functionality in addition to one or more of the aspects described herein.

[0070] It should also be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present application schematically. The diagrams only show the components related to the present application, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and proportion of each component in its actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0071] In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the examples can be practiced without these specific details.

[0072] In a semiconductor wafer fab, a buffer wafer cassette storage device is generally placed near a general inspection machine (or part of the Stocker) to cache wafers to be inspected, stored, or transported.

[0073] Existing buffer wafer cassette storage devices all have an overall metal welded frame. Through the threaded holes machined on the frame, they are connected to metal plates, and the sensors are fixedly installed at designated positions on the metal plates through bolts. The wafer cassette 80 is also placed on the metal plate. Therefore, after the sensors are fixedly installed, their positions are difficult to move or change, making it difficult to flexibly detect wafer cassettes of different models or with different positions of detection labels. In addition, since the frame is an overall welded structure, the frame structure cannot be changed, making it difficult to place wafer cassettes of different sizes.

[0074] The existing buffer wafer cassette storage devices have the following problems:

[0075] 1. The shelf is relatively heavy and not easy to carry.

[0076] 2. The welded frame cannot adjust the layer spacing size.

[0077] 3. The metal plate for placing the wafer cassette has less hollowing, making it easy to accumulate dust and not easy to clean.

[0078] 4. The partition blocks the line of sight and affects the operator's multi-layer picking and placing.

[0079] 5. Since the sensors are fixedly installed at designated positions on the metal plates, only one model or type of wafer cassette can be detected / stored.

[0080] Based on this, the embodiments of the present utility model propose a processing solution: as Figures 1 - 3 shown, a wafer cassette storage device of the present utility model, by setting the layer rack unit 20 as a grid structure and installing the detection unit 50 above and / or below the layer rack unit 20 through the connection unit 40, or adjusting the position of the detection unit 50 in the horizontal direction of the layer rack unit 20 through the connection unit 40, can at least detect multiple models or shapes of wafer cassettes 80 (such as wafer cassettes 80 with detection labels 81 set on the side, wafer cassettes 80 with grooves at the bottom and detection labels 81 in the grooves, wafer cassettes 80 with grooves at the bottom of the outer shell and detection labels 81 at the upper end of the inner shell), solving the problem in the prior art that only one model or type of wafer cassette 80 can be detected and stored.

[0081] The following describes the technical solutions provided by the embodiments of the present application in conjunction with the accompanying drawings.

[0082] Embodiment 1

[0083] As Figures 1 - 4As shown in the figure, this embodiment provides a wafer cassette storage device, which includes a plurality of upright columns 10 arranged in an array and a plurality of shelf units 20 detachably connected to the plurality of upright columns 10. The plurality of shelf units 20 are sequentially and spaced apart along the height direction of the upright columns 10, and a receiving space 30 for receiving the wafer cassette 80 is provided above each shelf unit 20.

[0084] Among them, the plurality of receiving spaces 30 together form a storage bin for the wafer cassette 80, and different receiving spaces 30 can store the same or different wafer cassettes 80.

[0085] Among them, the shelf unit 20 can slide up and down along the plurality of upright columns 10, and is limited to a preset height when it slides to a specified position.

[0086] Among them, the upright column 10 can be a round rod-shaped structure or a square rod-shaped structure.

[0087] Preferably, the upright column 10 is a round rod-shaped structure, and there are four upright columns 10, which are arranged at the four corners of the shelf unit 20.

[0088] Among them, the shelf unit 20 is a grid-like frame structure.

[0089] Among them, the shelf unit 20 has rod elements.

[0090] Specifically, the shelf unit 20 includes a plurality of first rod elements 21 arranged at intervals along the length direction of the shelf unit 20 and a plurality of second rod elements 22 arranged at intervals along the width direction of the shelf unit 20.

[0091] Among them, the length direction of the shelf unit 20 is the X-axis direction on the plane where the shelf unit 20 is located, and the width direction of the shelf unit 20 is the Y-axis direction on the plane where the shelf unit 20 is located.

[0092] Preferably, the plurality of first rod elements 21 are all arranged parallel to each other; the plurality of second rod elements 22 are all arranged parallel to each other.

[0093] Furthermore, the plurality of first rod elements 21 and / or the plurality of second rod elements 22 are arranged at equal intervals.

[0094] Preferably, the plurality of first rod elements 21 are arranged at equal intervals, and whether the plurality of second rod elements 22 are arranged at equal intervals can be determined according to the number of the second rod elements 22.

[0095] Among them, after the plurality of first rod elements 21 and the plurality of second rod elements 22 are respectively arranged on the shelf unit 20, they together form a grid-like frame structure as shown in Figure 4 the figure.

[0096] Among them, when loading wafers into the wafer cassette 80, it at least includes a form in which a plurality of wafers are directly carried by a visible outer shell, and a form in which a susceptor is built into the visible outer shell and a plurality of wafers are carried in the susceptor. Therefore, in order to facilitate the identification of wafer information, detection labels 81 can be provided at the upper end, side end, and lower end of the visible outer shell; when a susceptor is built into the visible outer shell, detection labels 81 can be provided at the upper end, lower end, and side end of the susceptor, or detection labels 81 can be provided on the visible outer shell and the susceptor respectively; among them, when a susceptor is built into the visible outer shell and detection labels 81 are provided on the visible outer shell and the susceptor respectively, the labels on the visible outer shell and the labels on the susceptor are a set of associated labels.

