Semiconductor condensation heat dissipation device

Abstract

The utility model discloses a semiconductor condensation heat dissipation device which comprises a heat dissipation device body, and the heat dissipation device body comprises a heat conduction plate used for installing a COB lamp body, a protruding part integrally formed in the middle of the side face of the heat conduction plate and heat dissipation fins integrally formed on the side faces of the heat conduction plate and the protruding part. The protruding part is located on the side face, away from the COB lamp body, of the heat conduction plate. A concave cavity used for storing temperature conduction liquid is formed in the protruding part, and a sealing temperature conduction plate is fixed to an opening of the concave cavity through a screw. The space between the concave cavity and the sealed heat conduction plate is filled with heat conduction liquid; a semiconductor cooling device is fixed to the side face, away from the cavity, of the sealed heat conduction plate. The COB lamp is reasonable in structural arrangement, the heat conduction plate can transmit heat of the COB lamp body to the temperature conduction liquid in the concave cavity, the heat is transmitted to the sealed temperature conduction plate after passing through the temperature conduction liquid, the heat is transmitted to the semiconductor cooling device through the sealed temperature conduction plate, the heat conduction uniformity can be improved through the temperature conduction liquid, the heat conduction performance can be rapidly improved, and the service life of the COB lamp is prolonged. And the applicability and the practicability are high.

Description

Technical Field

[0001] The utility model belongs to the technical field of lamp heat dissipation devices, and particularly relates to a semiconductor condensation heat dissipation device. Background Art

[0002] In common electrical structures such as lamps, in order to improve the use stability and service life, corresponding radiator structures are generally provided. The conventional structure of the prior art mainly dissipates heat by setting heat dissipation plates, heat dissipation fins and cooperating with fans, etc. Although heat dissipation operations can be achieved, the heat dissipation uniformity is poor. Especially for some COB point light source lamps, the heat dissipation plate at the contact of the COB point light source has a large amount of heat, and the position of the heat dissipation plate far from the COB point light source has a lower amount of heat, and its heat conduction performance is also relatively limited. Therefore, to a certain extent, the heat dissipation effect is affected, and the applicability and practicability are limited. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a semiconductor condensation heat dissipation device with reasonable structure setting and conducive to rapidly improving the heat conduction performance.

[0004] The technical solution for realizing the purpose of the utility model is a semiconductor condensation heat dissipation device, including a radiator body. The radiator body includes a heat conduction plate for installing a COB lamp body, a convex portion integrally formed in the middle of the side surface of the heat conduction plate, and heat dissipation fins integrally formed on the side surfaces of the heat conduction plate and the convex portion.

[0005] The convex portion is on the side surface of the heat conduction plate far from the COB lamp body;

[0006] A concave cavity for storing a heat conduction liquid is arranged in the convex portion, and a sealed heat conduction plate is fixed at the opening of the concave cavity by screws;

[0007] A heat conduction liquid is filled between the concave cavity and the sealed heat conduction plate;

[0008] A semiconductor cooling device is fixed on the side surface of the sealed heat conduction plate far from the concave cavity.

[0009] Further preferably: a convex platform with a size matching that of the concave cavity is integrally formed on the side surface of the sealed heat conduction plate, and an installation cavity is arranged on the other side surface of the sealed heat conduction plate;

[0010] The convex platform and the installation cavity are arranged on the symmetric side surfaces of the sealed heat conduction plate;

[0011] The sealed heat conduction plate is fixed at the opening of the concave cavity, and the side edge of the convex platform is attached to the inner wall of the concave cavity for sealing;

[0012] The semiconductor cooling device is attached in the installation cavity.

[0013] Further preferably, a pressing piece is fixed to the opening of the installation cavity by screws;

[0014] The semiconductor cooling device is attached to the installation cavity and positioned by being pressed by the pressing piece.

[0015] Further preferably, a protective cover is buckled on the radiator body;

[0016] Both the convex portion and the heat dissipation fins are located inside the protective cover.

[0017] Further preferably, ventilation slots are uniformly arranged on the side wall of the protective cover.

[0018] Further preferably, a connection terminal is arranged on the side wall of the protective cover, and a mounting terminal is fixed on the semiconductor cooling device.

[0019] Further preferably, the heat-conducting liquid is heat-conducting oil or water.

