Choline chloride production tail gas recycling device

Abstract

The utility model discloses a choline chloride production tail gas recycling device, which relates to the technical field of chemical engineering, and comprises a device main body, two sides of the device main body are respectively connected with a diversion port and a confluence port, a heat absorption pipe is connected between the diversion port and the confluence port, and a baffle is connected above the inside of the device main body. According to the utility model, through the arrangement of the shunting port, the converging port, the baffle plates, the heat absorption pipes, the semiconductor cooler, the heat absorption plate and the heat dissipation plate, tail gas flows towards the gas outlet after entering the device, and due to the arrangement of the baffle plates, the heat absorption pipes and the heat absorption plate, the tail gas flowing path is very complicated and needs to turn for multiple times; ethylene oxide is thrown out during turning by utilizing the characteristics of centrifugal force generated by airflow turning and high density of ethylene oxide; ethylene oxide in tail gas can be continuously recovered without waiting for gas precipitation, ethylene oxide can be directly liquefied to avoid tail gas residues, ethylene oxide can be directly utilized, and waste heat can be recovered to reduce heat waste.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical engineering, in particular to a device for recycling tail gas in the production of choline chloride. Background Technique

[0002] Choline chloride is an organic compound with the chemical formula C5H14ClNO. It is mainly used to treat fatty liver and cirrhosis, and also as a feed additive for poultry and livestock. It can stimulate the ovaries to lay more eggs, give birth to offspring, and increase the weight of poultry, livestock, fish, etc. The two main production processes of choline chloride are the chloroethanol method and the ethylene oxide method. In the processes such as the reaction of choline chloride, waste gas will be generated. The direct emission of waste gas will pollute the atmosphere, and some substances in part of the waste gas can be recycled to reduce resource waste. Therefore, it is necessary to treat the waste gas through a device for recycling tail gas in the production of choline chloride.

[0003] A device for recycling tail gas in the production of choline chloride with the application number 202123385685.0 includes a reaction kettle and a tail gas storage tank. The side of the reaction kettle is provided with a feed inlet, the top of the reaction kettle is provided with a tail gas discharge port, the side of the tail gas storage tank is provided with a tail gas inlet and a tail gas vent, the tail gas discharge port is connected to the tail gas inlet through a pipeline, and an electric cut-off valve is arranged on the pipeline connecting the tail gas discharge port and the tail gas inlet. The tail gas vent is connected to the feed inlet of the reaction kettle through a pipeline; the top of the tail gas storage tank is provided with a nitrogen exhaust port, the nitrogen exhaust port is connected to an on-line ethylene oxide detector through a pipeline, and a nitrogen release valve is arranged on the pipeline connecting the nitrogen exhaust port and the on-line ethylene oxide detector; the tail gas storage tank is provided with a nitrogen replenishing mechanism. The utility model can recycle the toxic ethylene oxide tail gas generated in the reaction, and the recycled tail gas participates in the reaction as a raw material, saving raw material resources.

[0004] According to the characteristics of the large density of ethylene oxide in this technical solution, ethylene oxide is separated from other waste gases by precipitation and purging nitrogen. First, precipitation requires static waiting for a period of time for the gas to stratify. If gas is continuously added or discharged, it is easy to cause gas turbulence and mixing, which is not conducive to continuous production. Second, nitrogen needs to be continuously introduced for a period of time to discharge the waste gas other than ethylene oxide later. Nitrogen is difficult to recycle and can only be produced by production equipment such as liquefied air, resulting in waste. Content of the Utility Model

[0005] Based on this, the purpose of the utility model is to provide a device for recycling tail gas in the production of choline chloride to solve the technical problems mentioned in the above background technique.

[0006] To achieve the above object, the present utility model provides the following technical solutions: A device for recycling the tail gas in the production of choline chloride, comprising a device main body. A shunt port and a confluence port are respectively connected to both sides of the device main body, and a heat absorption tube is connected between the shunt port and the confluence port. Above the interior of the device main body, a baffle is connected; A communication groove is provided inside the device main body; A semiconductor refrigerator is installed on the inner wall of the device main body, and a heat absorption plate is connected to the outer surface of the semiconductor refrigerator. A heat dissipation plate is connected to the back of the semiconductor refrigerator, and a wind groove is connected to the back of the device main body.