[0097] As Figures 4 - 5 shown, the wafer cassette storage device further includes a plurality of connection units 40 and a plurality of detection units 50. Among them, the plurality of connection units 40 are detachably arranged on the shelf unit 20, and a detection unit 50 is respectively provided on each connection unit 40. Among them, the plurality of connection units 40 are configured to be able to adjust the connection position on the shelf unit 20, and the detection unit 50 is configured to detect one or more wafer cassettes 80 placed above or below the shelf unit 20.

[0098] Among them, since a plurality of first rod elements 21 and a plurality of second rod elements 22 on the shelf unit 20 form a grid, the connection unit 40 can be positioned and flexibly adjusted according to the grid, such as moving from the rod elements of one grid to the rod elements of another adjacent grid.

[0099] Further, when the detection unit 50 is arranged below the shelf unit 20 along with the connection unit 40, the detection signal of the detection unit 50 can pass through the grid on the shelf unit 20 to detect the wafer cassette 80 accommodated above the shelf unit 20.

[0100] Among them, the position of the detection unit 50 can be flexibly set according to the type of the wafer cassette 80 or according to the position of the detection label 81 on the wafer cassette 80.

[0101] Among them, the shelf unit 20 is also used to provide an installation position for the connection unit 40.

[0102] Among them, since the shelf unit 20 is arranged in a grid structure, it is convenient for the connection unit 40 to be suspended on the shelf unit 20 or engaged with the rod elements of the shelf unit 20, and it is also convenient to adjust the position of the connection unit 40.

[0103] Among them, the connection unit 40 is used to connect and install the detection unit 50.

[0104] Among them, since the connecting unit 40 is detachably arranged on the shelf unit 20, the position of the detecting unit 50 can be adjusted by adjusting the position of the connecting unit 40 to cope with different models of wafer boxes 80, thereby improving the compatibility of the wafer box storage device for detecting different wafer boxes 80.

[0105] Specifically, a plurality of connecting units 40 are detachably arranged on the upper side and / or the lower side of the shelf unit 20, so that the detecting unit 50 arranged thereon is arranged on the upper side and / or the lower side of the shelf unit 20.

[0106] Among them, the detecting unit 50 is used for detecting the detection label 81 of the wafer box 80 stored on the shelf unit 20 after being installed on the shelf unit 20 through the connecting unit 40.

[0107] Specifically, when facing the detection scenarios of different types of wafer boxes 80, the position of the detecting unit 50 is adjusted by adjusting the connecting unit 40, so that the detection area of the detecting unit 50 can cover the detection label 81 on the wafer box 80.

[0108] In the utility model, the connecting unit 40 is detachably arranged on the shelf unit 20, and the detecting unit 50 is installed on the connecting unit 40, so that the position of the detecting unit 50 can be adjusted through the connecting unit 40, and the detection area of the detecting unit 50 can cover the detection labels 81 of different types of wafer boxes 80, thereby improving the compatibility of the wafer box storage device.

[0109] As Figure 5 shown, the connecting unit 40 includes a first connecting element 41 and / or a second connecting element 42.

[0110] Among them, the difference between the first connecting element 41 and the second connecting element 42 lies in the different connection methods with the shelf unit 20.

[0111] For example, the first connecting element 41 can be hung and connected to the shelf unit 20, and the second connecting element 42 can be snap-connected to the shelf unit 20.

[0112] Specifically, as Figures 6 - 7 shown, each first connecting element 41 includes a connecting plate portion 411 and at least two suspension portions 412 connected to both ends of the connecting plate portion 411. Among them, the suspension portion 412 has a hook portion 4122, and the hook portion 4122 has an inner surface surrounding an open area. When the hook portion 4122 is suspended on the rod element of the shelf unit 20, at least part of the inner surface of the hook portion 4122 contacts and supports the outer surface of the rod element of the shelf unit 20, such as at least part of the inner surface of the hook portion 4122 contacts and supports the outer surface of the first rod element 21 or the second rod element 22 of the shelf unit 20.

[0113] Among them, at least two suspension parts 412 are symmetrically arranged along the circumferential direction of the connecting plate part 411 and protrude from the upper surface of the connecting plate part 411, so as to facilitate the suspension of the suspension parts 412 on the rod elements of the shelf unit 20, so that the first connecting element 41 is suspended and connected to the shelf unit 20.

[0114] Among them, the suspension part 412 protruding from the connecting plate part 411 includes a first straight plate part 4121 and a hook part 4122. Among them, the height of the first straight plate part 4121 is greater than the height of the detection unit 50, or the distance between the connecting plate part 411 and the rod element of the shelf unit 20 after suspension is greater than the height of the detection unit 50, or the width of the detection unit 50 is less than the distance between two relatively arranged suspension parts 412, so that the detection unit 50 is installed on the upper surface of the connecting plate part 411 and detects the second wafer cassette 83.

[0115] Among them, the first straight plate part 4121 is a column element, a plate element or a square plate frame element.

[0116] In some of these embodiments, there may be four suspension parts 412, which are respectively arranged at the four corner positions or the four edge positions of the connecting plate part 411, so that when the connecting plate part 411 is suspended on the shelf unit 20 through the suspension parts 412, the suspension stability of the connecting plate part 411 is increased.

[0117] In some of these embodiments, by adjusting the orientation of the hook part 4122 of the suspension part 412, the suspension part 412 can be suspended on the first rod element 21 or the second rod element 22.

