Heat exchange device and heat exchange system

Abstract

The utility model relates to a heat exchange device and a heat exchange system, the heat exchange device is used for heating or cooling an electronic product through a temperature adjusting medium, and the heat exchange device comprises a containing cavity, at least one heat exchange device and a heat exchange system, wherein the accommodating cavity forms at least one medium groove through which a temperature adjusting medium flows, and a groove opening of the medium groove faces the accommodating cavity, so that the medium groove is communicated with the accommodating cavity; a turbulent flow body arranged in the medium groove is formed or installed in the containing cavity, and the turbulent flow body is provided with at least one turbulent flow face extending in the flow guiding direction intersecting with the temperature adjusting medium flowing direction. The heat exchange device and the heat exchange system have the beneficial effects that the heat exchange capacity of the temperature adjusting medium can be improved, and therefore the heat exchange efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device processing, and particularly to a heat exchange device and a heat exchange system. Background Art

[0002] During the processing of some existing products, heating or cooling treatment is required. For example, after the casing of some electronic products is heat-treated in a heating furnace, it needs to be cooled in time. In some processes, the cooling process often uses the method of spraying water to cool the electronic products. Since the chemical substances in the water will cause scale to form on the cooled electronic products, it will directly affect the product quality. In the related art, some processing equipment uses air cooling to cool electronic products, such as allowing cold air to directly flow through the chamber for installing electronic products on the processing equipment.

[0003] However, when the cold air passes through the surface of the electronic product, the heat exchange mainly depends on the cold air near the surface of the electronic product to exchange heat with the electronic product. Generally, the area near the surface of the electronic product is called the boundary layer. When the existing cooling equipment is in use, the cold air far from the boundary layer is not fully utilized, resulting in energy loss and low cooling efficiency.

[0004] For the same reason, some heating treatment equipment for heating the items to be processed also has the problem that the cold air far from the boundary layer is not fully utilized, resulting in low heat exchange efficiency of these heat exchange equipment. Summary of the Utility Model

[0005] The embodiments of the present application provide a heat exchange device and a heat exchange system, which improve the range of fluid flow and thus improve the heat exchange capacity of the temperature control medium to at least partially solve the above technical problems.

[0006] To achieve the above object, according to the first aspect of the present application, there is provided a heat exchange device for heating or cooling electronic products through a temperature control medium, including: a receiving cavity; wherein, at least one receiving cavity for receiving electronic products is formed in the receiving cavity; at least one medium groove through which the temperature control medium flows is formed in the receiving cavity, and the notch of the medium groove faces the receiving cavity so that the medium groove communicates with the receiving cavity; a turbulator disposed inside the medium groove is formed or installed in the receiving cavity, and the turbulator has at least one turbulator surface extending along a diversion direction intersecting with the flow direction of the temperature control medium.

[0007] Optionally, the medium groove is a through groove extending in a first direction.

[0008] Optionally, a plurality of the turbulators are arranged at intervals along the first direction at the bottom of the medium groove.

[0009] Optionally, the depth direction of the medium tank is defined as the second direction; the two oppositely arranged turbulators are arranged at intervals along a third direction perpendicular to both the first direction and the second direction at the bottom of the medium tank.

[0010] Optionally, a converging channel is formed between the two turbulators aligned in the second direction; the converging channel gradually contracts from the upstream to the downstream of the temperature control medium flow in the first direction; or, the converging channel gradually contracts from the downstream to the upstream of the temperature control medium flow in the first direction.

[0011] Optionally, the turbulator surface is configured to have at least one plane; the angle formed by the intersection of the turbulator surface and the straight line where the first direction is located is in the range of at least one of 0 to 15°, 15° to 30°, 30° to 45°, 45° to 60°, and 60° to 75°.

[0012] Optionally, the depth direction of the medium tank is defined as the second direction; a fluid channel is formed between the end of the turbulator away from the bottom of the medium tank and the orifice of the medium tank in the second direction for the temperature control medium to pass through.

[0013] Optionally, the contour shape of the turbulator surface is configured as at least one of a polygon and a semi - circle, and the long side of the shape of the turbulator surface is arranged on the side of the shape of the turbulator surface close to the bottom of the medium tank.

[0014] Optionally, a static pressure chamber is formed in the accommodation cavity, and in the flow direction of the temperature control medium, the static pressure chamber is arranged upstream of the accommodation cavity; the heat exchange device further includes: a fluid distributor; wherein, the fluid distributor is used to disperse the flowing temperature control medium to the corresponding medium tank; the fluid distributor is arranged in the static pressure chamber.

[0015] Optionally, the internal space of the static pressure chamber continuously increases from the upstream to the downstream of the temperature control medium flow.

[0016] Optionally, the fluid distributor includes a perforated plate; and / or the fluid distributor includes a plurality of flow - dividing plates for dispersing the flowing temperature control medium to different angles.