[0007] By adopting the above technical solutions, after the tail gas enters the device, it flows towards the air outlet direction. Due to the arrangement of multiple baffles, heat absorption tubes, and heat absorption plates, the flow path of the tail gas is very complex and requires multiple turns. Utilizing the centrifugal force generated by the airflow turning and the characteristic of large density of ethylene oxide, ethylene oxide is thrown out when turning. Then, again due to the large density of ethylene oxide, ethylene oxide falls to the periphery of the heat absorption plate through the communication groove; At the same time, the shunt port shunts the airflow into multiple heat absorption tubes. The airflow flows from right to left, while the tail gas flows from left to right. The tail gas and the airflow generate convection and cooperate with the heat conduction of the heat absorption tubes, so that the heat in the tail gas is carried away by the airflow, thereby reducing the temperature of the tail gas; After ethylene oxide falls to the periphery of the heat absorption plate, the semiconductor refrigerator cooperates with the heat absorption plate to absorb the heat of ethylene oxide, so that the temperature of ethylene oxide is reduced to below ten degrees Celsius, and then ethylene oxide is liquefied and can be reused for the reaction. At the same time, the semiconductor refrigerator dissipates the heat to the wind groove through the heat dissipation plate, and then the heat is carried away by another airflow passing through the wind groove; The airflow carrying the heat of the tail gas and ethylene oxide can be sent into equipment such as a reaction kettle that needs to be heated for preheating or heating, thus facilitating waste heat recovery.

[0008] Furthermore, both the heat absorption tube and the heat absorption plate are made of copper material, and the heat dissipation plate is made of aluminum material.

[0009] By adopting the above technical solutions, the copper heat absorption tube and heat absorption plate have a high heat conductivity, which is convenient for absorbing the heat in the tail gas and ethylene oxide. The aluminum heat dissipation plate also has a high heat conductivity and is convenient for heat dissipation.

[0010] Furthermore, a plurality of through holes are provided on both sides of the baffle, and the heat absorption tube penetrates through the through holes on both sides of the baffle.

[0011] By adopting the above technical solutions, the multiple through holes provided on the baffle facilitate the heat absorption tube to pass through the baffle, avoiding the influence of the baffle on the airflow passing through the heat absorption tube for waste heat recovery.

[0012] Furthermore, a plurality of heat absorption tubes are provided, and the plurality of heat absorption tubes are distributed in a rectangular array.

[0013] By adopting the above technical solution, the heat exchange area is increased by increasing the number of heat absorption tubes, so that the heat in the tail gas can be better absorbed by the air flow for waste heat recovery.

[0014] Furthermore, a plurality of the baffles are provided, and the plurality of baffles are distributed in a staggered manner up and down.

[0015] By adopting the above technical solution, the flow path of the tail gas is very complex and requires multiple turns. By using the centrifugal force generated by the turning of the air flow and the characteristic that ethylene oxide has a large density, ethylene oxide is thrown out when turning.

[0016] Furthermore, a plurality of the heat absorption tubes are all communicated with the shunt port and the confluence port.

[0017] By adopting the above technical solution, the shunt port shunts the air flow into the plurality of heat absorption tubes. The air flow flows from right to left, while the tail gas flows from left to right. The tail gas and the air flow generate convection and cooperate with the heat conduction of the heat absorption tubes, so that the heat in the tail gas is carried away by the air flow, thereby reducing the temperature of the tail gas.

[0018] Furthermore, a plurality of the heat absorption plates and the heat dissipation plates are provided, and the plurality of heat absorption plates and the heat dissipation plates are evenly distributed at equal intervals.

[0019] By adopting the above technical solution, the heat of ethylene oxide is absorbed by the semiconductor refrigerator in cooperation with the heat absorption plate, so that the temperature of ethylene oxide is reduced to below ten degrees Celsius, and then ethylene oxide is liquefied and can be reused for the reaction. At the same time, the semiconductor refrigerator dissipates the heat to the air trough through the heat dissipation plate.