[0020] The utility model has positive effects: The structure of the utility model is reasonably arranged. There is a convex portion in the middle of the side of the heat-conducting plate, and a concave cavity for storing the heat-conducting liquid is arranged inside the convex portion. A sealing heat-conducting plate is fixed to the opening of the concave cavity by screws; The heat-conducting liquid is filled between the concave cavity and the sealing heat-conducting plate. At the same time, a semiconductor cooling device is fixed on the side of the sealing heat-conducting plate away from the concave cavity. When in use, the heat-conducting plate can transfer the heat of the COB lamp body to the heat-conducting liquid in the concave cavity, and after passing through the heat-conducting liquid, it is transferred to the sealing heat-conducting plate and then transferred to the semiconductor cooling device for rapid cooling through the sealing heat-conducting plate. The heat-conducting liquid is beneficial to improving the rapid conduction of heat to the cooling device, with a constant and reliable use temperature, strong applicability and good practicability. Description of the Drawings

[0021] In order to make the content of the utility model easier to be clearly understood, the following further details the utility model according to specific embodiments and in combination with the drawings, where:

[0022] Figure 1 is a structural schematic diagram of the utility model;

[0023] Figure 2 is a specific structural schematic diagram of the radiator body in the utility model;

[0024] Figure 3 is a specific structural schematic diagram of the sealing heat-conducting plate and the semiconductor cooling device in the utility model.

[0025] Reference numerals: radiator body 1, heat-conducting plate 11, convex portion 12, heat dissipation fins 13, COB lamp body 2, concave cavity 3, sealing heat-conducting plate 4, semiconductor cooling device 5, convex platform 6, installation cavity 7, pressing piece 8, protective cover 9, ventilation slots 10, connection terminal 14, mounting terminal 15. Detailed implementation mode

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment

[0028] See Figures 1 to 3 As shown, a semiconductor condensation heat dissipation device includes a radiator body 1. The radiator body includes a heat conduction plate 11 for installing a COB lamp body 2, a convex portion 12 integrally formed in the middle of the side surface of the heat conduction plate, and heat dissipation fins 13 integrally formed on the side surfaces of the heat conduction plate and the convex portion. In this embodiment, the heat conduction plate, the convex portion and the heat dissipation fins are aluminum alloy structures. The heat conduction plate is mainly used to transfer the heat generated by several COB lamp bodies into the heat conduction liquid, and heat dissipation is achieved through the heat dissipation fins and the semiconductor cooling device.

[0029] In the actual application process, the convex portion is located on the side surface of the heat conduction plate away from the COB lamp body. At the same time, a concave cavity 3 for storing the heat conduction liquid is provided in the convex portion, and a sealed heat conduction plate 4 is fixed to the opening of the concave cavity by screws. At the same time, the heat conduction liquid is filled between the concave cavity and the sealed heat conduction plate. The sealed heat conduction plate is used to achieve the sealing of the opening of the concave cavity to prevent the internal heat conduction liquid from flowing out. In the actual application process, the heat conduction liquid is heat conduction oil or water. The sealed heat conduction plate is a metal structure with good heat conduction effect, and heat conduction is achieved by the contact between the sealed heat conduction plate and the heat conduction liquid.

[0030] In the actual application process, a semiconductor cooling device 5 is fixed to the side surface of the sealed heat conduction plate away from the concave cavity. In this embodiment, the semiconductor cooling device is a conventional structure of the prior art and is only simply applied, so it is not described in detail. The working voltage of the semiconductor cooling device is 12V, the working power is 45W, and its working temperature drop is -40 degrees.

[0031] In the actual application process, a boss 6 with a size matching that of the concave cavity is integrally formed on the side surface of the sealed heat-conducting plate, and an installation cavity 7 is arranged on another side surface of the sealed heat-conducting plate; in the actual application process, the boss and the installation cavity are arranged on the symmetric side surfaces of the sealed heat-conducting plate; the sealed heat-conducting plate is fixed at the opening of the concave cavity, and the side edge of the boss is attached to the inner wall of the concave cavity for sealing; the semiconductor cooling device is attached in the installation cavity. In this embodiment, the size of the installation cavity is the same as that of the semiconductor cooling device, so as to increase the heat-conducting contact area and improve the heat dissipation performance.

[0032] In the actual application process, a pressing piece 8 is fixed at the opening of the installation cavity by screws; the semiconductor cooling device is attached in the installation cavity and is positioned by being pressed by the pressing piece. Through the above structure, the installation stability and reliability of the semiconductor cooling device can be improved, and the number of the pressing pieces is two or more, which can prevent the semiconductor cooling device from loosening or tilting, and has strong practicability.