[0017] According to the second aspect of the present application, a heat exchange system is provided, including: a power source, a heat - cooler, and the aforementioned heat exchange device; wherein, the power source is used to provide the power for the flow of the temperature control medium; the heat - cooler is used to heat or cool the temperature control medium.

[0018] Optionally, the heat exchange system further includes: a medium pipeline; wherein, the medium pipeline is respectively connected to the power source, the heat - cooler, and the heat exchange device to form a loop for the circulation flow of the temperature control medium.

[0019] Optionally, the heat exchanger includes: a fin device and a thermoelectric cooler; wherein, the fin device has a fin flow path connected in the medium pipeline; the thermoelectric cooler is connected to the fin device to cool it.

[0020] Optionally, the heat exchanger further includes: a cooling fan; wherein, the cooling fan is used to drive air flow through the thermoelectric cooler to dissipate heat from the thermoelectric cooler.

[0021] The beneficial effect of the present application is: to provide a heat exchange device and a heat exchange system that can improve the flow range of the temperature-adjusting medium and thus improve the heat exchange capacity of the temperature-adjusting medium.

[0022] More specifically, some embodiments of the present application may produce the following specific beneficial effects:

[0023] When heat is exchanged between the temperature-adjusting medium and the electronic product to be processed, the flow direction of the temperature-adjusting medium is disturbed by the turbulence surface, so that the temperature-adjusting medium relatively far from the boundary layer and closer to the electronic product side is blocked by the turbulence surface and changes its flow direction. Therefore, the temperature-adjusting medium is relatively closer to the electronic product to be processed at the turbulence body, exchanges heat fully with the electronic product, the temperature gradient near the surface of the electronic product becomes larger, playing a role in impact-enhanced heat transfer, thereby improving the heat exchange efficiency.

[0024] Other features and advantages of the present application will be described in detail in the subsequent specific implementation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative efforts.

[0026] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, where the same reference numerals represent the same parts in the following description.

[0027] Figure 1 is the overall structural schematic diagram of the heat exchange system provided in the exemplary embodiment of the present application;

[0028] Figure 2 is the internal cross-sectional view of the heat exchange device provided in the exemplary embodiment of the present application;

[0029] Figure 3 is Figure 2 the cross-sectional view of the heat exchange device shown near the accommodation cavity;

[0030] Figure 4 isFigure 2 Cross-sectional view of the heat exchange device shown near the turbulator;

[0031] Figure 5 is Figure 2 Schematic structural diagram of the heat exchange device shown near the turbulator;

[0032] Figure 6 is Figure 2 Cross-sectional view of the heat exchange device shown near the turbulator from a second perspective;

[0033] Figure 7 Schematic diagram of the flow state of the temperature-regulating medium in the medium tank;

[0034] Figure 8 is Figure 2 Schematic structural diagram of the first embodiment of the turbulator in;

[0035] Figure 9 is Figure 2 Schematic structural diagram of the second embodiment of the turbulator in;

[0036] Figure 10 is Figure 2 Schematic structural diagram of the third embodiment of the turbulator in;

[0037] Figure 11 is Figure 2 Schematic structural diagram of the fourth embodiment of the turbulator in;

[0038] Figure 12 is Figure 2 Exploded view of a part of the structure in the heat exchange device shown;

[0039] Figure 13 is Figure 12 Schematic structural diagram of the first embodiment of the flow splitter plate in;

[0040] Figure 14 is Figure 12 Schematic structural diagram of the second embodiment of the flow splitter plate in;

[0041] Figure 15 is Figure 12 Schematic structural diagram of the third embodiment of the flow splitter plate in;

[0042] Figure 16 is Figure 12 Schematic structural diagram of the fourth embodiment of the flow splitter plate in;

[0043] Figure 17 is Figure 12 Schematic structural diagram of the fifth embodiment of the flow splitter plate in;

[0044] Figure 18 is Figure 12Schematic structural diagram of the sixth implementation of the middle flow splitter;

[0045] Figure 19 is Figure 12 Schematic structural diagram of the seventh implementation of the middle flow splitter;

[0046] Figure 20 Schematic diagram of the cooperation relationship between the second housing and the flow splitter in the heat exchange device provided in the exemplary implementation of the present application;

[0047] Figure 21 is Figure 2 Exploded view of another part of the structure in the heat exchange device shown;

[0048] Figure 22 is Figure 21 Schematic structural diagram of the middle substrate;

[0049] Figure 23 is Figure 1 Schematic structural diagram of part of the structure in the heat exchange system shown;

[0050] Figure 24 is Figure 23 Schematic structural diagram of part of the structure of the fin device under the first implementation;

[0051] Figure 25 is Figure 23 Exploded view of part of the structure of the fin device under the first implementation;

[0052] Figure 26 is Figure 23 Schematic structural diagram of the fin device under the second implementation of the fin device;

[0053] Figure 27 is Figure 23 Schematic diagram of the cooperation relationship between the fin device and the cooling fan under the second implementation of the fin device.