[0020] Furthermore, an air inlet is connected to one side of the top of the device main body, an air outlet is connected to the other side of the top of the device main body, and a discharge port is connected to the bottom of the device main body.

[0021] By adopting the above technical solution, the operator connects the air inlet to the device generating the tail gas, which is convenient for the tail gas to enter the device main body. A dust collector can be installed between the air inlet and the device generating the tail gas to avoid dust entering and affecting heat conduction; then the operator connects the air outlet to the subsequent tail gas treatment device or the emission device, which is convenient for further treating the tail gas or directly discharging it at high altitude; the operator connects the discharge port to the reaction kettle through a valve and a pipeline, which is convenient for the subsequent liquid ethylene oxide to enter the reaction kettle.

[0022] Furthermore, dust-proof nets are installed on both sides of the air trough.

[0023] By adopting the above technical solution, the entry of dust is reduced through the dust-proof net, and the influence of dust on the heat conduction of the heat dissipation plate is avoided.

[0024] In summary, the present utility model mainly has the following beneficial effects:

[0025] The utility model is provided with a shunt port, a confluence port, a baffle, a heat absorption tube, a semiconductor refrigerator, a heat absorption plate and a heat dissipation plate. After the tail gas enters the device, it flows towards the air outlet. Due to the arrangement of multiple baffles, heat absorption tubes and heat absorption plates, the flow path of the tail gas is very complex and requires multiple turns. By utilizing the centrifugal force generated by the airflow turning and the characteristic that the density of ethylene oxide is large, ethylene oxide is thrown out when turning, and then again due to the large density of ethylene oxide, ethylene oxide falls to the periphery of the heat absorption plate through the communication groove; at the same time, the shunt port shunts the airflow into the internal of multiple heat absorption tubes, the airflow flows from right to left, while the tail gas flows from left to right, and the tail gas and the airflow generate convection to cooperate with the heat conduction of the heat absorption tube, so that the heat in the tail gas is taken away by the airflow, thereby reducing the temperature of the tail gas; after ethylene oxide falls to the periphery of the heat absorption plate, the semiconductor refrigerator cooperates with the heat absorption plate to absorb the heat of ethylene oxide, so that ethylene oxide is reduced to below ten degrees Celsius, and then ethylene oxide is liquefied and can be reused for the reaction. At the same time, the semiconductor refrigerator dissipates heat into the air duct through the heat dissipation plate, and then the heat is taken away by another airflow passing through the air duct; the airflow carrying the heat of the tail gas and ethylene oxide can be sent into equipment such as a reaction kettle that needs to be heated for preheating or heating, so as to facilitate waste heat recovery; it is convenient to continuously recover ethylene oxide in the tail gas without waiting for the gas to precipitate, and can directly liquefy ethylene oxide to avoid tail gas residue, so that ethylene oxide can be directly utilized, and at the same time, waste heat can be recovered to reduce heat waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of the utility model;

[0027] Figure 2 is a schematic cross-sectional structural diagram of the utility model;

[0028] Figure 3 is a schematic structural diagram of the heat absorption tube of the utility model;

[0029] Figure 4 is a schematic side cross-sectional structural diagram of the utility model;

[0030] Figure 5 is a schematic structural diagram of the air duct of the utility model.

[0031] In the figure: 1, device main body; 2, air inlet; 3, air outlet; 4, discharge port; 5, shunt port; 6, confluence port; 7, baffle; 8, heat absorption tube; 9, communication groove; 10, semiconductor refrigerator; 11, heat absorption plate; 12, heat dissipation plate; 13, air duct; 14, dust-proof net. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0033] The embodiments of the present utility model will be described below according to its overall structure.

