Electrodeposition device capable of providing cooling circulation

Abstract

The utility model discloses an electro-deposition device capable of providing cooling circulation. The electro-deposition device comprises an electro-deposition tank body, a cooling external member and a cathode base, an upper opening and a lower opening are formed in the upper end and the lower end of the electro-deposition tank respectively, the electro-deposition tank is sleeved with a cooling suite, and cooling metal sheets are evenly distributed on the upper portion of the cooling suite. An electro-deposition source sheet is arranged at the top of the cathode base, and the lower part of the cooling external member is connected with the cathode base through a buckle, so that electro-deposition liquid contained in the electro-deposition tank body is in contact with the electro-deposition source sheet. According to the utility model, the annular cooling suite is arranged outside the electro-deposition tank body, and the cooling metal sheets are uniformly distributed at the upper part of the cooling suite, so that the risk of radionuclide pollution is reduced; the lower part of the cooling suite is connected with the cathode base through a buckle to fix the electro-deposition tank body; according to the utility model, the cooling suite and the electro-deposition tank body are combined into a whole in an innovative manner, so that the structure of the electro-deposition device is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of isotope radiation sources, and particularly relates to an electrodeposition device capable of providing cooling circulation for preparing an α radiation source. Background Technique

[0002] The α instrument calibration source is prepared with α radioactive nuclides. In order to ensure that the α particle energy hardly decays in the source and reduce self-absorption, the active layer must be very thin. The domestic α instrument calibration sources mainly include 241 Am, 238 Pu, and 244 Cm, etc. According to the classification of GB18871-2002, most α nuclides belong to the extremely toxic group. After α nuclides enter the human body, tissues will be continuously irradiated. The parts where radiation induces cell death, mutation and malignant mutation are in the cell nucleus, and deoxyribonucleic acid is the main target. Ionization and excitation mainly damage cells by acting on DNA molecules, leading to various health hazards until the radioactive nuclide decays completely or is completely excreted from the body.

[0003] Parker, Kitov and others developed a new method for preparing radiation sources and targets for nuclear physics experiments in weakly polar organic solvents in the 1960s. They used organic solvents such as isopropanol and electroplating solutions of inorganic acids containing trace radioactive substances for electroplating to prepare sources. The electroplating is carried out at a high DC voltage and a low current density, and the radioactive nuclide is deposited on the cathode in the form of hydroxide or other compounds. This method is called molecular electroplating and is widely used in the preparation of α instrument calibration sources. Molecular electroplating is carried out at a high voltage (500 - 1000V), and the electroplating solution is generally above 60 - 70°C. For solvents with lower boiling points, the boiling phenomenon is serious, the solution volatilizes quickly, and even combustion occurs. Moreover, radioactive nuclides will be carried during the process of a large amount of solvent volatilization, resulting in an increase in the concentration of radioactive aerosol in the laboratory.

[0004] East China Normal University filed a patent application for an invention named "An experimental device and experimental method for preparing α radiation source by electrodeposition-self deposition", with the application number 201910692601.6; this experimental device consists of a Teflon outer cylinder and a Teflon inner cylinder arranged on a stainless steel base, and a deposition tank with a jacket is provided. A sieve plate is arranged inside the Teflon inner cylinder; a water inlet pipe and a water outlet pipe are arranged on the Teflon outer cylinder; the water inlet pipe and the water outlet pipe are communicated with the jacket between the Teflon outer cylinder and the Teflon inner cylinder; this experimental device realizes the electrodeposition of α radioactive nuclides in the powered-on mode or the self-deposition of Po in the powered-off mode.

[0005] This experimental device has the following disadvantages:

[0006] (1) The refrigeration method is water circulation refrigeration. During the refrigeration process, the risk of the circulating water being contaminated by radionuclides is extremely high, leading to the spread of radioactive contamination and an increased risk of irradiation for the staff.

[0007] (2) The preparation of α radiation sources is generally carried out in a glove box. The operating space is limited, and the complex cooling mechanism occupies a large space, resulting in low production efficiency.

[0008] (3) The Teflon inner cylinder and the stainless steel base are connected by threads, and the Teflon inner cylinder and the Teflon outer cylinder are hermetically connected through a connecting sleeve; the connection method of this experimental device is complex and the operating efficiency is low. Summary of the Invention

[0009] In view of the deficiencies in the prior art, the present invention provides an electrodeposition device with a simple cooling structure, low pollution risk, and high working efficiency.

[0010] The present invention discloses an electrodeposition device capable of providing a cooling cycle, including: an electrodeposition cell, a cooling kit, and a cathode base.