[0118] In some of these embodiments, as Figure 8 , Figure 8a shown, each second connecting element 42 at least includes two connecting pieces 421 connected to both ends of the detection unit 50. The connecting piece 421 has a first limiting part 4211 for connecting the detection unit 50 and a locking part 4212 connected to the first limiting part 4211. The locking part 4212 has a stop wall protruding to one side relative to the first limiting part 4211; in each second connecting element 42, the first limiting parts 4211 of the two connecting pieces 421 are used to limit the relative movement between the rod element of the shelf unit 20 and the second connecting element 42 in the horizontal direction, and the stop walls of the two locking parts 4212 limit the relative movement between the rod element of the shelf unit 20 and the second connecting element 42 in the height direction.

[0119] Among them, the number of the connecting pieces 421 can be 2 or more than 2, such as 4.

[0120] When there are two connecting pieces 421, the two connecting pieces 421 are arranged at opposite ends of the detection unit 50; when there are four connecting pieces 421, the connecting pieces 421 are arranged at the four edges or four corners of the detection unit 50.

[0121] Furthermore, the connecting piece 421 can be fastened to the detection unit 50 by screws.

[0122] In some embodiments, the connecting piece 421 is arranged above or below the detection unit 50 and protrudes from the detection unit 50.

[0123] For example, the connecting piece 421 extends from the panel of the detection unit 50, and the connecting piece 421 is integrally connected to the panel of the detection unit 50.

[0124] Among them, the connecting piece 421 has a certain elasticity to facilitate the rod element of the shelf unit 20 to enter the locking portion 4212.

[0125] Furthermore, the locking portion 4212 also has a guiding function. For example, when the locking portion 4212 is arranged as a concave arc or C-shaped curved surface structure, since the longitudinal section of the locking portion 4212 is an arc or a curved surface structure such as this, the locking portion 4212 can guide the rod element of the shelf unit 20 to slide across the curved surface of the retaining wall of the locking portion 4212.

[0126] Furthermore, the first limiting portion 4211 is used to limit the rod element of the shelf unit 20 after the second connecting element 42 is engaged with the rod element of the shelf unit 20.

[0127] Among them, the openings of the arc-shaped concave surfaces of the locking portions 4212 on the two relatively arranged connecting pieces 421 are arranged in opposite directions, such as both facing the detection unit 50 or both facing away from the detection unit 50, so that the two relatively arranged locking portions 4212 can be clamped on two rod elements of the shelf unit 20 with a certain distance.

[0128] In some embodiments, when there are four connecting pieces 421, the openings of the arc-shaped concave surfaces of the locking portions 4212 of the connecting pieces 421 arranged in pairs on the detection unit 50 are all opposite.

[0129] In some of these embodiments, the detection unit 50 is connected to the upper surface or the lower surface of the connecting plate portion 411.

[0130] Furthermore, the detection unit 50 has a first panel 51 and a second panel 52 opposite to the first panel 51. A through hole 53 for the detection light to penetrate is provided on the first panel 51, and the detection unit 50 is connected to the connecting plate portion 411 through the second panel 52.

[0131] Among them, after the first panel 51 and the second panel 52 are connected relatively, a sealed cavity structure is formed.

[0132] Among them, regardless of whether the detection unit 50 is arranged above or below the shelf unit 20, the first panel 51 is always the panel close to the wafer cassette 80.

[0133] Specifically, sensors are arranged between the first panel 51 and the second panel 52, such as sensors for detecting the state of the wafer cassette by light, RFID sensors capable of generating electromagnetic waves, etc. Among them, the RFID sensor is used to detect the detection label 81 on the wafer cassette 80, and then read the information carried by the label.

[0134] In some of the embodiments, the detection unit 50 is configured to be connected to the upper surface of the connecting plate portion 411, and the detection light of the detection unit 50 can pass through the through hole 53 to detect the in-position state of the second wafer cassette 83 or the third wafer cassette 84 above the shelf unit 20.

[0135] Specifically, when the second wafer cassette 83 or the third wafer cassette 84 is placed on the shelf unit 20, the detection light of the detection unit 50 located below the shelf unit 20 passes through the grid of the shelf unit 20, and is blocked and reflected back to the detection unit 50 by the bottom surface of the second wafer cassette 83 or the third wafer cassette 84. When it is determined that the second wafer cassette 83 is already on the shelf unit, the RFID sensor starts to generate electromagnetic waves and can read the label of the second wafer cassette 83.

[0136] In some of the embodiments, when the detection unit 50 is configured to be connected to the lower surface of the connecting plate portion 411, the detection light of the detection unit 50 can detect the in-position state of the first wafer cassette 82 or the third wafer cassette 84 below the shelf unit 20.

[0137] Specifically, when the detection unit 50 is arranged above the first wafer cassette 82 or the third wafer cassette 84, the detection light of the detection unit 50 can be emitted downward, and is blocked and reflected back to the detection unit 50 by the top surface of the first wafer cassette 82. When it is determined that the first wafer cassette 82 is already on the shelf unit, the RFID sensor starts to generate electromagnetic waves and reads the label of the first wafer cassette 82.

[0138] In some embodiments, part of the detection units 50 are configured to be connected below adjacent shelf units 20 through corresponding first connection elements 41 (part of the detection units 50 are connected to the lower surface of the connection plate portion 411), and another part of the detection units 50 are configured to be connected above adjacent shelf units 20 through corresponding second connection elements 42, and the detection units 50 on opposite sides of adjacent shelf units 20 are arranged in an up-and-down corresponding manner; the first detection light of part of the detection units 50 can be emitted downward, and the second detection light of another part of the detection units 50 can be emitted upward; the first detection light is blocked by the top surface of the third wafer cassette 84 and reflected back to the detection unit 50, and / or, the second detection light is blocked by the bottom surface of the third wafer cassette 84 and reflected back to the detection unit 50, to perform in-situ detection on the third wafer cassette 84 located between the two up-and-down corresponding detection units 50. When it is determined that the third wafer cassette 84 has been located on the shelf unit 20, the RFID sensor starts to generate electromagnetic waves and reads the label of the third wafer cassette 84.