[0054] Explanation of reference numerals:

[0055] 10, heat exchange system;

[0056] 11, power source; 12, heat exchanger;

[0057] 12a, fin device; 12b, semiconductor cooler; 12c, cooling fan; 12d, fin flow path; 12e, cold end; 12f, hot end; 13, medium pipeline;

[0058] 100, heat exchange device;

[0059] 110. Accommodating cavity; 110a. Accommodating chamber; 110b. Medium groove; 110c. Notch; 110d. Bottom of the groove; 110e. Converging channel; 110f. Static pressure chamber;

[0060] 120. Turbulence inducer; 121. Turbulence surface;

[0061] 130. Flow splitter; 131. Perforated plate; 131a. Flow splitting hole; 132. Flow splitting plate;

[0062] 111. First housing; 112. Second housing; 112a. Medium inlet; 113. Third housing; 113a. Medium outlet;

[0063] 140. Substrate; 141. Partition part;

[0064] 20. Electronic product;

[0065] D1. Temperature - regulating medium flow direction; D2. Flow - guiding direction; D3. First direction; D4. Second direction; D5. Third direction;

[0066] h. Height of the turbulence inducer in the second direction; H. Depth of the medium groove; L. Length of the turbulence inducer; α. Inclination angle of the turbulence inducer; w. Thickness of the turbulence inducer;

[0067] x. Spacing between adjacent turbulence inducers in the left - right direction; y. Spacing between adjacent turbulence inducers in the up - down direction; z. Minimum spacing between turbulence inducers in the third direction;

[0068] D. Diameter of the flow splitting hole; d. Spacing between the flow splitting holes. Detailed implementation manners

[0069] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0070] Refer to Figure 1 , some embodiments of the present application provide a heat - exchange system 10, including: a power source 11, a heat exchanger 12, and a heat - exchange device 100.

[0071] Refer to Figures 2 to 22, the heat exchange device 100 can be used to heat or cool the electronic product 20 through a temperature regulating medium. The heat exchange device 100 includes a receiving cavity 110, and at least one receiving cavity 110a for receiving the electronic product 20 is formed in the receiving cavity 110. Structures corresponding to the installation of the electronic product 20 should be provided inside the receiving cavity 110a. For example, the inner wall of the receiving cavity 110a can fixedly install the electronic product 20 by interference fit, and these structures for installing the electronic product 20 are not shown in the drawings.

[0072] The receiving cavity 110 forms at least one medium groove 110b for the temperature regulating medium to flow through, and the notch 110c of the medium groove 110b faces the receiving cavity 110a so that the medium groove 110b communicates with the receiving cavity 110a. When the temperature regulating medium is introduced into the medium groove 110b, the electronic product 20 can exchange heat with the temperature regulating medium in the receiving cavity 110a to realize the cooling or heating of the electronic product 20. The temperature regulating medium is a fluid. In this application, the temperature regulating medium is a gas, and taking the heat exchange device 100 for cooling the electronic product 20 through the gas as an example, the working principle of the heat exchange system 10 is described.

[0073] Reference Figure 3 , in some embodiments, the notch 110c of the medium groove 110b communicates with the receiving cavity 110a along one side of the front-back direction in Figure 3 , so that after the electronic product 20 is placed in the receiving cavity 110a, the gas for cooling the electronic product 20 can flow through the medium groove 110b in the up-down direction and exchange heat with the electronic product 20 in the receiving cavity 110a.

[0074] To improve the heat exchange efficiency, in the heat exchange system 10 provided in this application, a turbulator 120 disposed inside the medium groove 110b is formed or installed in the receiving cavity 110 of the heat exchange device 100. Reference Figure 2 and Figure 3 , the turbulator 120 can be integrally formed with the receiving cavity 110. The turbulator 120 has at least one turbulator surface 121 extending along a diversion direction D2 intersecting with the flow direction D1 of the temperature regulating medium.

[0075] For example, reference Figure 4 , the flow direction of the temperature regulating medium in the receiving cavity 110 is in the up-down direction in Figure 4 , and the diversion direction D2 is in the front-back direction in Figure 4 , so that during the flow of the temperature regulating medium, when the gas in the medium groove 110b flows in the up-down direction, it is blocked by the turbulator surface 121, and thus changes the flow direction near the turbulator 120, making the gas flowing away from the notch 110c in the front-back direction flow towards the vicinity of the notch 110c, that is, the gas away from the electronic product 20 can approach or even impact the surface of the electronic product 20 in the receiving cavity 110a.

[0076] In the heat exchange device 100 according to the embodiments of the present application, through the above technical solution, when the temperature regulating medium exchanges heat with the electronic product 20 to be processed, the flow direction of the temperature regulating medium is disturbed by the turbulence surface 121, so that the temperature regulating medium relatively far from the electronic product 20 is blocked by the turbulence surface 121 and flows towards the notch 110c. Therefore, the temperature regulating medium is relatively closer to the electronic product 20 to be processed at the turbulator 120, exchanges heat fully with the electronic product 20, and the temperature gradient near the surface of the electronic product 20 becomes larger, playing a role in impact-enhanced heat transfer, thereby improving the heat exchange capacity of the heat exchange medium and further improving the heat exchange efficiency of the heat exchange device 100.