[0011] The upper and lower ends of the electrodeposition cell are respectively provided with an upper opening and a lower opening. The cooling kit is sleeved outside the electrodeposition cell, and cooling metal sheets are evenly distributed on the upper part of the cooling kit.

[0012] The top of the cathode base is provided with an electrodeposition source sheet. The lower part of the cooling kit is connected to the cathode base through a ring buckle to bring the electrodeposition solution contained in the electrodeposition cell into contact with the electrodeposition source sheet.

[0013] As a further improvement of the present invention, it further includes: an anode wire;

[0014] The anode wire extends from the upper opening into the electrodeposition solution in the electrodeposition cell, and the conductive column of the cathode base is connected to the negative pole of the DC regulated power supply.

[0015] As a further improvement of the present invention, the anode wire is a platinum wire, shaped like a coil, placed in the electrodeposition cell and parallel to the cathode.

[0016] As a further improvement of the present invention, circular skirts are provided at intervals along the axial direction on the outer wall of the electrodeposition cell, and tooth-shaped bayonets for clamping between two circular skirts are provided on the inner wall of the cooling kit; when the lower part of the cooling kit is connected to the cathode base through a ring buckle, the tooth-shaped bayonets of the cooling kit are clamped between two circular skirts to achieve stable fixation of the electrodeposition cell, the cooling kit, and the cathode base.

[0017] As a further improvement of the present utility model, the cooling kit is an annular structure composed of two semi-circular sub-kits. A first fixing protrusion is provided at the lower part of the cooling kit, and a second fixing protrusion is provided at the upper part of the cathode base. The ring buckle is buckled on the first fixing protrusion and the second fixing protrusion.

[0018] As a further improvement of the present utility model, a rubber gasket is provided between the lower opening of the electrodeposition cell body and the electrodeposition source sheet to achieve the seal between the lower opening and the electrodeposition source sheet. At the same time, the electrodeposition cell body is subjected to the inward and downward forces of the cooling kit to achieve the close contact among the electrodeposition source sheet, the rubber gasket and the electrodeposition cell body.

[0019] As a further improvement of the present utility model, a stepped first groove and a second groove are provided at the top of the cathode base. The groove diameter of the first groove is smaller than that of the second groove. The electrodeposition source sheet is provided in the lower first groove, and the rubber gasket is provided in the upper second groove.

[0020] As a further improvement of the present utility model, the rubber gasket is fixed to the bottom of the electrodeposition cell body by glue. An opening is provided in the middle of the rubber gasket, and the electrodeposition solution contacts the surface of the electrodeposition source sheet through the opening.

[0021] As a further improvement of the present utility model, the electrodeposition cell body is made of acrylic material, and a 45-degree inclined surface is provided at the upper opening. The cooling kit and the cathode base are made of copper.

[0022] As a further improvement of the present utility model, a Peltier semiconductor refrigerator is installed on the cooling metal sheet. Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] An annular cooling kit is provided outside the electrodeposition cell body of the present utility model. Cooling metal sheets are evenly distributed on the upper part of the cooling kit, reducing the risk of radionuclide pollution. The lower part of the cooling kit is connected to the cathode base through a ring buckle to fix the electrodeposition cell body. The present utility model innovatively combines the sealing of the cooling kit and the electrodeposition cell body into one, simplifies the structure of the electrodeposition device, and improves the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of the electrodeposition device disclosed by the present utility model;

[0025] Figure 2 is Figure 1 the enlarged view at A in

[0026] Figure 3 is Figure 1 or Figure 2 the sectional view and the top view of the electrodeposition cell body in

[0027] Figure 4 For Figure 1 or Figure 2 Cross-sectional view and top view of the cooling kit in;

[0028] Figure 5 For Figure 1 or Figure 2 Cross-sectional view and top view of the cathode base in;

[0029] Figure 6 For Figure 2 Cross-sectional view and top view of the rubber gasket in;

[0030] Figure 7 For Figure 2 Cross-sectional view and top view of the electroplating source sheet in.