[0034] Embodiment 1:

[0035] A device for recycling the tail gas in the production of choline chloride, as Figures 1 - 5 shown, includes a device main body 1. A shunt port 5 and a confluence port 6 are respectively connected to both sides of the device main body 1. An endothermic tube 8 is connected between the shunt port 5 and the confluence port 6. The endothermic tube 8 is made of copper material. A plurality of endothermic tubes 8 are provided, and the plurality of endothermic tubes 8 are distributed in a rectangular array. The plurality of endothermic tubes 8 are all communicated with the shunt port 5 and the confluence port 6. The shunt port 5 diverts the air flow into the plurality of endothermic tubes 8. The air flow flows from right to left, while the tail gas flows from left to right. The tail gas and the air flow generate convection to cooperate with the heat conduction of the endothermic tube 8, so that the heat in the tail gas is carried away by the air flow, thereby reducing the temperature of the tail gas; A baffle 7 is connected above the interior of the device main body 1. A plurality of baffles 7 are provided, and the plurality of baffles 7 are distributed vertically and staggered, making the flow path of the tail gas very complex and requiring multiple turns. Utilizing the centrifugal force generated by the turning of the air flow and the characteristic that ethylene oxide has a large density, ethylene oxide is thrown out when turning; A plurality of through holes are opened on both sides of the baffle 7, and the endothermic tube 8 penetrates through the through holes on both sides of the baffle 7, facilitating the penetration of the endothermic tube 8; A communication groove 9 is opened inside the device main body 1, and ethylene oxide falls to the periphery of the heat absorption plate 11 through the communication groove 9;

[0036] A semiconductor refrigerator 10 is installed on the inner wall of the device main body 1. A heat absorption plate 11 is connected to the outer surface of the semiconductor refrigerator 10. The heat absorption plate 11 is made of copper material. The semiconductor refrigerator 10 cooperates with the heat absorption plate 11 to absorb the heat of ethylene oxide, so that the temperature of ethylene oxide is reduced to below ten degrees Celsius, and then ethylene oxide is liquefied and can be reused for the reaction; A heat dissipation plate 12 is connected to the back of the semiconductor refrigerator 10. The heat dissipation plate 12 is made of aluminum material. A plurality of heat absorption plates 11 and heat dissipation plates 12 are provided, and the plurality of heat absorption plates 11 and heat dissipation plates 12 are evenly distributed at equal intervals. A wind groove 13 is connected to the back of the device main body 1. The semiconductor refrigerator 10 dissipates heat into the wind groove 13 through the heat dissipation plate 12, and then the heat is taken away by another air flow passing through the wind groove 13.

[0037] Refer to Figure 1 、 Figure 2 and Figure 4, in the above embodiment, an air inlet 2 is connected to one side of the top of the device main body 1. The air inlet 2 is connected to the device generating tail gas, facilitating the entry of tail gas into the interior of the device main body 1; an air outlet 3 is connected to the other side of the top of the device main body 1. The air outlet 3 is connected to the subsequent tail gas treatment device or the emission device, facilitating the further treatment of the tail gas or direct high-altitude emission; a discharge port 4 is connected to the bottom of the device main body 1. The discharge port 4 is connected to the reaction kettle through a valve and a pipeline, facilitating the entry of subsequent liquid ethylene oxide into the interior of the reaction kettle.

[0038] Embodiment Two:

[0039] Based on the above Embodiment One, in order to reduce the entry of dust, the following settings are now made.

[0040] Refer to Figure 1 、 Figure 2 and Figure 5 , in the above embodiment, dust-proof nets 14 are installed on both sides of the air duct 13. Dust entry is reduced through the dust-proof nets 14 to avoid dust affecting the thermal conductivity.

[0041] The implementation principle of the present utility model is as follows: First, the staff connects the air inlet 2 to the device generating tail gas, facilitating the entry of tail gas into the interior of the device main body 1. A dust collector can be installed between the air inlet 2 and the device generating tail gas to avoid the entry of dust and affect the heat conduction; then the staff connects the air outlet 3 to the subsequent tail gas treatment device or the emission device, facilitating the further treatment of the tail gas or direct high-altitude emission; the staff connects the shunt port 5 and one side of the air duct 13 to the blower, facilitating the generation of air flow to carry away heat. At the same time, dust entry is reduced through the dust-proof nets 14 to avoid dust affecting the thermal conductivity of the heat dissipation plate 12. Then the staff connects the confluence port 6 and the other side of the air duct 13 to the preheating or heating device to facilitate the recovery of heat; then the staff connects the discharge port 4 to the reaction kettle through a valve and a pipeline, facilitating the entry of subsequent liquid ethylene oxide into the interior of the reaction kettle;