[0077] In some embodiments, referring to Figure 2 and Figure 21 , a plurality of accommodation cavities 110a can be provided in the accommodation cavity 110, so as to perform heat exchange processing on a plurality of electronic products 20 at one time.

[0078] In some embodiments, it can be set that each accommodation cavity 110a is respectively communicated with a medium tank 110b, or, referring to Figure 3 , Figure 4 , Figure 5 and Figure 6 , it can also be set that each accommodation cavity 110a is communicated with a plurality of medium tanks 110b, so that the temperature regulating medium passes through a plurality of medium tanks 110b and exchanges heat with 20.

[0079] In some embodiments, the medium tank 110b is a through groove extending along the first direction D3. For example, referring to the up-down direction in Figure 3 , Figure 4 and Figure 5 , the temperature regulating medium flows through the medium tank 110b in the up-down direction. Therefore, the flow direction of the temperature regulating medium can be the up-down direction, and the first direction D3 can also be the up-down direction, that is, the extending direction of the medium tank 110b can be basically the same as the flow direction of the temperature regulating medium. This solution can reduce the obstruction of the wall surface forming the medium tank 110b to the flow of the temperature regulating medium, so that the temperature regulating medium can flow through the medium tank 110b relatively quickly and exchange heat quickly.

[0080] In some embodiments, a plurality of turbulators 120 are arranged at intervals along the first direction D3 at the bottom 110d of the medium tank 110b. So that the temperature regulating medium can be disturbed by a plurality of turbulators 120 during the flowing process, so that the heat exchange effects at various parts of the electronic product 20 are relatively uniform.

[0081] In some embodiments, a plurality of turbulators 120 can be linearly distributed only along the first direction D3 in the medium tank 110b.

[0082] In some embodiments, the depth direction of the medium groove 110b is defined as the second direction D4; two oppositely arranged turbulators 120 are arranged at the bottom 110d of the medium groove 110b at intervals along a third direction D5 perpendicular to both the first direction D3 and the second direction D4. Refer to Figure 4 , Figure 5 and Figure 6 , the second direction D4 can be the front-back direction, and the third direction D5 can be the left-right direction. Each turbulator 120 can be arranged in the medium groove 110b in a substantially aligned and symmetric manner in the left-right direction. When the groove width dimension of the medium groove 110b in the left-right direction is fixed, a plurality of turbulators 120 are arranged in the left-right direction, so that the temperature-regulating medium can be fully disturbed by the plurality of turbulators 120, thereby further improving the heat exchange efficiency.

[0083] In some embodiments, the extending direction of the turbulator 120 is inclined with respect to the first direction D3. For example, refer to Figure 5 , the turbulator 120 is inclined with respect to the up-down direction, so that when the temperature-regulating medium contacts the turbulence surface 121, it can flow along the extending direction of the turbulator 120. When there is a gap between the end of the extending direction of the turbulator 120 and the groove wall of the medium groove 110b, the temperature-regulating medium can "bypass" the turbulator 120 and continue to flow, so as to reduce the negative impact of the turbulator 120 on the flow rate of the temperature-regulating medium. Here, "bypass" means that the temperature-regulating medium does not move completely along the diversion direction, but there is a movement along the extending direction of the turbulator 120, so that the temperature-regulating medium can flow through the gap between adjacent turbulators 120 or the gap between the turbulator 120 and the groove wall of the medium groove 110b.

[0084] In some embodiments, refer to Figure 5 , the value range of the length L of the turbulator 120 along its extending direction can be, for example, 10 mm to 200 mm.

[0085] In some embodiments, refer to Figure 5 , when a plurality of turbulators 120 are arranged in the up-down direction in a medium groove 110b, the value range of the spacing y between adjacent turbulators 120 in the up-down direction can be, for example, 20 mm to 600 mm. The dimension of the turbulator 120 in the direction perpendicular to its inclined direction is regarded as the thickness w of the turbulator, and the value range of w can be, for example, 1 mm to 10 mm.

[0086] In some embodiments, refer to Figure 5 , when a plurality of medium grooves 110b are arranged in the left-right direction in a receiving cavity 110a, the turbulators 120 in each medium groove 110b can be linearly distributed in whole or in part in the left-right direction, and the value range of the spacing x between two adjacent turbulators 120 linearly distributed in the left-right direction can be, for example, 20 mm to 400 mm.

[0087] In some embodiments, referring to Figure 5 , a converging channel 110e is formed between two turbulators 120 aligned in the second direction D4, and the converging channel 110e can gradually contract from the upstream to the downstream of the flow of the temperature regulating medium in the first direction D3.