[0031] In the figure:

[0032] 1 - Electroplating tank body; 11 - Upper opening; 12 - Lower opening; 13 - Circular skirt;

[0033] 2 - Cooling kit; 21 - Cooling metal sheet; 22 - Toothed bayonet; 23 - First fixing protrusion;

[0034] 3 - Cathode base; 31 - First groove; 32 - Second groove; 33 - Conductive column; 34 - Second fixing protrusion;

[0035] 4 - Rubber gasket;

[0036] 5 - Electroplating source sheet. Detailed implementation manners

[0037] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0038] The following further describes the present utility model in detail with reference to the accompanying drawings:

[0039] As Figure 1 , 2As shown in the figure, the present utility model provides an electroplating device capable of providing a cooling cycle, comprising: an electroplating tank body 1, a cooling kit 2, and a cathode base 3. A cooling kit 2 is sleeved outside the electroplating tank body 1. An electroplating source sheet 5 and a rubber gasket 4 are sequentially arranged on the top of the cathode base 2 from bottom to top. The lower part of the cooling kit 2 is connected to the cathode base 3 through a ring buckle, so that the electroplating solution contained in the electroplating tank body 1 contacts the electroplating source sheet 5; wherein,

[0040] Further referring to Figure 3 , the electroplating tank body 1 of the present utility model is of a cylindrical structure, with an upper opening 11 and a lower opening 12 respectively arranged at its upper and lower ends. Circular skirts 13 are arranged at intervals along the axial direction on the outer wall of the electroplating tank body 1; during use, an electroplating solution is contained in the electroplating tank body 1, and an anode wire (not shown in the figure) extends from the upper opening 11 into the electroplating solution in the electroplating tank body 1. Further, the anode wire is a platinum wire, in the shape of a spiral incense coil, placed in the electroplating tank body 1 and parallel to the cathode (electroplating source sheet 5); further, the electroplating tank body 1 is made of acrylic material, and the upper opening 11 is provided with a 45-degree inclined plane, which is convenient for pouring out the electroplating solution from the tank body 1, and the electroplating solution is not easy to spill.

[0041] Further referring to Figure 4 , the cooling kit 2 of the present utility model is an annular structure composed of two semi-circular sub-kits. The cooling kit 2 is made of copper material, and the electroplating tank body 1 is placed in the middle of the cooling kit 2; equally spaced cooling metal sheets 21 are arranged on the upper part of the cooling kit 2, and Peltier semiconductor refrigerators are installed on the cooling metal sheets 21, which can cool the deposition solution in the electroplating tank to prevent the electroplating solution from boiling. Tooth-shaped bayonets 22 for clamping between the two circular skirts 13 are arranged on the inner wall of the cooling kit 2. During assembly, the tooth-shaped bayonets 22 are closely matched with the circular skirts 13 of the electroplating tank body 1. A first fixing protrusion 23 is arranged at the lower part of the cooling kit 2, and the first fixing protrusion 23 and a second fixing protrusion 34 on the upper part of the cathode base 3 are fixed through a ring buckle. When the cooling kit 2 is connected to the cathode base 3 through a ring buckle, the tooth-shaped bayonets 22 of the cooling kit 2 are clamped between the two circular skirts 13 to realize the stable fixation of the electroplating tank body 1, the cooling kit 2, and the cathode base 3. The cooling kit 2 innovatively combines the cooling device and the electroplating tank sealing method into one, greatly simplifying the structure and improving production efficiency.

[0042] Further referring to Figures 5 to 7, the cathode base 3 of the present utility model is made of copper, and the top of the cathode base 3 is provided with a stepped first groove 31 and a second groove 32. The groove diameter of the first groove 31 is smaller than that of the second groove 32; the diameter of the lower first groove 31 is equal to the diameter of the electrodeposition source sheet 5, and the electrodeposition source sheet is placed in the first groove 31. The diameter of the second groove 32 is equal to the outer diameter of the rubber gasket 4, and the second groove 32 plays a role in fixing the rubber gasket 4. The rubber gasket 4 is fixed to the bottom of the electrodeposition tank body 1 by glue. There is an opening in the middle of the rubber gasket 4, and the electrodeposition solution contacts the surface of the electrodeposition source sheet 5 through the opening in the middle of the rubber gasket 4; at the position corresponding to the first fixing protrusion 23 on the upper part of the cathode base 3, there is a second fixing protrusion 34, and the conductive column 33 of the cathode base 3 is connected to the negative pole of the DC regulated power supply. The electrodeposition tank body 1 of the present utility model is subjected to the inward and downward forces of the cooling kit 2 to realize the close contact among the electrodeposition source sheet 5, the rubber gasket 4 and the electrodeposition tank body 1, simplifies the structure of the electrodeposition tank, and improves the production efficiency.

[0043] The specific assembly method of the present utility model is as follows:

[0044] Put the electrodeposition source sheet and the electrodeposition tank body 1 into the cathode base 3 respectively, and then assemble the two semi-circular sub-kits of the cooling kit 2 to wrap the electrodeposition tank body 1 annularly, and make the toothed bayonet 22 of the cooling kit 2 snap into the two circular skirts 13 of the electrodeposition tank body 1; finally, connect the first fixing protrusion 23 at the lower part of the cooling kit 2 and the second fixing protrusion 34 at the upper part of the cathode base 3 through a buckle to realize the stable fixation of the electrodeposition tank body 1, the cooling kit 2 and the cathode base 3.