[0042] The tail gas enters the interior of the device main body 1 through the air inlet 2. Then the tail gas flows towards the air outlet 3. Due to the arrangement of multiple baffles 7, heat absorption tubes 8, and heat absorption plates 11, the flow path of the tail gas is very complex and requires multiple turns. Utilizing the centrifugal force generated by the turning of the air flow and the characteristic that ethylene oxide has a large density, ethylene oxide is thrown out when turning. Then, again due to the large density of ethylene oxide, ethylene oxide falls to the periphery of the heat absorption plate 11 through the communication groove 9; at the same time, the shunt port 5 shunts the air flow into the interior of multiple heat absorption tubes 8. The air flow flows from right to left, while the tail gas flows from left to right. The tail gas and the air flow generate convection to cooperate with the heat conduction of the heat absorption tubes 8, enabling the heat in the tail gas to be carried away by the air flow, thereby reducing the temperature of the tail gas;

[0043] After the ethylene oxide falls to the periphery of the heat absorption plate 11, the heat of the ethylene oxide is absorbed by the semiconductor refrigerator 10 in cooperation with the heat absorption plate 11, so that the ethylene oxide is reduced to below ten degrees Celsius, and then the ethylene oxide is liquefied and can be reused for the reaction. At the same time, the semiconductor refrigerator 10 dissipates the heat into the air duct 13 through the heat dissipation plate 12, and then the heat is carried away by another air flow passing through the air duct 13; the air flow carrying the tail gas and the heat of the ethylene oxide can be sent into equipment such as a reaction kettle that needs to be heated for preheating or heating, so as to facilitate waste heat recovery.

[0044] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and are not limitations thereto. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations that do not make creative contributions to the embodiments according to needs, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A choline chloride production tail gas recovery and utilization device, comprising a device body (1), characterized in that: The two sides of the device body (1) are respectively connected to a diversion port (5) and a confluence port (6), and a heat absorption pipe (8) is connected between the diversion port (5) and the confluence port (6); a baffle (7) is connected to the upper part of the device body (1); a connecting groove (9) is provided inside the device body (1); a semiconductor refrigerator (10) is installed on the inner wall of the device body (1), and a heat absorption plate (11) is connected to the outer surface of the semiconductor refrigerator (10); a heat dissipation plate (12) is connected to the back of the semiconductor refrigerator (10), and a wind groove (13) is connected to the back of the device body (1).

2. The choline chloride production tail gas recovery and utilization device according to claim 1, characterized in that: The heat absorbing tube (8) and the heat absorbing plate (11) are both made of copper material, and the heat dissipating plate (12) is made of aluminum material.

3. The choline chloride production tail gas recovery and utilization device according to claim 2, characterized in that: A plurality of through holes are provided on both sides of the baffle plate (7), and the heat absorption pipe (8) passes through the through holes on both sides of the baffle plate (7).

4. The choline chloride production tail gas recovery and utilization device according to claim 3, characterized in that: A plurality of the heat absorbing tubes (8) are provided, and the plurality of heat absorbing tubes (8) are distributed in a rectangular array.

5. The choline chloride production tail gas recovery and utilization device according to claim 3, characterized in that: A plurality of baffles (7) are provided, and the plurality of baffles (7) are staggeredly distributed up and down.

6. The choline chloride production tail gas recovery and utilization device according to claim 4, characterized in that: The plurality of heat absorption pipes (8) are all in communication with the branching port (5) and the converging port (6).

7. The choline chloride production tail gas recovery and utilization device according to claim 2, characterized in that: A plurality of the heat absorbing plates (11) and the heat dissipating plates (12) are provided, and the plurality of heat absorbing plates (11) and the heat dissipating plates (12) are distributed at equal distances.

8. The choline chloride production tail gas recovery and utilization device according to claim 1, characterized in that: One side of the top of the device body (1) is connected to an air inlet (2), the other side of the top of the device body (1) is connected to an air outlet (3), and the bottom of the device body (1) is connected to a discharge port (4).

9. The choline chloride production tail gas recovery and utilization device according to claim 1, characterized in that: Dust-proof nets (14) are installed on both sides of the air slot (13).

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