[0088] When the temperature regulating medium is a gas, the temperature regulating medium flows in the medium tank 110b, and the temperature regulating medium contacting the turbulator surface 121 is blocked and flows in the guiding direction D2 to a position close to the tank opening 110c, enhancing the heat exchange between the temperature regulating medium and the surface of the electronic product 20. At the same time, when the temperature regulating medium flows through the converging channel 110e between two turbulators 120 aligned in the second direction D4, the flow rate of the temperature regulating medium increases, which can further increase the flow rate of the temperature regulating medium guided by the turbulator surface 121 and approaching the tank opening 110c along the guiding direction D2, so that the temperature regulating medium can pass through the medium tank 110b more quickly. By strengthening the heat exchange and increasing the flow rate of the temperature regulating medium, the heat exchange efficiency between the electronic product 20 and the temperature regulating medium can be further improved.

[0089] In some embodiments, the converging channel 110e can also be set to gradually contract from the downstream to the upstream of the flow of the temperature regulating medium in the first direction D3.

[0090] Referring to Figure 7 , a flow state diagram is illustrated when the converging channel 110e is set to gradually contract from the downstream to the upstream of the flow of the temperature regulating medium in the first direction D3 and the temperature regulating medium is a gas and flows in the medium tank. The temperature regulating medium contacting the turbulator surface 121 is blocked and flows in the guiding direction D2 to a position close to the tank opening 110c, enhancing the heat exchange between the temperature regulating medium and the surface of the electronic product 20. At the same time, the temperature regulating medium can flow through the converging channel 110e between two turbulators 120 aligned in the second direction D4, and can also be blocked by the turbulator surface 121 and flow to a position close to the side wall of the medium tank 110b and flow through between the side wall of the medium tank 110b and the turbulator 120. Since the distance between the side wall of the medium tank 110b and the turbulator 120 decreases, the flow rate of the temperature regulating medium increases after passing through, which can further increase the flow rate of the temperature regulating medium guided by the turbulator surface 121 and approaching the tank opening 110c along the guiding direction D2, so that the temperature regulating medium can pass through the medium tank 110b more quickly. By strengthening the heat exchange and increasing the flow rate of the temperature regulating medium, the heat exchange efficiency between the electronic product 20 and the temperature regulating medium can be further improved.

[0091] In some embodiments, referring to Figure 5 , the value range of the minimum distance z between two turbulators 120 located on both sides of the converging channel in the left-right direction can be, for example, from 1 mm to 50 mm.

[0092] In some embodiments, the spoiler surface 121 is configured to have at least one planar surface. For example, referring to Figure 4 , the spoiler surface 121 can be a planar surface. Referring to Figure 5 , the angle formed by the intersection of the spoiler surface 121 and the straight line in the first direction D3 ranges from less than 90°. For example, the range of the angle α can be 0 to 15°, 15° to 30°, 30° to 45°, 45° to 60°, 60° to 75°, etc.

[0093] In some embodiments, the depth direction of the dielectric groove 110b is defined as the second direction D4; a fluid passage is formed between one end of the spoiler 120 away from the bottom 110d of the dielectric groove and the notch 110c of the dielectric groove in the second direction D4 for the temperature-regulating medium to pass through. At this time, referring to Figure 6 , the maximum dimension of the spoiler 120 in the second direction D4 is less than the depth of the dielectric groove 110b. The second direction D4 corresponds to the front-back direction in Figure 6 . The height of the spoiler 120 in the front-back direction is less than the depth of the dielectric groove 110b, so that there is at least a gap between the front of the spoiler 120 and the surface of the electronic product 20 in the accommodation cavity 110a, so that the temperature-regulating medium can flow through this gap, and this gap is regarded as the fluid passage mentioned above.

[0094] In some embodiments, referring to Figure 6 , the height h of the spoiler 120 in the second direction D4 can be, for example, 3 mm to 30 mm. The range of the ratio of the height of the spoiler 120 in the second direction D4 to the depth H of the dielectric groove 110b can be, for example, 0.3 to 0.7, so that there is enough spacing between the front of the spoiler 120 and the surface of 20 in the accommodation cavity 110a.

[0095] In some embodiments, referring to Figure 4 , the contour shape of the spoiler surface 121 can be configured as a quadrilateral. Figure 4 shows an embodiment in which the spoiler surface 121 is rectangular. One edge of the rectangle close to the bottom 110d is defined as the long side of the spoiler surface 121, and the long side of the spoiler surface 121 is arranged on the side of the shape of the spoiler surface 121 close to the bottom 110d of the dielectric groove 110b, that is, one edge of the rectangle is formed on the bottom 110d, so that the spoiler 120 is in line contact with the bottom 110d.

[0096] In some embodiments, referring to Figure 8, the contour shape of the spoiler surface 121 can be configured as a triangle. An edge of the triangle close to the bottom 110d of the groove is defined as the long edge of the spoiler surface 121. The long edge of the spoiler surface 121 is arranged on the side of the shape of the spoiler surface 121 close to the bottom 110d of the dielectric groove 110b, that is, an edge of the triangle is formed on the bottom 110d, so that the spoiler 120 is in line contact with the bottom 110d.