[0139] In some embodiments, a plurality of detection units 50 are configured to be connected below adjacent shelf units 20 through corresponding first connection elements 41. Among them, part of the detection units 50 are configured to be connected to the lower surface of the connection plate portion 411, and another part of the detection units 50 are configured to be connected to the upper surface of the connection plate portion 411, and the detection units 50 on opposite sides of adjacent shelf units 20 are arranged in an up-and-down corresponding manner. The third detection light of part of the detection units 50 can be emitted downward, and the fourth detection light of another part of the detection units 50 can be emitted upward; the third detection light is blocked by the top surface of the third wafer cassette 84 and reflected back to the detection unit 50, and / or, the fourth detection light is blocked by the bottom surface of the third wafer cassette 84 and reflected back to the detection unit 50, to perform in-situ detection on the third wafer cassette 84 located between the two up-and-down corresponding detection units 50. When it is determined that the third wafer cassette 84 has been located on the shelf unit 20, the RFID sensor starts to generate electromagnetic waves and reads the label of the third wafer cassette 84.

[0140] In some of these embodiments, the second panel 52 of the detection unit 50 is configured to be a shielding body formed of a material that shields electromagnetic waves, so as to suppress the propagation of the electromagnetic waves of the detection unit 50 outside the specified area, where the specified area is the area where the electromagnetic waves propagate along the direction of the second panel 52 towards the first panel 51.

[0141] Among them, by configuring the second panel 52 as a shielding body, the detection signal of the detection unit 50 can be made to propagate in the direction of the first panel 51, so that the detection area of the detection unit 50 is restricted to the specified area, to avoid the detection area of the detection unit 50 being too large and detecting the wafer cassette 80 at other positions.

[0142] Further, according to the different installation positions of the detection unit 50 or according to different wafer cassettes 80, different types of sensors can be installed between the first panel 51 and the second panel 52.

[0143] For example, when using the detection unit 50 to detect the first wafer cassette 82, the second wafer cassette 83, or the third wafer cassette 84, a first sensor can be installed between the first panel 51 and the second panel 52 to detect the first wafer cassette 82, or a second sensor can be installed to detect the second wafer cassette 83, or a third sensor can be installed to detect the third wafer cassette 84.

[0144] As Figures 1 - 3 shown in FIGS. 9 to 12, the following will explain in detail how to detect different types of wafer cassettes 80.

[0145] (1) Each detection unit 50 is configured to be installed below a layer rack unit 20 through a corresponding first connection element 41 to detect the first wafer cassette 82 below the layer rack unit 20 or the second wafer cassette 83 above the layer rack unit, wherein the first wafer cassette 82 is a wafer cassette 80 having a detection label 81 at the upper end of the cassette body, and the second wafer cassette 83 is a wafer cassette 80 having a detection label 81 at the side and / or bottom of the cassette body.

[0146] Wherein, when the detection label 81 is provided on the side of the cassette body of the second wafer cassette 83, the detection label 81 can be provided on the outer side of the cassette body; when the detection label 81 is provided at the bottom of the second wafer cassette 83, the bottom of the second wafer cassette 83 can have a groove, and the detection label 81 is installed in the groove.

[0147] For example, when the layer rack unit 20 has two layers and the detection unit 50 is installed below the upper layer rack unit 20 through the first connection element 41, if the first wafer cassette 82 is placed above the lower layer rack unit 20, at this time, the detection unit 50 and the detection label 81 on the first wafer cassette 82 are vertically corresponding, and the detection label 81 on the first wafer cassette 82 is within the detection area of the detection unit 50, and the detection unit 50 can detect the first wafer cassette 82. Among them, a first sensor can be installed in the detection unit 50 to detect the detection label 81 on the first wafer cassette 82.

[0148] For another example, when the shelf unit 20 has two layers and the detection unit 50 is installed below the lower shelf unit 20 through the first connection element 41, if the second wafer cassette 83 is placed above the lower shelf unit 20, at this time, the detection unit 50 and the detection label 81 on the second wafer cassette 83 are vertically corresponding, the detection label 81 on the second wafer cassette 83 is located within the detection area of the detection unit 50, and the detection unit 50 can detect the second wafer cassette 83. Among them, a second sensor can be installed in the detection unit 50 to detect the detection label 81 on the second wafer cassette 83.

[0149] (2) Each detection unit 50 is configured to be installed above a shelf unit 20 through a corresponding second connection element 42 to detect the second wafer cassette 83 above the shelf unit 20.

[0150] Specifically, when the second wafer cassette 83 is placed on the shelf unit 20, if the detection unit 50 is installed above the shelf unit 20 through a corresponding second connection element 42, at this time, the groove can be buckled on the detection unit 50 to limit the wafer cassette 80 while the detection unit 50 detects the detection label 81 in the groove.

[0151] Among them, when the connection unit 40 and the detection unit 50 are located in the groove, the connection element 40 and the detection unit 50 can limit the wafer cassette 80 through the groove, and the limiting direction is related to the orientation of the groove.