[0045] The usage method of the present utility model is as follows:

[0046] After completing the assembly of the electrodeposition device, add the electrodeposition solution into the electrodeposition tank body 1, insert the anode wire into the electrodeposition solution in the electrodeposition tank body 1 from the upper opening 11, and connect the conductive column 33 of the cathode base 3 to the negative pole of the DC regulated power supply; turn on the power supply, and the electrodeposition reaction starts.

[0047] The advantages of the present utility model are as follows:

[0048] The present utility model is provided with an annular cooling kit outside the electrodeposition tank body. The upper part of the cooling kit is evenly provided with cooling metal sheets, and each cooling metal sheet is equipped with a Peltier semiconductor refrigerator, reducing the risk of radionuclide pollution; the lower part of the cooling kit is connected to the cathode base through a buckle to fix the electrodeposition tank body; the present utility model innovatively combines the cooling kit and the electrodeposition tank body into one for sealing, simplifies the structure of the electrodeposition device, and improves the production efficiency.

[0049] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An electrodeposition device capable of providing a cooling cycle, characterized in that: include: Electrodeposition cells, cooling kits and cathode bases; The upper and lower ends of the electrodeposition tank body are respectively provided with an upper opening and a lower opening, the outer side of the electrodeposition tank body is provided with the cooling sleeve, and the upper part of the cooling sleeve is evenly distributed with cooling metal sheets; An electrodeposition source sheet is disposed on the top of the cathode base, and the lower portion of the cooling sleeve is connected to the cathode base via a ring buckle so that the electrodeposition liquid contained in the electrodeposition tank body is in contact with the electrodeposition source sheet.

2. The electrodeposition device capable of providing a cooling cycle according to claim 1, characterized in that: Also included: anode wire; The anode wire penetrates into the electrodeposition liquid in the electrodeposition tank body from the upper opening, and the conductive column of the cathode base is connected to the negative pole of the DC voltage-stabilized power supply.

3. The electrodeposition device capable of providing a cooling cycle as claimed in claim 2, characterized in that: The anode wire is a platinum wire in the shape of a coil, which is placed in the electrodeposition tank and parallel to the cathode.

4. The electrodeposition device capable of providing a cooling cycle according to claim 1, characterized in that: The outer wall of the electrodeposition tank body is provided with circular skirts at intervals along the axial direction, and the inner wall of the cooling sleeve is provided with a toothed snap-in slot for being inserted between the two circular skirts; when the lower part of the cooling sleeve is connected to the cathode base through a buckle, the toothed snap-in slot of the cooling sleeve is inserted between the two circular skirts to fix the electrodeposition tank body, the cooling sleeve and the cathode base.

5. The electrodeposition device capable of providing a cooling cycle according to claim 1 or 4, characterized in that: The cooling kit is an annular structure consisting of two semicircular sub-kits. A first fixing protrusion is provided at the lower part of the cooling kit, a second fixing protrusion is provided at the upper part of the cathode base, and the ring buckle is buckled on the first fixing protrusion and the second upper fixing protrusion.

6. The electrodeposition device capable of providing a cooling cycle as claimed in claim 1, characterized in that: A rubber gasket is provided between the lower opening of the electrodeposition tank body and the electrodeposition source sheet.

7. The electrodeposition device capable of providing a cooling cycle as claimed in claim 6, characterized in that: The top of the cathode base is provided with a first groove and a second groove in a stepped manner, wherein the groove diameter of the first groove is smaller than the groove diameter of the second groove; an electrodeposition source sheet is arranged in the lower first groove, and a rubber gasket is arranged in the upper second groove.

8. The electrodeposition device capable of providing a cooling cycle as claimed in claim 7, characterized in that: The rubber gasket is fixed to the bottom of the electrodeposition tank body by glue, and a hole is opened in the middle of the rubber gasket, and the electrodeposition liquid contacts the surface of the electrodeposition source sheet through the hole.

9. The electrodeposition device capable of providing a cooling cycle as claimed in claim 1, characterized in that: The electrodeposition tank body is made of acrylic material, and the upper opening is provided with a 45-degree slope; the cooling kit and the cathode base are made of copper material.

10. The electrodeposition device capable of providing a cooling cycle according to claim 1, characterized in that: A Peltier semiconductor cooler is installed on the cooling metal sheet.

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