[0097] In some embodiments, referring to Figure 9 , the contour shape of the spoiler surface 121 can be configured as a semi-circle. The straight edge of the semi-circle is defined as the long edge of the spoiler surface 121. The long edge of the spoiler surface 121 is arranged on the side of the shape of the spoiler surface 121 close to the bottom 110d of the dielectric groove 110b, that is, the straight edge of the semi-circular spoiler surface 121 can be formed on the bottom 110d, so that the spoiler surface 121 and the bottom 110d form a line contact.

[0098] In some embodiments, referring to Figure 10 , the contour shape of the spoiler surface 121 can be configured as a polygon. An edge of the polygon close to the bottom 110d of the groove is defined as the long edge of the spoiler surface 121. The long edge of the spoiler surface 121 is formed on the bottom 110d, so that the spoiler surface 121 and the bottom 110d form a line contact.

[0099] In some embodiments, referring to Figure 11 , the contour shape of the spoiler surface 121 can be configured as a polygon. An edge of the polygon close to the bottom 110d of the groove is defined as the long edge of the spoiler surface 121. The long edge of the spoiler surface 121 is formed on the bottom 110d, so that the spoiler surface 121 and the bottom 110d form a line contact.

[0100] In some embodiments, the spoiler surface 121 can be in surface contact with the bottom 110d. For example, a fillet is processed at one end of the spoiler surface 121 close to the bottom 110d, so that the spoiler surface 121 smoothly transitions to the bottom 110d.

[0101] This application uses the spoiler surface 121 to guide the flow of the temperature-regulating medium. However, for the specific contour shape of the spoiler surface 121, the shapes exemplified above can be adopted, or other shapes can also be adopted. This application does not make specific restrictions and can be selected according to actual needs to meet the requirements in different usage scenarios.

[0102] In some embodiments, a static pressure chamber 110f is formed in the accommodation cavity 110. In the temperature control medium flow direction D1, the static pressure chamber 110f is arranged upstream of the accommodation chamber 110a. The heat exchange device 100 further includes: a fluid splitter 130. The fluid splitter 130 is configured to disperse the flowing temperature control medium to the corresponding medium tanks 110b. The fluid splitter 130 is arranged in the static pressure chamber 110f. By providing the fluid splitter 130, the temperature control medium is dispersed into the medium tanks 110b, so that the temperature control medium can be relatively evenly distributed in each medium tank 110b, thereby improving the uniformity of the heat exchange effect at various parts of the electronic product 20 and reducing the possibility of quality problems such as cracks and deformations caused by uneven temperature distribution at various parts of the electronic product 20.

[0103] In some embodiments, the internal space of the static pressure chamber 110f continuously increases from the upstream to the downstream of the temperature control medium flow. Refer to Figure 12 , the accommodation cavity 110 may include a second housing 112. The second housing 112 is arranged above the accommodation chamber 110a and can be used to close the accommodation chamber 110a. Meanwhile, a static pressure chamber 110f is formed inside the second housing 112, and the bottom of the static pressure chamber 110f communicates with the top of the accommodation chamber 110a. A medium inlet 112a communicating with the static pressure chamber 110f is formed at the top of the second housing 112, and the temperature control medium can enter the static pressure chamber 110f from the medium inlet 112a. Since at least a section of the internal space of the static pressure chamber 110f continuously increases from top to bottom, after the temperature control medium enters the static pressure chamber 110f from the medium inlet 112a, it diffuses in the static pressure chamber 110f, facilitating the subsequent uniform distribution of the temperature control medium into each medium tank 110b.

[0104] In some embodiments, refer to Figure 12 and Figure 13 , the fluid splitter 130 includes a porous plate 131. The porous plate 131 is arranged between the static pressure chamber 110f and the accommodation chamber 110a. A plurality of diversion holes 131a are provided on the porous plate 131. The diversion holes 131a communicate the static pressure chamber 110f and the accommodation chamber 110a. With this solution, the temperature control medium in the static pressure chamber 110f is dispersed through each diversion hole 131a and then enters the medium tank 110b, realizing the uniform distribution of the temperature control medium into each medium tank 110b.

[0105] In some embodiments, refer to Figure 13 , the porous plate 131 can be quadrilateral. The value ranges of its side lengths a and b can be, for example, 50 mm to 500 mm. The description of the shape and size of the porous plate is only exemplary, and the present application does not specifically limit the shape of the porous plate.

[0106] In some embodiments, refer to Figure 13, the diversion holes 131a can be, for example, circular holes, and the value range of the diversion hole diameter D can be, for example, 5 mm to 50 mm. A number of circular holes can be distributed in a matrix on the porous plate 131, and the value range of the center distance (regarded as the diversion hole spacing) d between adjacent circular holes can be, for example, 10 mm to 200 mm.

[0107] This application does not specifically limit the shape of the diversion holes 131a. For example, referring to Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 , the shape of the diversion holes 131a can be rectangular, triangular, polygonal, semi-circular, wavy, elliptical, etc., which are only for illustrative purposes.