[0152] (3) Some detection units 50 are configured to be connected below adjacent shelf units 20 through corresponding first connection elements 41, and some other detection units 50 are configured to be connected above adjacent shelf units 20 through corresponding second connection elements 42, and the detection units 50 opposite to each other on adjacent shelf units 20 are arranged vertically corresponding to detect the third wafer cassette 84 located between the two vertically corresponding detection units 50. Among them, the third wafer cassette 84 is a wafer cassette 80 with detection labels 81 at both the lower end and the upper end of the box body, or with detection labels 81 at both the side part and the upper end of the box body.

[0153] Among them, the wafer cassette 80 having a detection label 81 at the upper end can mean that the detection label 81 is at the top of the wafer cassette 80, or that the detection label 81 is at the top of the susceptor inside the wafer cassette 80.

[0154] For example, when the shelf unit 20 has multiple layers and detection units 50 are respectively installed above and below each shelf unit 20 through corresponding first connection elements 41 or second connection elements 42, and the detection units 50 between adjacent shelf units 20 are vertically corresponding, if the third wafer cassette 84 is located between two opposite detection units 50, the upper detection unit 50 can detect the detection label 81 at the upper end of the third wafer cassette 84, and the lower detection unit 50 can detect the detection label 81 at the bottom or side of the third wafer cassette 84.

[0155] In some embodiments, the connection mode between the connection unit 40 and the shelf unit 20 includes one of hanging connection, snap connection, magnetic attraction connection, adhesive connection, tethering connection, and buckle connection.

[0156] Preferably, the connection mode between the connection unit 40 and the shelf unit 20 is hanging connection or snap connection.

[0157] In some embodiments, the connection unit 40 includes a magnetic attraction member, and both the first rod element 21 and the second rod element 22 are made of magnetic attraction metal.

[0158] In some embodiments, the connection unit 40 is adhesively connected to the second magic tape on the first rod element 21 and / or the second rod element 22 through the first magic tape.

[0159] In some embodiments, the connection unit 40 is tethered to the first rod element 21 and / or the second rod element 22 through a tethering member.

[0160] A wafer cassette storage device of the present utility model can flexibly adjust the position of the detection unit 50 on the shelf unit 20 by detachably mounting the connection unit 40 on the shelf unit 20, so that the detection unit 50 can detect the wafer cassette 80 with the detection label 81 at different positions, solving the problem that the existing wafer cassette storage device can only detect one type of wafer cassette 80.

[0161] Embodiment 2

[0162] This embodiment is a modified embodiment of Embodiment 1. The difference between this embodiment and Embodiment 1 lies in the structures of the column 10 and the shelf unit 20.

[0163] As Figures 13 - 16 shown, each column 10 includes a plurality of second limiting portions 11, and the plurality of second limiting portions 11 are arranged on the column 10 at intervals along the height direction of the column 10.

[0164] Among them, the second limiting portions 11 are arranged on the column 10 at equal intervals and with intervals, so as to adjust the height of the shelf unit 20 at equal intervals.

[0165] The wafer cassette storage device further includes a plurality of fixing units 60. Each fixing unit 60 is disposed around a corresponding column 10. The fixing unit 60 includes two oppositely disposed fixing portions 61. The two fixing portions 61 are oppositely disposed on both sides of the corresponding column 10, and a third limiting portion 62 is disposed on the side surface of each fixing portion 61 facing the column 10. The third limiting portion 62 cooperates with the second limiting portion 11.

[0166] Wherein, a fixing unit 60 is disposed on each column 10. The fixing unit 60 is used to fix and limit the shelf unit 20 to the column 10, so that the shelf unit 20 is limited to a fixed height.

[0167] Wherein, the fixing portion 61 may be an arc-shaped structure, and its inner surface can be completely attached to the outer surface of the column 10.

[0168] Wherein, when the two fixing portions 61 are simultaneously attached to the column 10, they may partially or completely wrap the column 10.

[0169] Preferably, the two fixing portions 61 are integrally arranged as a semi-circular structure, so that when the two fixing portions 61 are simultaneously attached to both sides of the column 10 at the same height, the column 10 can be completely wrapped.

[0170] Wherein, when the two fixing portions 61 are buckled on both sides of the column 10 at the same height, the second limiting portion 11 is connected with the third limiting portion 62 in a matching manner.

[0171] Wherein, the second limiting portion 11 may be a limiting groove, and the third limiting portion 62 may be a limiting block. The limiting block and the limiting groove are connected in a matching manner. Or the second limiting portion 11 is a limiting block, and the third limiting portion 62 is a limiting groove.

[0172] Wherein, the second limiting portion 11 may also be a limiting hole, a limiting post, a limiting block, etc.; the third limiting portion 62 may be a limiting post, a limiting block matching the limiting hole, or a limiting hole or a limiting groove matching the limiting post and the limiting block.

[0173] Preferably, the second limiting portion 11 may be a limiting groove, and it may be disposed around the circumference of the column 10; the third limiting portion 62 may be a limiting convex block. When the fixing portion 61 is buckled onto the column 10, the limiting convex block can be inserted into the corresponding limiting groove.

[0174] More preferably, the limiting groove is an annular limiting groove, and the fixing portion 61 is an arc-shaped limiting block.

[0175] Among them, the shelf unit 20 is configured to be adjustable in the installation position along the height direction of the upright column 10. Each shelf unit 20 includes a plurality of fixing sleeves 23. The plurality of fixing sleeves 23 are arranged along the circumferential direction of the shelf unit 20 at the edge of the shelf unit 20 and correspondingly sleeved on a plurality of upright columns 10, and the inner diameter of the fixing sleeve 23 gradually increases from top to bottom.