[0033] In the actual application process, a protective cover 9 is buckled on the radiator body; the convex portion and the heat dissipation fins are both within the protective cover. Venting groove holes 10 are uniformly arranged on the side wall of the protective cover. A connection terminal 14 is arranged on the side wall of the protective cover, and a mounting terminal 15 is fixed on the semiconductor cooling device. In this embodiment, the protective cover can be a plastic structure body or a metal structure body. At the same time, the venting groove holes can improve the heat dissipation effectiveness, and the connection terminal and the mounting terminal are mainly used for connection to ensure the use stability and reliability of the semiconductor cooling device.

[0034] The utility model has positive effects: The structure of the utility model is reasonably arranged. There is a convex portion in the middle of the side surface of the heat-conducting plate, and a concave cavity for storing heat-conducting liquid is arranged in the convex portion. A sealed heat-conducting plate is fixed at the opening of the concave cavity by screws; a heat-conducting liquid is filled between the concave cavity and the sealed heat-conducting plate. At the same time, a semiconductor cooling device is fixed on the side surface of the sealed heat-conducting plate far away from the concave cavity. When in use, the heat-conducting plate can transfer the heat of the COB lamp body to the heat-conducting liquid in the concave cavity, and after passing through the heat-conducting liquid, it is transferred to the sealed heat-conducting plate and then transferred to the semiconductor cooling device for rapid cooling through the sealed heat-conducting plate. The heat-conducting liquid is beneficial to improving the rapid conduction of heat to the cooling device, the use temperature is constant and reliable, and it has strong applicability and good practicability.

[0035] The standard parts used in this embodiment can be directly purchased from the market, and the non-standard structural components described in the description can also be directly processed according to the existing technical common sense without any doubt. At the same time, the connection methods of each component adopt the mature conventional means in the existing technology, and the machines, parts and equipment all adopt the conventional models in the existing technology, so no specific description will be made here.

[0036] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or alterations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And these obvious changes or alterations derived from the essential spirit of the present utility model still fall within the protection scope of the present utility model.

Claims

1. A semiconductor condensation heat dissipation device, comprising a heat sink body, characterized in that: The heat sink body comprises a heat conducting plate for mounting the COB lamp body, a protrusion integrally formed in the middle of the side of the heat conducting plate, and heat dissipation fins integrally formed on the side of the heat conducting plate and the protrusion; The protrusion is located on the side of the heat conducting plate away from the COB lamp body; The raised portion is provided with a concave cavity for storing the temperature conducting liquid, and a sealed temperature conducting plate is fixed at the opening of the concave cavity by screws; The cavity and the sealed thermal conductive plate are filled with thermal conductive liquid; A semiconductor cooling device is fixed on the side of the sealed heat conducting plate away from the concave cavity.

2. A semiconductor condensation heat dissipation device according to claim 1, characterized in that: A boss whose size matches the size of the cavity is integrally formed on the side of the sealed heat conducting plate, and a mounting cavity is provided on the other side of the sealed heat conducting plate; The boss and the mounting cavity are arranged on symmetrical sides of the sealed heat conducting plate; The sealed heat conducting plate is fixed at the opening of the cavity, and the side edge of the boss is attached to the inner wall of the cavity for sealing; The semiconductor cooling device is fitted in the installation cavity.

3. A semiconductor condensation heat dissipation device according to claim 2, characterized in that: A pressing sheet is fixed at the opening of the installation cavity by screws; The semiconductor cooling device is fitted in the installation cavity and is pressed and positioned by a pressing sheet.

4. A semiconductor condensation heat dissipation device according to claim 1, characterized in that: A protective cover is buckled on the radiator body; The protrusion and the heat dissipation fins are both located inside the protective cover.

5. A semiconductor condensation heat dissipation device according to claim 4, characterized in that: The side wall of the protective cover is evenly provided with ventilation slots.

6. A semiconductor condensation heat dissipation device according to claim 4, characterized in that: A connecting terminal is arranged on the side wall of the protective cover, and a mounting terminal is fixed on the semiconductor cooling device.

7. The semiconductor condensation heat dissipation device according to claim 1, characterized in that: The temperature conducting liquid is heat conducting oil or water.

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