[0108] In some embodiments, a plurality of porous plates 131 can be fixedly arranged in the second housing 112 in the up and down direction.

[0109] In some embodiments, referring to Figure 20 , the fluid diverter 130 includes a number of diverter plates 132 that disperse the flowing temperature control medium to different angles. Each diverter plate 132 is arranged at intervals in the static pressure chamber 110f in the up and down direction or inclined to the up and down direction, so that the static pressure chamber 110f is divided into a plurality of spaced spaces. When the temperature control medium flows from the static pressure chamber 110f to the medium tank 110b, it is separated into each spaced space by the diverter plates 132, so that the temperature control medium can be evenly distributed to each medium tank 110b.

[0110] In some embodiments, both the porous plate 131 and the diverter plates 132 can be arranged in the second housing 112. The porous plate 131 can be arranged below each diverter plate 132 or above the diverter plates 132.

[0111] In some embodiments, the turbulator 120 can be separately provided from the accommodation cavity 110. For example, a substrate 140 is fixedly arranged in the accommodation cavity 110, and the turbulator 120 is formed or fixedly arranged on the substrate 140, so that the turbulator 120 is fixedly connected to the accommodation cavity 110.

[0112] In some embodiments, referring to Figure 21 , the substrate 140 is detachably and fixedly arranged in the accommodation cavity 110a, so that the turbulator 120 is detachably and fixedly connected to the inside of the accommodation cavity 110. At this time, the electronic product 20 can be clamped by using the substrate 140, the turbulator 120 and the inner wall of the accommodation cavity 110a, or the electronic product 20 can be clamped by using two relatively arranged substrates 140. Then, by fixing the substrate 140 in the accommodation cavity 110a, the electronic product 20 can be installed in the accommodation cavity 110a to perform heat exchange treatment on the electronic product 20.

[0113] This application does not specifically limit the fixing method of the substrate 140 and the accommodating cavity 110. For example, it can be fixed by screw connection, snap connection, etc.

[0114] In some embodiments, referring to Figure 22 , a plurality of partition portions 141 are protrudingly provided on the substrate 140. The partition portions 141 are used to contact the surface of the electronic product to cooperate with the inner wall of the accommodating cavity 110a or the partition portions 141 of another substrate 140 to realize the clamping of the electronic product 20. The dielectric groove 110b can be formed between the partition portions 141, that is, a dielectric groove 110b is formed between two adjacent partition portions 141. The turbulator 120 protrudingly provided on the bottom 110d of the dielectric groove 110b, and the turbulator 120 is in the same protruding direction as the partition portion 141. The height of the protruding portion of the turbulator 120 is less than the height of the protruding portion of the partition portion 141, so that when the partition portion 141 contacts the electronic product 20, the turbulator 120 can be spaced apart from the electronic product 20 to ensure that the temperature control medium can flow through the gap between the turbulator 120 and the electronic product 20.

[0115] In some embodiments, the power source 11 is used to provide the power for the flow of the temperature control medium. For example, when the temperature control medium is a gas, the power source 11 can be a circulation fan. The heat exchanger 12 is used to heat or cool the temperature control medium.

[0116] In some embodiments, referring to Figure 1 , the heat exchange system 10 further includes: a medium pipeline 13. The medium pipeline 13 is respectively connected to the power source 11, the heat exchanger 12 and the heat exchange device 100 to form a loop for the circulation of the temperature control medium. By forming a loop for the circulation of the temperature control medium, the temperature control medium flows in the loop by the power provided by the power source 11, is heated or cooled after exchanging heat with the electronic product 20 in the heat exchange device 100, and then exchanges heat with the heat exchanger 12 and is again powered by the power source 11 to enter the heat exchange device 100. The temperature control medium completes the circulation operation in such a closed loop, which can ensure that the temperature control medium is not easily contaminated, thereby reducing the possibility of the electronic product 20 being contaminated by impurities during the heat exchange process.

[0117] In some embodiments, the heat exchange system 10 of this application can be used to cool the electronic product 20. Referring to Figure 24, the cooler 12 includes: a fin device 12a and a thermoelectric cooler 12b. Among them, the fin device 12a has a fin flow path 12d connected to the medium pipeline 13, and the temperature-adjusting medium can flow between the fin flow path 12d and the medium pipeline 13. The thermoelectric cooler 12b is connected to the fin device 12a to cool it. After the temperature-adjusting medium cools down the electronic product 20, its own temperature rises. The thermoelectric cooler 12b cools the fin device 12a, that is, the temperature-adjusting medium in the fin flow path 12d is cooled. After being powered by the power source 11 again, it can flow to the heat exchange device 100 and continue to cool down the electronic product 20.

[0118] In some embodiments, referring to Figure 23 , the cooler 12 further includes: a cooling fan 12c; wherein, the cooling fan 12c is used to drive air flow through the thermoelectric cooler 12b to dissipate heat from the thermoelectric cooler 12b.