[0176] Among them, when the two fixing parts 61 are attached to both sides of the corresponding upright column 10 and the second limiting part 11 and the third limiting part 62 are cooperatively connected, the fixing sleeve 23 slides along the upright column 10 and is sleeved outside the two fixing parts 61, so that the shelf unit 20 is located between a plurality of upright columns 10 at the height of the second limiting part 11.

[0177] Preferably, the fixing sleeves 23 are arranged at the four corners of the shelf unit 20, and the upright columns 10 are also located at the four corner positions of the shelf unit 20.

[0178] Among them, when the length of the shelf unit 20 is relatively long, in addition to being located at the four corner positions of the shelf unit 20, the upright columns 10 are arranged along the length direction of the shelf unit 20 at the edge of the shelf unit 20, and the shelf unit 20 is sleeved on a plurality of upright columns 10 through a plurality of fixing sleeves 23.

[0179] Specifically, when the two fixing parts 61 are buckled on both sides of the upright column 10 at the same height, the second limiting part 11 and the third limiting part 62 are cooperatively connected. At this time, the fixing sleeve 23 slides along the upright column 10 and is sleeved outside the two fixing parts 61. Since the inner diameter of the fixing sleeve 23 gradually increases from top to bottom, when the fixing sleeve 23 slides and is fastened to the outside of the two fixing parts 61, the fixing sleeve 23 cannot continue to move downward, so that the shelf unit 20 is fixed between a plurality of upright columns 10.

[0180] Furthermore, when the inner surface of the fixing part 61 is attached to the upright column 10, the distance from the outer surface of the fixing part 61 to the central axis of the upright column 10 gradually increases from top to bottom, and the outer surface of the fixing part 61 matches the inner surface of the fixing sleeve 23, so as to facilitate the fixing sleeve 23 to be sleeved on the fixing unit 60.

[0181] Furthermore, the two fixing parts 61 are cooperatively connected through a protrusion 63 and a recess 64 to keep at the same height when the two fixing parts 61 are sleeved in the fixing sleeve 23 and are squeezed by the fixing sleeve 23.

[0182] For example, a protrusion 63 is arranged at the edge of one fixing part 61, and a groove is arranged at the edge of the other fixing part 61, so that when the two fixing parts 61 are simultaneously sleeved on the same height of the upright column 10, the two fixing parts 61 can limit each other and prevent the fixing part 61 from sliding downward.

[0183] The working principle of this embodiment is as follows:

[0184] When it is necessary to adjust the height of the shelf unit 20, first disengage the fixing sleeve 23 from the fixing portion 61, and at the same time adjust the two fixing portions 61 to a preset height so that the second limiting portion 11 and the third limiting portion 62 are cooperatively connected;

[0185] Move the shelf unit 20, and re - sleeve the fixing sleeve 23 outside the two fixing portions 61, so that the fixing sleeve 23 is limited on the two fixing portions 61, thereby realizing the limitation of the shelf unit 20, and thus realizing the adjustment of the height of the shelf unit 20.

[0186] The following is the application method of this embodiment:

[0187] When all 6 - inch wafer boxes 80 are placed on the shelf unit 20, adjust the height of the shelf unit 20 through the fixing sleeve 23, the two fixing portions 61 and the second limiting portion 11, so that the distance between different shelf units 20 is suitable for placing 6 - inch wafer boxes 80;

[0188] When all 8 - inch wafer boxes 80 are placed on the shelf unit 20, adjust the height of the shelf unit 20 through the fixing sleeve 23, the two fixing portions 61 and the second limiting portion 11, so that the distance between different shelf units 20 is suitable for placing 8 - inch wafer boxes 80.

[0189] When 6 - inch wafer boxes 80 are placed on a part of the shelf units 20 and 8 - inch wafer boxes 80 are placed on another part, the height between a part of the shelf units 20 can be adjusted to be suitable for 6 - inch wafer boxes 80, and the other part of the shelf units 20 can be adjusted to be suitable for 8 - inch wafer boxes 80.

[0190] In a wafer box storage device of this embodiment, the shelf unit 20 can move up and down along the column 10 through the fixing sleeve 23, the two fixing portions 61 and a plurality of second limiting portions 11 and be limited to the column 10 after moving, so that the distance between different shelf units 20 can be flexibly adjusted, such as increasing the distance between adjacent shelf units 20 or decreasing the distance between adjacent shelf units 20, so as to place wafer boxes 80 of different sizes, different models or different types on the wafer box storage device.

[0191] Embodiment 3

[0192] This embodiment is a modified embodiment of Embodiment 1 or Embodiment 2. The difference between it and Embodiment 1 or Embodiment 2 is that it further includes a wire groove unit 70 and the structure of the shelf unit 20 is different.

[0193] Such as Figure 1As shown, the wafer cassette storage device further includes a wire groove unit 70. Part of the wire groove unit 70 is disposed along the length direction and / or the width direction of the shelf unit 20 at the edge of the shelf unit 20 and is located above the shelf unit 20, for routing wires and blocking the wafer cassettes 80 on the shelf unit 20.

[0194] Among them, in this embodiment, by reusing the wire groove unit 70, the manufacturing difficulty of the shelf unit 20 can be reduced, and the manufacturing materials of the shelf unit 20 can be saved. For example, there is no need to install a blocking portion 24 on one side of the shelf unit 20 where the wire groove unit 70 is not provided.

[0195] Such as Figure 14 As shown, the shelf unit 20 further includes a blocking portion 24. The blocking portion 24 is disposed at at least one edge of the shelf unit 20 for blocking the wafer cassettes 80.

[0196] Among them, the blocking portions 24 are all disposed at the edges of the shelf unit 20.

[0197] Preferably, the blocking portions 24 are provided on the shelf unit 20 except for the side where the wire groove unit 70 is provided.

[0198] For example, stop portions are provided at both ends in the length direction of the partition portion, and safety guard edges are provided at the edges in the length direction of the partition net.

[0199] When positioning the wafer cassette 80 with a groove at the bottom, the detection unit 50 is inserted into the groove to limit the wafer cassette 80 in the length direction of the shelf unit 20; in the width direction of the shelf unit 20, the wire groove unit 70 and the safety guard edge are used to limit the wafer cassette 80.

[0200] In some of the embodiments, the wafer cassette storage device further includes an electric control box and a display.

[0201] Among them, the electric control box is used to supply power to the power-consuming devices such as the detection unit 50 and the display through cables.

[0202] Among them, the electric control box can be installed at the bottom of the wafer cassette storage device, such as below the bottom shelf unit 20 of the wafer cassette storage device.

[0203] For example, the electric control box supplies power to the sensors in each detection unit 50.

[0204] Among them, the display is used to display the number of wafer cassettes 80, the placement position information, the number of storage positions, etc.

[0205] Among them, the display screen can be installed on the top of the wafer cassette storage device, such as on the top shelf unit 20.

[0206] The utility model adopts a detachable structure design, with 4 columns 10 for support. The shelf units 20 are quickly installed according to the required layer spacing, and the fixing part 61 and the fixing sleeve 23 are used to fix the shelf units 20 on the columns 10; the rod elements of the shelf units 20 are designed with equal spacing, and the detection unit 50 adopts a detachable (such as hanging, clamping) installation form, and the installation position of the sensor can be adjusted equidistantly; the shelf units 20 have a high opening rate, are welded with metal rods, are not easy to accumulate dust on the top, have a good perspective effect, can see the upper and lower wafer boxes 80, and are convenient for operators to access and inspect.

[0207] The connection unit 40 of the utility model is installed in the form of a hook. The connection unit 40 is designed with 4 hooks, and the installation is realized by the hooks. The side of the hook is positioned; the shelf unit 20 is designed in a grid form, and the grid is designed with equal spacing. The connection unit 40 can be installed with equidistant movement. Sensors can be installed above and below the grid at the same time to realize the simultaneous reading of information of the wafer box 80 by the upper and lower sensors.

[0208] The utility model adopts a detachable structure design, which is convenient for disassembly and assembly, can realize the adjustment of layer spacing, and the spacing of the detection unit 50 is adjustable; with the detachable structure design, the shelves of the storage device can be disassembled into part bodies such as columns 10, shelf units 20, and detection units 50, which is convenient for part cleaning, has a small packaging volume, and is convenient for transportation; the shelf unit 20 adopts a partition net design, the overall weight of the wafer box storage device is light, and it is easy to handle; the shelf unit 20 has a high hollowing rate, is not easy to accumulate dust, has a good multi-layer perspective effect, and is convenient for operators to inspect the wafer box 80 and store the wafer box 80; detection units 50 can be installed above and below the shelf unit 20 at the same time to realize the simultaneous reading of information of the wafer box 80 by the upper and lower sensors and be compatible with the information reading of various models of wafer boxes 80.

[0209] In the utility model, different models of detection units 50 are hung on the shelf unit 20 from the upper and lower directions. The layer spacing of the shelf unit 20 is adjustable, and the diversification adjustment of the equipment size can be realized, and it is compatible with wafer boxes 80 of various sizes; the hook structure is used to design the sensor installation parts (connection unit 40), and the hook is hung at the installation position without tightening, which is convenient for disassembly and assembly; the spacing of the sensors (detection unit 50) can be adjusted. (Adopting the hook type design, the installation is simple and convenient, and the structure uses fewer parts; the sensors can move according to the equidistant grid to realize the change of the sensor spacing; the hook type installation can be installed above and below the grid type storage parts at the same time to realize the simultaneous reading of information of the wafer box 80 by the upper and lower sensors.)

[0210] In summary, the comprehensive benefit of the invention is to ensure the diversification adjustment of the size of the wafer storage device (compatible with various sizes), which is convenient for operators to use, and is convenient for equipment cleaning, packaging and transportation.

[0211] In this specification, for the same or similar parts among various embodiments, reference can be made to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the descriptions are relatively simple, and for the relevant parts, reference can be made to the corresponding parts in the system embodiments.

[0212] As described above, the foregoing are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wafer box storage device, comprising a plurality of columns arranged in an array; a plurality of shelf units detachably connected to the columns, the plurality of shelf units being arranged in sequence and spaced apart along the height direction of the columns, each shelf unit having a storage space for accommodating a wafer box above, characterized in that: The wafer box storage device further comprises a plurality of connection units detachably arranged on the shelf unit, and each of the connection units is respectively provided with a detection unit; Among them, the plurality of connection units are configured to be able to adjust the connection position on the shelf unit, and the detection unit is configured to detect one or more wafer boxes placed above or below the shelf unit.

2. The wafer box storage device according to claim 1, characterized in that: The plurality of connection units include a first connection element and / or a second connection element; A plurality of the connection units are detachably arranged on the upper side of the shelf unit and / or the lower side of the shelf unit; The shelf unit is a grid-like frame structure.