[0119] In some embodiments, referring to Figure 25 , the cold end 12e of the thermoelectric cooler 12b contacts the fin device 12a to cool down the fin device 12a. The cooling fan 12c is arranged at the hot end 12f of the thermoelectric cooler 12b. When the cooling fan 12c works, it dissipates heat from the hot end 12f to make the thermoelectric cooler 12b work stably.

[0120] In some embodiments, referring to Figure 26 , the fin device 12a can be formed by stacking multiple heat dissipation fins, and the fin flow path 12d can be a pipeline interspersed on the fin device 12a. At this time, referring to Figure 27 , a cooling fan 12c can also be used to dissipate heat from the fin device 12a, or the thermoelectric cooler 12b can be used to dissipate heat from the fin flow path 12d.

[0121] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0122] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0123] Among the embodiments, implementation manners and related technical features of the present application, they can be combined and replaced with each other without conflict.

[0124] The above are only the preferred embodiments of the present application and do not impose any formal restrictions on the present application. However, any simple modifications, equivalent changes, and decorations made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A heat exchange device for heating or cooling electronic products through a temperature regulating medium, characterized in that: include: A receiving cavity body, formed with at least one receiving cavity for receiving electronic products; The accommodating cavity forms at least one medium groove for the temperature regulating medium to flow through, and the notch of the medium groove faces the accommodating cavity so that the medium groove is connected with the accommodating cavity; The accommodating cavity is formed or installed with a disturbing body arranged inside the medium groove, and the disturbing body has at least one disturbing surface extending along the flow direction and intersecting with the flow direction of the temperature regulating medium.

2. The heat exchange device according to claim 1, characterized in that: The dielectric groove is a through groove extending substantially along the first direction.

3. The heat exchange device according to claim 2, characterized in that: A plurality of the fluid disruptors are arranged at intervals along the first direction at the bottom of the medium tank.

4. The heat exchange device according to claim 2, characterized in that: The depth direction of the dielectric groove is defined as a second direction; the two oppositely disposed fluid disruptors are disposed at the bottom of the dielectric groove at intervals along a third direction perpendicular to both the first direction and the second direction.

5. The heat exchange device according to claim 4, characterized in that: A gradually contracting channel is formed between the two turbulent bodies aligned in the second direction; the gradually contracting channel gradually contracts from the upstream to the downstream of the temperature regulating medium flow in the first direction; or, The gradually contracting channel gradually contracts from downstream to upstream of the flow of the temperature regulating medium in the first direction.

6. The heat exchange device according to claim 2, characterized in that: The spoiler surface is constructed to have at least one plane; the angle formed by the spoiler surface obliquely intersecting the first direction ranges from at least one of 0° to 15°, 15° to 30°, 30° to 45°, 45° to 60°, and 60° to 75°.

7. The heat exchange device according to claim 2, characterized in that: The depth direction of the medium groove is defined as a second direction; in the second direction, a fluid channel is formed between one end of the disrupting body away from the bottom of the medium groove and the groove opening of the medium groove for the temperature regulating medium to pass through.

8. The heat exchange device according to claim 1, characterized in that: The contour shape of the spoiler surface is configured as at least one of a polygon and a semicircle, and the long side of the spoiler surface is arranged on a side of the spoiler surface close to the groove bottom of the medium groove.

9. The heat exchange device according to claim 1, characterized in that: The accommodating cavity is formed with a static pressure cavity, and in the flow direction of the temperature regulating medium, the static pressure cavity is arranged upstream of the accommodating cavity; The heat exchange device also includes: A fluid distributor, used for distributing the temperature-adjusting medium flowing through to the corresponding medium tank; Wherein, the flow divider is arranged in the static pressure chamber.

10. The heat exchange device according to claim 9, characterized in that: The internal space of the static pressure chamber increases continuously from upstream to downstream of the flow of the temperature control medium.

11. The heat exchange device according to claim 9, characterized in that: The flow divider comprises a porous plate; and / or The flow distributor includes a plurality of flow distributor plates for distributing the temperature regulating medium flowing through the flow distributor to different angles.

12. A heat exchange system, comprising: A power source, used to provide power for the temperature control medium to flow; Heater and cooler, used for heating or cooling the temperature regulating medium; Characterized in that the heat exchange system also includes a heat exchange device as described in any one of claims 1 to 11.

13. The heat exchange system according to claim 12, characterized in that: The heat exchange system further comprises: The medium pipeline is respectively connected to the power source, the cooler and the heat exchanger to form a loop for circulating the temperature regulating medium.

14. The heat exchange system according to claim 13, characterized in that: The heat and cooler comprises: A fin device having a fin flow path connected in the medium pipeline; A semiconductor refrigerator is connected to the fin device to cool it.

15. The heat exchange system according to claim 14, characterized in that: The heat and cooler also includes: The heat dissipation fan is used to drive air flow through the semiconductor refrigerator to dissipate heat from the semiconductor refrigerator.

Images