3. The wafer box storage device according to claim 2, characterized in that: Each of the detection units is configured to be installed below a shelf unit through the corresponding first connecting element to detect a first wafer box below the shelf unit or a second wafer box above the shelf unit; wherein the first wafer box is a wafer box having a detection label on the upper end of the box body, and the second wafer box is a wafer box having a detection label on the side of the box body and / or the bottom of the box body; or, Each of the detection units is configured to be installed above a shelf unit through the corresponding second connecting element to detect a second wafer box above the shelf unit; wherein the second wafer box is a wafer box having a detection label on the side and / or bottom of the box body; or, Part of the detection units are configured to be connected to the bottom of each adjacent shelf unit through the corresponding first connecting element, and another part of the detection units are configured to be connected to the top of each adjacent shelf unit through the corresponding second connecting element, and the relative detection units on the adjacent shelf units are arranged correspondingly up and down, and the third wafer box located between the two corresponding upper and lower detection units is detected; wherein the third wafer box is a wafer box with detection labels on both the bottom and the upper end of the box body, or with detection labels on the side and the upper end of the box body.

4. The wafer box storage device according to claim 2 or 3, characterized in that: The shelf unit has a rod element; Each of the first connecting elements comprises a connecting plate portion and at least two hanging portions connected to both ends of the connecting plate portion, wherein the hanging portion has a hook-shaped portion, and the hook-shaped portion has an inner surface surrounding an open area; the inner surface of the hook-shaped portion at least partially contacts and is supported by the outer surface of the rod element of the shelf unit; Each of the second connecting elements includes at least two connecting plates connected to the two ends of the detection unit, wherein the connecting plate has a first limiting portion connected to the detection unit and a locking portion connected to the first limiting portion, and the locking portion has a blocking wall protruding to one side relative to the first limiting portion; in each of the second connecting elements, the first limiting portions of the two connecting plates are used to limit the relative movement between the rod element of the shelf unit and the second connecting element in the horizontal direction, and the blocking walls of the two locking portions limit the relative movement between the rod element of the shelf unit and the second connecting element in the height direction.

5. The wafer box storage device according to claim 4, characterized in that: The detection unit is connected to the upper surface or the lower surface of the connecting plate portion; The detection unit comprises a first panel and a second panel which is separated from the first panel, the first panel is provided with a through hole for the detection light to pass through, and the detection unit is connected to the connecting plate portion through the second panel; The detection unit is configured to be connected to the upper surface of the connecting plate portion so that the detection light of the detection unit can pass through the through hole to detect the in-position status of the second wafer box or the third wafer box above the shelf unit; The detection unit is configured to be connected to the lower surface of the connecting plate portion so that the detection light of the detection unit can pass through the through hole to detect the in-place status of the first wafer box or the third wafer box below the shelf unit; and / or, The second panel of the detection unit is configured to form a shielding body using a material that shields electromagnetic waves, thereby suppressing the electromagnetic waves of the detection unit from propagating outside a designated area, wherein the designated area is an area where electromagnetic waves propagate along the second panel toward the first panel.

6. The wafer box storage device according to claim 1, characterized in that: The connection method between the connection unit and the shelf unit includes one of a hanging connection, a snap connection, a magnetic connection, an adhesive connection, a tethered connection, and a snap connection.

7. The wafer box storage device according to any one of claims 1 to 3, characterized in that: The shelf unit comprises a plurality of first rod elements spaced apart along the length direction of the shelf unit and a plurality of second rod elements spaced apart along the width direction of the shelf unit; Wherein, a plurality of the first rod elements and / or a plurality of the second rod elements are arranged at equal intervals.

8. The wafer box storage device according to claim 2, characterized in that: Each of the columns comprises: A plurality of second limiting portions, wherein the plurality of second limiting portions are arranged on the column at intervals along a height direction of the column; The wafer box storage device also includes: A plurality of fixing units, each of which is arranged around a corresponding column, and the fixing unit comprises two fixing parts arranged opposite to each other, the two fixing parts are arranged opposite to each other on both sides of the corresponding column, and a third limiting part is arranged on the side of each fixing part facing the column, and the third limiting part cooperates with the second limiting part; The shelf units are configured to be able to adjust the installation position along the height direction of the column, and each of the shelf units further includes: A plurality of fixing sleeves, the plurality of fixing sleeves are arranged on the edge of the shelf unit along the circumference of the shelf unit and are correspondingly sleeved on the plurality of columns, and the inner diameters of the fixing sleeves increase sequentially from top to bottom; Among them, when the two fixing parts are attached to the two sides of the corresponding columns and the second limiting part and the third limiting part are matched and connected, the fixing sleeve slides along the column and is sleeved on the outside of the two fixing parts to position the shelf unit between the multiple columns at the height of the second limiting part.

9. The wafer box storage device according to claim 8, characterized in that: When the inner surface of the fixing part is attached to the column, the distance between the outer surface of the fixing part and the central axis of the column gradually increases from top to bottom, and the outer surface of the fixing part matches the inner surface of the fixing sleeve.

10. The wafer box storage device according to claim 2, characterized in that: Also includes: Wire slot units, part of which are arranged at the edge of the shelf unit along the length direction of the shelf unit and / or the width direction of the shelf unit and are located above the shelf unit, and are used for arranging wires and blocking the wafer box on the shelf unit; A blocking portion is disposed on at least one edge of the shelf unit and is used to block the wafer box.

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